ALFS1J-C0 LED Takardun Bayani - Kunshin SMD na Ceramic - 425lm @1000mA - 3.25V - Kallon Kwanar 120° - Takardun Fasaha na Hausa

1. Bayanin Samfur

ALFS1J-C0 babban LED ne mai ƙarfi, mai hawa a saman, wanda aka ƙera musamman don aikace-aikacen hasken waje na mota masu buƙatu. An saka shi a cikin kunshin yumbu mai ƙarfi, yana ba da ingantaccen sarrafa zafi da amincin a ƙarƙashin yanayi mai tsanani. Na'urar tana da cancanta bisa ga ƙa'idodin AEC-Q102, yana tabbatar da cewa ta cika ƙa'idodi masu tsauri don kayan lantarki na mota. Aikace-aikacensa na farko sun haɗa da fitilun mota, fitilun gudu na rana (DRL), da fitilun hazo, inda aikin daidaitawa, babban fitarwa na haske, da dorewa na dogon lokaci suke da mahimmanci.

Babban fa'idodin wannan LED sun haɗa da babban ƙarfin haske na al'ada na lumens 425 a lokacin tuƙi na 1000mA, faɗin kwanar kallo na digiri 120 don kyakkyawan rarraba haske, da ƙirar ƙarfi tare da kariya ta ESD har zuwa 8 kV (HBM). Hakanan yana bin ka'idojin RoHS, REACH, da ƙa'idodin marasa halogen, yana sa ya dace da kasuwannin motoci na duniya. Ƙarfin sulfur na samfurin an rarraba shi azaman A1, yana nuna babban juriya ga yanayin iska mai ɗauke da sulfur da ake samu a yanayin mota.

2. Fassarar Ma'ana Mai Zurfi na Sigogi na Fasaha

2.1 Halayen Hasken Haske da Na Lantarki

An ayyana mahimman sigogi na aiki a ƙarƙashin yanayin gwaji na ƙarfin lantarki na gaba (I_F) na 1000mA tare da kiyaye farantin zafi a 25°C. Ƙarfin haske na al'ada (Φ_v) shine 425 lm, tare da mafi ƙarancin 400 lm da matsakaicin 500 lm, ƙarƙashin ƙimar auna na ±8%. Ƙarfin lantarki na gaba (V_F) yawanci yana auna 3.25V, daga 2.90V zuwa 3.80V (±0.05V tolerance). Tsawon zango ko daidaitaccen zafin launi (CCT) yana cikin kewayon 5391K zuwa 6893K, yana rarraba shi azaman LED farin sanyi. An ƙayyade kwanar kallo a matsayin digiri 120, tare da jurewar ±5°.

2.2 Matsakaicin Matsakaici na Ƙarshe da Halayen Zafi

These ratings define the limits beyond which permanent damage may occur. The absolute maximum forward current is 1500 mA. The device is not designed for reverse voltage operation. The maximum junction temperature (T_J) is 150°C, with an operating temperature range of -40°C to +125°C. The thermal resistance from the junction to the solder point is a critical parameter for heat dissipation. The real thermal resistance (R_{th JS real}) is typ. 4.0 K/W (max 4.4 K/W), while the electrical equivalent (R_{th JS el}) is typ. 3.0 K/W (max 3.4 K/W). The maximum power dissipation is 5700 mW.

. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters.

.1 Luminous Flux Binning

Luminous flux is binned in groups, with the provided data showing Group "C". Within this group, bins are defined: Bin 6 (400-425 lm), Bin 7 (425-450 lm), Bin 8 (450-475 lm), and Bin 9 (475-500 lm). The test is performed at the typical forward current with a 25ms pulse, and measurement tolerance is ±8%.

.2 Forward Voltage Binning

Forward voltage is categorized into three groups: Group 1A (2.90V - 3.20V), Group 1B (3.20V - 3.50V), and Group 1C (3.50V - 3.80V). This allows designers to select LEDs with similar V_Ffor better current matching in multi-LED arrays. The measurement tolerance is ±0.05V.

.3 Color (Chromaticity) Binning

The color coordinates on the CIE 1931 chromaticity diagram are binned into specific regions. The datasheet shows bins for cool white LEDs, including 63M, 61M, 58M, 56M, 65L, 65H, 61L, and 61H. Each bin is defined by a quadrilateral area on the x,y coordinate plot. For example, Bin 63M covers coordinates approximately from (0.3127, 0.3093) to (0.3212, 0.3175). The coordinate measurement tolerance is ±0.005.

. Performance Curve Analysis

.1 Forward Current vs. Forward Voltage (IV Curve)

The graph shows the non-linear relationship between forward current and forward voltage at 25°C. The curve is typical for a power LED, with voltage increasing logarithmically with current. This data is essential for designing the driver circuit to ensure the LED operates within its specified voltage range at the desired current.

.2 Relative Luminous Flux vs. Forward Current

This graph illustrates light output relative to the value at 1000mA as a function of drive current. Luminous flux increases with current but may exhibit sub-linear growth at higher currents due to efficiency droop and increased junction temperature.

.3 Thermal Performance Graphs

Several graphs depict performance versus junction temperature (T_J) at I_F=1000mA. TheRelative Luminous Flux vs. Junction Temperaturecurve shows the light output decreasing as temperature rises, a characteristic known as thermal quenching. TheRelative Forward Voltage vs. Junction Temperaturecurve shows V_Fdecreasing linearly with increasing temperature, which can be used for junction temperature estimation. TheChromaticity Coordinates Shift vs. Junction Temperaturegraph shows how the color point (CIE x, y) changes with temperature, which is crucial for color-critical applications.

.4 Forward Current Derating Curve

This is a critical design graph. It plots the maximum allowable forward current against the solder pad temperature (T_S). As T_Sincreases, the maximum permissible current must be reduced to prevent the junction temperature from exceeding 150°C. The curve provides specific derating points: e.g., at T_S=110°C, I_Fcan be 1500mA; at T_S=125°C, I_Fmust be reduced to 1200mA. Operation below 50mA is not recommended.

.5 Spectral Distribution

The relative spectral power distribution graph shows the intensity of light emitted across wavelengths from approximately 400nm to 800nm at 25°C and 1000mA. It characterizes the LED's cool white light, typically produced by a blue LED chip combined with a phosphor layer.

. Mechanical and Package Information

The LED uses a surface-mount device (SMD) ceramic package. Ceramic offers superior thermal conductivity compared to plastic packages, facilitating better heat transfer from the LED junction to the printed circuit board (PCB). This is vital for maintaining performance and longevity in high-power applications like automotive lighting. The specific mechanical dimensions, including length, width, height, and pad locations, are detailed in the mechanical drawing section of the datasheet. The package includes a thermal pad for efficient soldering to a thermal land on the PCB.

. Soldering and Assembly Guidelines

.1 Recommended Soldering Pad Layout

A recommended land pattern (footprint) for PCB design is provided. This pattern ensures proper solder joint formation, electrical connection, and most importantly, optimal thermal transfer from the LED's thermal pad to the PCB's copper plane. Adhering to this layout is crucial for reliability.

.2 Reflow Soldering Profile

The datasheet specifies a reflow soldering profile with a peak temperature of 260°C. This profile defines the time-temperature curve that the assembly must follow during the reflow process. Key parameters include preheat, soak, reflow, and cooling rates and durations. Following this profile prevents thermal shock to the ceramic package and ensures reliable solder joints without damaging the internal LED structure.

.3 Precautions for Use

General handling and usage precautions are outlined. These include warnings against applying reverse voltage, exceeding absolute maximum ratings, and improper soldering techniques. It also emphasizes the importance of static discharge (ESD) protection during handling, even though the device has built-in ESD protection up to 8kV.

. Packaging and Ordering Information

The product is supplied in tape and reel packaging suitable for automated pick-and-place assembly machines. Packaging information details the reel dimensions, tape width, pocket spacing, and orientation of the components on the tape. The part number structure (e.g., ALFS1J-C010001H-AM) encodes specific attributes such as the series, bin codes for flux and color, and other variant information. Ordering information guides the user on how to specify the desired bin combinations when placing an order.

. Application Suggestions

.1 Typical Application Scenarios

The primary designed applications areAutomotive Exterior Lightingsystems. This includes:
- Headlamps (Low/High Beam): Where high luminous intensity and precise beam control are required.
- Daytime Running Lights (DRL): Requiring high efficiency and visibility.
- Fog Lamps: Needing good penetration in adverse weather conditions.
The wide viewing angle and high flux make it suitable for both primary light sources and supplementary lighting functions.

.2 Design Considerations

1. Thermal Management: This is the most critical aspect. The PCB must have an adequate thermal design—using thick copper layers, thermal vias, and possibly an external heatsink—to keep the solder pad temperature (T_S) as low as possible. Refer to the derating curve for current limits.
2. Drive Current: While the LED can be driven up to 1500mA, operating at or below the typical 1000mA provides a better balance of light output, efficiency, and thermal load, enhancing long-term reliability.
3. Optical Design: The 120° viewing angle requires appropriate secondary optics (lenses, reflectors) to shape the beam for the specific application (e.g., a focused beam for headlights).
4. Electrical Design: Use a constant-current LED driver compatible with the forward voltage bin. For arrays, consider bin selection and possible use of current-balancing techniques.

. Technical Comparison and Differentiation

Compared to standard commercial or industrial LEDs, the ALFS1J-C0 offers several key differentiators essential for automotive use:
- AEC-Q102 Qualification: This is a mandatory reliability standard for automotive LEDs, involving rigorous tests for temperature cycling, humidity, solder heat resistance, and more.
- Ceramic Package: Provides better thermal performance and long-term stability under high temperature and humidity than plastic packages (e.g., PPA, PCT).
- Sulfur Robustness (Class A1): Specifically tested and guaranteed to resist corrosion from sulfur-containing gases, a common failure mode in automotive environments.
- High ESD Rating (8kV HBM): Offers greater protection against electrostatic discharge during handling and assembly.
- Extended Temperature Range (-40°C to +125°C): Guarantees operation in the extreme temperatures encountered by vehicles.

. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the actual light output I can expect from Bin C7?
A: Bin C7 specifies a luminous flux range of 425-450 lm when measured at I_F=1000mA and T_s=25°C. Considering the ±8% measurement tolerance, the actual measured value for a specific LED could be between approximately 391 lm and 486 lm under those ideal test conditions. In a real application with higher temperature, the output will be lower.

Q: How do I determine the required heatsink based on the thermal data?
A: You need to perform a thermal calculation. The key parameter is the real thermal resistance, R_{th JS real}(typ. 4.0 K/W). This is the resistance from the junction to the solder point. You must add the thermal resistance from the solder point to the ambient (through the PCB, thermal interface material, and heatsink) to calculate the total R_{th JA}. Using the formula T_J= T_A+ (R_{th JA}× Power Dissipation), you can ensure T_Jremains below 150°C, preferably with a safety margin. The derating curve provides a simplified guide based on solder pad temperature.

Q: Can I drive this LED with a constant voltage source?
A: It is strongly discouraged. LEDs are current-driven devices. Their forward voltage has a negative temperature coefficient and varies from unit to unit (as seen in the voltage bins). A constant voltage source could lead to thermal runaway: as the LED heats up, V_Fdrops, causing current to increase, which generates more heat, further dropping V_Fand increasing current until failure. Always use a constant-current driver or a circuit that actively regulates the current.

. Practical Design and Usage Case

Case: Designing a Daytime Running Light (DRL) Module
A designer is creating a DRL module for a passenger car. The design calls for 6 LEDs to achieve the desired brightness and form factor.
1. Bin Selection: To ensure uniform appearance, the designer specifies tight color bins (e.g., 61M ± 1 step) and a single luminous flux bin (e.g., C7). They may also specify a tight forward voltage bin (e.g., 1A) to improve current sharing in a simple series configuration.
2. Thermal Design: The module will be mounted in a confined space. The designer uses a metal-core PCB (MCPCB) with a 2oz copper layer. Thermal simulation is run to ensure the solder pad temperature does not exceed 110°C in the worst-case ambient temperature (e.g., 85°C inside the headlamp assembly). According to the derating curve, at T_S=110°C, the full 1500mA is permissible, but the designer chooses to drive at 1000mA for better efficacy and longevity.
3. Electrical Design: The 6 LEDs are placed in a series string. The total forward voltage at 1000mA will be approximately 6 × 3.25V = 19.5V (typ), but could range from ~17.4V to 22.8V based on binning. A buck-boost constant-current LED driver is selected to accommodate this voltage range from a 12V automotive battery system (nominal 12V, but operating from 9V to 16V).
4. Optical Design: A secondary optic (a TIR lens) is designed over each LED to collimate the 120° emission into a controlled horizontal fan beam suitable for a DRL signature.

. Principle Introduction

The ALFS1J-C0 is a phosphor-converted white LED. The fundamental principle involves a semiconductor chip (typically made of indium gallium nitride - InGaN) that emits blue light when forward biased (electroluminescence). This blue light is partially absorbed by a cerium-doped yttrium aluminum garnet (YAG:Ce) phosphor layer deposited over the chip. The phosphor down-converts a portion of the blue photons to longer wavelengths, primarily in the yellow region. The mixture of the remaining blue light and the converted yellow light is perceived by the human eye as white light. The exact ratio of blue to yellow, and the inclusion of other phosphors, determines the correlated color temperature (CCT) and color rendering index (CRI). The ceramic package serves as a robust substrate for mounting the chip and phosphor, and as an efficient heat spreader.

. Development Trends

The evolution of automotive LEDs like the ALFS1J-C0 follows several clear industry trends:
1. Increased Luminous Efficacy (lm/W): Ongoing improvements in chip design, phosphor efficiency, and package thermal management aim to deliver more light output for the same electrical input power, reducing energy consumption and thermal load.
2. Higher Power Density and Miniaturization: There is a push to achieve higher flux from smaller package footprints, enabling more compact and stylized lighting designs.
3. Improved Color Consistency and Stability: Advancements in phosphor technology and binning processes lead to tighter color tolerances and reduced color shift over temperature and lifetime.
4. Enhanced Reliability and Robustness: Standards like AEC-Q102 are continuously evolving, and new tests are added to address real-world failure modes, such as sulfur resistance, which has become a key requirement.
5. Integration and Smart Lighting: The future points towards integrated modules that combine LEDs, drivers, sensors, and communication interfaces for adaptive front-lighting systems (AFS) and communication via light (Li-Fi or V2X signaling).
6. Specialized Spectra: Development of spectra optimized for specific purposes, such as improved visibility in fog or reduced glare for oncoming traffic, is an active area of research.