LED Dual Color 3.0x2.5x1.4mm - Ƙarfin Gaba 1.8-3.6V/1.8-2.4V - Ragewa 72mW/108mW - Orange/Blue Takardar Fasaha ta Turanci

1. Bayanin Samfur

Wannan samfurin LED ne mai launi biyu wanda ya haɗa chip orange da chip blue a cikin gida guda na SMD. Girman package shine 3.0mm x 2.5mm x 1.4mm. An ƙera shi don ayyukan nuni da nunawa gabaɗaya inda ake buƙatar launuka biyu daban-daban. Na'urar ta dace da hanyoyin haɗa SMT na yau da kullun kuma ta bi ka'idodin RoHS. Matsayinta na damshi an rarraba shi a matsayin Mataki 3, yana buƙatar kulawa mai kyau bayan buɗe shi. Ƙarƙashin kusurwar haske na digiri 60 yana ba da haske mai da hankali, yana sa ya dace da aikace-aikacen da ke buƙatar jagoranci mai girma.

2. Binciken Sigogin Fasaha

2.1 Halayen Lantarki da Haske

Ana auna duk halaye a Ts = 25°C sai dai in an faɗi akasin haka. LED tana nuna faɗin gwangwanin haske na 15nm ga duka chips. Ana raba ƙarfin gaba (VF) zuwa lambobi da yawa don kowane launi don tabbatar da tsararru mai ƙarfi. Ga chip orange, VF yana daga 1.8V zuwa 3.6V a cikin bins B1 zuwa J0. Ga chip blue, VF yana daga 1.8V zuwa 2.4V a cikin bins B1 zuwa D2. Tsawon igiyar haske (λd) ga orange yana tsakanin 615nm da 630nm, yayin da ga blue yana tsakanin 460nm da 470nm, duka an auna su a 20mA. Ƙarfin haske (IV) a 20mA yana daga 230mcd zuwa 1200mcd ga duka launuka, tare da bins masu yawa (I00, J00, K00, L00) don tsararru mai kyau. Kusurwar gani (2θ1/2) tana da digiri 60. An iyakance halin baya a VR=5V zuwa matsakaicin 10μA. Juriyar yanayin zafi daga mahadar zuwa wurin siyarwa (RTHJ-S) tana da 450°C/W.

2.2 Matsakaicin Matsayi na Haƙƙi

Matsakaicin matsayi na haƙƙi yana bayyana iyakokin da za a iya lalata na'urar idan aka wuce. Ragewa (Pd) tana da 72mW ga chip orange da 108mW ga chip blue. Matsakaicin ƙarfin gaba (IF) yana da 30mA kowace chip. Ƙarfin gaba na kololuwa (IFP) yana iya kaiwa 60mA a madaidaicin aiki na 1/10 da faɗin bugun jini 0.1ms. Haƙƙin fitar da wutar lantarki (HBM) yana da 1000V. Yanayin zafin aiki (Topr) yana daga -40°C zuwa +85°C, kuma yanayin zafin ajiya (Tstg) shima daga -40°C zuwa +85°C. Yanayin zafin mahadar (Tj) bai kamata ya wuce 95°C ba. Yana da mahimmanci a tabbatar da cewa ragewa bai wuce waɗannan iyakokin ba, kuma dole ne a yi kulawa mai kyau game da yanayin zafi.

3. Tsarin Rabe-Rabe (Binning System)

Ana raba LED zuwa bins da yawa don samar da rabe-raben ma'auni na musamman. An bayyana bins na ƙarfin gaba ga duka launuka bisa ga tebur na ƙayyadaddun. Ga orange: B1 (1.8-1.9V), B2 (1.9-2.0V), C1 (2.0-2.1V), C2 (2.1-2.2V), D1 (2.2-2.3V), D2 (2.3-2.4V), G0 (2.8-3.0V), H0 (3.0-3.2V), I0 (3.2-3.4V), J0 (3.4-3.6V). Ga blue: B1 (1.8-1.9V), B2 (1.9-2.0V), C1 (2.0-2.1V), C2 (2.1-2.2V), D1 (2.2-2.3V), D2 (2.3-2.4V). Bins na tsawon igiyar haske: Orange – D00 (615-620nm), E00 (620-625nm), F00 (625-630nm); Blue – C00 (460-465nm), D00 (465-470nm). Bins na ƙarfin haske ga duka launuka: I00 (230-350mcd), J00 (350-530mcd), K00 (530-800mcd), L00 (800-1200mcd). Lambar bin da ke kan label tana ba da cikakken bayani.

4. Binciken Hotunan Ayyuka

An ba da hotuna na yau da kullun na siffofin haske don ra'ayin ƙira. Hoton ƙarfin gaba vs. ƙarfin gaba (Fig.1-6) yana nuna dangantakar tashin hankali na LEDs. Hoton ƙarfin gaba vs. ƙarfin haske (Fig.1-7) yana nuna cewa ingancin haske yana ƙaruwa a layi tare da ƙarfin har zuwa 30mA. Hoton zafin pin vs. ƙarfin haske (Fig.1-8) yana nuna raguwa a hankali yayin da zafin yake ƙaruwa, tare da raguwa kusan 10% a 100°C. Hoton zafin pin vs. ƙarfin gaba (Fig.1-9) yana nuna raguwar izinin ƙarfin gaba yayin da zafin pin ke ƙaruwa. Hoton ƙarfin gaba vs. tsawon igiyar haske (Fig.1-10, Fig.1-11) yana nuna ɗan canjin ja ga chip orange da ɗan canjin shuɗi ga chip blue yayin da ƙarfin ke ƙaruwa. Hoton ƙarfin haske vs. gwangwanin haske (Fig.1-12) yana nuna rarraba haske na duka chips tare da tsawon haske na kololuwa kusan 623nm ga orange da 467nm ga blue. Tsarin haske (Fig.1-13) yana tabbatar da kusurwar gani na digiri 60 tare da rarraba irin na Lambertian.

5. Bayanan Injiniya da Tattara Kaya

Girman fayil na package shine 3.00mm x 2.50mm x 1.40mm tare da haƙƙin ±0.2mm. Hannun sama yana nuna chips biyu: ɗaya orange (O) da ɗaya blue (B), tare da anode gama gari da cathodes daban-daban bisa ga alamar polarity a hannun ƙasa. An bayar da tsarin siyarwa (suggested pad layout) don haɗin zafi da lantarki mai kyau. Girman tef ɗin jigilar kaya: faɗi 8.00mm, tazara 4.00mm, tare da zurfin rami na 1.6mm. Girman reel: A=8.0±0.1mm, B=178±1mm, C=60±1mm, D=13.0±0.5mm. Kowace reel tana da 2500 guda. Label ɗin ya haɗa da lambar sashi, lambar ƙayyadaddun, lambar lot, lambar bin (ciki har da flux, bin chromaticity, ƙarfin gaba, tsawon igiyar haske), yawa, da kwanan wata.

6. Jagororin Siyarwa da Haɗa

6.1 SMT Reflow Siyarwa

Tsarin reflow da aka ba da shawara ya dogara da ka'idodin JEDEC. Matsakaicin hawan zafin jiki daga Tsmin zuwa Tp bai kamata ya wuce 3°C/s ba. Preheating: Tsmin=150°C, Tsmax=200°C, lokaci 60-120s. Lokaci sama da 217°C (TL) ya kamata ya kasance 60-150s. Babban zafin jiki (Tp) shine 260°C tare da matsakaicin lokaci (tp) na 10s. An iyakance lokaci a cikin 5°C na ainihin babban zafin jiki zuwa 30s. Matsakaicin saurin sanyaya bai kamata ya wuce 6°C/s ba. Jimlar lokaci daga 25°C zuwa Tp ya kamata ya kasance a cikin mintuna 8. Kada a yi reflow siyarwa fiye da sau biyu, tare da akalla sa'o'i 24 tsakanin ayyukan. Siyarwa da hannu: zafin ƙarfe a ƙasa da 300°C na ƙasa da daƙiƙa 3, sau ɗaya kawai. Ba a ba da shawarar gyara bayan siyarwa ba; idan ba zai yiwu ba, yi amfani da ƙarfe mai kai biyu kuma tabbatar da cewa ba a shafi halayen LED ba.

6.2 Kariya Da Kulawa

Kada a sa LED akan PCB mai lanƙwasa. Bayan siyarwa, guje wa matsawwacin injiniya ko sanyaya cikin sauri. Muhallin aiki ya kamata ya iyakance mahadi na sulfur zuwa ƙasa da 100PPM. Halogen (bromine da chlorine) dole ne a sarrafa shi: guda<900PPM, jimlar<1500PPM. VOCs daga kayan haɗi na iya shiga cikin silicone encapsulant kuma su haifar da canjin launi; ana ba da shawarar gwada daidaituwa. Yi amfani da isopropyl alcohol don tsaftacewa; ba a ba da shawarar tsaftacewa ta ultrasonic ba. Yanayin ajiya: kafin buɗe, ≤30°C da ≤75% RH, rayuwa ta shekara 1; bayan buɗe, ≤30°C da ≤60% RH, amfani a cikin sa'o'i 168. Idan an sha ruwa, toya a 60±5°C na > sa'o'i 24.

7. Bayanan Tattara Kaya da Oda

Ana isar da LEDs a cikin tef da reel packaging tare da 2500 guda kowace reel. Tef ɗin jigilar kaya yana da kariya daga wutar lantarki kuma reel ɗin yana daidai da EIA-481. Jakar kariya daga damshi tare da desiccant da katin nuna damshi yana tabbatar da ajiya bushe. Akwatin katako na waje yana dauke da reels da yawa don jigilar kaya mai yawa. Bayanin oda ya kamata ya haɗa da cikakken lambar sashi da lambar bin. Misalin lambar sashi: RF-P13025TS-B37 (lura: nuni na ciki, oda na ainihi ya kamata ya kayyade bins da ake so).

8. Shawarwarin Aikace-aikace

Lokacin ƙira da'irar, koyaushe haɗa resistor mai iyakance ƙarfin don hana wuce gona da iri saboda bambancin wutar lantarki. Kada a taɓa tura LED fiye da matakan haƙƙi na ƙarshe. Kulawa da zafi yana da mahimmanci: tabbatar da isasshen zafin jiki don kiyaye zafin mahadar ƙasa da 95°C. Don aiki mai launi biyu, ana iya sarrafa kowane chip da kansa ta hanyar cathodes daban-daban. Guji amfani da wutar lantarki ta baya saboda yana iya lalata. Don aikace-aikace masu aminci, yi la'akari da rage ƙarfin gaba a yanayin zafi mai yawa. A cikin wurare masu yawan sulfur ko halogen, zaɓi kayan da suka dace da iyakokin da aka ba da shawara. Yi amfani da kariyar ESD mai dacewa yayin kulawa da haɗa.

9. Kwatancen Fasaha

Idan aka kwatanta da amfani da LEDs guda biyu daban, wannan package mai chips biyu yana ba da ceton sarari a kan PCB, rage yawan kayan haɗi, da inganta daidaituwar haske. Ƙarƙashin kusurwar haske yana ba da ƙarfin haske a kan axis, mai amfani ga nunin maki. Samun bins masu kyau yana ba masu ƙira damar daidaita LEDs daidai don daidaiton launi da haske. Juriyar zafi ta ɗan fi girma (450°C/W) idan aka kwatanta da wasu LEDs masu ƙarfi, don haka don aikace-aikacen ƙarfi mai yawa, dole ne a yi la'akari da kulawa da zafi a hankali.

10. Tambayoyin da Akai-akai

Q1: Yaya zan zaɓi bin ƙarfin gaba daidai?

Zaɓi bin da yayi daidai da wutar lantarkin direbanka da ƙarfi. Don samar da wutar lantarki na 5V tare da resistor, zaɓi bin VF wanda ke ba da isasshen sarari don raguwar wutar lantarki ta resistor.

Q2: Menene tasirin zafin jiki akan tsawon igiyar haske?

Yayin da zafin mahadar ke ƙaruwa, tsawon igiyar haske yana canza ɗan ƙarami: orange yana motsawa zuwa tsawon igiyoyi (canjin ja), blue yana motsawa zuwa gajerun igiyoyi (canjin shuɗi). Ana iya samun ainihin canjin daga hotuna na yau da kullun.

Q3: Yaya zan kula da haɗarin ESD?

Yi amfani da wuraren aiki masu ƙasa, igiyoyin hannu masu kariya daga wuta, da kayan tattarawa masu gudanarwa. An ƙiyasta na'urar zuwa 1000V HBM, amma abubuwan ESD masu ƙarfi na iya lalata.

Q4: Menene rayuwar ajiya bayan buɗe jakar kariya daga damshi?

Sa'o'i 168 a ƙarƙashin ≤30°C da ≤60% RH. Idan ba'a yi amfani da shi ba a cikin wannan lokacin, toya kafin amfani.

11. Misalan Aikace-aikace na Aiki

Aikace-aikace na yau da kullun sun haɗa da nunin matsayi (misali, orange don gargaɗi, blue don aiki na yau da kullun), hasken baya don maɓallai da alamomi, da hasken nuni gabaɗaya. Ikon launi biyu yana ba da damar siginar launi biyu ba tare da buƙatar ƙarin sarari PCB ba. Misali, wannan nuni na iya nuna kashe (babu haske), jiran aiki (blue), da aiki (orange). Ƙarƙashin kusurwar haske yana da kyau don aikace-aikacen da ake buƙatar haske daidai, kamar a cikin nunin gaban panel ko ƙananan alamomi.

12. Ka'idar Aiki

LED na'ura ce ta semiconductor da ke fitar da haske ta hanyar electroluminescence. Lokacin da ƙarfin gaba ke gudana a cikin mahadar p-n, electrons da holes suna sake haɗuwa, suna sakin makamashi a cikin nau'in photons. Tsawon igiyar haske (launi) na hasken da aka fitar yana dogara da makamashin bandgap na kayan semiconductor. Chip orange yawanci yana dogara da tsarin AlGaInP (aluminum gallium indium phosphide), yayin da chip blue ya dogara da InGaN (indium gallium nitride). Duka chips an rufe su a cikin lens na silicone mai haske ko mai yaduwa don kare wayoyi da kuma samar da kusurwar gani da ake so.

13. Hanyoyin Ci Gaba

Masana'antar LED tana ci gaba da neman ingantacciyar aiki (lm/W), daidaiton launi, da ƙananan girman package. LEDs masu launi biyu da yawa suna ƙara haɗawa da dabarun tattarawa na ci gaba kamar chip-scale packaging (CSP) da system-in-package (SiP). Ingantattun kayan haɗin zafi da hanyoyin haɗa die suna taimakawa rage juriyar zafi, suna ba da damar ƙarin ƙarfin tuƙi. Bugu da ƙari, daidaiton binning yana inganta tare da tsararru ta atomatik, yana ba da haƙƙi mafi ƙarfi don aikace-aikace masu wahala kamar hasken mota da likitanci. Ana haɓaka kayan lens na silicone don tsayayya da yin rawaya da inganta aminci a cikin wurare masu wahala. Gabaɗaya, hanyar ita ce zuwa mafi ƙanƙanta, ingantacce, kuma amintattun mafita na LED masu launi da yawa.