Table of Contents
- 1. Product Overview
- 2. In-depth Technical Parameter Analysis
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical and Optical Characteristics
- 3. Bin System Explanation The datasheet clearly states that the device is "binned by luminous intensity." This indicates a binning or sorting process after production. Due to inherent variations in semiconductor epitaxial growth and chip manufacturing processes, LED parameters (such as luminous intensity and forward voltage) may differ across batches or even within the same batch. The binning process involves testing each unit and categorizing it into different groups (bins) based on specific measured parameters. For LTD-5721AKF, the primary binning criterion is the average luminous intensity. Units are grouped according to their light output measured at the standard test current (20mA). This ensures that customers receive displays with consistent brightness levels. Although this brief datasheet does not explicitly detail it, such displays typically also bin forward voltage (VF) to ensure electrical consistency and may bin dominant wavelength (λd) to maintain color consistency, despite its narrow half-width indicating good inherent color purity. 4. Performance Curve Analysis
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Pin Connections and Internal Circuitry
- 6. Soldering and Assembly Guide
- 7. Application Recommendations
- 7.1 Typical Application Scenarios
- 7.2 Design Considerations
- 8. Technical Comparison and Differentiation
- 9. Frequently Asked Questions (Based on Technical Parameters)
- 10. Design Use Case Studies
- 11. Introduction to Technical Principles
- 12. Technology Trends
1. Product Overview
LTD-5721AKF, net, parlak ve güvenilir sayısal okuma gerektiren uygulamalar için tasarlanmış yüksek performanslı, çift haneli bir LED dijital gösterge modülüdür. Temel işlevi, kompakt ve verimli bir paketleme içinde görsel sayısal veri sağlamaktır. Cihazın temel avantajı, LED çiplerinin üretiminde, sarı-turuncu spektrum aralığında yüksek verimlilikle ışık yayma özelliğiyle bilinen gelişmiş AlInGaP (alüminyum indiyum galyum fosfor) yarı iletken teknolojisinin kullanılmasıdır. Bu teknoloji, opak GaAs alt tabaka üzerindeki özel çip yapısıyla birleşerek, bu göstergenin temel performans özelliklerini oluşturur.
This device is classified as a common anode type, which is the standard configuration for simplifying the driving circuit of multi-segment displays. Each digit is equipped with a right-side decimal point, providing flexibility for displaying decimals. The physical design employs a combination of a gray panel and white segment codes, meticulously engineered to maximize contrast and improve character readability under various lighting conditions. The 0.56-inch character height (14.22 mm) makes it suitable for applications requiring information to be read from a medium distance without the need for oversized components.
2. In-depth Technical Parameter Analysis
2.1 Absolute Maximum Ratings
Absolute maximum ratings define the stress limits that may cause permanent damage to the device. It is not recommended to operate the display continuously near or at these limits, as doing so may shorten its service life.
- Power consumption per segment:70 mW. This is the maximum power that a single LED segment can safely dissipate as heat without causing damage.
- Peak forward current per segment:60 mA. This current rating applies to pulse conditions (1 kHz frequency, 10% duty cycle), allowing for higher instantaneous brightness in multiplexed driving schemes.
- Continuous forward current per segment:25 mA at 25°C. This is the maximum recommended DC current for continuous operation of a single segment. A derating factor of 0.28 mA/°C is specified, meaning the maximum allowable continuous current decreases when the ambient temperature (Ta) exceeds 25°C to prevent overheating.
- Reverse voltage per segment:5 V. Applying a reverse voltage exceeding this value may break down the PN junction of the LED.
- Operating and Storage Temperature Range:-35°C to +105°C. This device is rated for industrial-grade temperature tolerance.
- Soldering Conditions:Wave soldering temperature is 260°C, maximum 3 seconds, provided the body temperature of the device does not exceed the maximum rated temperature. This is critical for assembly to prevent thermal damage to the plastic package and internal connections.
2.2 Electrical and Optical Characteristics
These parameters are measured under standard test conditions (Ta = 25°C) and define the typical performance of the device.
- Average luminous intensity (IV):At IF= 20 mA, it is 43.75 mcd (minimum), 70 mcd (typical). This is a measure of the light output power perceived by the human eye. The test condition was revised from 1 mA to 20 mA, indicating the standard operating current for brightness specifications.
- Peak emission wavelength (λp):611 nm (typical value). This is the wavelength at which the spectral power distribution of the emitted light reaches its maximum.
- Spectral line half-width (Δλ):17 nm (typical value). This parameter indicates the spectral purity or bandwidth of the emitted light, measured as the full width at half maximum (FWHM) of the emission peak.
- Dominant wavelength (λd):605 nm (typical value). This is the single wavelength that best represents the perceived color of light, calculated based on the emission spectrum and the CIE color matching functions.
- Forward voltage per segment (VF):At IF= 20 mA, 2.05 V (min), 2.6 V (typical). This is the voltage drop across an LED segment when operating. Designers must ensure the drive circuit can supply this voltage.
- Reverse current per segment (IR):at VRAt = 5 V, it is 100 μA (maximum). This is the tiny leakage current that flows when the specified reverse voltage is applied.
- Luminous intensity matching ratio:For similar luminous areas, the maximum is 2:1. This parameter specifies the maximum allowable ratio between the brightest and darkest segments within the device under the same driving conditions, ensuring visual uniformity.
Measurement description:The luminous intensity value is measured using a combination of a sensor and a filter designed to approximate the CIE photopic luminosity function, which models the spectral sensitivity of the standard human eye under normal (photopic) lighting conditions.
3. Binning System Description
The datasheet explicitly states that the device is "binned by luminous intensity." This indicates that a binning or sorting process exists after production. Due to inherent variations in semiconductor epitaxial growth and chip manufacturing processes, LED parameters (such as luminous intensity and forward voltage) can vary between different batches or even within the same batch.
The binning process involves testing each unit and sorting them into different groups (bins) based on specific measurement parameters. For LTD-5721AKF, the primary binning criteria areAverage Luminous Intensity. Units are grouped based on their measured light output at a standard test current (20mA). This ensures customers receive displays with consistent brightness levels. While not explicitly detailed in this brief datasheet, such displays typically also bin for forward voltage (VF) to ensure electrical consistency and may bin for dominant wavelength (λd) are binned to maintain color consistency, despite its narrow half-width indicating good intrinsic color purity.
4. Performance Curve Analysis
The datasheet references "Typical Electrical/Optical Characteristic Curves" on page 5. Although no specific graphs are provided in the text, we can infer their standard content and significance based on the listed parameters.
Typical curves for such devices include:
- Forward Current vs. Forward Voltage (I-V Curve):This graph shows the nonlinear relationship between the current flowing through an LED and the voltage across it. This is crucial for designing current-limiting circuits. The curve will show a turn-on voltage (approximately 2V), after which the current increases rapidly with a small increase in voltage.
- Luminous Intensity vs. Forward Current (I-L Curve):This graph illustrates how light output increases with drive current. It is typically linear within a certain range but saturates at very high currents due to thermal effects and efficiency droop. This curve validates the 20mA test point for intensity specifications.
- Luminous Intensity vs. Ambient Temperature:This curve shows the derating of light output as the LED junction temperature rises. It is known that the efficiency of AlInGaP LEDs is temperature-dependent, and output typically decreases with increasing temperature. This provides a basis for thermal management design.
- Spectral Distribution:A plot of relative intensity versus wavelength, showing a peak at ~611 nm and a FWHM of ~17 nm, confirming monochromatic yellow-orange emission.
5. Mechanical and Packaging Information
5.1 Package Dimensions
The device utilizes a standard LED display package. The dimension drawing provides critical dimensions for PCB (Printed Circuit Board) pad design and mechanical integration. Key notes in the drawing include:
- All linear dimensions are specified in millimeters (mm).
- The default tolerance for dimensions is ±0.25 mm, unless otherwise specified.
- The specific tolerance for pin tip offset is ±0.4 mm, which is crucial for ensuring proper alignment of pins with PCB holes during automatic insertion.
5.2 Pin Connections and Internal Circuitry
The device adopts a dual in-line package with a total of 18 pins. The internal circuit diagram and pin connection table are crucial for correct electrical interfacing.
- Circuit Type:Common anode. This means the anode terminals of all LED segments for each digit are internally connected together. To illuminate a segment, its corresponding cathode pin must be driven low (connected to ground or a current sink), while the common anode for that digit is driven high (connected to the positive supply through a current-limiting resistor).
- Pinout:A detailed table maps each pin number to its function: the cathode for a specific segment (A-G, DP) of Digit 1 or Digit 2, or the common anode for each digit. For example, Pin 1 is the cathode for segment 'E' of Digit 1, and Pin 14 is the common anode for Digit 1. This precise mapping is crucial for creating the correct driving sequence in the microcontroller or driver IC software.
6. Soldering and Assembly Guide
Proper handling during assembly is crucial for reliability. The specification provides specific soldering parameters.
- Wave soldering:The recommended condition is 260°C for a maximum of 3 seconds. The note "1/16 inch below the mounting plane" may refer to the depth to which the leads should be immersed in the solder wave.
- Key Conditions:The most important precaution is that "the temperature of the device [must] not exceed the maximum rated temperature (during assembly)." This means that throughout the entire soldering process (including preheating and post-heating stages), the temperature of the LED display package itself must never exceed the maximum storage temperature of 105°C. Failure to comply may lead to internal delamination, lens cracking, or degradation of LED chip performance.
- General Operations:Standard ESD (Electrostatic Discharge) precautions should be observed as LED chips are sensitive to static electricity.
7. Application Recommendations
7.1 Typical Application Scenarios
The LTD-5721AKF is suitable for various industrial, commercial, and instrumentation applications requiring compact, bright, and reliable digital displays. Examples include:
- Kayan aikin gwaji da aunawa:Mitocin dijital masu yawa, ƙididdiga na mitar, hanyoyin wutar lantarki, na'urori masu karanta ma'aunin firikwensin.
- Sarrafa masana'antu:Panel instruments for displaying temperature, pressure, speed, or count on machinery.
- Consumer Appliances:High-end kitchen appliances, audio equipment tuners, older model digital clocks or timers.
- Automotive Aftermarket:Instrument and Display Module (though environmental specifications should be verified against specific automotive requirements).
7.2 Design Considerations
- Current Limiting:LED is a current-driven device. A series current-limiting resistor must be used for each common anode connection (or for each segment in more advanced constant-current drive designs) to set the operating current to 20 mA or lower according to derating guidelines. The resistor value is calculated using R = (VPower Supply- VF- VDriver saturation voltage drop) / IF.
- Multiplexed driver:对于双位数显示器,复用是标准的驱动技术。数字一个接一个地快速连续点亮(例如,频率>100 Hz)。这需要顺序控制共阳极引脚(数字)和阴极引脚(段)。这种方法减少了所需的驱动引脚数量和总功耗。
- Viewing Angle:The datasheet claims a "wide viewing angle," which is typical for LED displays with diffuser lenses or surfaces. This should be considered when placing the display in the final product.
- Thermal Management:Although this device can operate at temperatures up to 105°C, its luminous efficacy decreases as temperature rises. To achieve optimal brightness and service life, it is recommended to provide adequate ventilation or heat dissipation in the design, especially when operating near the maximum current or under high ambient temperatures.
8. Technical Comparison and Differentiation
Compared to other digital LED displays (especially older technologies), the key differentiating factors of the LTD-5721AKF include:
- AlInGaP technology versus traditional GaAsP or GaP:Compared to older semiconductor materials, AlInGaP LEDs offer significantly higher luminous efficiency and brightness in red, orange, and yellow colors. This results in better visibility and/or lower power consumption at the same perceived brightness.
- Gray panel / white segment:The specific color combination of panel and segments is designed to achieve high contrast. The grey panel absorbs more ambient light than a black panel, reducing reflections, while the white segment area helps to uniformly diffuse the emitted yellow-orange light, improving character appearance.
- Lead-Free Package (RoHS Compliant):The device construction complies with the Restriction of Hazardous Substances (RoHS) directive, suitable for products sold in markets with stringent environmental regulations. This is a key compliance differentiator.
- Solid State Reliability:Like all LEDs, it surpasses mechanical displays (such as flip-disc displays) or vacuum fluorescent displays (VFD) in terms of shock/vibration resistance, instant start-up capability, and long service life.
9. Frequently Asked Questions (Based on Technical Parameters)
Q1: What is the purpose of the "Luminous Intensity Matching Ratio" being 2:1?
A1: This ratio ensures visual consistency. It guarantees that within a single display unit, when driven under identical electrical conditions, the brightness of any one segment will not exceed twice that of any other segment. This prevents the digits from appearing uneven or "patchy."
Q2: Can I drive this display with a 5V power supply?
A2: Yes, a 5V supply is very common. However, you must connect a current-limiting resistor in series with each common anode. Using a typical VFIt is 2.6V, target IFis 20 mA, the resistance value is approximately (5V - 2.6V) / 0.02A = 120 ohms. A standard 120Ω or 150Ω resistor is suitable, and can be adjusted based on the actual VFand the required brightness.
Q3: What does "common anode" mean for my circuit design?
A3: In a common anode configuration, you apply positive voltage to the common pin of the digit you want to activate. Then, you sink current to ground through the cathode pins of the segments you wish to illuminate on that digit. Your driving circuit (microcontroller or driver IC) must be configured to source current to the anode and sink current from the cathodes.
Q4: Why is the peak wavelength (611nm) different from the dominant wavelength (605nm)?
A4: This is normal for LEDs. The peak wavelength is the literal highest point on the emission spectrum curve. The dominant wavelength is calculated based on the entire spectrum and the human eye's color response; it is the single wavelength of pure light that appears to have the same color. This difference accounts for the shape and asymmetry of the LED's actual emission spectrum.
10. Design Use Case Studies
Scenario: Design a simple digital voltmeter reading display.
A designer is creating a 0-20V DC voltmeter. The analog-to-digital converter (ADC) outputs a binary-coded decimal (BCD) value. This BCD data needs to be converted into 7-segment format and displayed on two digits (e.g., 19.99V).
Implementation:
1. Use a microcontroller with sufficient I/O pins (or a dedicated BCD to 7-segment decoder/driver IC).
2. Connect the microcontroller's I/O pins to the LTD-5721AKF's segment cathodes (A-G, DP).
3. Connect two additional pins of the microcontroller to the two common anodes (Digit 1 and Digit 2).
4. In software, write a multiplexing routine. It first calculates which segments to light for Digit 1 (tens place), enables (sets high) the anode pin for Digit 1, and sets the corresponding segment cathode pins low. After a brief delay (e.g., 5ms), it disables Digit 1, calculates the segments for Digit 2 (ones place), enables the anode for Digit 2, and sets its segment pins low. This cycle repeats rapidly.
5. Place current-limiting resistors (e.g., 150Ω) on the common anode lines between the microcontroller pins and the display. The resistor value is chosen based on the supply voltage (e.g., 5V) and the desired segment current (~20mA).
6. Grey panel/white segment design ensures the display's workbench is easily readable under bright lighting conditions.
11. Introduction to Technical Principles
The core light-emitting component is the AlInGaP LED chip. AlInGaP is a III-V compound semiconductor. By precisely controlling the ratios of aluminum (Al), indium (In), gallium (Ga), and phosphorus (P) during the crystal growth process (typically via Metal-Organic Chemical Vapor Deposition - MOCVD), engineers can adjust the material's bandgap. The bandgap energy directly determines the wavelength (color) of photons emitted when electrons recombine with holes in the junction region.
In the LTD-5721AKF, its composition is adjusted to emit in the yellow-orange region (~605-611 nm). The chip is fabricated on a non-transparent gallium arsenide (GaAs) substrate. The display's "grey panel" is part of the plastic encapsulation molding, which includes a diffuser to evenly spread light from the small chip across the larger segment area. The internal circuitry uses wire bonding to connect the anodes and cathodes of multiple LED chips (one per segment per digit) to the appropriate package pins, forming the common anode matrix described in the pinout arrangement.
12. Technology Trends
While discrete LED numeric displays like LTD-5721AKF remain relevant in specific applications, the broader trends in display technology have shifted. For new designs, designers typically consider:
- Integrated Dot Matrix LED Displays:These displays offer alphanumeric and symbolic capabilities, not just numeric, providing greater flexibility within similar package sizes.
- OLED (Organic LED) Displays:They offer superior contrast, wider viewing angles, and a thinner form factor, although historically their lifespan and cost profile have differed in industrial applications.
- TFT-LCD module:They provide complete graphics capabilities, color, and the ability to display complex information, although they require more complex driving electronics and backlighting.
- LED display internal trends:The efficiency (lumens per watt) of all LED colors continues to improve, developing more robust and temperature-resistant packaging, and integrating drive electronics directly into the display module to simplify system design.
The enduring value of devices like the LTD-5721AKF lies in their simplicity, robustness, high brightness, low cost for purely digital applications, and ease of interfacing with microcontrollers, ensuring their place in the electronic ecosystem for dedicated readout functions.
Detailed Explanation of LED Specification Terminology
Complete Explanation of LED Technical Terms
I. Core Indicators of Photoelectric Performance
| Terminology | Unit/Representation | Layman's Explanation | Why is it important |
|---|---|---|---|
| Luminous Efficacy | lm/W | The luminous flux emitted per watt of electrical power; the higher the value, the more energy-efficient. | It directly determines the energy efficiency rating and electricity cost of the luminaire. |
| Luminous Flux | lm (lumen) | The total amount of light emitted by a light source, commonly known as "brightness". | Determines whether the luminaire is bright enough. |
| Viewing Angle | ° (degree), such as 120°. | The angle at which light intensity drops to half, determining the beam width. | Affects the illumination range and uniformity. |
| Color Temperature (CCT) | K (Kelvin), e.g., 2700K/6500K | The color temperature of light: lower values lean yellow/warm, higher values lean white/cool. | Determines the lighting ambiance and suitable application scenarios. |
| Color Rendering Index (CRI / Ra) | Unitless, 0–100 | The ability of a light source to reproduce the true colors of objects, with Ra≥80 being preferable. | Affects color fidelity, used in high-demand places such as shopping malls and art galleries. |
| Color tolerance (SDCM) | MacAdam ellipse steps, such as "5-step" | A quantitative indicator of color consistency; the smaller the step number, the more consistent the color. | Ensure no color difference among the same batch of luminaires. |
| Dominant Wavelength | nm (nanometer), e.g., 620nm (red) | The wavelength value corresponding to the color of a colored LED. | Determines the hue of monochromatic LEDs such as red, yellow, and green. |
| Spectral Distribution | Wavelength vs. Intensity curve | Shows the intensity distribution of light emitted by an LED across various wavelengths. | Affects color rendering and color quality. |
II. Electrical Parameters
| Terminology | Symbol | Layman's Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Voltage ya chini inayohitajika kuwasha LED, kama "kizingiti cha kuanzisha". | Voltage ya chanzo cha usukumaji lazima iwe ≥ Vf, voltage inajumlishwa wakati LED nyingi zimeunganishwa mfululizo. |
| Forward Current | If | The current value that makes the LED emit light normally. | Constant current drive is often used, as the current determines brightness and lifespan. |
| Maximum Pulse Current | Ifp | Peak current that can be withstood for a short period of time, used for dimming or flashing. | Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur. |
| Reverse Voltage | Vr | Maximum reverse voltage an LED can withstand; exceeding it may cause breakdown. | Reverse connection or voltage surges must be prevented in the circuit. |
| Thermal Resistance | Rth (°C/W) | The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. | High thermal resistance requires a stronger heat dissipation design, otherwise the junction temperature will increase. |
| Electrostatic Discharge Immunity (ESD Immunity) | V (HBM), such as 1000V | Electrostatic discharge immunity, higher value indicates greater resistance to electrostatic damage. | Anti-static measures must be implemented during production, especially for high-sensitivity LEDs. |
III. Thermal Management and Reliability
| Terminology | Key Indicators | Layman's Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures lead to lumen depreciation and color shift. |
| Lumen Depreciation | L70 / L80 (hours) | The time required for brightness to decrease to 70% or 80% of its initial value. | Directly define the "service life" of an LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Color Shift | Δu′v′ or MacAdam Ellipse | The degree of color change during use. | Affects the color consistency of the lighting scene. |
| Thermal Aging | Material performance degradation | Degradation of packaging materials due to prolonged high temperatures. | May lead to decreased brightness, color shift, or open-circuit failure. |
IV. Packaging and Materials
| Terminology | Common Types | Layman's Explanation | Features and Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | The housing material that protects the chip and provides optical and thermal interfaces. | EMC has good heat resistance and low cost; ceramics offer superior heat dissipation and long lifespan. |
| Chip Structure | Face-up, Flip Chip (Flip Chip) | Chip Electrode Layout Method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, silicate, nitride | Covered on the blue light chip, partially converted into yellow/red light, mixed into white light. | Different phosphors affect luminous efficacy, color temperature, and color rendering. |
| Lens/Optical Design | Flat, microlens, total internal reflection | Optical structure of the encapsulation surface, controlling light distribution. | Determines the emission angle and light distribution curve. |
V. Quality Control and Binning
| Terminology | Grading Content | Layman's Explanation | Purpose |
|---|---|---|---|
| Luminous flux binning | Codes such as 2G, 2H | Grouped by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness within the same batch of products. |
| Voltage binning | Codes such as 6W, 6X | Group by forward voltage range. | Facilitates driver power matching and improves system efficiency. |
| Color binning | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within an extremely narrow range. | Ensure color consistency to avoid uneven color within the same luminaire. |
| Color temperature binning | 2700K, 3000K, etc. | Group by color temperature, each group has a corresponding coordinate range. | Satisfying the color temperature requirements for different scenarios. |
VI. Testing and Certification
| Terminology | Standard/Test | Layman's Explanation | Meaning |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term operation under constant temperature conditions, recording luminance attenuation data. | Used for estimating LED lifetime (combined with TM-21). |
| TM-21 | Lifetime projection standard | Life estimation under actual operating conditions based on LM-80 data. | Provide scientific life prediction. |
| IESNA standard | Illuminating Engineering Society Standard | Covers optical, electrical, and thermal test methods. | Industry-recognized testing basis. |
| RoHS / REACH | Environmental certification. | Ensure products do not contain harmful substances (e.g., lead, mercury). | Entry requirements for the international market. |
| ENERGY STAR / DLC | Energy Efficiency Certification | Energy efficiency and performance certification for lighting products. | Commonly used in government procurement and subsidy programs to enhance market competitiveness. |