Dual-Color SMD LED Datasheet - AlInGaP Chip - Green and Red Light - 30mA - Simplified Chinese Technical Document

1. Product Overview

Wannan takarda ta yi cikakken bayani game da ƙayyadaddun fasaha na babban haske, LED na SMD mai launi biyu. Na'urar tana haɗa cikakkun ƙananan na'urori masu zaman kansu guda biyu a cikin kayan ɗaki ɗaya: ɗaya yana fitar da haske mai kore, ɗayan kuma ja. Ta amfani da ci-gaban fasahar AlInGaP chip, wannan LED an tsara shi musamman don aikace-aikacen da ke buƙatar nuna launuka daban-daban guda biyu daga cikin ƙaƙƙarfan kayan ɗaki guda ɗaya. Manyan fa'idodinsa sun haɗa da babban ƙarfin haskakawa, dacewa da tsarin haɗawa ta atomatik, da kuma bin ka'idojin muhalli.

Wannan LED yana amfani da daidaitaccen 8mm na'urar tacewa ta masana'antu, ana samar da shi akan reels na inci 7, wanda ya dace da manyan layukan saka ta atomatik. Ya dace da hanyoyin gyarar gami da yawa, gami da infrared reflow da vapor phase reflow, kuma an rarraba shi azaman samfurin kore, wanda ya dace da umarnin muhalli masu dacewa.

2. Bincike Cikakken na Sigogi na Fasaha

2.1 Matsakaicin Matsakaici na Cikakken

The operational limits of the device are defined at an ambient temperature (Ta) of 25°C. The green and red chips share the same maximum ratings, ensuring symmetrical performance and design safety margin.

• Power Dissipation:75 mW per chip. This parameter defines the maximum power that the LED can safely dissipate as heat under continuous operation.
• Peak Forward Current:80 mA, permissible under pulsed conditions (1/10 duty cycle, 0.1ms pulse width). This rating is critical for multiplexing or brief high-intensity signal applications.
• DC Forward Current:30 mA. This is the recommended maximum continuous forward current to ensure reliable, long-term operation.
• Current Derating:Starting from 25°C, the linear derating is 0.4 mA/°C. For each degree Celsius above 25°C, the maximum allowable continuous current must be reduced by 0.4 mA to prevent thermal overstress.
• Reverse Voltage:5 V. Exceeding this voltage in the reverse direction will cause immediate and irreversible damage to the LED chip.
• Temperature Range:The operating and storage temperature range is -55°C to +85°C, indicating its suitability for industrial and extended environmental applications.
• Soldering Tolerance:The device can withstand 260°C wave or infrared reflow soldering for 5 seconds, and 215°C vapor phase reflow soldering for 3 minutes.

2.2 Halayen Lantarki da Na'urar Gani

Measured at Ta=25°C and a standard test current (IF) of 2 mA, these parameters define the core performance of the LED.

• Luminous Intensity (Iv):Minimum 1.8 mcd for both colors, typical value is 2.5 mcd. This is the perceived brightness of the light output measured by a sensor filtered to the CIE photopic (human eye) response curve.
• Viewing Angle (2θ1/2):Typical value is 130 degrees. This wide viewing angle indicates a diffuse, non-focused emission pattern, suitable for status indicators requiring visibility from a broad range of angles.
• Peak Wavelength (λP):Green: 570 nm (typical). Red: 636 nm (typical). This is the wavelength at which the spectral power output reaches its maximum.
• Dominant Wavelength (λd):Green: 569 nm (Typ.). Red: 633 nm (Typ.). This is the single wavelength that best represents the perceived color of the LED, derived from the CIE chromaticity diagram.
• Spectral Bandwidth (Δλ):Green: 15 nm (Typ.). Red: 20 nm (Typ.). This defines spectral purity; a narrower bandwidth yields more saturated and purer color.
• Forward Voltage (VF):Green: 1.8V (Typ.), 2.2V (Max.). Red: 1.7V (Typ.), 2.2V (Max.). This is the voltage drop across the LED when conducting the specified current. It is crucial for circuit design and power supply selection.
• Reverse Current (IR):Max. 10 μA at VR=5V. This is a measure of junction leakage in the off state.
• Capacitance (C):Typical value is 40 pF at VF=0V, f=1MHz. Relevant for high-frequency switching applications.

3. Bayanin Tsarin Rarraba

LEDs are binned according to performance to ensure consistency within production lots. Designers can specify bins to meet precise application requirements.

3.1 Luminous Intensity Binning

Green and red chips use the same intensity binning code. Tolerance within each bin is +/-15%.

• Binning Code G:At 2mA, 1.80 mcd (min) to 2.80 mcd (max).
• Bin code H:At 2mA, 2.80 mcd (min) to 4.50 mcd (max).
• Bin code J:At 2mA, 4.50 mcd (min) to 7.10 mcd (max).

3.2 Dominant Wavelength Binning (Green Only)

Only green chips have specified wavelength bins to control color consistency. The tolerance for each bin is +/- 1nm.

• Grading Code C:567.5 nm to 570.5 nm.
• Grading Code D:570.5 nm to 573.5 nm.
• Grading Code E:573.5 nm to 576.5 nm.

4. Performance Curve Analysis

Although specific graphical curves (e.g., Figure 1, Figure 6) are referenced in the specification, their typical characteristics can be described based on technology and specified parameters.

Forward Current vs. Forward Voltage (I-V Curve):AlInGaP LEDs exhibit a characteristic exponential I-V relationship. A typical VF value of approximately 1.8V indicates a relatively low operating voltage compared to some other semiconductor materials. The curve will show a sharp turn-on at the threshold voltage, followed by a region where voltage increases approximately linearly with current.

Luminous Intensity vs. Forward Current (L-I Curve):Within the recommended operating range (up to 30mA DC), the light output is typically linear with current. However, at higher currents, efficiency may decrease due to thermal effects and other non-linear factors within the semiconductor.

Temperature Dependence:The luminous intensity of an LED generally decreases as the junction temperature increases. The specified current derating factor (0.4 mA/°C) is a direct consequence of this thermal behavior, intended to maintain reliability. The forward voltage also has a negative temperature coefficient, meaning it decreases slightly as temperature rises.

Spectral Distribution:The green light chip, with a typical peak at 570 nm and a narrow bandwidth of 15 nm, will produce a saturated green light. The red light chip, with a peak at 636 nm and a bandwidth of 20 nm, produces a standard red light. These wavelengths fall entirely within the high-sensitivity region of the human eye.

5. Mechanical and Packaging Information

5.1 Device Dimensions and Pin Assignment

This LED complies with the EIA standard SMD package dimensions. The lens is water white. The internal pin assignment for the dual-chip is as follows:

• Green light chip:Connected to pins 1 and 3.
• Red light chip:Connect to pins 2 and 4.

This configuration allows the two LEDs to be driven completely independently. Unless otherwise specified, all dimensional tolerances are ±0.10 mm.

5.2 Recommended Land Pattern

A recommended land pattern (pad size) is provided to ensure proper solder joint formation, mechanical stability, and thermal relief during the reflow process. Adhering to this layout is crucial for achieving reliable surface mount connections and preventing tombstoning or misalignment.

5.3 Carrier Tape and Reel Packaging

The device is supplied on 8 mm wide embossed carrier tape. Key packaging specifications include:

• Reel dimensions:Diameter 7 inches.
• Quantity per reel:3000 pieces.
• Minimum Order Quantity (MOQ):Minimum order starts from 500 pieces remaining.
• Cover tape:Empty component pockets are sealed with top cover tape.
• Missing component:According to packaging standards, a maximum of two consecutive LEDs are allowed to be missing.
• Standard:Packaging complies with ANSI/EIA 481-1-A-1994 specification.

6. Soldering and Assembly Guidelines

6.1 Shawarar Lanƙwasa Reflow

Two suggested infrared (IR) reflow profiles are provided: one for standard (tin-lead) soldering processes and another for lead-free soldering processes. The lead-free profile is specifically designed for use with Sn-Ag-Cu (SAC) alloy solder paste. Both profiles define key parameters such as preheat temperature and time, peak temperature, and time above liquidus to ensure proper solder joint formation while preventing excessive thermal stress on the LED package.

6.2 Yanayin Walda na Gabaɗaya

• Reflow Soldering:Preheating: 120-150°C, maximum 120 seconds. Peak temperature: maximum 240°C. Time above liquidus: maximum 10 seconds.
• Wave Soldering:Preheating: maximum 100°C, maximum 60 seconds. Solder wave: maximum 260°C, maximum 10 seconds.
• Hand Soldering (Soldering Iron):Temperature: maximum 300°C. Soldering time: maximum 3 seconds per solder joint (only once).

6.3 Tsaftacewa

Idan an yi buƙatar tsaftacewa bayan walda, ya kamata a yi amfani da takamaiman sinadarai kawai. Sinadarai da ba a ƙayyade ba na iya lalata kayan haɗin LED. Ana ba da shawarar nutsar da LED a cikin ethanol ko isopropyl alcohol a yanayin zafi na yau da kullun, ba fiye da minti ɗaya ba.

6.4 Ajiya da Aiki

• Yanayin Ajiya:Bai kamata ya wuce 30°C da zafi na 70% ba.
• Hali na Zafi:LED ɗin da aka ciro daga ainihin fakitin kariyar zafi ya kamata a yi masa walda mai jujjuyawa cikin mako guda. Idan ana buƙatar ajiya na dogon lokaci a wajen ainihin jakar, dole ne a ajiye shi a cikin akwati mai rufi tare da busasshen abu ko a cikin busasshen nitrogen.
• Gasasshen:Components stored outside the bag for more than one week should be baked at approximately 60°C for at least 24 hours before assembly to remove absorbed moisture and prevent the "popcorn" effect during reflow soldering.

7. Shawarar Aikace-aikace

7.1 Yanayin Aikace-aikace na Al'ada

This bicolor LED is ideal for applications requiring multi-state indication from a single point, such as:

• Status Indicators:Power (Green=On, Red=Off/Error), Network Activity, Battery Charging Status (Red=Charging, Green=Full).
• Consumer Electronics:Indicators on household appliances, audio/video equipment, and computer peripherals.
• Industrial control panel:Machine status indication (Green = Running, Red = Stopped/Fault).
• Automotive interior lighting:Dual-function dashboard or console indicator.

7.2 Abubuwan Lura da Zane na Lantarki

Driving method:LED is a current-driven device. To ensure uniform brightness, especially when multiple LEDs are used in parallel,Strongly recommendedUse a series current-limiting resistor for each LED (Circuit Model A). It is not recommended to drive multiple LEDs in parallel directly from a voltage source (Circuit Model B), as slight differences in the forward voltage (VF) characteristics between individual LEDs will lead to significant variations in current distribution and brightness.

The value of the series resistor (R_s) can be calculated using Ohm's Law: R_s= (V_supply- V_F) / I_F, where V_Fis the LED's forward voltage at the desired current I_F.

Karfin wutar lantarki na gaba.

7.3 Electrostatic Discharge (ESD) Protection

• LEDs are sensitive to electrostatic discharge, which can degrade or damage the semiconductor junction. Precautions must be taken during handling and assembly:
• Personnel should wear grounded wrist straps or anti-static gloves.
• All workstations, tools, and equipment must be properly grounded.
• Use conductive or dissipative mats on work surfaces.

Store and transport LEDs in ESD protective packaging.

8. Technical Comparison and DifferentiationThe key differentiating feature of this product lies in itsrealization of dual-color functionality in a single SMD packageand the adoption of.

AlInGaP chip technology

• . Compared to monochrome LEDs, this device saves PCB space, reduces component count, and simplifies assembly for applications requiring two colors. Compared to other dual-color technologies (e.g., single chip with phosphor), the use of two separate AlInGaP chips offers the following advantages:Color Saturation:
• AlInGaP provides highly saturated, pure green and red light without phosphor conversion, resulting in higher color purity.Efficiency:
• AlInGaP is known for its high external quantum efficiency, especially in the red and amber spectral regions, which helps devices achieve high brightness.Independent Control:

The two chips are electrically isolated, allowing fully independent control of color, brightness, and blinking patterns.

9. Frequently Asked Questions (FAQ)
Q1: Can I drive both the green and red LEDs at their maximum DC current (30mA each) simultaneously?

A1: Yes, but total power consumption must be considered. At 30mA, the typical VF is 1.8V (green) and 1.7V (red), with a total power of approximately (0.03A * 1.8V) + (0.03A * 1.7V) = 0.105W or 105 mW. This exceeds the 75 mW rating of a single chip. Therefore, simultaneous operation at full current may require thermal management or derating based on ambient temperature and PCB layout to ensure the junction temperature remains within safe limits.
Q2: What is the difference between peak wavelength and dominant wavelength?

A2: Peak wavelength (λP) is the physical wavelength at which the LED emits the most optical power. Dominant wavelength (λd) is a value calculated based on the CIE chromaticity diagram, representing the perceived color as a single wavelength. For monochromatic light sources like AlInGaP LEDs, the two are usually very close, but λd is the more relevant parameter for color specification in applications.
Q3: How to understand the binning codes when ordering?

A3: You can specify the desired intensity bin (e.g., "J" for the highest brightness), and for green chips, you can also specify the dominant wavelength bin (e.g., "D" for a specific green hue). This ensures you receive LEDs with consistent performance. If not specified, you may receive a mixed batch from production.
Q4: Is a heatsink required?

A4: For continuous operation at or near the maximum DC current, especially under high ambient temperatures or when both colors are illuminated, careful thermal design is crucial. While a single indicator may not require a dedicated heatsink, it is recommended to ensure a good thermal path from the LED pad to the PCB copper layer (using thermal vias or large copper pours) to aid heat dissipation and maintain performance and longevity.

10. Design and Application Case Studies

Scenario: Designing a Dual-State Power Indicator for Portable DevicesRequirements:

Indicate "Charging" (red) and "Full/On" (green). The device is powered by a 5V USB source. The indicator should be clearly visible, but brightness should not be excessive to save power.

1. Design Steps:Current Selection:_FSelect a forward current (I
2. ). Based on the typical luminous intensity of 2.5 mcd at 2 mA, 5 mA might be a good starting point for a clear indication.
   Resistor calculation:ForRed LED_F(V
   R_{Typical value = 1.7V), at 5 mA:}R
   红= (5V - 1.7V) / 0.005A = 660 Ω. Use a standard 680 Ω resistor.For_FGreen LED
   R_(VTypical value = 1.8V), at 5 mA:
3. R绿_F= (5V - 1.8V) / 0.005A = 640 Ω. Use standard 620 Ω or 680 Ω resistor._FPower check:
4. Power per LED: P = V* I
5. ≈ 1.7V * 0.005A = 8.5 mW (red) and 1.8V * 0.005A = 9 mW (green). Both are well below the 75 mW maximum, even if both were on simultaneously (which they are not in this use case).Circuit implementation:

Connect the red LED (pins 2,4) with its 680Ω resistor to a microcontroller GPIO pin, set as a high-level output during charging. Connect the green LED (pins 1,3) with its resistor to another GPIO pin, activated when charging is complete or the device is powered on. The common cathode/anode configuration (implied by separate pins) allows for this simple independent driving.

PCB Layout:Follow the recommended pad dimensions. Ensure there is no solder mask between pads to prevent solder bridging. Include a small area of copper pour connected to the ground plane beneath the LED to provide slight thermal relief.11. Technical Principle Introduction

This LED is based on_{Aluminum Indium Gallium Phosphide (AlInGaP)}semiconductor material. This is a III-V compound semiconductor whose bandgap energy—the energy difference between the valence band and the conduction band—can be precisely tuned by varying the proportions of Al, In, Ga, and P. This tunability allows engineers to design materials that emit light at specific wavelengths in the red, orange, amber, and green regions of the visible spectrum._{When a forward voltage is applied across the p-n junction of the AlInGaP chip, electrons are injected from the n-region into the p-region, and holes are injected from the p-region into the n-region. These charge carriers recombine in the active region of the junction. In a direct bandgap semiconductor like AlInGaP, this recombination event releases energy in the form of a photon (a particle of light). The wavelength (color) of this photon is directly determined by the material's bandgap energy (E}photon

= hc/λ ≈ E

Bandgap

• ). The two-color package accommodates two such independently manufactured chips, each made from AlInGaP material with different compositions, producing green and red light respectively.12. Industry Trends and Developments
• The SMD indicator LED market continues to evolve. Key trends associated with such components include:Miniaturization:
• Although this device uses a standard package, the market continuously drives towards smaller package sizes (e.g., 0402, 0201) to save space on increasingly dense PCBs, particularly in consumer portable electronics.Efficiency Improvement:
• Continuous improvements in materials science and chip design aim to extract more light (lumens) per watt of electrical input, thereby reducing power consumption at a given brightness level.Enhanced Reliability and Robustness:
• Improvements in packaging materials and die-attach technologies enhance the device's ability to withstand higher temperatures, humidity, and mechanical stress, expanding its use in automotive and industrial applications.Integrated Solutions: