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LED Lamp 204-10SYGC/S530-E2 Datasheet - 5mm Round - Voltage 2.0V - Brilliant Yellow Green - 60mW - English Technical Document

Complete technical datasheet for the 204-10SYGC/S530-E2 Brilliant Yellow Green LED lamp. Includes detailed specifications, electro-optical characteristics, package dimensions, soldering guidelines, and application notes.
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PDF Document Cover - LED Lamp 204-10SYGC/S530-E2 Datasheet - 5mm Round - Voltage 2.0V - Brilliant Yellow Green - 60mW - English Technical Document

1. Product Overview

The 204-10SYGC/S530-E2 is a high-brightness, through-hole LED lamp designed for applications requiring reliable and robust illumination. It utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip to produce a Brilliant Yellow Green light output. The device is housed in a standard 5mm round, water-clear epoxy resin package, offering a compact and versatile solution for various indicator and backlighting applications.

This LED series is engineered to deliver consistent performance with a choice of viewing angles. It is compliant with major environmental and safety standards, including RoHS (Restriction of Hazardous Substances), EU REACH regulation, and is manufactured as a Halogen-Free component, ensuring its suitability for modern electronic designs with stringent material requirements.

1.1 Core Advantages and Target Market

The primary advantages of this LED lamp include its high luminous intensity, reliable construction, and broad environmental compliance. Its robust design makes it suitable for applications where long-term reliability is critical. The product is available on tape and reel for automated assembly processes, enhancing manufacturing efficiency.

The target applications for this device are primarily in consumer and industrial electronics where clear, bright indication is needed. Typical use cases include status indicators, backlighting for buttons or panels, and general-purpose illumination in compact spaces. Its specifications make it a suitable choice for cost-effective yet reliable lighting solutions.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key technical parameters specified in the datasheet. Understanding these values is crucial for proper circuit design and ensuring the LED operates within its safe operating area (SOA).

2.1 Absolute Maximum Ratings

Absolute Maximum Ratings ihe nkọwa nke oke nrụgide nke nwere ike imebi ngwaọrụ ahụ kpamkpam ma ọ bụrụ na agafere ya. Ndị a abụghị ọnọdụ maka ọrụ nkịtị.

2.2 Electro-Optical Characteristics

Iɓe parameter ɗin, an auna su a daidaitaccen gwajin na'ura na 20 mA da yanayin yanayi na 25°C, suna bayyana aikin haske da na lantarki na LED.

Measurement Uncertainties: The datasheet notes specific tolerances for key measurements: ±0.1V for VF, ±10% for Iv, and ±1.0nm for λd. These must be considered in precision applications.

3. Performance Curve Analysis

The provided characteristic curves offer valuable insights into the LED's behavior under varying conditions, which is essential for robust system design.

3.1 Relative Intensity vs. Wavelength

Wannan jadawalin rarraba haske yana nuna fitowar haske a matsayin aikin tsayin raƙuman ruwa. Ga AlGaInP-based yellow-green LED, bakan yawanci koli ɗaya ne, kunkuntar kunkuntar da ke tsakiya a kusa da tsayin raƙuman ruwa (573 nm typ). Cikakken faɗi a rabin matsakaici (FWHM), wanda aka nuna ta hanyar bandwidth na radiation na bakan (Δλ) na 20 nm typ, yana bayyana tsaftar launi. Ƙunƙuntar bandwidth yana nuna launi mai cikakkiyar jikewa, tsafta.

3.2 Directivity Pattern

The directivity (or radiation pattern) curve illustrates how light intensity varies with angle from the central axis. For a LED with a 20° viewing angle, this curve will show a sharp drop in intensity beyond approximately ±10° from the center. This pattern is influenced by the shape of the epoxy lens and the position of the chip within the package.

3.3 Forward Current vs. Forward Voltage (I-V Curve)

This fundamental curve demonstrates the exponential relationship between current and voltage in a semiconductor diode. For LEDs, the "turn-on" or "knee" voltage is clearly visible. Operating significantly above this knee voltage results in a rapid increase in current for a small increase in voltage. This highlights the critical importance of using a current-limiting mechanism (almost always a series resistor for simple circuits) rather than attempting to drive an LED with a constant voltage source alone.

3.4 Relative Intensity vs. Forward Current

This curve shows that light output (luminous intensity) is generally proportional to forward current, but the relationship is not perfectly linear, especially at higher currents. Efficiency (light output per unit of electrical input) may decrease at very high currents due to increased heat generation and other non-ideal effects. It is important to operate within the recommended current range for optimal efficiency and longevity.

3.5 Thermal Characteristics

The curves for Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature are crucial for thermal management.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED is housed in a standard 5mm round radial-leaded package. Key dimensional notes from the datasheet include:

The dimensional drawing provides precise measurements for the lead spacing, body diameter, lens height, and lead length and diameter. These are critical for PCB footprint design, ensuring proper fit in the mounting holes and correct positioning of the lens relative to the panel or diffuser.

4.2 Polarity Identification

For radial-leaded LEDs, the cathode is typically identified by a flat spot on the rim of the plastic flange and/or by the shorter lead length. The datasheet diagram should clearly indicate which lead is the cathode (usually the one marked with the flat edge). Correct polarity is essential for device operation.

5. Soldering and Assembly Guidelines

Adhering to these guidelines is paramount to ensuring the reliability and longevity of the LED after assembly.

5.1 Lead Forming

5.2 Soldering Process

The datasheet provides specific recommendations for both hand and dip soldering:

5.3 Storage Conditions

LEDs are moisture-sensitive devices. The recommended storage after shipment is at 30°C or less and 70% relative humidity or less, with a shelf life of 3 months. For longer storage (up to one year), they should be kept in a sealed container with a nitrogen atmosphere and desiccant. Rapid temperature changes in humid environments must be avoided to prevent condensation inside the package.

5.4 Cleaning

If cleaning is necessary after soldering, use only isopropyl alcohol at room temperature for no more than one minute. Ultrasonic cleaning is strongly discouraged as the high-frequency vibrations can fracture the delicate wire bonds inside the package. If absolutely required, the process must be carefully qualified beforehand.

6. Heat and ESD Management

6.1 Heat Management

Gaskata mai inganci na thermal shine mabuɗin amincin LED da kuma fitar da haske mai tsayayye. Dole ne a rage yawan ƙarfin lantarki daidai a yanayin zafi mafi girma, kamar yadda aka nuna ta hanyar lanƙwasa rage ƙarfin lantarki. Dole ne a sarrafa yanayin zafi da ke kewaye da LED a aikace-aikacen ƙarshe. Wannan sau da yawa ya haɗa da la'akari da tsarin PCB (yankin tagulla don yada zafi), iskar yanayi, da yuwuwar amfani da heatsinks don aikace-aikacen ƙarfi mai ƙarfi ko yawan girma.

6.2 ESD (Electrostatic Discharge) Protection

Die na semiconductor yana da matukar hankali ga fitar da wutar lantarki ta electrostatic. Abubuwan ESD na iya haifar da gazawa nan take ko lalacewa a ɓoye wanda ke rage amincin dogon lokaci. Dole ne a bi tsarin sarrafa ESD daidai a duk matakan samarwa, haɗawa, da sarrafawa. Wannan ya haɗa da amfani da tashoshin aiki masu tushe, igiyoyin wuyan hannu, da kwantena masu ɗaukar wutar lantarki. Kayan tattarawa da aka ƙayyade (jakunkuna anti-electrostatic) an ƙera su ne don kare na'urori yayin jigilar su da adanawa.

7. Packaging and Ordering Information

7.1 Packing Specification

LEDs are packaged to ensure protection from moisture, electrostatic discharge, and physical damage.

7.2 Label Explanation

The packing labels contain several codes for traceability and identification:

8. Application Suggestions and Design Considerations

8.1 Typical Application Circuits

The most basic and common drive circuit for a single LED is a series current-limiting resistor. The resistor value is calculated as: R = (Vsupply - VF) / IF. For example, with a 5V supply, a typical VF of 2.0V, and a desired IF of 20mA: R = (5V - 2.0V) / 0.020A = 150 Ω. The power rating of the resistor should be at least P = IF2 * R = (0.02)2 * 150 = 0.06W, so a standard 1/8W (0.125W) or 1/4W resistor is sufficient.

For driving multiple LEDs, they are typically connected in series (if the supply voltage is high enough to overcome the sum of VFs) with a single resistor, or in parallel each with its own series resistor. Parallel connection without individual resistors is not recommended due to VF variation between LEDs, which can cause uneven current sharing and brightness.

8.2 Design Considerations

9. Technical Comparison and Differentiation

Compared to older technology like GaP (Gallium Phosphide) based green LEDs, this AlGaInP device offers significantly higher brightness and efficiency for a given current. The Brilliant Yellow Green color is often more visually distinct and vibrant than standard green.

Within its own category of 5mm round LEDs, its key differentiators are its specific combination of high typical luminous intensity (250 mcd), narrow viewing angle (20°), and full compliance with modern environmental standards (RoHS, REACH, Halogen-Free). The detailed and conservative maximum ratings and handling guidelines also indicate a design focused on robustness and reliability in demanding applications.

10. Frequently Asked Questions (FAQ)

Q: Can I drive this LED with a 3.3V supply?
A: Yes. Using the formula R = (3.3V - 2.0V) / 0.020A = 65 Ω. A 68 Ω standard resistor value would give IF ≈ 19.1 mA, which is acceptable.

Q: Why is the soldering distance (3mm from the bulb) so important?
A: Heat travels up the metal leads. If solder is applied too close to the epoxy bulb, the excessive heat can soften or crack the epoxy, damage the internal seal, or re-melt the internal wire bonds, leading to immediate or intermittent failure.

Q: The datasheet shows a typical intensity of 250 mcd. What does the minimum of 125 mcd mean for my design?
A: You must design your optical system (e.g., brightness required behind a diffuser) based on the minimum guaranteed value (125 mcd) to ensure all units in your production run meet the requirement. The typical value is what most units will achieve, but there is natural variation.

Q: Can I use this LED outdoors?
A: Kewayon zafin aiki (-40°C zuwa +85°C) yana ba da damar amfani da shi a waje dangane da zafin jiki. Duk da haka, fakitin epoxy na iya zama mai saukin lalacewa ta UV da shigar danshi a cikin dogon lokaci idan ba a rufe shi da kyau ko kuma ba a kare shi ba. Don wuraren waje masu tsauri, ana ba da shawarar LED da aka ƙayyade musamman don irin waɗannan yanayi (sau da yawa tare da ruwan tabarau na silicone).

11. Practical Application Example

Scenario: Zayyana panel mai nuna matsayi don kayan aikin masana'antu. The panel has multiple indicators showing power, fault, and standby status. Space is limited, and indicators need to be visible in brightly lit environments.

Design Choice: The 204-10SYGC/S530-E2 LED is selected for the "Standby" indicator due to its bright yellow-green color, which is distinct from red (fault) and green (power on). Its 20° viewing angle ensures the light is directed towards the operator's line of sight without excessive spill, improving contrast. The LED is driven at 15 mA (below the 20mA test current) via a current-limiting resistor from the equipment's 24V DC rail. This lower current increases longevity and reduces heat. The PCB footprint is designed exactly per the package dimensions, with 0.8mm holes for the leads. During assembly, a dedicated soldering fixture ensures the 3mm clearance rule is maintained during wave soldering. The final assembly passes a 48-hour burn-in test to screen for early failures.

12. Operating Principle

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. The 204-10SYGC/S530-E2 uses an AlGaInP (Aluminum Gallium Indium Phosphide) compound semiconductor. When a forward voltage is applied across the p-n junction, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers (electrons and holes) recombine, they release energy. In this specific material system, the energy bandgap is such that the released energy corresponds to a photon in the yellow-green wavelength range (~573 nm). The water-clear epoxy resin package serves as a lens, shaping the light output beam and protecting the delicate semiconductor chip.

13. Technology Trends

While through-hole LEDs like the 5mm round package remain popular for prototyping, educational use, and certain industrial applications, the overall industry trend has shifted significantly towards surface-mount device (SMD) packages (e.g., 0603, 0805, 2835, 5050). SMD LEDs offer advantages in automated assembly, board space savings, and often better thermal performance due to a lower profile and direct connection to the PCB pad acting as a heatsink.

Furthermore, the efficiency (lumens per watt) of LED technology continues to improve across all color ranges due to advancements in epitaxial growth, chip design, and package extraction efficiency. For indicator applications, the focus is often on reliability, color consistency, and cost-effectiveness rather than pushing absolute efficiency limits. Compliance with evolving environmental regulations (like Halogen-Free requirements) remains a key driver for component updates and new product introductions.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Kwanin Duba ° (digiri), misali, 120° Kwanin da ƙarfin haske ya ragu zuwa rabi, yana ƙayyade faɗin katako. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), misal, 2700K/6500K Gumi/ƙanƙanin haske, ƙananan ƙimomi suna da rawaya/dumi, mafi girma farare/sanyi. Yana ƙayyade yanayin hasken da ya dace da yanayi.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Halin zazzabi aiki na ainihi a cikin guntun LED. Kowane raguwar 10°C na iya ninka tsawon rayuwa; yawan zafi yana haifar da raguwar haske, canjin launi.
Kupungua kwa Lumen L70 / L80 (masaa) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: yana da kyau mai jure zafi, farashi mai rahusa; Ceramic: mafi kyau zubar da zafi, tsawon rai.
Tsarin Chip Gaba, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X An rarrabe ta hanyar kewayon ƙarfin lantarki na gaba. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse An rarraba ta hanyar daidaitawar launi, tabbatar da kewayon matsi. Yana ba da tabbacin daidaiton launi, ya guji rashin daidaiton launi a cikin kayan haske.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Standard ya kukadiria maisha Inakadiria maisha chini ya hali halisi kulingana na data ya LM-80. Inatoa utabiri wa kisayansi wa maisha.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Takaddama muhalli Tabbatar da babu abubuwa masu cutarwa (dariya, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.