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LTP-1557AJD LED Display Module Specification Sheet - 1.2-inch (30.42mm) Height - AlInGaP Red Light - 5x7 Dot Matrix - Chinese Technical Documentation

LTP-1557AJD 1.2-inch 5x7 Dot Matrix LED Display Module complete technical specifications, using AlInGaP red LED chips, covering electrical, optical, mechanical, and application data.
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PDF Document Cover - LTP-1557AJD LED Display Module Datasheet - 1.2-inch (30.42mm) Height - AlInGaP Red Light - 5x7 Dot Matrix - Technical Document

1. Product Overview

The LTP-1557AJD is a single-character alphanumeric display module designed for applications requiring clear and reliable character output. Its core function is to visually present ASCII or EBCDIC encoded characters through a grid of individually addressable light-emitting diodes (LEDs). Primary target markets include industrial control panels, instrumentation, point-of-sale terminals, communication equipment, and any embedded system requiring a simple, rugged user interface to display status or data. Its solid-state construction offers significant advantages in reliability and operational lifespan compared to older display technologies such as vacuum fluorescent or incandescent displays.

The core advantage of this module lies in its use of AlInGaP (Aluminum Indium Gallium Phosphide) LED technology. This semiconductor material system is renowned for producing highly efficient red and amber light. Compared to older GaAsP (Gallium Arsenide Phosphide) LEDs, AlInGaP LEDs offer superior luminous efficiency, meaning brighter output for the same electrical input power and better performance at elevated temperatures. The device features a gray panel with white dots, enhancing contrast and readability under various lighting conditions.

2. Detailed Technical Parameters

2.1 Photometric and Optical Characteristics

Optical performance is defined under standard test conditions with an ambient temperature (Ta) of 25°C. The key parameters areAverage luminous intensity (Iv)Its typical value is 2500 microcandelas (µcd), with a minimum value of 1020 µcd. This measurement was conducted under conditions of a pulse drive current (Ip) of 32mA and a duty cycle of 1/16. The use of pulse driving is common in multiplexed displays, aiming to achieve higher peak brightness while ensuring the safe average power consumption of each LED point.

Color characteristics are defined by wavelength. The device'sPeak emission wavelength (λp)is 656 nm, placing it within the red region of the visible spectrum.Dominant Wavelength (λd)is specified as 640 nm. It is important to note the distinction between the two: the peak wavelength is the point of maximum spectral power, while the dominant wavelength is the single wavelength perceived by the human eye as the color.Spectral line half-width (Δλ)It is 22 nm, indicating the spectral purity or bandwidth of the emitted light; the narrower the half-width, the more saturated and pure the color.Luminous intensity matching ratio (IV-m)Maximum 2:1, meaning the brightness variation between the brightest and darkest points in the array should not exceed this ratio, ensuring a uniform appearance.

2.2 Electrical Characteristics

Electrical parameters define the operating limits and conditions of the device. At a test current (IF) of 20mA, any single LED point'sForward Voltage (VF)Between 2.1V (minimum) and 2.6V (maximum). This forward voltage is characteristic of AlInGaP technology and is crucial for designing current-limiting circuits. When a 5V reverse bias voltage (VR) is applied,Reverse Current (IR)is a maximum of 100 µA, which indicates the leakage characteristics of the diode in the off state.

3. Absolute Maximum Ratings

These ratings define stress limits that may cause permanent damage and are not intended for continuous operation. Key limitations include:Average Power Dissipation per Point(33 mW),Peak forward current per point(90 mA) andAverage forward current per point(13 mA at 25°C, linearly derated by 0.17 mA/°C above 25°C).Reverse voltage per pointis 5V. The device'sOperating Temperature RangeIt is -35°C to +85°C, and the storage temperature range is the same. The soldering temperature must not exceed 260°C for more than 3 seconds at a point 1.6mm below the package mounting plane.

4. Explanation of the Grading System

The datasheet indicates that the deviceBinned by luminous intensity. This means the units are tested and categorized (binned) based on their measured light output. This allows designers to select components from specific intensity bins to ensure uniform brightness across multiple displays in a product, avoiding noticeable variations. While not explicitly detailed in this document, common binning parameters for such LEDs may also include forward voltage (Vf) and dominant wavelength (λd) to ensure electrical and color consistency.

5. Performance Curve Analysis

The datasheet references typical electrical/optical characteristic curves. Although not displayed in the provided text, such curves typically include:Forward Current vs. Forward Voltage Relationship Curve (I-V Curve)This shows the nonlinear relationship between current and voltage, which is crucial for designing drive circuits.I-L curve (Light Intensity vs. Forward Current)This shows how the light output increases with current, typically exhibiting a roughly linear region before very high currents cause a drop in efficiency.Light Intensity vs. Ambient Temperature curveThe curve shows the thermal derating characteristics of light output, which is crucial for applications operating in high-temperature environments. AlInGaP LEDs typically maintain performance better at high temperatures compared to older technologies.

6. Mechanical and Packaging Information

The device is a display with a matrix height of 1.2 inches (30.42 mm). Package dimensions are provided in the drawing, with all dimensions in millimeters. Unless otherwise specified, the tolerance is ±0.25 mm. The mechanical drawing is essential for PCB pad design and ensuring proper installation within the enclosure. The package features a specific 5x7 matrix pin arrangement, including connections for 7 row anodes and 5 column cathodes (or vice versa, depending on the internal circuit configuration).

6.1 Pin Connections and Internal Circuitry

The pin connection table lists 14 pins. The internal circuit diagram shows a common-cathode or common-anode configuration for a 5x7 matrix. Specific pin assignments are provided (e.g., Pin 1: Anode Row 5, Pin 3: Cathode Column 2). This configuration allows the display to be multiplexed. By activating one row (or column) at a time and providing the corresponding column (or row) data, all 35 dots can be controlled using only 12 I/O lines (7+5), significantly reducing the number of microcontroller pins required compared to directly driving each LED.

7. Soldering and Assembly Guide

Awọn ofin iṣẹṣiṣẹpọ pataki jẹ iṣiro otutu irinṣẹ. Awọn iye to pọju ti o ṣe pato sọ pe, ni wiwọn 1.6 mm (1/16 inṣi) labẹ iṣori fifi sori, apoti le gbaOṣuwọn otutu irinṣẹ to ga julọ ti 260°C, fun iṣẹju-aaya 3 to pọ julọ. Eyi jẹ apẹẹrẹ ti irinṣẹ igbọn omi tabi irinṣẹ ọwọ. Fun irinṣẹ atunṣe, o yẹ ki a lo iṣiro otutu ti ko ni olu ti ko ni oṣuwọn giga to 260°C. O ṣe pataki lati yẹra fun iwọn-ara gbigbona ti o pọ si lati ṣe idiwọn bibajẹ LED chip, awọn okun iṣọkan, tabi apoti plastiki. Awọn ilana ESD (Itusilẹ Ẹlẹktrọniku ti o ni ẹmi) ti o tọ gbọdọ tẹle nigbagbogbo nigba iṣẹṣiṣẹpọ.

8. Application Suggestions

8.1 Typical Application Scenarios

This display is ideal for applications requiring single characters or digits, or where multiple units can be stacked horizontally to form a multi-character display. Common uses include: digital panel meters (voltage, current, temperature), simple status indicators on industrial machinery (displaying error codes, mode numbers), basic readouts on consumer appliances, and prototyping or educational kits for learning multiplexed LED driving.

8.2 Design Considerations

Drive Circuit Design: Need to reuse the drive circuit. This typically involves a microcontroller with sufficient I/O pins or a dedicated LED driver IC (such as MAX7219 or similar devices). The circuit must include current-limiting resistors for each column or row line to set the forward current to a safe value, usually between 10-20mA per segment based on the required brightness and power consumption limits.Power supply: Must consider a forward voltage of approximately 2.4V. Typically, a 3.3V or 5V power supply is used, generating an appropriate voltage drop across the current-limiting resistor.Refresh rate:复用扫描速率必须足够高(通常>60 Hz)以避免可见闪烁。Viewing Angle: The datasheet mentions a wide viewing angle, which is very beneficial for applications where the display may be viewed from off-axis positions.

9. Technical Comparison and Differentiation

The main differentiation of the LTP-1557AJD lies in its use ofAlInGaP LED technologyCompared to displays using old-style GaAsP or standard red GaP LEDs, AlInGaP offers:Higher luminous efficiency: More light output per unit of electrical power, resulting in lower power consumption at the same brightness or higher brightness at the same power consumption.Better high-temperature performance: AlInGaP LEDs experience less efficiency degradation at higher junction temperatures, making them more suitable for industrial environments.Superior color saturation: Their spectral characteristics typically produce a deeper, visually more vivid red.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Why use pulsed current (1/16 duty cycle) instead of DC to test luminous intensity?
A: This reflects its intended multiplexed mode of operation. Testing under pulsed conditions simulates real-world usage and allows for specifying a higher, more relevant peak brightness that a user will perceive.

Q: Can I drive each point with a constant DC current?
A: Technically yes, but it is extremely inefficient. This would require 35 independent current-limiting drivers. Multiplexing is the standard and expected method, which significantly reduces the number of components and power consumption in the drive circuit.

Q: What is the purpose of the intensity matching ratio (2:1)?
A: It ensures visual uniformity. Without binning, some points might be noticeably brighter or darker than others, resulting in uneven and unprofessional-looking characters.

Q: How to understand the derating factor (0.17 mA/°C) for average forward current?
A: This means for every 1°C increase in ambient temperature (above 25°C), the maximum safe continuous current per point must be reduced by 0.17 mA. For example, at 50°C (25 degrees above 25°C), the maximum current would be 13 mA - (25 * 0.17 mA) = 8.75 mA per point.

11. Practical Design Case Study

Consider using the LTP-1557AJD to design a single-digit temperature display for an incubator. A microcontroller (e.g., ATmega328P) reads the temperature sensor. Its seven I/O pins are configured as outputs to drive the row anodes (via small NPN transistors or a ULN2003 Darlington array for higher current capability). Another five I/O pins drive the column cathodes directly or via transistors. The firmware rapidly scans the seven rows. For each row, it outputs a 5-bit pattern on the column pins, corresponding to the segments that need to be lit on that specific row to form the desired digit (0-9). Current-limiting resistors are placed on the column lines. The scanning routine runs in a timer interrupt to ensure a consistent, flicker-free refresh rate of approximately 100 Hz. The AlInGaP technology ensures the display remains clearly readable even when the internal ambient temperature of the incubator rises.

12. Introduction to Working Principles

LTP-1557AJD is based onMultiplexed 5x7 dot matrixprinciple. Internally, 35 LEDs are arranged in a grid, with their anodes connected by rows and cathodes by columns (or vice versa in a common-anode configuration). To illuminate a specific point, a voltage is applied to its corresponding row line (making it high for common-cathode types), while its corresponding column line is pulled low (sinking current). To display a pattern or character, the controller rapidly cycles (scans) through each row. When a specific row is activated, the controller sets the appropriate column lines to create the pattern for that row. The persistence of vision of the human eye merges these rapidly changing row images into a stable, complete character. This method reduces the number of required control lines from 35 (one per LED) to just 12 (rows + columns).

13. Technology Trends

Ingawa maonyesho ya alama ya 5x7 tofauti kama LTP-1557AJD bado yanatumika katika matumizi maalum, yanayohusisha gharama, au rahisi, mwelekeo mpana wa teknolojia ya maonyesho umebadilika kuelekea suluhisho za ushirikiano.Maonyesho ya Kudhibiti UshirikianoModuli za kisasa za LCD (Maonyesho ya Kioevu-Kioo) na OLED (Diodi ya Mwanga wa Kikaboni) kwa kawaida hujumuisha chip ya kudhibiti iliyojengwa ndani, inayoshughulikia uzalishaji wa herufi na ukarabati, kupitia mawasiliano rahisi ya serial (I2C, SPI) au interface sambamba, ikirahisisha sana uundaji wa programu.Higher Resolution and Graphic DisplayFor more complex information, small graphic OLED or TFT-LCD modules are now common, offering pixel-addressable graphic capabilities.Surface Mount Technology (SMT)Newer LED indicators and displays primarily use SMT packages (e.g., 0805, 0603 LEDs arranged in matrices) for automated assembly, while through-hole packages like this product are more typical for prototyping or manual assembly. The underlying AlInGaP and InGaN (for blue/green/white light) LED chip technology continues to advance, offering increasingly higher efficiency and reliability.

Detailed Explanation of LED Specification Terminology

Complete Explanation of LED Technical Terminology

I. Core Indicators of Photoelectric Performance

Terminology Unit/Representation Popular Explanation Why It Is Important
Luminous Efficacy lm/W (lumens per watt) The luminous flux emitted per watt of electrical power; the higher the value, the more energy-efficient it is. Directly determines the energy efficiency rating and electricity cost of the luminaire.
Luminous Flux lm (lumen) Total amount of light emitted by a light source, commonly known as "brightness". Determines whether a luminaire is bright enough.
Viewing Angle ° (degrees), e.g., 120° The angle at which the light intensity drops to half determines the beam width. Affects the illumination range and uniformity.
Color Temperature (CCT) K (Kelvin), e.g., 2700K/6500K The warmth or coolness of light color; lower values are yellowish/warm, higher values are whitish/cool. Determining the lighting atmosphere and applicable scenarios.
Color Rendering Index (CRI / Ra) Unitless, 0–100 The ability of a light source to restore the true color of an object, Ra≥80 is recommended. Affects color authenticity, used in high-demand places such as shopping malls and art galleries.
Color Tolerance (SDCM) MacAdam Ellipse Steps, e.g., "5-step" A quantitative indicator of color consistency; a smaller step number indicates higher color consistency. Ensure no color difference among the same batch of luminaires.
Dominant Wavelength nm (nanometer), misali 620nm (ja) Rangi ya LED ya rangi inayolingana na thamani ya urefu wa wimbi. Kuamua rangi ya LED ya rangi moja kama nyekundu, manjano, kijani, n.k.
Spectral Distribution Wavelength vs. Intensity Curve Display the intensity distribution of light emitted by the LED across various wavelengths. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbol Popular Explanation Design Considerations
Forward Voltage Vf The minimum voltage required to light up an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf; voltages add up when multiple LEDs are connected in series.
Forward Current If The current value that makes the LED emit light normally. Constant current drive is often used, as the current determines brightness and lifespan.
Maximum Pulse Current Ifp Peak current that can be withstood in a short time, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled, otherwise overheating damage.
Reverse Voltage Vr The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. The circuit must be protected against reverse polarity or voltage surges.
Thermal Resistance Rth (°C/W) The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. High thermal resistance requires a more robust heat dissipation design; otherwise, the junction temperature will rise.
ESD Immunity V (HBM), e.g., 1000V The ability to withstand electrostatic discharge; a higher value indicates greater resistance to damage from static electricity. Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Key Metrics Popular Explanation Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, lifespan may double; excessively high temperatures cause lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) The time required for brightness to drop to 70% or 80% of its initial value. Directly defines the "service life" of an LED.
Lumen Maintenance % (e.g., 70%) The percentage of remaining brightness after a period of use. Characterizes the ability to maintain brightness after long-term use.
Color Shift Δu′v′ or MacAdam ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Material performance degradation Deterioration of packaging materials due to prolonged high temperatures. May lead to decreased brightness, color shift, or open-circuit failure.

IV. Packaging and Materials

Terminology Common Types Popular Explanation Characteristics and Applications
Package Type EMC, PPA, Ceramic The housing material that protects the chip and provides optical and thermal interfaces. EMC tahan panas baik, biaya rendah; keramik pendinginan unggul, umur panjang.
Struktur chip Face-up, Flip Chip Chip electrode arrangement method. Flip Chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating YAG, silicate, nitride Covered on the blue light chip, partially converted into yellow/red light, mixed into white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical design Plane, Microlens, Total Internal Reflection Optical structure on the encapsulation surface, controlling light distribution. Determine the beam angle and light distribution curve.

V. Quality Control and Binning

Terminology Binning Content Popular Explanation Purpose
Luminous Flux Classification Codes such as 2G, 2H Group by brightness level, each group has a minimum/maximum lumen value. Ensure consistent brightness for the same batch of products.
Voltage binning Codes such as 6W, 6X Group by forward voltage range. Facilitates driver matching and improves system efficiency.
Color binning. 5-step MacAdam Ellipse Group by color coordinates to ensure colors fall within a minimal range. Ensure color consistency to avoid uneven color within the same luminaire.
Color temperature binning 2700K, 3000K, etc. Grouped by color temperature, each group has a corresponding coordinate range. To meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standards/Testing Popular Explanation Significance
LM-80 Lumen Maintenance Test Record brightness attenuation data under constant temperature conditions over a long period of illumination. Used to estimate LED lifetime (combined with TM-21).
TM-21 Standard for Life Projection Projecting lifetime under actual use conditions based on LM-80 data. Provide scientific life prediction.
IESNA Standard Illuminating Engineering Society Standard Covers optical, electrical, and thermal testing methods. Industry-recognized testing basis.
RoHS / REACH Environmental Certification Ensure products are free from hazardous substances (e.g., lead, mercury). Market access requirements for entering the international market.
ENERGY STAR / DLC Energy Efficiency Certification Energy Efficiency and Performance Certification for Lighting Products. Commonly used in government procurement and subsidy programs to enhance market competitiveness.