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H11AAX Series AC Input Optocoupler Datasheet - 6-Pin DIP Package - Isolation Voltage 5000Vrms - Technical Documentation

H11AAX Series AC Input Optocoupler Complete Technical Datasheet. Features include 5000Vrms isolation, reverse-parallel infrared LED input, phototransistor output, and multiple package options.
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PDF Document Cover - H11AAX Series AC Input Photocoupler Datasheet - 6-Pin DIP Package - Isolation Voltage 5000Vrms - Chinese Technical Documentation

1. Product Overview

The H11AAX series is a family of AC input optocouplers (also known as opto-isolators or photocouplers). These devices are specifically designed to provide electrical isolation between AC or unknown polarity DC input circuits and output control circuits. Their core function is to transmit electrical signals using light, thereby eliminating electrical connections and preventing ground loops, voltage spikes, and noise from propagating between circuits.

This series includes four main models: H11AA1, H11AA2, H11AA3, and H11AA4. The primary difference between them lies in the Current Transfer Ratio (CTR), which defines the signal transmission efficiency from the input to the output. These devices utilize a compact 6-pin Dual In-line Package (DIP), offering standard through-hole mounting, wide pin spacing, and Surface Mount Device (SMD) options.

1.1 Core Advantages and Target Market

The H11AAX series offers several key advantages, making it suitable for demanding industrial and consumer applications. Its most prominent feature is an isolation voltage of up to 5000Vrms, which is crucial for the safety and reliability of mains-connected equipment. A creepage distance exceeding 7.62mm further enhances its safety rating. The device is certified by major international safety agencies including UL, cUL, VDE, SEMKO, NEMKO, DEMKO, FIMKO, and CQC, making it globally suitable for products requiring regulatory compliance.

The integrated back-to-back infrared LED configuration at the input is its signature feature. This design allows the device to be driven directly by AC voltage or DC voltage of unknown polarity without the need for an external rectification circuit, thereby simplifying circuit design. The output is a silicon NPN phototransistor.

The target markets and applications are diverse, primarily focusing on areas where electrical isolation and AC signal detection are crucial. Typical applications include AC line monitoring for detecting the presence of mains voltage, telephone line interface circuits, and sensors in industrial control systems for detecting DC signals of unknown polarity.

2. In-depth Analysis of Technical Parameters

This section provides a detailed and objective analysis of the electrical, optical, and thermal characteristics specified in the datasheet. Understanding these parameters is crucial for reliable circuit design.

2.1 Absolute Maximum Ratings

These ratings define the stress limits of the device. Operation beyond these limits may cause permanent damage. Operation under these conditions is not guaranteed.

2.2 Electro-Optical Characteristics

These parameters are typically measured at 25°C and define the device's performance under normal operating conditions.

2.2.1 Input Characteristics

2.2.2 Output Characteristics

2.2.3 Transmission Characteristics

These parameters define the signal transmission efficiency and speed.

3. Grading System Description

The H11AAX series employs a simple grading system based solely on Current Transfer Ratio (CTR).

CTR Grading (X in H11AAX):The numerical suffix (1, 2, 3, 4) directly corresponds to the minimum guaranteed CTR percentage listed in Section 2.2.3. There is no grading based on wavelength, forward voltage, or other parameters. Designers must select the appropriate grade based on the required output current drive capability versus the available input current. For example, the H11AA4 (minimum CTR 100%) has the highest sensitivity and is suitable for applications with very low input drive capability; whereas in circuits with higher available drive current, the H11AA2 may be sufficient and more cost-effective.

4. Performance Curve Analysis

Datasheet ya yi nuni da madaidaicin layukan halayen haske da lantarki. Ko da yake ba a kwafin takamaiman zane-zane a cikin rubutun da aka bayar, amma manufarsu da bayanan da suke isarwa sun zama daidai ga irin wannan kayan aiki.

Madaidaicin layukan sun haɗa da:

Designers should consult these curves in the complete datasheet to understand nonlinear behaviors and derating factors not reflected in the min/typ/max tables.

5. Mechanical and Packaging Information

The device is offered in multiple package variants to accommodate different assembly processes.

5.1 Package Dimensions and Type

Detailed dimension drawings are provided for each type, including body dimensions, lead length, lead pitch, and coplanarity specifications. These are crucial for PCB pad design.

5.2 Pad Layout and Polarity Marking

Recommended pad layouts are provided for the surface mount options (S and S1). The datasheet notes that this is a recommendation, and designers should modify it based on their specific PCB fabrication process and thermal requirements.

Device marking:The top of the package is marked with:
- "EL" (manufacturer code)
- Full model number (e.g., H11AA1)
- 1-digit year code (Y)
- 2-digit week code (WW)
- Optional "V" suffix if the unit is specified for VDE safety certification.

Pin configuration (6-pin DIP):
1. Anode/Cathode (LED1 Anode, LED2 Cathode)
2. Cathode/Anode (LED1 Cathode, LED2 Anode)
3. No Connection (NC)
4. Emitter (Phototransistor)
5. Collector (Phototransistor)
6. Base (Phototransistor). The base pin is typically left floating or connected to the emitter via a resistor for sensitivity adjustment or speed enhancement.

6. Soldering and Assembly Guidelines

A key guideline in the Absolute Maximum Ratings is the soldering temperature: 260°C for a maximum of 10 seconds. This is compatible with standard lead-free (SnAgCu) reflow profiles.

Important Notice:

7. Packaging and Ordering Information

Ordering codes follow the pattern below:H11AAXY(Z)-V

Tape and reel specifications:Provides detailed dimensions for carrier tape (pocket size A, B), cover tape, and reels for automated surface mount assembly.

8. Application Suggestions

8.1 Typical Application Circuit

AC Line Monitor:The input is directly connected across the AC line (with a current-limiting resistor). The output transistor switches synchronously with the AC zero-crossing, providing a digital pulse train or rectified signal to the microcontroller for detecting the presence of the power supply.

Unknown Polarity DC Sensor:Reverse parallel input allows the device to be connected to a DC voltage source without considering polarity, making it ideal for detection in battery-powered devices or industrial sensors where wiring polarity may be reversed.

Telephone Line Interface:Used for ring detection or off-hook detection, providing isolation between the telephone line and logic circuits.

8.2 Design Considerations

9. Technical Comparison and Differentiation

The H11AAX series primarily differentiates itself through itsAC input capability(achieved via a back-to-back LED structure). Most standard optocouplers (e.g., 4N25, PC817) have a single LED input requiring a defined forward bias, thus necessitating an external bridge rectifier for AC operation. The H11AAX integrates this functionality.

Compared to other communication input optocouplers, its main advantage isIsolation rating up to 5000Vrmsandcomprehensive international safety certifications(UL, VDE, etc.), which are crucial for products sold in multiple global markets. The availability of multiple CTR grades and package types (through-hole and SMD) provides design flexibility.

10. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive the H11AAX directly with 120VAC or 230VAC mains?
A: Haiwezi kutumika moja kwa moja. Lazima uunganishe resistor ya kudhibiti mkondo katika mzunguko wa pembejeo. Thamani ya resistor lazima ihesabiwe kulingana na voltage ya kilele ya umeme wa nyumbani (mfano, ~340V kwa 230VAC), mkondo wa mbele unaohitajika, na VF ya LED. Pia lazima uzingatie nguvu ya kiwango cha resistor.

Q2: Ni mzunguko wa juu zaidi wa AC gani naweza kutumia coupler hii ya mwanga?
A: Muda wa juu zaidi wa kubadili ni 10 µs. Kwa nadharia hii inaruhusu mzunguko wa mraba hadi takriban 50 kHz. Hata hivyo, kwa kugundua safi ya mawimbi ya sine ya AC ya 50/60 Hz, inafaa kabisa kwa sababu kipindi chake (16.7ms/20ms) ni refu zaidi kuliko muda wa kubadili.

Q3: Why is there a base pin (pin 6), and how should I use it?
A: The base pin provides access to the base of the phototransistor. Leaving it floating is standard practice. Connecting a resistor between the base and emitter can:
1. Increase speed:A low-value resistor (e.g., 10kΩ to 100kΩ) can shunt the stored charge, reducing the turn-off time (Toff).
2. Reduce sensitivity / Increase threshold:Resistor provides a leakage path, slightly increasing the minimum input current required to turn on the output.

Q4: How do I choose between different CTR grades (H11AA1, AA2, AA3, AA4)?
A: Choose based on your input drive capability and required output current. If your circuit can only provide very small input current (e.g., from a high-voltage resistor), select a higher CTR grade (AA3 or AA4) to obtain sufficient output. If input current is ample, a lower grade (AA1 or AA2) may be more cost-effective. Always design with margin for CTR degradation over time and temperature.

11. Practical Design Case Study

Scenario: Design a 230VAC Mains Presence Detector.

Objective:When 230VAC is present, provide a 3.3V logic high-level signal to the microcontroller.

Design Steps:
1. Component Selection:H11AA1 (minimum CTR 20%) is selected because the input current will be sufficient.
2. Input Resistance Calculation:Peak Voltage = 230V * √2 ≈ 325V. Desired IF ≈ 10mA (for good CTR). VF ≈ 1.2V. R = (325V - 1.2V) / 0.01A ≈ 32.4kΩ. Use a standard 33kΩ resistor. Power dissipation of resistor R: P = (230V)^2 / 33000Ω ≈ 1.6W. A resistor rated for 2W or 3W is required.
3. Output circuit:Connect the collector (pin 5) to the 3.3V microcontroller power supply through a pull-up resistor (e.g., 10kΩ). Connect the emitter (pin 4) to ground. Leave the base (pin 6) floating.
4. How it works:When AC power is present, the output transistor turns on during each half-cycle, pulling the collector (and the MCU input pin) low. The MCU sees a 50/60 Hz pulsating low-level signal, which can be debounced in software to indicate "power on".
5. PCB layout:在PCB上,输入端(引脚1、2、3、电阻)和输出端(引脚4、5、6、MCU)走线之间保持>7.62mm的爬电距离,以保持隔离等级。

12. Working Principle

The H11AAX operates based on the principle of opto-isolation. On the input side, two gallium arsenide infrared light-emitting diodes (LEDs) are connected in inverse parallel. When an AC voltage (with a series current-limiting resistor) is applied, one LED conducts and emits light during the positive half-cycle, while the other LED conducts and emits light during the negative half-cycle. Consequently, infrared light pulses are generated at twice the frequency of the input AC signal.

Wannan hasken yana ratsa cikin shingen keɓewa mai haske a cikin kunsa. A fitarwa, hasken yana haskaka yankin tushe na transistor na silicon NPN phototransistor. Photons suna haifar da nau'ikan lantarki-ramuka, suna samar da igiyar tushe, wanda ke kunna transistor, yana ba da damar igiyar mai tattara (IC) ta gudana. Wannan rabo na igiyar mai tattara da igiyar shigarwa mai kyau shine rabon canja wurin igiyar (CTR). Ƙarfin lantarki na mai tattara-mai fitarwa na phototransistor ana sarrafa shi ta hanyar da'irar kaya na waje.

13. Technology Trends

Teknolojia ya optocoupler inaendelea kukua. Ingawa kanuni za msingi zinabaki sawa, mwelekeo unajumuisha:

The H11AAX series, with its robust design and safety certifications, represents a mature and reliable solution for traditional AC detection and basic isolation needs, with its integrated AC input capability providing significant advantages.

Detailed Explanation of LED Specification Terminology

Complete Interpretation of LED Technical Terminology

I. Core Indicators of Photoelectric Performance

Terminology Unit/Representation Popular Explanation Aiseā e Taua ai
Luminous Efficacy lm/W (lumens per watt) The luminous flux emitted per watt of electrical power; higher values indicate greater energy efficiency. It directly determines the energy efficiency rating of the luminaire and the electricity cost.
Luminous Flux lm (lumen) The total amount of light emitted by a light source, commonly known as "brightness". Determines whether the luminaire is bright enough.
Viewing Angle ° (degree), e.g., 120° The angle at which luminous intensity drops to half, determining the beam width. Affects the range and uniformity of illumination.
Color Temperature (CCT) K (Kelvin), such as 2700K/6500K Launin haske mai dumi ko sanyi, ƙananan ƙima suna karkata zuwa rawaya/dumi, manyan ƙima suna karkata zuwa fari/sanyi. Yana ƙayyade yanayin hasken wuta da kuma yanayin da ya dace.
Color Rendering Index (CRI / Ra) Unitless, 0–100 The ability of a light source to reproduce the true colors of objects, with Ra≥80 being preferable. Affects color fidelity, used in high-demand places such as shopping malls and art galleries.
Color tolerance (SDCM) MacAdam ellipse step, such as "5-step" A quantitative indicator of color consistency; a smaller step number indicates better color consistency. Ensure no color difference among luminaires from the same batch.
Dominant Wavelength nm (nanometer), e.g., 620nm (red) Wavelength values corresponding to the colors of colored LEDs. Determines the hue of monochromatic LEDs such as red, yellow, and green.
Spectral Distribution Wavelength vs. Intensity Curve Shows the intensity distribution of light emitted by an LED at each wavelength. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbols Popular Explanation Design Considerations
Forward Voltage (Forward Voltage) Vf The minimum voltage required to light up an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf; voltages add up when multiple LEDs are connected in series.
Forward Current If The current value that makes the LED emit light normally. Constant current drive is often used, as the current determines brightness and lifespan.
Maximum Pulse Current Ifp The peak current that can be withstood for a short period of time, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled to prevent overheating damage.
Reverse Voltage Vr Maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. Reverse connection or voltage surges must be prevented in the circuit.
Thermal Resistance (Thermal Resistance) Rth (°C/W) The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. High thermal resistance requires stronger heat dissipation design, otherwise junction temperature rises.
Electrostatic Discharge Immunity (ESD Immunity) V (HBM), such as 1000V Electrostatic discharge immunity; a higher value indicates greater resistance to damage from static electricity. Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Key Indicators Popular Explanation Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, the lifespan may double; excessively high temperatures lead to lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) The time required for the brightness to drop to 70% or 80% of its initial value. Directly define the "useful life" of an LED.
Lumen Maintenance % (e.g., 70%) The percentage of remaining brightness after a period of use. Characterizes the ability to maintain brightness after long-term use.
Color Shift Δu′v′ or MacAdam ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Material performance degradation Degradation of packaging materials due to long-term high temperature. Zai iya haifar da raguwar haske, canjin launi ko gazawar bude hanya.

IV. Kullewa da Kayan aiki

Terminology Nau'o'in da aka saba gani Popular Explanation Characteristics and Applications
Package Types EMC, PPA, Ceramics The housing material that protects the chip and provides optical and thermal interfaces. EMC offers good heat resistance and low cost; ceramics provide superior heat dissipation and long lifespan.
Chip Structure Front-side, Flip Chip Chip electrode arrangement method. Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating. YAG, silicate, nitride Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical Design Flat, microlens, total internal reflection The optical structure on the encapsulation surface controls light distribution. Determines the emission angle and light distribution curve.

V. Quality Control and Grading

Terminology Grading Content Popular Explanation Purpose
Luminous Flux Binning Codes such as 2G, 2H Group by brightness level, each group has a minimum/maximum lumen value. Ensure consistent brightness for products in the same batch.
Voltage binning Code such as 6W, 6X Grouped by forward voltage range. Ease of matching drive power supply, improving system efficiency.
Color binning 5-step MacAdam ellipse Group by color coordinates to ensure colors fall within a minimal range. Ensure color consistency to avoid uneven color within the same luminaire.
Color temperature grading 2700K, 3000K, etc. Group by color temperature, each group has a corresponding coordinate range. Meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standard/Test Popular Explanation Meaning
LM-80 Lumen Maintenance Test Long-term operation under constant temperature conditions, recording luminance attenuation data. For estimating LED lifetime (in conjunction with TM-21).
TM-21 Lifetime projection standard Projecting lifespan under actual use conditions based on LM-80 data. Providing scientific life prediction.
IESNA Standard Illuminating Engineering Society Standard Covers optical, electrical, and thermal test methods. Industry-recognized testing basis.
RoHS / REACH Environmental Certification Ensure the product does not contain harmful substances (e.g., lead, mercury). Entry requirements for the international market.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting products. Commonly used in government procurement and subsidy programs to enhance market competitiveness.