Dual Color SMD LED LTST-S326KFKGKT Datasheet - Orange/Green - 20mA - 75mW - English Technical Document

1. Product Overview

This document details the specifications for a high-brightness, dual-color, side-looking Surface Mount Device (SMD) Light Emitting Diode (LED). The device incorporates two distinct semiconductor chips within a single package: one emitting orange light and the other emitting green light. It is designed for applications requiring compact, reliable, and efficient indicator or backlighting solutions where space is at a premium and side emission is necessary.

The core advantages of this product include its compliance with RoHS (Restriction of Hazardous Substances) directives, making it suitable for environmentally conscious designs. It features an ultra-bright AlInGaP (Aluminium Indium Gallium Phosphide) material system for both colors, which is known for high efficiency and good color purity. The package is finished with tin plating for excellent solderability. It is fully compatible with standard automated pick-and-place assembly equipment and infrared (IR) reflow soldering processes, facilitating high-volume manufacturing.

The target market encompasses a wide range of consumer electronics, industrial control panels, automotive interior lighting, instrumentation, and communication devices where dual-status indication (e.g., power on/standby, charge status, network activity) or compact side illumination is required.

2. Bincike na Cikakken Sigogi na Fasaha

2.1 Matsakaicin Matsakaici na Gabaɗaya

Wadannan ƙididdiga suna ayyana iyakokin damuwa waɗanda sama da su lalacewar dindindin na na'urar na iya faruwa. Ba a ba da garantin aiki a ƙarƙashin ko a waɗannan iyakokin ba. Ga duka guntu na lemu da kore:

• Ragewar Wutar Lantarki (Pd): 75 mW. Wannan shine matsakaicin jimlar wutar lantarki (halin yanzu * ƙarfafawa gaba) wanda za'a iya tarwatsewa azaman zafi. Wucewa wannan iyaka yana haifar da haɗarin yin zafi da gazawa mai tsanani.
• Kololuwar Halin Yanzu na Gaba (I_FP): 80 mA. Wannan shine matsakaicin ƙarfin da aka yarda a ƙarƙashin yanayin bugun jini, wanda aka ƙayyade a cikin aikin 1/10 da faɗin bugun 0.1ms. Ya fi girma sosai fiye da ƙimar DC, yana ba da damar walƙiya ta gajere amma mai ƙarfi.
• DC Forward Current (I_F): 30 mA. Wannan shine matsakaicin ci gaba da gudana da aka ba da shawarar don aiki mai dogaro na dogon lokaci. Matsakaicin yanayin aiki don gwada ƙarfin haske shine 20 mA.
• Reverse Voltage (V_R): 5 V. Yin amfani da ƙarfin baya mai girma fiye da wannan na iya rushe haɗin PN na LED.
• Operating Temperature Range: -30°C zuwa +85°C. An tabbatar da cewa na'urar za ta yi aiki a cikin wannan kewayon zafin yanayi.
• Storage Temperature Range: -40°C to +85°C.
• Infrared Soldering Condition: Withstands 260°C peak temperature for 10 seconds, which is a standard requirement for lead-free (Pb-free) solder reflow processes.

2.2 Electrical & Optical Characteristics

These parameters are measured at a standard ambient temperature (Ta) of 25°C and a forward current (I_F) of 20 mA, unless otherwise noted. They define the typical performance of the device.

• Luminous Intensity (I_V): A key measure of brightness.
  • Orange: Ƙimar al'ada ita ce 160 mcd (millicandela), tare da mafi ƙarancin 71 mcd.
  • Kore: Ƙimar al'ada ita ce 50 mcd, tare da mafi ƙarancin 18 mcd.
  Guntun lemu yana da haske sosai fiye da kore a ƙarashin wutar lantarki guda, wanda shine sifa na fasahar AlInGaP a cikin bakan lemu/ja.
• Kallon Kuskure (2θ_1/2): Digiri 130 (na al'ada ga duka launuka). Wannan faɗin kusurwar kallo shine sifa mai ma'ana ta LED mai kallon gefe, yana ba da tsarin fitarwa mai faɗi wanda ya dace da aikace-aikacen da ake kallon LED daga gefe.
• Kololuwar Tsawon Zangon Fitowa (λ_P): Tsawon zango inda ƙarfin hasken da aka fitar ya fi girma.
  • Orange: 610 nm (na al'ada).
  • Kore: 574 nm (typical).
• Dominant Wavelength (λ_d): The single wavelength that best represents the perceived color of the light, derived from the CIE chromaticity diagram.
  • Orange: 601 nm (typical).
  • Kore: 570 nm (typical).
• Spectral Line Half-Width (Δλ): The bandwidth of the emitted spectrum at half its maximum intensity. Typical values are 15 nm for orange and 17 nm for green, indicating relatively pure, saturated colors.
• Forward Voltage (V_F): The voltage drop across the LED when operating at the specified current.
  • Both Colors: Ƙimar al'ada ita ce 2.0 V, tare da matsakaicin 2.4 V a 20 mA. Wannan ƙaramin V_F yana dacewa da ƙananan ƙirar lantarki na ƙarfi (misali, tsarin 3.3V ko 5V).
• Koma-baya na Halin yanzu (I_R): Matsakaicin 10 μA a koma-baya na ƙarfin lantarki na 5V, yana nuna ingantaccen ingancin haɗin gwiwa.

Muhimman Bayanin kula: Ana auna ƙarfin haske ta amfani da tacewa wanda ke kwaikwayon martanin ido na ɗan adam. Kusurwar kallo (θ_1/2) ita ce kusurwar kashe-ax inda ƙarfin ya ragu zuwa rabin ƙimar sa akan-ax. Na'urar tana da hankali ga Zubar da Lantarki (ESD); daidaitaccen sarrafawa tare da kayan aikin ƙasa wajibi ne.

3. Bayanin Tsarin Binning

Don tabbatar da daidaito a cikin samarwa, ana rarraba LEDs zuwa kwandon aiki bisa ga auna ƙarfin haske. Wannan yana ba masu zane damar zaɓar sassa waɗanda suka cika takamaiman buƙatun haske.

3.1 Orange LED Intensity Bins

An rarraba a I_F = 20 mA. Tolerancin a cikin kowane kwando shine ±15%.

• Kwando Q: 71.0 – 112.0 mcd
• Kwando R: 112.0 – 180.0 mcd
• Kwando S: 180.0 – 280.0 mcd

3.2 Green LED Intensity Bins

An rarraba a I_F = 20 mA. Tolerancin a cikin kowane kwando shine ±15%.

• Bin M: 18.0 – 28.0 mcd
• Bin N: 28.0 – 45.0 mcd
• Bin P: 45.0 – 71.0 mcd
• Kwando Q: 71.0 – 112.0 mcd
• Kwando R: 112.0 – 180.0 mcd

This binning structure shows a wider range of available brightness levels for the green LED compared to the orange. Designers must specify the required bin code(s) when ordering to guarantee the luminous intensity range for their application.

4. Performance Curve Analysis

The datasheet references typical performance curves (shown on page 6). While the exact graphs are not reproduced in text, their implications are critical for design.

• Forward Current vs. Forward Voltage (I-V Curve): This curve is non-linear. The forward voltage (V_F) has a negative temperature coefficient; it decreases slightly as the junction temperature increases. Driving the LED with a constant current source, rather than a constant voltage, is essential for stable light output.
• Luminous Intensity vs. Forward Current: Intensity increases approximately linearly with current up to a point, but efficiency may drop at very high currents due to increased heat. Operating at or below the recommended 20-30 mA ensures optimal performance and longevity.
• Luminous Intensity vs. Ambient Temperature: The output of AlInGaP LEDs generally decreases as ambient temperature rises. Designers must account for this derating in high-temperature environments to ensure sufficient brightness.
• Spectral Distribution: The graphs would show the relative intensity across wavelengths, confirming the peak and dominant wavelengths and the spectral half-width, which affects color purity.

5. Mechanical & Package Information

5.1 Package Dimensions and Polarity

The device conforms to an EIA standard SMD package outline. Key dimensional tolerances are ±0.10 mm unless specified otherwise. The lens is water clear. The pin assignment is crucial for correct operation:

• Pin C1: Anode for the Green LED chip.
• Pin C2: Anode for the Orange LED chip.
• The cathodes for both chips are internally connected to a common terminal (typically the third pin or the thermal pad, depending on package). The schematic in the datasheet must be consulted for the exact connection diagram.

5.2 Recommended Solder Pad Layout

The datasheet provides suggested land pattern (footprint) dimensions for the PCB. Adhering to these recommendations is vital for achieving reliable solder joints, proper alignment, and effective heat dissipation during the reflow process. The suggested pattern ensures sufficient solder volume and prevents issues like tombstoning (component standing up on one end). A recommended soldering direction is also indicated to optimize the reflow process.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

A detailed suggested IR reflow profile for Pb-free processes is provided (page 3). Key parameters include:

• Pre-heat: 150–200°C for a maximum of 120 seconds to gradually heat the board and activate the flux.
• Peak Temperature: Maximum of 260°C.
• Time Above Liquidus: The time within the critical temperature zone (typically ~217°C for Pb-free solder) must be controlled to ensure proper solder joint formation without overheating the LED. The profile is based on JEDEC standards.
• Limit: The device can withstand this reflow process a maximum of two times.

Note: The optimal profile depends on the specific PCB design, solder paste, and oven. The provided profile serves as a starting point that must be characterized and adjusted for the actual production setup.

6.2 Hand Soldering

If hand soldering is necessary, extreme care must be taken:

• Iron Temperature: Maximum 300°C.
• Soldering Time: Maximum 3 seconds per joint.
• Limit: Hand soldering should be performed only once to minimize thermal stress.

6.3 Cleaning

Only specified cleaning agents should be used. Unspecified chemicals may damage the epoxy lens or package. If cleaning is required post-soldering, immersion in ethyl alcohol or isopropyl alcohol at room temperature for less than one minute is acceptable.

6.4 Storage and Handling

• Moisture Sensitivity: The LEDs are packaged in moisture-barrier bags with desiccant. Once the original sealed bag is opened, the components are exposed to ambient humidity.
• Floor Life: Ana ba da shawarar kammala IR reflow soldering a cikin mako guda bayan buɗe jakar kariya daga danshi.
• Extended Storage: Don adanawa fiye da mako guda a waje da ainihin jakar, ya kamata a adana abubuwan a cikin kwandon da aka rufe tare da desiccant ko a cikin nitrogen desiccator.
• Baking: Abubuwan da aka adana a waje da ainihin marufinsu fiye da mako guda ya kamata a gasa a kusan 60°C na aƙalla sa'o'i 20 kafin haɗawa don cire danshin da aka ɗauka da kuma hana "popcorning" (fashewar fakitin) yayin reflow.

7. Packaging & Ordering Information

7.1 Tape and Reel Specifications

The device is supplied for automated assembly, packaged in 8mm wide embossed carrier tape on 7-inch (178mm) diameter reels.

• Quantity per Reel: 3000 pieces.
• Minimum Order Quantity (MOQ): 500 pieces for remainder quantities.
• Cover Tape: Empty component pockets are sealed with a top cover tape.
• Missing Components: Matsakaicin adadin LED da ba a samu ba a jere a cikin tef ɗin shine biyu.
• Ma'auni: Marufi ya yi daidai da ƙayyadaddun ANSI/EIA-481.

7.2 Part Number Structure

Lambar bangare LTST-S326KFKGKT tana ɗauke da takamaiman siffofi. Duk da cewa cikakken fassarar kamfani bazai kasance a bainar jama'a ba, tsarin gama gari ya haɗa da lambar jeri (LTST), girman fakitin/nau'in (S326), launi/ruwan tabarau (KFKGKT don launi biyu mai tsabta), da yuwuwar lambobin kwandon. Dole ne a tabbatar da ko a ƙayyade takamaiman lambar kwandon don ƙarfi a lokacin oda.

8. Application Notes & Design Considerations

8.1 Typical Application Scenarios

• Dual-State Indicators: Power (Green) / Fault (Orange); Charge Complete (Green) / Charging (Orange); Network Link/Activity.
• Side-Illumination: Backlighting for membrane switches, edge-lit panels, or light guides where the LED is mounted perpendicular to the viewing surface.
• Consumer Electronics: Status indicators on routers, printers, audio equipment, and gaming consoles.
• Industrial Controls: Panel indicators for machine status, alarm conditions, or mode selection.

8.2 Muhimman Abubuwan Zane

1. Current Limiting: NEVER connect an LED directly to a voltage source. Always use a series current-limiting resistor or, preferably, a constant current driver. Calculate the resistor value using R = (V_supply - V_F) / I_F. Use the maximum V_F from the datasheet (2.4V) for a robust design.
2. Gudanar da Zafi: Yayin da ɓarnawar wutar lantarki ta yi ƙasa, shimfidar PCB ya kamata ya samar da isasshen yanki na tagulla a kusa da kullin gyaɗa don yin aiki azaman ma'aunin zafi, musamman idan ana aiki kusa da matsakaicin halin yanzu ko cikin yanayin yanayi mai zafi.
3. Kariya ta ESD: Aiwatar da kariyar ESD akan layukan siginar da ke tuka LED a cikin yanayi masu mahimmanci. Bi ƙa'idodin ESD masu tsauri yayin sarrafawa da haɗawa.
4. Ƙirar Gani: Kusurwar kallo na digiri 130 tana ba da tarwatsewa mai faɗi. Don aikace-aikacen da ke buƙatar haske mai mai da hankali, na iya zama dole a yi amfani da ruwan tabarau na waje ko bututun haske.
5. Gudanar da Kai: LEDs guda biyu suna da anodes daban. Wannan yana ba su damar sarrafa su daban ta hanyar filayen GPIO na microcontroller guda biyu (tare da direbobi/masoya masu dacewa) ko haɗawa.

9. Technical Comparison & Differentiation

Compared to single-color SMD LEDs, this dual-color device offers significant space savings on the PCB by combining two functions in one package footprint. Versus older through-hole bi-color LEDs, the SMD format enables automated assembly, higher board density, and better reliability.

Key differentiators of this specific part include the use of AlInGaP technology for both colors, which typically offers higher efficiency and better temperature stability compared to some other material systems for orange/red, paired with a compatible green. The side-looking form factor is a distinct advantage over top-emitting LEDs for edge-lighting applications. The wide 130-degree viewing angle and RoHS compliance are standard expectations for modern components.

10. Tambayoyin da ake yawan yi (FAQs)

Q1: Can I drive both LED chips simultaneously at their maximum DC current (30mA each)?
A1: Technically yes, but you must consider the total power dissipation. At 30mA and a typical V_F of 2.0V, each chip dissipates 60mW, for a total of 120mW. This exceeds the absolute maximum power dissipation rating of 75mW per chip Kuma kwayoyin zafi na hade na iya haifar da zafi fiye da kima. Yana da aminci a sarrafa kowane chip a ko ƙasa da 20mA don ci gaba da amfani.

Q2: Ta yaya zan gane madaidaicin fil (C1 da C2) akan kayan haɗin jiki?
A2: Zanen kunshin datasheet zai nuna alamar polarity, kamar ɗigo, tsaga, ko kusurwar da aka yanka akan kunshin. Wannan alamar tayi daidai da takamaiman fil (misali, Fil 1). Dole ne ku kwatanta wannan alamar tare da teburin sanya fil (C1=Kore, C2=Orange) a cikin datasheet. Koyaushe ku tabbatar da takaddun mai kayan.

Q3: Me yasa ƙimar binning tolerance ±15%? Zan iya samun ƙaramin bins?
A3: ±15% sanannen ƙimar masana'antu ce don ƙwayoyin haske mai haske a cikin daidaitattun LEDs na nuna alama. Tana ɗaukar bambance-bambancen tsari na yau da kullun. Ƙananan bins (misali, ±5%) na iya kasancewa a matsayin odar musamman ko don mafi girman kayan, amma yawanci suna zuwa da farashi mafi girma. Ga yawancin aikace-aikacen nuna alama, ±15% yana karɓuwa.

Q4: Bayanina na reflow oven ya bambanta da shawarar. Shin wannan matsala ce?
A4: Shawarar bayanin jagora ce. Yana da mahimmanci cewa ainihin bayanin ku bai wuce cikakkiyar matsakaicin ƙimar (260°C na 10 sec) ba. Ya kamata ku siffanta tsarin ku don tabbatar da zafin jiki mafi girma na LED da lokacin da ya wuce ruwa suna cikin iyakokin aminci. Ana ba da shawarar tabbatar da bayanin ta hanyar thermalcouples.

11. Nazarin Shari'ar Zane na Aiki

Scenario: Designing a status indicator for a portable device with a single side-view window. The indicator must show Green for "Normal Operation" and Orange for "Low Battery".

Implementation:

1. Component Selection: The LTST-S326KFKGKT is ideal due to its side emission, fitting perfectly next to the edge of the window, and its dual-color capability in one package.
2. Schematic: Kulla Pin C1 (Green) da Pin C2 (Orange) zuwa fil ɗin GPIO guda biyu na microcontroller na na'urar ta hanyar resistors masu iyakancewar ƙarfin lantarki. Yi lissafin ƙimar resistor don ƙarfin tuƙi na 15mA (mai ra'ayin mazan jiya don rayuwar baturi) ta amfani da ƙarfin lantarki na 3.3V: R = (3.3V - 2.4V) / 0.015A = 60 Ohms. Yi amfani da ƙimar daidaitaccen ƙima na gaba, 62 Ohms.
3. Tsarin PCB: Sanya LED a kusa da gefen allon kusa da taga mai nuna alama. Bi girman filayen solder da aka ba da shawarar daga takardar bayanan. Ƙara ƙaramin juzu'in jan ƙarfe wanda aka haɗa zuwa fil ɗin zafi (cathode) don watsa zafi.
4. Firmware: Lambar microcontroller kawai tana saita madaidaicin filin GPIO sama don haskaka LED Green ko Orange bisa ga matsayin tsarin.

12. Technology Principle Introduction

Wannan LED ya dogara ne akan electroluminescence na semiconductor. Zuciyar kowane guntu ita ce PN junction da aka yi daga kayan semiconductor na AlInGaP (Aluminium Indium Gallium Phosphide). Lokacin da aka yi amfani da ƙarfin lantarki na gaba, electrons daga yankin N-type da ramuka daga yankin P-type ana allurar su a kan junction. Lokacin da waɗannan masu ɗaukar caji suka sake haɗuwa, suna sakin makamashi a cikin nau'in photons (haske). Takamaiman abun da ke cikin gawa na AlInGaP yana ƙayyade ƙarfin bandgap na semiconductor, wanda kai tsaye yake ƙayyade tsawon zango (launi) na hasken da aka fitar. Guntun orange yana da ƙaramin bandgap fiye da guntun kore. Hasken da aka samar a junction yana tserewa ta hanyar ruwan tabarau na epoxy mai siffar dome, wanda kuma yana kare mutuwar semiconductor da haɗin waya. Kunshin kallon gefe ya haɗa da kofin mai nuna alama wanda ke jagorantar fitowar farko a gefe.

13. Industry Trends & Developments

The trend in SMD indicator LEDs continues toward higher efficiency (more light output per unit of electrical power), which reduces energy consumption and heat generation. There is also a drive for miniaturization, with packages becoming ever smaller while maintaining or improving optical performance. The integration of multiple colors or even RGB capabilities into a single miniature package is common. Furthermore, advancements in packaging materials aim to improve reliability under higher temperature reflow profiles and harsher environmental conditions. The adoption of more robust and consistent binning systems helps designers achieve tighter color and brightness uniformity in their products. The underlying semiconductor materials, like AlInGaP, are continually refined to improve internal quantum efficiency and color stability over temperature and lifetime.