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EL063X Series 8-Pin SOP Package Dual-Channel High-Speed 10Mbit/s Logic Gate Optocoupler Datasheet - Technical Documentation

EL063X Series Dual-Channel High-Speed 10Mbit/s Logic Gate Optocoupler (8-pin SOP Package) Technical Datasheet. Features high common-mode transient immunity, wide operating temperature range, and complies with industry standards.
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PDF Document Cover - 8-pin SOP Package Dual-Channel High-Speed 10Mbit/s Logic Gate Optocoupler EL063X Series Datasheet - Chinese Technical Document

1. Product Overview

The EL063X series is a class of dual-channel high-speed logic gate optocouplers (optical isolators). These devices are designed to provide robust electrical isolation and high-speed digital signal transmission between two circuits. Their core function is to transmit logic-level signals across an isolation barrier through optical coupling between an infrared light-emitting diode (LED) and a high-speed integrated photodetector with logic gate output. This design effectively eliminates ground loops, prevents noise transmission, and protects sensitive circuits from voltage spikes or ground potential differences.

The primary application areas for this component include industrial automation, communication interfaces, power supply control, and computer peripherals, where reliable, noise-immune signal transmission is critical. The dual-channel configuration within a single package offers space-saving advantages for differential signal applications or multi-channel control line isolation and ensures consistency in channel characteristics.

2. Detailed Technical Parameters

Electrical and optical parameters define the operating boundaries and performance of the optocoupler.

2.1 Absolute Maximum Ratings

These are stress limits that must not be exceeded under any conditions, even momentarily. Operating beyond these ratings may cause permanent damage to the device.

2.2 Electrical Characteristics

These parameters are guaranteed under the specified operating conditions (unless otherwise noted, Ta = -40°C to 85°C).

2.2.1 Input Characteristics

2.2.2 Output and Transmission Characteristics

2.3 Switching Characteristics

These parameters define high-speed digital performance, measured under standard test conditions (Ta=25°C, VCC=5V, IF=7.5mA, CL=15pF, RL=350Ω).

3. Performance Curve Analysis

Although the provided PDF excerpt mentions "typical photoelectric characteristic curves," the specific charts are not included in the text. Typically, such curves for optocouplers include:

The device employs a standard 8-pin small outline package (SOP or SOIC). This surface-mount package conforms to the common SO8 package dimensions, facilitating PCB layout and assembly.

4.1 Pin Configuration

The pin configuration is as follows:

Pin 1: Anode (Channel 1 input LED)

Pin 2: Cathode (Channel 1 input LED)

5. Welding and Assembly GuideThe device is suitable for standard surface-mount assembly processes.

Soldering temperature: The maximum allowable soldering temperature is 260°C for 10 seconds. This is compatible with typical lead-free reflow soldering temperature profiles.

Moisture Sensitivity: Although not explicitly stated in the excerpt, most plastic-encapsulated SMD devices have a Moisture Sensitivity Level (MSL). To prevent "popcorn" phenomenon during reflow soldering, proper handling, baking (if required), and storage according to the manufacturer's guidelines are essential.

Data Transmission and Line Receivers: Suitable for isolated serial data links (e.g., RS-232, RS-485 isolation), digital I/O isolation, and multiplexing.

Switched-mode power supply feedback: In flyback or other isolated converter topologies, isolates the feedback signal from the secondary (output) side to the primary (controller) side.

Pulse transformer replacement: Provides a solid-state, potentially more reliable and compact alternative for transmitting digital pulses across an isolation barrier.

, and can be increased to the absolute maximum rating to improve speed, at the cost of higher power consumption.

A: The high-speed switching of the output stage can cause noise on the V

line. The local bypass capacitor provides a low-impedance source for this current, preventing the V

The development of optocouplers such as the EL063X series is driven by several key trends in the field of electronics:

Demand for higher speed and bandwidth: With the increasing speed of industrial networks (EtherCAT, PROFINET IRT) and communication interfaces, isolators must keep pace. The trend from kilobits to megabits, and now to 10+ megabit speeds is evident.
Enhanced noise immunity: The growing electrical complexity of industrial and automotive environments requires isolators with higher CMTI ratings to ensure reliable operation amidst noise generated by motor drives, switching power supplies, and RF sources.

Miniaturization and integration: The dual-channel design in SOP-8 packages reflects the need to save PCB space and reduce component count. Further trends include integrating more channels (quad-channel isolators) or combining isolation with other functions (such as ADC drivers or I
C level shifting).

Higher Safety and Reliability Standards: Stricter safety regulations across industries are driving demand for components with higher isolation voltages, longer operational lifetimes, and robust certifications from bodies like UL, VDE, and CQC.CC?
Alternative Isolation Technologies: While optocoupler technology is mature, they face competition from capacitive isolators (using SiOCCbarriers) and magnetic isolators (giant magnetoresistance or transformer-based), which may offer advantages in speed, power consumption, and integration density. However, optocouplers maintain a solid position due to their high CMTI, simplicity, and well-understood reliability.CCEL063X series, with its balance of speed, dual-channel integration, high CMTI, and safety certifications, is designed to meet the market's ongoing demand for robust, high-performance signal isolation.

Q: Can I use this device to isolate analog signals?
A: No. This is alogic gatephotocoupler. The output is a digital logic level (high or low), not a linear representation of the input current. For analog isolation, a linear optocoupler (with a phototransistor or photodiode output) is required.

Q: What is the purpose of the "strobable output" mentioned in the description?
A> While not detailed in this excerpt, a strobable output typically means the output stage has an enable or strobe control. This allows the output to be turned on/off or latched by a third control signal, which can be useful for multiplexing applications or reducing power consumption. The pin configuration here does not show a separate strobe pin, so this functionality may be integrated internally in a specific mode or may refer to the output being enabled by the input signal itself.

. Operational Principle

The operational principle is based on optoelectronic conversion. When a sufficient forward current (IF) is applied to the input Infrared Emitting Diode (IRED), it emits light photons. These photons traverse the transparent isolation barrier (typically a molded plastic compound). On the output side, a high-speed silicon photodetector integrated circuit receives this light. This IC contains a photodiode that converts the light back into a photocurrent. This photocurrent is then processed by an internal amplifier and comparator circuit (the "logic gate") to produce a clean, well-defined digital output voltage. When the input LED is ON, the output is driven to a logic LOW state (typically by an active pull-down transistor). When the input LED is OFF, the output circuit pulls the pin to a logic HIGH state (through the external pull-up resistor RL). This positive logic operation is summarized in the provided Truth Table: Input High = Output Low, Input Low = Output High.

. Industry Trends & Context

The development of photocouplers like the EL063X series is driven by several key trends in electronics:

The EL063X series, with its balance of speed, dual-channel integration, high CMTI, and safety certifications, is positioned to address these ongoing demands in the market for robust, high-performance signal isolation.

LED Specification Terminology Explained

Complete Explanation of LED Technical Terms

I. Core Indicators of Photoelectric Performance

Terminology Unit/Representation Layman's Explanation Why is it important
Luminous Efficacy lm/W The luminous flux emitted per watt of electrical power; the higher the value, the more energy-efficient. It directly determines the energy efficiency rating and electricity cost of the luminaire.
Luminous Flux lm (Lumen) The total amount of light emitted by a light source, commonly known as "brightness". Determines whether the luminaire is bright enough.
Viewing Angle ° (degree), such as 120° The angle at which light intensity drops to half, determining the beam width. Affects the illumination range and uniformity.
Color Temperature (CCT) K (Kelvin), e.g., 2700K/6500K The color temperature of light, lower values lean yellow/warm, higher values lean white/cool. Determines the lighting ambiance and suitable application scenarios.
Color Rendering Index (CRI / Ra) Unitless, 0–100 The ability of a light source to reproduce the true colors of objects, with Ra≥80 being preferable. Affects color fidelity, used in high-demand places such as shopping malls and art galleries.
Color tolerance (SDCM) MacAdam ellipse steps, such as "5-step" A quantitative metric for color consistency; a smaller step number indicates better color consistency. Ensure no color variation among luminaires from the same batch.
Dominant Wavelength nm (nanometer), e.g., 620nm (red) The wavelength value corresponding to the color of a colored LED. Determines the hue of monochromatic LEDs such as red, yellow, and green.
Spectral Distribution Wavelength vs. Intensity curve Shows the intensity distribution of light emitted by an LED at various wavelengths. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbol Layman's Explanation Design Considerations
Forward Voltage (Forward Voltage) Vf The minimum voltage required to light up an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf, and the voltage adds up when multiple LEDs are connected in series.
Forward Current If The current value that makes the LED emit light normally. Constant current drive is often used, as the current determines brightness and lifespan.
Maximum Pulse Current Ifp Peak current that can be withstood for a short period of time, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur.
Reverse Voltage Vr Maximum reverse voltage an LED can withstand; exceeding it may cause breakdown. Reverse connection or voltage surges must be prevented in the circuit.
Thermal Resistance Rth (°C/W) The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. High thermal resistance requires a stronger heat dissipation design, otherwise the junction temperature will increase.
Electrostatic Discharge Immunity (ESD Immunity) V (HBM), such as 1000V Electrostatic discharge immunity, higher value indicates greater resistance to electrostatic damage. Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Key Indicators Layman's Explanation Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, the lifespan may double; excessively high temperatures lead to lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) The time required for the brightness to drop to 70% or 80% of its initial value. Directly define the "service life" of LED.
Lumen Maintenance % (e.g., 70%) The percentage of remaining brightness after a period of use. Characterizes the ability to maintain brightness after long-term use.
Color Shift Δu′v′ or MacAdam Ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Material performance degradation Degradation of packaging materials due to prolonged high temperatures. May lead to decreased brightness, color shift, or open-circuit failure.

IV. Packaging and Materials

Terminology Common Types Layman's Explanation Features and Applications
Package Type EMC, PPA, Ceramic The housing material that protects the chip and provides optical and thermal interfaces. EMC has good heat resistance and low cost; ceramics offer superior heat dissipation and long lifespan.
Chip Structure Face-up, Flip Chip Chip Electrode Layout Method. Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating YAG, silicate, nitride Covered on the blue light chip, partially converted into yellow/red light, mixed into white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical Design Flat, microlens, total internal reflection The optical structure on the encapsulation surface controls the distribution of light. It determines the light emission angle and the light distribution curve.

V. Quality Control and Binning

Terminology Grading Content Layman's Explanation Purpose
Luminous flux binning Codes such as 2G, 2H Grouped by brightness level, each group has a minimum/maximum lumen value. Ensure consistent brightness within the same batch of products.
Voltage binning Codes such as 6W, 6X Group by forward voltage range. Facilitates driver power matching and improves system efficiency.
Color binning 5-step MacAdam ellipse Group by color coordinates to ensure colors fall within an extremely narrow range. Ensure color consistency to avoid uneven color within the same luminaire.
Color temperature binning 2700K, 3000K, etc. Group by color temperature, each group has a corresponding coordinate range. To meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standard/Test Layman's Explanation Meaning
LM-80 Lumen Maintenance Test Long-term operation under constant temperature conditions, recording brightness attenuation data. Used to estimate LED lifetime (combined with TM-21).
TM-21 Lifetime extrapolation standard Estimating lifespan under actual operating conditions based on LM-80 data. Providing scientific lifespan prediction.
IESNA standard Illuminating Engineering Society Standard Covers optical, electrical, and thermal test methods. Industry-recognized testing basis.
RoHS / REACH Environmental certification. Ensure products are free from harmful substances (e.g., lead, mercury). Entry requirements for the international market.
ENERGY STAR / DLC Energy Efficiency Certification Energy efficiency and performance certification for lighting products. Commonly used in government procurement and subsidy programs to enhance market competitiveness.