LTP-2058AKD LED Display Datasheet - 2.3-inch (58.42mm) Height - 5x8 Dot Matrix - Hyper Red (650nm)

1. Product Overview

LTP-2058AKD ni moduli ya kuonyesha tarakimu moja na herufi, iliyoundwa kwa matumizi yanayohitaji matokeo ya herufi wazi na zinazosomeka. Kazi yake kuu ni kuonyesha kwa macho herufi zilizosimbwa kwa ASCII au EBCDIC kupitia wigo wa diodi zinazotoa mwanga (LED) zinazoweza kudhibitiwa kila moja peke yake.

Core Advantages & Target Market: Faida kuu za kifaa hiki ni pamoja na urefu mkubwa wa herufi wa inchi 2.3 (mm 58.42) kwa uonekano bora, pembe pana ya kutazama inayotolewa na muundo wake wa ndege moja, na uaminifu thabiti wa hali imara unaoasiliwa na teknolojia ya LED. Hitaji lake la nguvu chini na uendeshaji na misimbo ya kawaida ya herufi hufanya iweze kufaa kwa paneli za udhibiti wa viwanda, vyombo vya kupima, vituo vya mauzo, na mifumo mingine iliyojumuishwa ambapo maonyesho ya kudumu, yasiyo ya matengenezo mengi, na yanayosomeka kwa urahisi yanahitajika.

2. Technical Specifications Deep Dive

This section provides an objective analysis of the device's key performance parameters as defined in the datasheet.

2.1 Photometric & Optical Characteristics

The optical performance is central to the display's function. The device utilizes AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor material for its LED chips, which are fabricated on a non-transparent GaAs substrate. This technology is known for high efficiency in the red-orange spectrum.

Luminous Intensity (I_V): The average luminous intensity per dot is specified with a minimum of 1650 µcd, typical of 3500 µcd, under a test condition of I_p=32mA and 1/16 duty cycle. This parameter defines the brightness of each individual LED dot.
Wavelength Characteristics:
- Peak Emission Wavelength (λ_p): 650 nm (nanometers). This is the wavelength at which the LED emits the most optical power.
- Dominant Wavelength (λ_d): 639 nm. This is the single wavelength perceived by the human eye, defining the color as \"Hyper Red.\"
- Spectral Line Half-Width (Δλ): 20 nm. This indicates the spread of the emitted light's wavelength, with a smaller value representing a more pure, saturated color.
Luminous Intensity Matching Ratio (I_V-m): 2:1 maximum. This is a critical parameter for display uniformity, specifying that the brightness of the dimmest dot in an array will be no less than half the brightness of the brightest dot under the same driving conditions.

2.2 Electrical Parameters

Fahimtar iyakokin lantarki da wuraren aiki yana da mahimmanci don ƙirar da'ira mai dogaro.

Absolute Maximum Ratings: These are stress limits that must not be exceeded, even momentarily.
- Average Power Dissipation per Dot: 40 mW.
- Peak Forward Current per Dot: 90 mA.
- Average Forward Current per Dot: 15 mA a 25°C, e fa'aitiitia laina i le 0.2 mA/°C.
- Voltage Fa'afeagai i le Dot Ta'itasi: 5 V. O le sili atu i lenei mea e mafai ona fa'aleagaina le so'oga LED.
Uiga Fa'aeletise/Optical (i le T_A=25°C): These are typical operating parameters.
- Forward Voltage (V_F): Ranges from 2.1V (min) to 2.8V (max) depending on current. Typical is 2.6V at 20mA and 2.8V at 80mA.
- Reverse Current (I_R): 100 µA maximum at V_R=5V.

2.3 Thermal Characteristics

Thermal management is implied through the derating specifications and temperature ranges.

Operating Temperature Range: -35°C to +85°C. The device is designed to function within this ambient temperature span.
Storage Temperature Range: -35°C to +85°C.
Current Derating: The average forward current rating decreases linearly by 0.2 mA for every degree Celsius above 25°C. This is a direct thermal limitation to prevent overheating.
Solder Temperature: Withstands 260°C for 3 seconds at 1/16 inch (approx. 1.6mm) below the seating plane during assembly.

3. Binning System Explanation
The datasheet indicates the device is "categorized for luminous intensity." This refers to a binning process where manufactured units are sorted (binned) based on measured luminous intensity. This ensures designers can select parts with consistent brightness levels for their application, which is crucial for multi-digit displays where uniform appearance is desired. While specific bin codes are not listed in this document, typical bins would group LEDs with similar I_V values.

4. Performance Curve Analysis
The datasheet references "Typical Electrical/Optical Characteristic Curves." Although the specific graphs are not provided in the text, such curves typically include:

I-V (Current-Voltage) Curve: Shows the relationship between forward voltage (V_F) and forward current (I_F). It is non-linear, with a threshold voltage (around 1.8-2.0V for AlInGaP red) below which very little current flows.

Luminous Intensity vs. Forward Current: Demonstrates how light output increases with current, typically in a near-linear relationship within the recommended operating range before efficiency drops at very high currents.

Temperature Dependence: Curves showing how forward voltage decreases and wavelength may shift slightly with increasing junction temperature.

These curves are vital for designing efficient constant-current drivers and understanding performance under varying thermal conditions.

5. Mechanical & Package Information
The physical construction defines the form factor and assembly interface.

Package Type: A through-hole package with 14 pins.

Matrix Description: 5 columns by 8 rows of LED dots, creating a grid capable of forming all alphanumeric characters and some symbols.

Visual Design: Features a gray face (likely the package epoxy) with white segments (the illuminated dot areas), providing good contrast when off and a clean appearance when lit.

Stackability: The device is designed to be stacked horizontally, allowing for the creation of multi-character displays by placing units side-by-side.

Dimensions: All dimensions are in millimeters with a general tolerance of ±0.25 mm unless otherwise specified. The exact dimensional drawing is referenced in the datasheet.

5.1 Pin Connection & Polarity

The 14-pin interface uses a multiplexed anode-column and cathode-row scheme for matrix addressing, which reduces the required driver pins from 40 (5x8) to 13 (5+8).

Pinout: Pin 1: Cathode Row 6

Internal Circuit: The internal diagram shows a common matrix configuration where each LED dot is formed at the intersection of an anode column line and a cathode row line. To illuminate a specific dot, its corresponding anode pin must be driven high (with current limiting) while its corresponding cathode pin is driven low.

6. Soldering & Assembly Guidelines
The key assembly specification provided is the soldering temperature profile: the device can withstand a peak temperature of 260°C for 3 seconds, measured 1/16 inch (1.6mm) below the seating plane. This is a standard wave or reflow soldering condition. Designers should ensure their PCB assembly process adheres to this limit to prevent package damage or LED degradation.

Storage Conditions: Components should be stored within the specified storage temperature range of -35°C to +85°C in a dry environment, typically in moisture-sensitive device (MSD) bags if required.

7. Application Suggestions

7.1 Typical Application Scenarios

Industrial HMIs: Status displays on machinery, PLC operator panels.
Test & Measurement Equipment: Digital readouts for multimeters, frequency counters, power supplies.
Retail & Hospitality: Price displays, queue management systems, simple information boards.
Embedded Systems: Where a simple, robust, and low-power character output is needed.

7.2 Design Considerations

Driver Circuit: E buoro matrix scan driver IC ma microcontroller nke nwere GPIO pins zuru oke na ikike isi nweta ma ọ bụ imikpu ike. A na-atụ aro ịkwọ ụgbọala na-agbanwe agbanwe maka nchapụta ọkụ na-agbanwe agbanwe.
Mmachi Ugbu a: Ndị na-emegide mpụga ma ọ bụ onye ọkwọ ụgbọala na-agbanwe agbanwe bụ iwu iji gbochie ike site na ngalaba LED ọ bụla n'ime oke nkezi na oke elu akọwapụtara.
Multiplexing: Since it's a matrix display, it operates on a multiplexing (scanning) principle. The refresh rate must be high enough (typically >60Hz) to avoid visible flicker. The duty cycle affects the perceived brightness and peak current requirements.
Viewing Angle: The wide viewing angle is beneficial for applications where the operator may not be directly in front of the display.
Power Supply: Ensure the supply voltage is sufficient to overcome the LED forward voltage (V_F) plus the voltage drop across any current-limiting components and driver circuitry.

8. Technical Comparison & Differentiation
Compared to older technologies like incandescent or vacuum fluorescent displays (VFDs), this LED matrix offers:

Superior Reliability & Lifetime: Solid-state construction with no filaments or glass envelopes, leading to much longer operational life and resistance to vibration.

Lower Power Consumption: Especially at lower brightness levels.

Faster Response Time: Instant on/off capability.

Wider Operating Temperature Range: Suitable for harsh environments.

Compared to modern graphic OLED or TFT modules, it is:

Simpler to Interface: Requires fewer control lines and simpler software.

More Rugged and Cost-Effective for simple character-only applications.

Highly Readable in high-ambient-light conditions due to its high contrast and emissive nature.

9. Frequently Asked Questions (Based on Technical Parameters)
Q1: How do I calculate the appropriate current-limiting resistor for a single dot? A: Use Ohm's Law: R = (V_supply - V_F) / I_F. For example, with a 5V supply, a typical V_F of 2.6V at 20mA: R = (5 - 2.6) / 0.02 = 120 Ω. Always use the maximum V_F from the datasheet for a conservative design to ensure current doesn't exceed limits.

Q2: What does "1/16 DUTY" mean in the test condition for luminous intensity? A: It means the measurement was taken with the LED pulsed on for 1/16th of the total scan cycle time. In a multiplexed 5x8 matrix, a common scanning scheme activates one row at a time. If all 8 rows are scanned, each row is active for 1/8 duty cycle. The 1/16 duty suggests a different scanning pattern or a measurement condition where the peak pulse current is higher, and the average power is kept within limits. The actual operating duty cycle depends on the driver design.

Q3: Can I connect these displays in parallel to make a multi-digit unit? A: An tsara su don a jera su a kwance, ma'ana kuna sanya raka'a da yawa kusa da juna akan PCB. Ba za ku iya haɗa fil ɗin kawai a layi daya ba saboda kowace raka'a ta ƙunshi cikakken matrix 5x8. Kowane nuni yana buƙatar nasa saitin direbobin ginshiƙi, yayin da direbobin layi galibi ana iya raba su a cikin dukkan raka'a a cikin ƙirar lambobi da yawa don sauƙaƙe da'irar bincike.

Q4: Why is the dominant wavelength (639nm) different from the peak wavelength (650nm)? A: This is due to the spectral response of the human eye. The LED emits light across a range of wavelengths centered at 650nm (peak). However, the human eye is more sensitive to wavelengths around 555nm (green) and less sensitive to deep red. The dominant wavelength is calculated by finding the single wavelength of pure monochromatic light that would appear to have the same color as the LED's broad spectrum output to a standard human observer. It's the "perceived" color point.

10. Operating Principle Introduction
The LTP-2058AKD is an active matrix LED display. Its fundamental principle is electroluminescence from a semiconductor P-N junction. When a forward voltage exceeding the diode's threshold is applied across an anode (column) and cathode (row), electrons and holes recombine in the active AlInGaP layer, releasing energy in the form of photons (light) at a wavelength determined by the material's bandgap. The 5x8 matrix arrangement allows any of the 40 dots to be individually addressed by selecting the correct combination of one column (power source) and one row (ground path). Multiplexing scans through rows rapidly, turning on the necessary columns for each row, to create the illusion of a stable, fully lit character.

11. Technology Trends
E ui o fa'aaliga matrix togi LED tu'ufa'atasi e pei o le LTP-2058AKD o lo'o tumau pea ona talafeagai mo fa'aoga fa'apitoa fa'atauva'a po'o fa'atauga maualalo, o le tulaga lautele i tekinolosi fa'aaliga o lo'o aga'i atu i le maualuga atu o le tu'ufa'atasia ma galuega. O mea fa'apipi'i i luga o le eleele (SMD) fa'asologa LED ma fa'aputuga fa'ata'avale ta'avale LED ua fa'ateleina le taatele. E le gata i lea, mo talosaga e mana'omia ai ata po'o mataitusi sili atu ona lavelave, o fa'aaliga LED vaeluaga, OLEDs, ma TFT LCD laiti e ofoina atu le sili atu ona fetuutuunai. O le mataupu faavae o le matrix addressing e tumau pea ona taua, ae o le faʻatinoga e agai atu i mamanu chip-on-board (COB) ma fesoʻotaʻiga pei o le I2C poʻo le SPI, faʻaitiitia le numera o vaega ma faʻafaigofie le mamanu o le polokalama pe a faʻatusatusa i le taʻavale saʻo GPIO matrix.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important

Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.

Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.

Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.

CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.

CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.

SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Inahakikisha rangi sawa kwenye kundi moja la LED.

Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.

Spectral Distribution Wavelength vs intensity curve Inaonyesha usambazaji wa nguvu kwenye urefu wa mawimbi. Inaathiri uwasilishaji wa rangi na ubora.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations

Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.

Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.

Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.

Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.

Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.

ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Metric Key Simple Explanation Impact

Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Kila kupungua kwa 10°C kunaweza kuongeza maisha ya taa mara mbili; joto la juu sana husababisha kupungua kwa mwanga na mabadiliko ya rangi.

Kupungua kwa Lumen L70 / L80 (saa) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".

Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.

Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.

Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications

Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.

Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.

Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.

Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose

Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.

Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.

Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.

CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance

LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).

TM-21 Standard ya kukadiria maisha Inakadiria maisha chini ya hali halisi kulingana na data ya LM-80. Provides scientific life prediction.

IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.

RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Bukatar shiga kasuwa a duniya.

ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.

Term	Unit/Representation	Simple Explanation	Why Important
Luminous Efficacy	lm/W (lumens per watt)	Light output per watt of electricity, higher means more energy efficient.	Directly determines energy efficiency grade and electricity cost.
Luminous Flux	lm (lumens)	Total light emitted by source, commonly called "brightness".	Determines if the light is bright enough.
Viewing Angle	° (degrees), e.g., 120°	Angle where light intensity drops to half, determines beam width.	Affects illumination range and uniformity.
CCT (Color Temperature)	K (Kelvin), e.g., 2700K/6500K	Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool.	Determines lighting atmosphere and suitable scenarios.
CRI / Ra	Unitless, 0–100	Ability to render object colors accurately, Ra≥80 is good.	Affects color authenticity, used in high-demand places like malls, museums.
SDCM	MacAdam ellipse steps, e.g., "5-step"	Color consistency metric, smaller steps mean more consistent color.	Inahakikisha rangi sawa kwenye kundi moja la LED.
Dominant Wavelength	nm (nanometers), e.g., 620nm (red)	Wavelength corresponding to color of colored LEDs.	Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution	Wavelength vs intensity curve	Inaonyesha usambazaji wa nguvu kwenye urefu wa mawimbi.	Inaathiri uwasilishaji wa rangi na ubora.

Term	Symbol	Simple Explanation	Design Considerations
Forward Voltage	Vf	Minimum voltage to turn on LED, like "starting threshold".	Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current	If	Current value for normal LED operation.	Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current	Ifp	Peak current tolerable for short periods, used for dimming or flashing.	Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage	Vr	Max reverse voltage LED can withstand, beyond may cause breakdown.	Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance	Rth (°C/W)	Resistance to heat transfer from chip to solder, lower is better.	High thermal resistance requires stronger heat dissipation.
ESD Immunity	V (HBM), e.g., 1000V	Ability to withstand electrostatic discharge, higher means less vulnerable.	Anti-static measures needed in production, especially for sensitive LEDs.

Term	Metric Key	Simple Explanation	Impact
Junction Temperature	Tj (°C)	Actual operating temperature inside LED chip.	Kila kupungua kwa 10°C kunaweza kuongeza maisha ya taa mara mbili; joto la juu sana husababisha kupungua kwa mwanga na mabadiliko ya rangi.
Kupungua kwa Lumen	L70 / L80 (saa)	Time for brightness to drop to 70% or 80% of initial.	Directly defines LED "service life".
Lumen Maintenance	% (e.g., 70%)	Percentage of brightness retained after time.	Indicates brightness retention over long-term use.
Color Shift	Δu′v′ or MacAdam ellipse	Degree of color change during use.	Affects color consistency in lighting scenes.
Thermal Aging	Material degradation	Deterioration due to long-term high temperature.	May cause brightness drop, color change, or open-circuit failure.

Term	Common Types	Simple Explanation	Features & Applications
Package Type	EMC, PPA, Ceramic	Housing material protecting chip, providing optical/thermal interface.	EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure	Front, Flip Chip	Chip electrode arrangement.	Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating	YAG, Silicate, Nitride	Covers blue chip, converts some to yellow/red, mixes to white.	Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics	Flat, Microlens, TIR	Optical structure on surface controlling light distribution.	Determines viewing angle and light distribution curve.

Term	Binning Content	Simple Explanation	Purpose
Luminous Flux Bin	Code e.g., 2G, 2H	Grouped by brightness, each group has min/max lumen values.	Ensures uniform brightness in same batch.
Voltage Bin	Code e.g., 6W, 6X	Grouped by forward voltage range.	Facilitates driver matching, improves system efficiency.
Color Bin	5-step MacAdam ellipse	Grouped by color coordinates, ensuring tight range.	Guarantees color consistency, avoids uneven color within fixture.
CCT Bin	2700K, 3000K etc.	Grouped by CCT, each has corresponding coordinate range.	Meets different scene CCT requirements.

Term	Standard/Test	Simple Explanation	Significance
LM-80	Lumen maintenance test	Long-term lighting at constant temperature, recording brightness decay.	Used to estimate LED life (with TM-21).
TM-21	Standard ya kukadiria maisha	Inakadiria maisha chini ya hali halisi kulingana na data ya LM-80.	Provides scientific life prediction.
IESNA	Illuminating Engineering Society	Covers optical, electrical, thermal test methods.	Industry-recognized test basis.
RoHS / REACH	Environmental certification	Ensures no harmful substances (lead, mercury).	Bukatar shiga kasuwa a duniya.
ENERGY STAR / DLC	Energy efficiency certification	Energy efficiency and performance certification for lighting.	Used in government procurement, subsidy programs, enhances competitiveness.