Takardar Bayani na Fasaha na LED Infrared 1W na Ceramic 3535 - Girman 3.5x3.5x0.9mm - Ƙarfin Lantarki 1.5V - Ƙarfi 1W - Infrared 850nm

1. Bayyani Game da Samfur Jerin Ceramic 3535 LED ne mai ƙarfi, wanda aka ƙera don aikace-aikacen da ke buƙatar hasken infrared mai ƙarfi da dogaro. Wannan na'urar 1W tana amfani da tushe na yumbu, yana ba da ingantaccen sarrafa zafi da kwanciyar hankali na dogon lokaci idan aka kwatanta da marufi na filastik na gargajiya. Babban tsayin raƙuman da ake fitarwa shine 850nm, wanda ya sa ya dace da faffadan aikace-aikacen ganowa, hangen nesa na inji, da tsaro.

Babban fa'idodin wannan jerin sun haɗa da kyakkyawan ikon kawar da zafi saboda ginin yumbu, faɗin kusurwar kallo na digiri 120 don ɗaukar hoto mai faɗi, da ƙaramin ƙafa na 3.5mm x 3.5mm wanda ke sauƙaƙa tsarin PCB mai yawan girma. Kasuwannin da aka yi niyya sune sarrafa masana'antu, tsarin sa ido, na'urori masu auna halittu (biometric sensors), da kowane aikace-aikacen da ke buƙatar hasken infrared mai ƙarfi da kuma ci gaba.

2. Ma'auni na Fasaha da Fassarar Manufa

2.1 Matsakaicin Matsakaicin Matsakaici Waɗannan ma'auni suna bayyana iyakokin da za su iya haifar da lalacewa ta dindindin ga na'urar. Ba a ba da garantin aiki a ƙarƙashin waɗannan sharuɗɗan ba.

Ƙarfin Lantarki na Gaba (IF):

500 mA (DC)

• Ƙarfin Lantarki na Bugun Jini na Gaba (IFP):700 mA (Faɗin bugun jini ≤10ms, Zagayowar aiki ≤1/10)
• Rushewar Ƙarfi (PD):1000 mW
• Yanayin Zafin Aiki (Topr):-40°C zuwa +100°C
• Yanayin Zafin Ajiya (Tstg):-40°C zuwa +100°C
• Yanayin Zafi na Junction (Tj):125°C
• Yanayin Zafin Solder (Tsld):Solder reflow a 230°C ko 260°C na iyakar dakika 10.
• 2.2 Halayen Lantarki da Na'urar Gani (Na al'ada @ Ta=25°C) Waɗannan ma'auni suna wakiltar aikin al'ada a ƙarƙashin ƙayyadaddun yanayin gwaji.Ƙarfin Lantarki na Gaba (VF):

1.5 V (Na al'ada), 2.0 V (Matsakaici) a IF=350mA. Ƙarancin ƙarfin lantarki na gaba yana ba da gudummawa ga ingantaccen tsarin tsarin.

Ƙarfin Lantarki na Baya (VR):

• 5 V. Wuce wannan ƙarfin lantarki a cikin bias na baya zai iya haifar da gazawa nan da nan.Tsayin Raƙuman Kololuwa (λd):
• 850 nm. Wannan shine tsayin raƙuman da ƙarfin haske ya fi girma.Ƙarfin Lantarki na Baya (IR):
• 50 μA (Matsakaici) a VR=5V.Kusurwar Kallo (2θ1/2):
• Digiri 120. Wannan faɗin kusurwa yana ba da tsarin haske mai faɗi da daidaito.2.3 Halayen Zafi Marufin yumbu shine babban siffar zafi. Kayan yumbu suna da babban yanayin zafi, wanda ke canja wurin zafi daga junction na LED chip zuwa PCB da muhalli yadda ya kamata. Wannan yana shafar rayuwar na'urar da kiyaye haske kai tsaye. Ƙirar zafi daidai akan PCB na aikace-aikace, gami da isasshen yanki na tagulla da yuwuwar heatsinking, yana da mahimmanci don kiyaye yanayin zafi na junction ƙasa da matsakaicin ƙimar 125°C, musamman lokacin aiki a cikin cikakken ƙarfin tuƙi na 350mA.
• 3. Bayanin Tsarin Rarraba (Binning) An rarraba samfurin zuwa rukunoni don tabbatar da daidaito a cikin rukunin samarwa. Masu ƙira yakamata su ƙayyade rukunoni don tabbatar da daidaiton aiki a cikin aikace-aikacensu.3.1 Rarraba Ƙarfin Lantarki na Gaba (VF) Ana rarraba LED ɗin dangane da ƙarfin lantarki na gaba (VF) a ƙarfin gwajin.

Lambar A:

VF = 1.4V zuwa 1.6V

Lambar B:

VF = 1.6V zuwa 1.8V

Lambar C:

VF = 1.8V zuwa 2.0V

• Lura: Matsakaicin ma'auni shine ±0.08V.Zaɓin ƙaƙƙarfan rukunin ƙarfin lantarki zai iya sauƙaƙa ƙirar da'irar ƙayyade ƙarfin lantarki.
• 3.2 Rarraba Tsawon Raƙuman Kololuwa (λd) Ga wannan takamaiman samfurin (T1901PIA), an rarraba tsayin raƙuman kamar haka:Lambar I2:
• λd = 845nm zuwa 865nm. Wannan ƙaƙƙarfan kewayon 20nm ya dace da aikace-aikacen da ke da hankali ga takamaiman tsayin raƙuman infrared, kamar wasu nau'ikan hangen dare ko na'urori masu auna haske.4. Bincike akan Maƙallan Aiki Takardar bayani tana ba da bayanan hoto masu mahimmanci don ƙirar da'ira da zafi.

4.1 Ƙarfin Lantarki na Gaba da Ƙarfin Lantarki na Gaba (Maƙalar I-V) Wannan maƙalar tana nuna alaƙar ƙarfin lantarki da ƙarfin lantarki. VF na al'ada na 1.5V a 350mA shine mahimmin batu. Masu ƙira suna amfani da wannan maƙalar don zaɓar masu hana ƙarfin lantarki da suka dace ko don ƙirar tuƙi na ƙarfin lantarki mai tsayi. Maƙalar za ta canza tare da zafin jiki; ƙarfin lantarki yana raguwa yayin da yanayin zafi na junction ya ƙaru don wani ƙarfin lantarki.4.2 Ƙarfin Haske Mai Dangantaka da Yanayin Zafi na Junction Wannan jadawalin yana kwatanta raguwar zafi na fitarwar LED. Gabaɗaya LED ɗin infrared suna nuna raguwar inganci da zafi idan aka kwatanta da LED ɗin da ake iya gani, amma har yanzu fitarwa yana raguwa yayin da yanayin zafi na junction ya tashi. Dole ne a yi la'akari da wannan a cikin sarrafa zafi don tabbatar da ci gaba da aiki a tsawon rayuwar samfurin da kuma a cikin yanayin aiki.

4.3 Maƙalar Rarraba Raƙuman Ruwa (Spectral Distribution) Maƙalar tana tabbatar da babban tsayin raƙuman 850nm kuma tana nuna faɗin raƙuman ruwa. Ƙunƙuntaccen faɗin raƙuman ruwa shine na al'ada ga masu fitar da infrared masu inganci. Fahimtar bakan yana da mahimmanci don haɗawa da na'urori masu gano haske ko na'urori masu ɗaukar hoto waɗanda ke da takamaiman amsawar bakan.

5. Bayanin Injiniya da Marufi

• 5.1 Girman Marufi da Zanen Tsari Na'urar tana da jikin yumbu mai murabba'i mai auna 3.5mm x 3.5mm. Matsakaicin tsayi shine kusan 0.9mm. An ba da cikakkun zane-zane masu girma tare da ƙimar ƙima (misali, ±0.10mm don girman .X, ±0.05mm don girman .XX) don daidaitaccen tsarin PCB.5.2 Tsarin Gado Mai Shawara da Ƙirar Stencil An ba da shawarar ƙirar ƙirar ƙasa don tabbatar da ingantaccen solder da mafi kyawun canja wurin zafi. Tsarin gado yawanci ya haɗa da gadaje anode/cathode guda biyu da babban gado na zafi. An ƙayyade ƙirar stencil (maganin solder paste) kuma, galibi ana ba da shawarar rage buɗaɗɗen buɗaɗɗen don babban gado na zafi don hana gada solder da yawan yawan manna. Bin waɗannan shawarwari yana da mahimmanci don cimma haɗin solder da dogaro da haɓaka kawar da zafi daga gado na zafi zuwa cikin PCB.

5.3 Gano Polarity (Anode/Cathode) Ana yiwa alama cathode a saman marufi, sau da yawa tare da launin kore ko tsaga/ɓangaren da aka yanke akan ruwan tabarau. Ya kamata ƙafar PCB ta haɗa da alamar polarity da ta dace da wannan fasalin don hana sanya ba daidai ba.

6. Jagororin Solder da Haɗawa

6.1 Ma'auni na Solder Reflow LED ɗin ya dace da daidaitattun hanyoyin reflow na infrared ko convection. Matsakaicin zafin jiki shine 260°C, tare da lokacin da ya wuce ruwa (misali, 217°C) bai wuce dakika 10 ba. Ya kamata a bi shawarar bayanin reflow don guje wa girgizar zafi. Gabaɗaya marufin yumbu yana da juriya ga ɗaukar danshi fiye da marufi na filastik, amma har yanzu ƙa'idodin kulawa na al'ada don na'urori masu hankali ga danshi (MSD) na iya shiga dangane da takamaiman kayan da aka yi amfani da su.

6.2 Kula da Sarrafawa da Ajiya Ajiye LED a cikin busasshiyar muhalli, mai hana tashin hankali. A guji matsin lamba na injiniya akan ruwan tabarau. Yi amfani da matakan kariya na ESD yayin sarrafawa. Kada a tsaftace tare da masu tsaftacewa na ultrasonic bayan solder, saboda hakan na iya lalata tsarin ciki.

7. Bayanin Marufi da Oda

7.1 Marufi na Kaset da Reel Ana ba da samfurin akan kaset ɗin mai ɗaukar kaya da aka nannade akan reels, wanda ya dace da injunan haɗawa da zaɓi da sanyawa ta atomatik. Girman kaset (girman aljihu, tsalle) an daidaita su. Yawan reel yawanci dubunnan guda ne a kowane reel.

7.2 Tsarin Lambar Model Lambar sashi (misali, T1901PIA) tana ɓoye mahimman halaye:

T:

Mai gano jerin.

19:

Lambar marufi don Ceramic 3535.

P:

Lambar ƙidaya don babban mutu ɗaya.

I:

Lambar launi don Infrared (IR).

A:

Lambar ciki ko lambar rukuni.

Ƙarin kari na iya nuna rukunin ƙarfin lantarki, rukunin tsayin raƙuman ruwa, da sauransu.

Sauran lambobin da aka ayyana a cikin tsarin sun haɗa da launi (R, G, B, Y, W, da sauransu), ƙidayar mutu (S, P, 2, 3), da nau'in ruwan tabarau (00 don babu, 01 don ruwan tabarau).

8. Shawarwari na Aikace-aikace

8.1 Yanayin Aikace-aikace na Al'ada Sa ido & Tsaro: Haskakawa don kyamarori na CCTV tare da tacewa na IR, yana ba da hangen dare marar ganuwa. Hangen Nesa na Injini: Hasken tsari, haɓaka bambanci, ko gano lahani a cikin tsarin bincike ta atomatik. Na'urori masu Auna Halittu (Biometric Sensors): Gane iris, gane fuska, ko na'urori masu sikanin yatsa. Kusanci & Hankalin Gesture: Ana amfani da shi a cikin kayan lantarki na mabukaci da aikace-aikacen mota. Maɓalli & Maɓallan Hasken Gani (Optical Switches & Encoders): Samar da tushen haske don ganowa na tushen katsewa.

8.2 Abubuwan da Ya Kamata a Yi la'akari da su a Ƙirar Da'irar Direba: Yi amfani da direban ƙarfin lantarki mai tsayi don ingantaccen fitarwa. Ƙarancin VF yana ba da damar aiki daga wadatar ƙarfin lantarki mai ƙarancin ƙarfi. Yi la'akari da amfani da mai daidaita canji don aiki mai inganci a cikakken ƙarfi. Sarrafa Zafi: Wannan shine mafi mahimmanci. Haɗa gado na zafi zuwa babban zubar da tagulla akan PCB tare da hanyoyin zafi da yawa zuwa sassan ciki ko heatsink na gefen ƙasa. Ana ba da shawarar kwaikwayon zafi don aikace-aikacen mai ƙarfi ko babban zafin muhalli. Ƙirar Hasken Gani (Optical Design): Ƙarfin haske na digiri 120 na iya buƙatar na'urori na biyu (ruwan tabarau, masu watsawa) don siffanta haske don takamaiman aikace-aikace. Saman marufin yumbu bazai dace da haɗin gani kai tsaye ba; sau da yawa ana haɗa ruwan tabarau na farko.

9. Kwatancen Fasaha da Bambanci Idan aka kwatanta da daidaitattun LED 3535 na filastik, wannan sigar yumbu tana ba da fa'idodi masu mahimmanci: Mafi Girman Aikin Zafi: Ƙananan juriya na zafi daga junction zuwa allon, wanda ke haifar da ƙarancin yanayin zafi na aiki, mafi girman yuwuwar ƙarfin tuƙi, da tsayin rayuwa sosai a babban ƙarfi. Ƙarfafa Dogaro: Yumbu ba shi da ƙarfi kuma baya lalacewa ko rawaya a ƙarƙashin zafi mai zafi ko fitowar UV, sabanin wasu robobi. Hakanan yana da juriya ga fashewar injiniya. Ingantaccen Fitarwar Hasken Gani: Mafi kyawun sarrafa zafi yana haifar da mafi kwanciyar hankali tsayin raƙuman ruwa da ƙarfin haske akan lokaci da zagayowar zafin jiki. Cinikin shine yawanci ɗan tsada na naúrar idan aka kwatanta da marufi na filastik.

10. Tambayoyin da Ake Yawan Yi (Dangane da Ma'auni na Fasaha)

10.1 Menene bambanci tsakanin ƙarfin lantarki na gaba (IF) da ƙarfin lantarki na bugun jini (IFP)? IF (500mA) shine matsakaicin ƙarfin lantarki na DC na ci gaba da LED ɗin zai iya ɗauka. IFP (700mA) shine matsakaicin ƙarfin lantarki da aka yarda a cikin gajerun bugun jini (faɗin ≤10ms, zagayowar aiki ≤10%). Bugun jini yana ba da damar mafi girman fitarwar haske na nan take, mai amfani a cikin aikace-aikacen strobe ko bugun jini na ganowa, amma matsakaicin ƙarfi bai kamata ya wuce iyakar 1W ba.

• 10.2 Ta yaya zan zaɓi rukunin ƙarfin lantarki (voltage bin) daidai? Idan ƙirar ku tana amfani da mai hana ƙarfin lantarki mai sauƙi don iyakance ƙarfin lantarki, ƙaƙƙarfan rukunin VF (misali, duk Lambar B) yana tabbatar da ƙarfin lantarki mafi daidaito saboda haka daidaiton haske a duk LED ɗin da ke cikin jeri. Don ƙira ta amfani da direbobi masu aiki na ƙarfin lantarki mai tsayi, rukunin ƙarfin lantarki ba shi da mahimmanci, saboda direban zai daidaita ƙarfin lantarki don kiyaye ƙarfin lantarki da aka saita.10.3 Shin zan iya tuka wannan LED ba tare da heatsink ba? A cikakken ƙimar 350mA/1W, hanyar zafi da ta dace wajibi ne. Marufin yumbu yana taimakawa, amma dole ne a haɗa shi da tsarin sarrafa zafi na PCB. Don ƙananan ƙarfin tuƙi (misali, 100-200mA) ko aikin bugun jini, buƙatun ba su da tsauri, amma har yanzu ana ba da shawarar binciken zafi.
• 11. Nazarin Aikace-aikace na Aiki Yanayi: Babban Sikanin Barcode na Masana'antu mai Sauri. Sikanin yana buƙatar karanta lambobi akan fakitin da ke tafiya da sauri. Tsarin yana amfani da jerin LED infrared 850nm mai bugun jini don haskaka manufa. An zaɓi LED na Ceramic 3535 saboda ikonsa na sarrafa manyan ƙarfin bugun jini (har zuwa 700mA) don walƙiya masu haske, gajeren lokaci, ɗaukar hotuna masu tsabta ba tare da blur motsi ba. Kwanciyar hankali na zafi na marufin yumbu yana tabbatar da daidaiton girman bugun jini da tsayin raƙuman ruwa a cikin dogon lokacin aiki a cikin yanayin masana'antu mai dumi. Faɗin ƙarfin haske na digiri 120 yana ba da damar ƙananan LED ɗin su rufe filin sikanin. An ƙera PCB tare da kauri na tagulla da hanyoyin zafi a ƙarƙashin kowane gado na zafi na LED don kawar da matsakaicin zafin da aka samar yayin aikin bugun jini.12. Gabatarwa akan Ƙa'idar Aiki LED Infrared (IR LED) yana aiki akan ƙa'idar electroluminescence ɗaya da LED ɗin da ake iya gani. Lokacin da aka yi amfani da ƙarfin lantarki na gaba a kan junction p-n, electrons da ramuka suna sake haɗuwa a cikin yanki mai aiki, suna sakin makamashi a cikin nau'in photons. Tsayin raƙuman ruwa (launi) na hasken da aka fitar an ƙaddara shi ta hanyar ƙarfin bandgap na kayan semiconductor da aka yi amfani da su. Don fitarwa na 850nm, ana amfani da kayan kamar Aluminum Gallium Arsenide (AlGaAs). Marufin yumbu yana aiki da farko azaman gida mai ƙarfi da kuma mai ɗaukar zafi don mutuwar semiconductor, haɗin waya, da na'urar gani na farko (idan akwai).
• 13. Trends da Ci gaban Fasaha Trend a cikin manyan LED ɗin infrared yana zuwa ga mafi girman ingancin bangon toshe (ƙarin fitarwar haske a kowace watt na lantarki) da ƙara yawan ƙarfi. Wannan yana haifar da amfani da fasahar guntu mai ci gaba (flip-chip, thin-film) da kayan marufi kamar yumbu da tushen ƙarfe don mafi kyawun sarrafa zafi. Hakanan ana mai da hankali kan inganta dogaro da tsawon rayuwa a ƙarƙashin yanayi mai tsauri (zafi mai zafi, babban danshi). Bugu da ƙari, haɗakar direbobi da na'urori tare da LED cikin ƙira masu wayo wani trend ne mai girma, yana sauƙaƙa ƙirar tsarin ga masu amfani na ƙarshe. Bukatar takamaiman, ƙunƙuntaccen rukunin tsayin raƙuman ruwa don aikace-aikacen ganowa yana ci gaba da tura ci gaba a cikin girma na kayan epitaxial da injiniyan na'ura.Die count code for a single high-power die.
• I:Color code for Infrared (IR).
• A:Internal code or bin code.
• Additional suffixes may indicate voltage bin, wavelength bin, etc.

Other codes defined in the system include color (R, G, B, Y, W, etc.), die count (S, P, 2, 3), and lens type (00 for none, 01 for lens).

. Application Suggestions

.1 Typical Application Scenarios

• Surveillance & Security:Illumination for CCTV cameras with IR-cut filters, providing invisible night vision.
• Machine Vision:Structured light, contrast enhancement, or defect detection in automated inspection systems.
• Biometric Sensors:Iris recognition, facial recognition, or fingerprint scanners.
• Proximity & Gesture Sensing:Used in consumer electronics and automotive applications.
• Optical Switches & Encoders:Providing the light source for interruption-based sensing.

.2 Design Considerations

• Driver Circuit:Use a constant current driver for stable output. The low VF allows for operation from low-voltage supplies. Consider using a switching regulator for high-efficiency operation at full power.
• Thermal Management:This is paramount. Connect the thermal pad to a large copper pour on the PCB with multiple thermal vias to inner layers or a bottom-side heatsink. Thermal simulation is recommended for high-power or high-ambient-temperature applications.
• Optical Design:The 120-degree beam may require secondary optics (lenses, diffusers) to shape the light for specific applications. The ceramic package surface may not be ideal for direct optical coupling; a primary lens is often incorporated.

. Technical Comparison and Differentiation

Compared to standard plastic 3535 LEDs, this ceramic version offers significant advantages:

• Superior Thermal Performance:Lower thermal resistance from junction to board, leading to lower operating junction temperature, higher maximum drive current potential, and significantly longer lifetime at high power.
• Enhanced Reliability:Ceramic is inert and does not degrade or yellow under high-temperature or high-UV exposure, unlike some plastics. It is also more resistant to mechanical cracking.
• Stable Optical Output:Better thermal management results in more stable wavelength and radiant power over time and temperature cycles.
• The trade-off is typically a slightly higher unit cost compared to plastic packages.

. Frequently Asked Questions (Based on Technical Parameters)

.1 What is the difference between forward current (IF) and pulse current (IFP)?

IF (500mA)is the maximum continuous DC current the LED can handle.IFP (700mA)is the maximum current allowed in short pulses (≤10ms width, ≤10% duty cycle). Pulsing allows for higher instantaneous radiant output, useful in strobe or pulsed-sensing applications, but average power must not exceed the 1W limit.

.2 How do I select the correct voltage bin?

If your design uses a simple series resistor for current limiting, a tighter VF bin (e.g., all Code B) ensures more consistent current and therefore consistent brightness across all LEDs in an array. For designs using active constant-current drivers, the voltage bin is less critical, as the driver will adjust the voltage to maintain the set current.

.3 Can I drive this LED without a heatsink?

At the full 350mA/1W rating, a proper thermal path is mandatory. The ceramic package helps, but it must be connected to the PCB's thermal management system. For lower drive currents (e.g., 100-200mA) or pulsed operation, the requirements are less stringent, but thermal analysis is still recommended.

. Practical Application Case Study

Scenario: High-Speed Industrial Barcode Scanner.A scanner needs to read codes on fast-moving packages. The system uses a pulsed 850nm infrared LED array to illuminate the target. The Ceramic 3535 LED is chosen for its ability to handle high pulse currents (up to 700mA) for bright, short-duration flashes, capturing clear images without motion blur. The ceramic package's thermal stability ensures consistent pulse amplitude and wavelength over long operating periods in a warm factory environment. The wide 120-degree beam allows fewer LEDs to cover the scanning field. The PCB is designed with thick copper layers and thermal vias under each LED's thermal pad to dissipate the average heat generated during the pulsed operation.

. Operating Principle Introduction

An Infrared Light Emitting Diode (IR LED) operates on the same electroluminescence principle as a visible LED. When a forward voltage is applied across the p-n junction, electrons and holes recombine in the active region, releasing energy in the form of photons. The wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material used. For 850nm emission, materials like Aluminum Gallium Arsenide (AlGaAs) are commonly used. The ceramic package serves primarily as a mechanically robust and thermally conductive housing for the semiconductor die, wire bonds, and primary optic (if present).

. Technology Trends and Developments

The trend in high-power infrared LEDs is towards higher wall-plug efficiency (more light output per electrical watt input) and increased power density. This drives the adoption of advanced chip technologies (flip-chip, thin-film) and packaging materials like ceramics and metal-core substrates for optimal thermal management. There is also a focus on improving reliability and lifetime under harsh conditions (high temperature, high humidity). Furthermore, the integration of drivers and sensors with the LED into smart modules is a growing trend, simplifying system design for end-users. The demand for specific, narrow wavelength bands for sensing applications continues to push advancements in epitaxial material growth and device engineering.