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CNY17-X CNY17F-X Optocoupler Datasheet - 6-Pin DIP Package - Isolation Voltage 5000Vrms - Current Transfer Ratio 40-320% - Technical Documentation

Complete technical datasheet for the CNY17-X and CNY17F-X series 6-pin DIP phototransistor couplers, including electrical characteristics, transfer ratio, switching times, package dimensions, and ordering information.
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PDF Document Cover - CNY17-X CNY17F-X Optocoupler Datasheet - 6-Pin DIP Package - Isolation Voltage 5000Vrms - Current Transfer Ratio 40-320% - Technical Document

1. Product Overview

The CNY17-X and CNY17F-X series are families of 6-pin dual in-line package (DIP) optocouplers (also known as opto-isolators). Each device consists of a gallium arsenide infrared light-emitting diode (LED) optically coupled to a silicon NPN phototransistor. Its primary function is to provide electrical isolation between two circuits while allowing signal transmission via light. The main difference between the two series is: the CNY17-X series provides an external base connection pin (pin 6), while the CNY17F-X series does not have this connection (NC), resulting in lower noise sensitivity for the latter.

1.1 Core Advantages and Target Market

These devices are designed for applications requiring reliable signal isolation. Their core advantages include a high isolation voltage of up to 5000 Vrms, a compact DIP form factor suitable for through-hole mounting, and sorted current transfer ratio (CTR) groups for design consistency. They are certified by major international safety standards bodies (UL, cUL, VDE, SEMKO, etc.), making them well-suited for a wide range of industrial, consumer electronics, and power supply applications with stringent safety and noise immunity requirements.

2. In-depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

Absolute Maximum Ratings define the stress limits that may cause permanent damage to the device. These are not recommended operating conditions.

2.2 Electro-Optical Characteristics

These parameters define the performance of the device under typical operating conditions (unless otherwise specified, Ta= 25°C).

2.2.1 Halayen Shigarwa (Infrared LED)

2.2.2 Halayen Fitarwa (Phototransistor)

2.3 Halayen Watsawa

These are the most critical parameters in signal coupling applications.

2.4 Halayen Sauya

Dynamic performance is defined by turn-on/turn-off times and rise/fall times, which depend on test conditions.

3. Grading System Description

Babban rarrabuwar waɗannan na'urorin haɗin haske ya dogara ne akanCurrent Transfer Ratio (CTR). Matakai huɗu (1, 2, 3, 4) suna ba da ƙananan da manyan ƙimar CTR waɗanda ke haɓaka sannu a hankali. Wannan yana ba masu zane damar zaɓar na'urar da ta dace da ribar siginar da ake buƙata, kuma ya tabbatar da daidaiton rukuni na samarwa. Misali, da'irar shigarwar dijital da ke buƙatar sigina mai ƙarfi da bayyananne na iya amfani da darajar -3 ko -4, yayin da da'irar da ke da hankali ga canje-canje na iya ƙayyadad da ƙaƙƙarfan darajar -1 mai ƙarancin riba.

4. Performance Curve Analysis

Takardar bayanai ta ambaci "Lankwila na Halayen Hasken Lantarki na Al'ada". Ko da yake ba a cikin rubutun da aka bayar cikakken bayani game da takamaiman jadawali, lankwila na al'ada na irin waɗannan na'urori sun haɗa da:

These curves are essential for understanding device behavior under non-standard conditions and for optimizing circuit design.

5. Mechanical and Packaging Information

These devices are available in standard 6-pin DIP packages and offer multiple pin form options.

5.1 Package Dimensions and Options

Detailed dimension drawings (in millimeters) are provided for each option, specifying body dimensions, pin length, pin pitch, and mounting plane.

5.2 Pin Configuration and Polarity

Clear pin identification is crucial for proper installation.

6. Soldering and Assembly Guide

The datasheet specifies a maximum soldering temperature of 260°C for 10 seconds. This typically applies to wave soldering or hand soldering for through-hole pins. For surface-mount options (S, S1), a standard infrared or convection reflow profile with a peak temperature not exceeding 260°C should be used. Precautions should be taken during handling to avoid excessive mechanical stress on the package. It should be stored in a dry, anti-static environment within the specified temperature range of -55°C to +125°C.

7. Packaging and Ordering Information

7.1 Model Numbering Rules

The part number follows the format:CNY17-XY(Z)-VCNY17F-XY(Z)-V

7.2 Packaging Specifications

8. Application Recommendations

8.1 Typical Application Circuit

The datasheet lists common uses: power supply regulators (for feedback isolation), digital logic inputs (for level shifting and noise isolation), and microprocessor inputs (for interfacing with noisy external signals). It shows a specific test circuit for switching times (Figure 11), which includes an input current-limiting resistor (RIN), an optional base-emitter resistor for CNY17-X (RBE), and a collector load resistor (RL).

8.2 Design Considerations

9. Technical Comparison

The key internal difference within the series is the presence or absence of an external base pin (present in CNY17-X, absent in CNY17F-X). CNY17-X offers greater design flexibility; the base pin can be left floating, connected to the emitter via a resistor (to improve speed by clearing stored charge), or used for specific bias configurations. CNY17F-X offers superior noise immunity because the phototransistor's base is entirely internal and inaccessible, which is a significant advantage in noisy industrial environments. Both series share the same isolation, voltage, and CTR specifications.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What are the main differences between the -1, -2, -3, and -4 grades?
A: The difference lies in the guaranteed range of the Current Transfer Ratio (CTR). Grade -4 has the highest gain (160-320%), while Grade -1 has the lowest gain (40-80%). Please select based on the required signal amplification factor in your circuit.

Q: When should I use CNY17F-X instead of CNY17-X?
A: Use CNY17F-X when operating in environments with significant electrical noise (e.g., motor drives, industrial control). The lack of an external base connection makes it inherently less susceptible to electromagnetic interference (EMI) coupling into the sensitive base region.

Q: How do I calculate the input series resistor for the LED?
A: Use Ohm's Law: RIN= (VCC_IN- VF) / IF. Assume VFTypical value ≈ 1.2V (max 1.65V). For example, using a 5V supply and expecting IFto be 10mA: RIN= (5V - 1.2V) / 0.01A = 380Ω. Use a standard 390Ω resistor.

Q: Can I use it for AC signal isolation?
A: Yes, but with limitations. The phototransistor output is unidirectional (DC). To transmit an AC signal, typically two optocouplers are needed (one for each half-cycle), or additional circuitry is required to bias the output into its linear region for analog transmission, although linearity is not a specified parameter for this device.

11. Practical Design Examples

Scene:Isolate the 3.3V microcontroller GPIO pin from the 24V industrial sensor signal.

  1. Device Selection:Select CNY17F-3 for good gain (100-200% CTR) and high noise immunity.
  2. Input Side (Microcontroller):The GPIO pin drives the LED through a current-limiting resistor. Assuming VGPIO_HIGH≈ 3.3V, target IF= 5mA: RIN= (3.3V - 1.2V) / 0.005A = 420Ω. Use 430Ω.
  3. Output side (sensor interface):Connect the phototransistor collector to the 24V power supply via a pull-up resistor (RL). The emitter is grounded. Select RLto ensure the output saturates when on and provides a valid logic high level when off. Assuming typical IC≈ CTR * IF= 150% * 5mA = 7.5mA, and the desired output logic high level when off is about 20V: RL≤ (24V - 20V) / (ICEO). Since ICEOThe maximum value is approximately 50nA, making almost any resistance value suitable for leakage current. For switching speed, a 10kΩ resistor is a common starting point. The output (collector node) now provides an isolated, inverted copy of the input signal.

12. Working Principle

An optocoupler works by converting an electrical signal into light, transmitting it across an electrically insulating barrier, and then converting the light back into an electrical signal. In the CNY17-X/F-X series, current (IF) flows through the infrared LED, causing it to emit photons. These photons pass through the transparent insulating molding compound and strike the base region of the silicon phototransistor. The photon energy generates electron-hole pairs in the base region, creating a base current that turns on the transistor, allowing collector current (IC) to flow. The ratio IC/IF即为CTR。输入和输出之间没有电气连接,提供了由模塑化合物的介电强度和内部引脚间距(爬电距离>7.6mm)决定的电气隔离。

13. Technology Trends

Optocoupler technology continues to evolve. While traditional phototransistor-based couplers like the CNY17 series remain popular for their cost-effectiveness and general-purpose isolation, trends are moving towards:
Higher Speeds:Haɓaka ƙwararrun masu haɗa haske da na'urori masu ƙara haɗin gwiwa (misali masu keɓance na dijital) don saurin canja wurin bayanai na Mbps da yawa.
Haɗin kai mafi girma:Haɗa tashoshi masu keɓance da yawa a cikin fakit ɗaya, ko haɗa keɓancewa da wasu ayyuka (kamar tuƙi na ƙofar ko hanyar haɗin ADC).
Ƙarfin aminci da tsawon rai mafi girma:Mai da hankali kan kayan aiki da ƙira, don rage raguwar CTR akan lokaci da zafin jiki.
Ƙananan girma:Ƙaura zuwa ƙananan fakiti masu haɗawa da saman (SOIC, SSOP), tare da kiyayewa ko haɓaka matakin keɓancewa. Zaɓuɓɓukan S da S1 na jerin CNY17 suna nuna wannan yanayin zuwa haɗaɗɗun saman.

Detailed Explanation of LED Specification Terminology

Complete Explanation of LED Technical Terminology

I. Core Indicators of Photoelectric Performance

Terminology Unit/Representation Layman's Explanation Why It Is Important
Luminous Efficacy lm/W The luminous flux emitted per watt of electrical power; higher values indicate greater energy efficiency. Directly determines the energy efficiency rating of the luminaire and the electricity cost.
Luminous Flux lm Total light output from a light source, commonly known as "brightness". Determines if a luminaire is bright enough.
Viewing Angle ° (degrees), e.g., 120° The angle at which light intensity drops to half, determining the width of the light beam. Affects the illumination range and uniformity.
Yanayin zafi na launi (CCT) K (Kelvin), misali 2700K/6500K Launin haske mai dumi ko sanyi, ƙananan ƙima yana karkata zuwa rawaya/dumi, babban ƙima yana karkata zuwa fari/sanyi. Yana ƙayyade yanayin haskakawa da wurin da ya dace.
Ma'aunin nuna launi (CRI / Ra) Ba shi da raka'a, 0–100 The ability of a light source to restore the true color of an object, Ra≥80 is recommended. Affects color fidelity, used in high-demand places such as shopping malls and art galleries.
Color tolerance (SDCM) MacAdam ellipse steps, e.g., "5-step" A quantitative indicator of color consistency; the smaller the step number, the more consistent the color. Ensures no color difference among the same batch of luminaires.
Dominant Wavelength nm (nanometer), e.g., 620nm (red) The wavelength value corresponding to the color of a colored LED. Determines the hue of monochromatic LEDs such as red, yellow, and green.
Spectral Distribution Wavelength vs. Intensity curve Shows the intensity distribution of light emitted by the LED across various wavelengths. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbol Layman's Explanation Design Considerations
Forward Voltage Vf The minimum voltage required to turn on an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf; voltages add up when multiple LEDs are connected in series.
Forward Current If The current value that allows an LED to emit light normally. Constant current drive is often used, as the current determines brightness and lifespan.
Maximum Pulse Current Ifp The peak current that can be withstood in a short time, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur.
Reverse Voltage Vr The maximum reverse voltage that an LED can withstand; exceeding this may cause breakdown. The circuit must be protected against reverse connection or voltage surges.
Thermal Resistance Rth (°C/W) The resistance to heat flow from the chip to the solder point; a lower value indicates better heat dissipation. High thermal resistance requires a stronger heat dissipation design; otherwise, the junction temperature will increase.
Electrostatic Discharge Immunity (ESD Immunity) V (HBM), e.g., 1000V The ability to withstand electrostatic discharge; a higher value indicates greater resistance to damage from static electricity. Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Maɗaukakin Ma'auni Layman's Explanation Tasiri
Junction Temperature Tj(°C) Ainihin zafin aiki a cikin guntu na LED. Kowane raguwa na 10°C, rayuwa na iya tsawaita sau biyu; yawan zafi yana haifar da raguwar haske, karkatar launi.
Lumen Depreciation L70 / L80 (hours) The time required for brightness to drop to 70% or 80% of its initial value. Directly defines the "useful life" of an LED.
Lumen Maintenance % (e.g., 70%) The percentage of remaining brightness after a period of use. Characterizes the ability to maintain brightness after long-term use.
Color Shift Δu′v′ or MacAdam Ellipse The degree of color change during use. Affects the color consistency of a lighting scene.
Thermal Aging Decline in material performance. Degradation of packaging materials due to prolonged high temperatures. May lead to decreased brightness, color change, or open-circuit failure.

IV. Packaging and Materials

Terminology Common Types Layman's Explanation Characteristics and Applications
Package Types EMC, PPA, Ceramic The housing material that protects the chip and provides optical and thermal interfaces. EMC offers good heat resistance and low cost; ceramic provides superior heat dissipation and long lifespan.
Chip Structure Front-side, Flip Chip Chip electrode arrangement. Flip Chip offers better heat dissipation and higher luminous efficacy, suitable for high power.
Phosphor coating YAG, silicate, nitride Coated on the blue LED chip, partially converts to yellow/red light, mixes to form white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical Design Flat, microlens, total internal reflection The optical structure on the package surface controls light distribution. Determines the emission angle and light distribution curve.

V. Quality Control and Binning

Terminology Grading Content Layman's Explanation Purpose
Luminous Flux Grading Codes such as 2G, 2H Grouped by brightness level, each group has a minimum/maximum lumen value. Ensure consistent brightness within the same batch of products.
Voltage Binning Codes such as 6W, 6X Grouping based on forward voltage range. Facilitates driver matching and improves system efficiency.
Color Binning 5-step MacAdam ellipse Group by color coordinates to ensure colors fall within an extremely narrow range. Ensure color consistency to avoid color variation within the same luminaire.
Color temperature binning 2700K, 3000K, etc. Group by color temperature, each group has a corresponding coordinate range. Meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standard/Test Layman's Explanation Significance
LM-80 Lumen Maintenance Test Long-term operation under constant temperature conditions to record brightness attenuation data. Used to estimate LED lifetime (combined with TM-21).
TM-21 Lifetime extrapolation standard Estimate lifetime under actual use conditions based on LM-80 data. Provide scientific lifetime prediction.
IESNA standard Illuminating Engineering Society Standard Covers optical, electrical, and thermal test methods. Industry-recognized testing basis.
RoHS / REACH Environmental Certification Ensures products are free from harmful substances (e.g., lead, mercury). Market access requirements for entering international markets.
ENERGY STAR / DLC Energy efficiency certification. Energy efficiency and performance certification for lighting products. Commonly used in government procurement and subsidy programs to enhance market competitiveness.