LED Lamp Bead 6324-15SUBC/S400-X10 Datasheet - Blue - 3.3V Forward Voltage - 20mA Operating Current - Technical Documentation

1. Product Overview

This document provides the complete technical specifications for the high-brightness blue LED lamp bead model 6324-15SUBC/S400-X10. This device belongs to a product series specifically designed for applications requiring exceptional luminous output. The LED utilizes a standard lamp bead-style package structure, suitable for a wide range of electronic assembly processes. Its core design prioritizes reliability and robustness across various operating environments.

This device complies with major environmental and safety directives, including RoHS (Restriction of Hazardous Substances), the EU REACH regulation, and is manufactured as a halogen-free component. This compliance ensures the product meets stringent international standards for electronic components. The LED is supplied in tape-and-reel packaging, suitable for automated SMT assembly, thereby enhancing efficiency in high-volume production environments.

1.1 Core Advantages and Target Market

The primary advantage of this LED lies in the combination of its high luminous intensity and reliable packaging. Under a standard 20mA drive current, its typical luminous intensity is 500 millicandelas (mcd), providing significant brightness for its form factor. This product is specifically designed for general indicator and backlighting applications in consumer and industrial electronics. The main target markets include manufacturers of televisions, computer monitors, telephones, and various computer peripherals, where consistent, bright blue indication or illumination is required. The availability of multiple viewing angles allows designers to select the optimal light radiation pattern for their specific application, balancing wide-area coverage against axial intensity.

2. Detailed Technical Parameters

This section provides a detailed and objective analysis of the key technical parameters defined in its specification sheet. Understanding these specifications is crucial for proper circuit design and ensuring long-term reliability.

2.1 Absolute Maximum Ratings

Absolute Maximum Ratings define the stress limits that may cause permanent damage to the device. These are not operating conditions.

• Continuous Forward Current (I_F)): 25 mA. This is the maximum DC current that can be continuously applied to the LED.
• Peak Forward Current (I_FP)): 100 mA. Iri na ƙimar wutar lantarki na bugun jini (duty cycle 1/10, mitar 1 kHz) yana ba da izinin tuƙi na ɗan lokaci, wanda ya dace da aikace-aikacen multiplex ko strobe.
• Reverse voltage (V_R)): 5 V. Wuce wannan ƙarfin lantarki a ƙarƙashin karkatar da baya na iya haifar da karyewar haɗin gwiwa.
• Power dissipation (P_d)): 90 mW. This is the maximum power that the package can dissipate in the form of heat, calculated as the forward voltage multiplied by the forward current.
• Operating and Storage Temperature: The device can operate at -40°C to +85°C and can be stored at -40°C to +100°C.
• Soldering Temperature: Pins can withstand 260°C for 5 seconds, which is compatible with standard lead-free reflow soldering temperature profiles.

2.2 Electro-Optical Characteristics

These parameters are measured at an ambient temperature of 25°C and a forward current (I_F) are measured under standard test conditions, unless otherwise specified.

• Luminous intensity (I_v)): Typical value is 500 mcd, minimum value is 250 mcd. This specifies the perceived brightness of the LED by the human eye.
• Viewing angle (2θ_1/2)): 60 degrees (typical). This is the full angle at which the luminous intensity drops to half of its peak axial value.
• Peak wavelength (λ_p)): 468 nm (typical). This is the wavelength at which the spectral power distribution of the emitted light reaches its maximum.
• Dominant wavelength (λ_d)): 470 nm (typical value). This is the single wavelength perceived by the human eye, defining the LED's "blue".
• Spectral Radiant Bandwidth (Δλ): 35 nm (typical value). This indicates the spectral width of the emitted light, measured at Full Width at Half Maximum (FWHM).
• Forward Voltage (V_F)): Ranges from 2.7V (minimum) to 3.7V (maximum), with a typical value of 3.3V at 20mA. This is crucial for designing current-limiting circuits.
• Reverse Current (I_R)): Maximum 50 μA when a 5V reverse bias is applied.

The datasheet also specifies the measurement uncertainty: V_Fis ±0.1V, I_v±10%, λ_d.

±1.0nm.

3. Explanation of the Grading System

• CATThe product employs a binning system that classifies units based on key optical and electrical parameters. This ensures consistency within production batches, making it suitable for applications requiring strict color or brightness matching. The packaging label includes codes for these bins:
• HUELuminous Intensity Grade. Units are binned according to measured light output.
• REFDominant Wavelength Grade. LEDs are binned according to their specific blue hue.

Forward Voltage Grade. LEDs are grouped according to their forward voltage drop at test current.

Designers should consult the supplier for specific bin code definitions and availability to ensure the selected bin meets the application requirements for color consistency and electrical performance.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate the device's behavior under various conditions. This is crucial for understanding performance beyond the single-point specification of 25°C/20mA.

4.1 Relationship Between Relative Intensity and Wavelength

This curve graphically displays the spectral power distribution, with a peak at approximately 468 nm and a typical full width at half maximum of 35 nm, confirming the monochromatic blue emission of the InGaN chip.

4.2 Directivity Pattern

The polar plot illustrates the spatial distribution of light, corresponding to a 60-degree viewing angle. The intensity is highest along the central axis (0°) and symmetrically decreases towards the edges.

4.3 Forward Current vs. Forward Voltage Relationship (I-V Curve)_FThis curve shows a typical exponential relationship for a diode. The forward voltage increases logarithmically with current. At the recommended 20mA operating point, the typical voltage is 3.3V. This curve is crucial for thermal management because V

has a negative temperature coefficient.

4.4 Relative Intensity vs. Forward Current Relationship

The graph indicates that within the normal operating range, light output is approximately linear with current. Driving the LED beyond its maximum rating does not proportionally increase light output but instead generates excessive heat.

4.5 Temperature Dependence Curve_aTwo key curves show the ambient temperature (T

• ) no he:Relationship between Relative Strength and Ambient Temperature
• As the ambient temperature increases, the light output decreases. This derating must be considered in designs intended for operation at high temperatures.Relationship between forward current and ambient temperature_F: For a fixed voltage, due to the negative temperature coefficient of V

, the forward current increases with temperature. This highlights the extreme importance of using a constant current driver rather than a constant voltage source to prevent thermal runaway.

5. Mechanical and Packaging Information

• LED is encapsulated in a standard lamp bead-style housing. The package drawing provides critical dimensions for PCB pad design and clearance verification.
• All dimensions are provided in millimeters.
• A key note specifies that the flange height must be less than 1.5mm (0.059 inches).
• The default tolerance for unspecified dimensions is ±0.25mm.

Drawings typically show pin pitch, package body dimensions, lens shape, and the cathode indicator location (usually a flat or shorter pin).

Designers must strictly adhere to these dimensions when creating PCB pad patterns to ensure proper soldering and alignment.

6. Soldering and Assembly Guide

Correct operation is crucial for maintaining reliability. The datasheet provides detailed instructions.

• 6.1 Pin Forming
• The bending point must be at least 3mm away from the epoxy lamp body base.
• Form the leads before soldering.
• Avoid applying stress to the package; clip the leads at room temperature.

PCB holes must align perfectly with LED pins to avoid installation stress.

• 6.2 Storage
• Storage conditions: temperature ≤30°C, relative humidity ≤70%. Shelf life is 3 months from the date of shipment.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.

Avoid sudden temperature changes in humid environments to prevent condensation.

6.3 Welding ProcessManual soldering: Soldering iron tip temperature ≤300°C (max 30W), time ≤3 seconds, solder joint distance from lamp body ≥3mm.Wave soldering/Dip soldering

: Preheat ≤100°C (≤60 seconds), solder bath ≤260°C for ≤5 seconds, solder joint distance from lamp body ≥3mm. A recommended soldering temperature profile is provided, showing a gradual temperature rise, a plateau within the 260°C limit, and a controlled cooling slope. Rapid cooling is not recommended. Avoid multiple soldering cycles and applying mechanical stress while the LED is hot.

6.4 Cleaning

If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute. Avoid ultrasonic cleaning unless pre-verified, as it may damage the chip or bonding wires.

6.5 Thermal Management

Thermal design is crucial. At higher ambient temperatures, the operating current must be derated (refer to the derating curve). The temperature around the LED in the final application must be controlled to maintain performance and lifespan.

6.6 Electrostatic Discharge (ESD) Protection

LEDs are sensitive to ESD and surge voltages, which can damage the semiconductor chip. Standard ESD handling procedures (e.g., grounded workstations, wrist straps) must be followed during assembly and operation.

7. Packaging and Ordering Information

7.1 Packaging Specifications

• LED is packaged in the following manner to provide protection and facilitate automated handling:
• Place in antistatic bag.
• Antistatic bag into inner box.
• Inner box into master carton.Packaging Quantity

: Minimum 200 to 500 pieces per bag. 5 bags per inner box. 10 inner boxes per outer carton.

7.2 Labeling Instructions

• CPNPackaging labels include:
• : Customer Part Number.P/N
• QTY: Manufacturer Part Number (6324-15SUBC/S400-X10).
• : Quantity per package.CAT/HUE/REF
• Binning code for intensity, wavelength, and voltage.LOT No

Traceable production batch number.

8. Application Recommendations

8.1 Typical Application Scenarios

• As previously listed, the primary application is as status indicators or backlights for the following devices:
• Televisions and monitors (power, input source indicators).
• Telephones (message waiting, line status).

Kompyuta na vifaa vya nje (nguvu imewashwa, shughuli ya diski ngumu).

Mwangaza wake mkubwa pia hufanya uwe unaofaa kwa taa za jopo katika mazingira yenye mwanga wa kutosha.

• 8.2 Design ConsiderationsDriver circuit_F: Always use a series current-limiting resistor or constant current driver. Use the formula R = (Power supply voltage - V_F) / I_Fto calculate the resistor value. Use the maximum V
• value from the datasheet to ensure the current does not exceed the limit under all conditions.Thermal management
• : On the PCB, ensure there is sufficient copper foil area around the LED pins to act as a heat sink, especially when driving close to the maximum current.Viewing angle
• : Select the appropriate viewing angle model for the application. A 60-degree viewing angle provides a good balance between axial brightness and wide-range visibility.ESD protection

: In sensitive environments, consider adding a transient voltage suppression (TVS) diode or a small capacitor in parallel with the LED (with a resistor in series) to prevent voltage spikes.

9. Technical Comparison and Differentiation

• Although a direct comparison with competitors requires specific alternative models, according to its datasheet, the key differentiating features of this LED include:High Brightness
• : A typical value of 500 mcd at 20mA, which is a significant output for a standard lamp bead package.Full Compliance
• Simultaneous compliance with RoHS, REACH, and halogen-free standards is a strong advantage for the global market and environmentally conscious designs.Robust Specifications
• Clear absolute maximum ratings and detailed operating instructions reduce application risk.Tape and reel supply

Supports high-speed automated assembly, reducing manufacturing costs for mass production.

10. Frequently Asked Questions (Based on Technical Parameters)Q1: Can I drive this LED directly with a 5V power supply?_FA: No. Its typical forward voltage is 3.3V. Direct connection to 5V will cause excessive current and may damage the LED. You must use a current-limiting resistor. For example, using a 5V supply, target current 20mA, and using the maximum V

value of 3.7V for safety: R = (5V - 3.7V) / 0.020A = 65 ohms. A 68-ohm resistor would be a standard choice.Q2: Why does the luminous intensity decrease when the ambient temperature rises?

A: This is a fundamental characteristic of semiconductor LEDs. As the temperature increases, the efficiency of the radiative recombination process that generates light inside the InGaN chip decreases, resulting in lower light output for the same electrical input. The derating curve quantifies this effect.Q3: What is the difference between peak wavelength and dominant wavelength?

A: Peak wavelength (468 nm) is the physical peak of the emission spectrum. Dominant wavelength (470 nm) is a calculated value representing the single wavelength of pure monochromatic light that is perceived by the human eye as having the same color as the LED output. They are typically close but not identical.Q4: How critical is the 3mm distance for soldering and pin bending?

A: Extremely critical. The epoxy lamp body is sensitive to thermal and mechanical stress. Maintaining a 3mm distance ensures that soldering heat does not cause thermal shock to the epoxy (leading to cracking or delamination) and that bending stress is not transferred to the fragile internal bond wires connected to the semiconductor die.

11. Practical Design and Usage Cases Scenario: Designing a front panel power indicator for a desktop computer.RequirementsVisible in a bright room, powered by the system's 5V standby power rail, ensuring long-term reliable operation.Design Steps:Component Selection: Due to its high brightness (typical 500 mcd), this blue LED is suitable.Circuit Calculation_F: Using the 5V standby power rail. Assuming a conservative V_FFor 3.5V, the desired I²is 15mA (for longer lifespan and lower heat generation), the resistance value is R = (5V - 3.5V) / 0.015A = 100 ohms. The resistor's power rating: P = I²R = (0.015)* 100 = 0.0225W. A standard 1/8W (0.125W) resistor is more than sufficient.PCB Layout: Place the LED at the front panel location. Arrange large area copper pour around the cathode and anode pins as a heat sink. Design the pad pattern according to the package dimensions.Assembly

: If the PCB is assembled via wave soldering process, follow wave soldering guidelines to ensure the LED is placed last or shielded as much as possible to minimize thermal exposure.

12. Introduction to Working Principles

As shown in the materials section, this LED is based on an indium gallium nitride (InGaN) semiconductor chip. When a forward voltage exceeding the diode threshold (approximately 2.7V) is applied, electrons and holes are injected into the chip's active region. When these carriers recombine, they release energy in the form of photons (light). The specific composition of the InGaN alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, blue (~470 nm). The epoxy resin lens is used to protect the chip, shape the light output beam (60-degree viewing angle), and enhance light extraction efficiency from the semiconductor material.

13. Teknoloji Trendleri

• LED technology continues to evolve. While this component represents a mature standard product, the broader industry trends affecting such devices include:Efficiency improvements
• : Ongoing materials science research aims to increase the lumens per watt (luminous efficacy) of LEDs, reducing energy consumption for the same light output.Miniaturization
• The drive for smaller electronic devices is pushing LED package sizes to continuously shrink while maintaining or increasing brightness.Enhanced Reliability
• Improvements in packaging materials and die-attach technology continue to extend operational lifespan and tolerance to harsh environments.Smart Integration

The trend is toward LEDs that integrate drivers, controllers, or even sensors within the package, though this is more common in high-end lighting modules than in basic indicator lights.