LTST-S115TGKFKT 双色侧发光贴片LED规格书 - 侧视封装 - 绿色(530nm) & 橙色(611nm) - 3.2V/2.0V - 76mW/75mW - 中文技术文档

1. Product Overview

This document provides the complete technical specifications for a dual-color, side-view surface-mount device (SMD) LED. This component is specifically designed for applications requiring compact, high-brightness illumination from the side, with its primary target market being LCD panel backlight modules. Its core advantages include: integrating two different semiconductor chips within a single package, compatibility with automated assembly processes, and compliance with RoHS and green product standards.

This LED features a transparent lens and encapsulates two independent light-emitting chips: one producing green light and the other producing orange light. This design allows for color mixing or independent control in space-constrained designs. The device is supplied on industry-standard 8mm carrier tape, wound onto 7-inch reels, facilitating high-volume, automated pick-and-place assembly and reflow soldering.

2. Cikakken bayani game da sigogi na fasaha

2.1 Absolute Maximum Ratings

These ratings define the stress limits that may cause permanent damage to the device. Operation at or beyond these limits is not guaranteed. Key parameters include:

• Power Dissipation (Pd):The green chip is 76 mW, and the orange chip is 75 mW. This is the maximum allowable power that the LED can dissipate as heat when the ambient temperature (Ta) is 25°C. Exceeding this limit risks thermal runaway and failure.
• Peak Forward Current (I_FP):Under pulse conditions (1/10 duty cycle, 0.1ms pulse width), it is 100 mA for green and 80 mA for orange. This rating is much higher than the DC rating, allowing the use of brief high-current pulses in applications such as multiplexing or achieving instantaneous peak brightness.
• DC Forward Current (I_F):It is 20 mA for green and 30 mA for orange. This is the recommended continuous operating current to ensure long-term reliable performance.
• Reverse Voltage (V_R):It is 5 V for both chips. Applying a reverse voltage exceeding this value may cause immediate and catastrophic junction breakdown. The datasheet clearly states that reverse voltage operation cannot be sustained.
• Temperature Range:Zangin aiki: -20°C zuwa +80°C; Zangin ajiya: -30°C zuwa +100°C. Waɗannan suna bayyana iyakokin yanayin aiki da ajiya ba tare da aiki ba.
• Yanayin gauran infrared:Yana iya jurewar 260°C na tsawon dakika 10, wannan shine daidaitaccen buƙatun tsarin gauran maras gubar (Pb-free) wanda ya dace da ka'idojin IPC/JEDEC.

2.2 Electrical and Optical Characteristics

Waɗannan sune madaidaicin sigogi na aiki da aka auna a yanayin Ta=25°C da I_F=20mA, suna wakiltar halayen da ake tsammani a ƙarƙashin yanayin aiki na yau da kullun.

• Ƙarfin haske (I_V):Mafi ƙarancin ƙwayar kore shine 71.0 mcd, mafi girma shine 450.0 mcd. Mafi ƙarancin ƙwayar lemu shine 28.0 mcd, mafi girma shine 280.0 mcd. Ana sarrafa wannan faɗin kewayon ta tsarin rarrabawa (wanda za a bayyana daga baya). Ana yin ma'aunin ƙarfi ta amfani da na'urar firikwensin da aka tace don dacewa da lanƙwasa amsawar idon ɗan adam na gani (CIE).
• Kallon kusurwa (2θ_1/2):The typical value for both colors is 130 degrees. This wide viewing angle is a characteristic of side-view LEDs, making them very suitable for backlight applications that require uniform light distribution across the panel.
• Peak Wavelength (λ_P):The typical value is 530 nm for green and 611 nm for orange. This is the wavelength at which the spectral power distribution reaches its maximum.
• Dominant Wavelength (λ_d):The typical value is 525 nm for green and 605 nm for orange. This is the single wavelength perceived by the human eye that defines the color, derived from the CIE chromaticity diagram. It is a more relevant parameter for color specification.
• Spectral Line Half-Width (Δλ):The typical value is 35 nm for green and 17 nm for orange. This indicates spectral purity; a narrower half-width means a more saturated and purer color. In this device, the orange AlInGaP chip exhibits higher color purity than the green InGaN chip.
• Forward Voltage (V_F):At 20mA current, the typical value is 3.2 V (max 3.6 V) for green and 2.0 V (max 2.4 V) for orange. This parameter is crucial for driver circuit design, as the two chips require different supply voltages at the same current.
• Reverse current (I_R):at V_R=5V, both have a maximum of 10 µA. Low reverse leakage current is a hallmark of a high-quality semiconductor junction.

3. Bayani game da tsarin rarrabawa

To ensure consistency in mass production, LEDs are binned according to performance. This system allows designers to select devices that meet the specific minimum standards for their application.

3.1 Rarraba Ƙarfin Haskakawa

Light output is classified into letter-designated bins. Each bin has defined minimum and maximum intensities, with an in-bin tolerance of ±15%.

• Green chip:Bins Q (71.0-112.0 mcd), R (112.0-180.0 mcd), S (180.0-280.0 mcd), T (280.0-450.0 mcd).
• Orange chip:Bins N (28.0-45.0 mcd), P (45.0-71.0 mcd), Q (71.0-112.0 mcd), R (112.0-180.0 mcd), S (180.0-280.0 mcd).

3.2 Rarraba Babban Tsawon Zango (Kore kawai)

Green chips are also binned by dominant wavelength to control color consistency.

• Bins AP (520.0-525.0 nm), AQ (525.0-530.0 nm), AR (530.0-535.0 nm). The tolerance for each wavelength bin is ±1 nm.

The specific bin combination for a complete device (e.g., green intensity bin, orange intensity bin, green wavelength bin) is typically specified in the full ordering code or can be obtained from the manufacturer.

4. Bincike kan Lankwalin Aiki

The datasheet references typical characteristic curves, which are crucial for understanding the device's behavior under different conditions. Although the exact graphs are not provided in the text, their standard interpretation is as follows:

• I-V (Current-Voltage) Curve:Shows the relationship between forward voltage (V_F) and forward current (I_F). It is nonlinear, featuring a turn-on/threshold voltage (approximately 2.8V for green, 1.8V for orange), beyond which the current increases rapidly. This curve is essential for designing constant current drivers.
• Relative Luminous Intensity vs. Forward Current:Demonstrates how light output increases with current, typically showing an approximately linear relationship within the recommended operating range. Driving current exceeding I_Fleads to diminishing returns and increased heat generation.
• Relative Luminous Intensity vs. Ambient Temperature:Shows light output decreasing with rising junction temperature. LEDs are less efficient at higher temperatures. This curve is crucial for thermal management design to maintain brightness consistency.
• Spectral Distribution:A plot of relative radiant power versus wavelength, showing the peak (λ_P) and the full width at half maximum (Δλ).

5. Bayanan Injiniya da Kunshewa

5.1 Package Dimensions and Polarity

The device employs standard EIA package dimensions. Pin definitions are clear: Cathode 2 (C2) corresponds to the green (InGaN) chip, and Cathode 1 (C1) corresponds to the orange (AlInGaP) chip. The common anode configuration is typical for multi-chip LEDs. A detailed dimension drawing (not fully detailed in the text excerpt) will provide precise length, width, height, lead pitch, and lens geometry, with a standard tolerance of ±0.10 mm for all dimensions.

5.2 Recommended Pad Layout and Orientation

The datasheet contains recommendations for the printed circuit board (PCB) pad pattern (pad dimensions) and soldering orientation. Following these guidelines ensures proper mechanical alignment, forms reliable solder joints, and prevents issues like tombstoning during reflow soldering.

6. Soldering and Assembly Guide

6.1 Reflow Soldering Temperature Profile

A recommended infrared (IR) reflow temperature profile for lead-free processes is provided. This profile complies with JEDEC standards, and its key parameters include:

• Preheat:150-200°C, maximum 120 seconds, to gradually heat the board and components, activate the flux, and minimize thermal shock.
• Peak Temperature:Maximum 260°C. The device is rated to withstand this temperature for 10 seconds.
• The profile emphasizes that board-specific characterization is necessary due to variations in board design, components, and solder paste.

6.2 Hand Soldering

For hand soldering, an iron temperature not exceeding 300°C is recommended, with a maximum soldering time of 3 seconds per joint. This operation should be performed only once to avoid thermal damage to the plastic package and internal bond wires.

6.3 Cleaning

Only specified cleaning agents should be used. The recommended method is immersion in ethanol or isopropanol at room temperature for less than one minute. The use of aggressive or unspecified chemicals may damage the epoxy lens and package, leading to reduced light output or premature failure.

6.4 Storage and Handling

LEDs are Moisture Sensitive Devices (MSD).

• Sealed Package:Storage conditions are ≤30°C and ≤90% RH. The shelf life is one year when stored in a moisture barrier bag with desiccant.
• Opened package:Storage conditions should not exceed 30°C and 60% RH. Components removed from the original packaging should be reflow soldered within one week. For longer storage, they must be kept in a sealed container with desiccant or in a nitrogen dryer. If stored opened for more than one week, baking at approximately 60°C for at least 20 hours is required before assembly to remove absorbed moisture and prevent the "popcorn" phenomenon during reflow soldering.

7. Packaging and Ordering Information

This product is supplied in tape and reel format compatible with automated SMD assembly equipment.

• Reel:7-inch diameter reel.
• Carrier tape:8mm wide carrier tape.
• Quantity:3000 pieces per full reel. For remaining quantities, the minimum packaging quantity is 500 pieces.
• Quality:Packaging conforms to ANSI/EIA 481-1-A-1994 specification. Empty positions in the carrier tape are sealed with cover tape. The maximum number of consecutive missing components ("missing LEDs") is two.

8. Application Suggestions

8.1 Typical Application Scenarios

The primary and explicitly stated application isLCD Backlight, particularly in small and medium-sized displays, where side-view LEDs are used to inject light into the Light Guide Plate (LGP). The dual-color function allows for tunable white backlighting (by mixing green and orange with blue LEDs elsewhere) or creating specific color accents and indicators within the display assembly. Other potential applications include status indicators, panel lighting, and decorative lighting in consumer electronics, office equipment, and communication devices.

8.2 Design Considerations

• Drive Circuit:Since the green and orange chips have different forward voltages (3.2V vs. 2.0V), they cannot be driven from a single constant voltage source in a simple parallel configuration without a current-limiting resistor for each chip. Using a constant current driver is recommended for optimal performance and stability.
• Thermal Management:Although power consumption is low, employing a proper PCB layout with sufficient heat dissipation and possibly small copper pads helps manage heat, especially when operating near maximum current or at higher ambient temperatures. This helps maintain luminous efficacy and lifespan.
• Optical Design:A 130-degree viewing angle is suitable for edge-lit backlighting. The design of the light guide plate, diffuser, and reflector must be optimized for this LED's emission pattern to achieve uniform illumination.

9. Technical Comparison and Differentiation

This device offers specific advantages in its niche:

• Dual-Chip Integration:Compared to using two separate monochromatic LEDs, this package saves PCB space, simplifies assembly (one mounting step), and ensures precise mechanical alignment between the two light sources, which is crucial for color mixing.
• Side-View Profile:Compared to top-view LEDs, the side-view package is crucial for ultra-thin backlight modules where thickness (Z-axis) is constrained and light must be emitted parallel to the PCB plane.
• Chip Technology:The use of AlInGaP to manufacture orange chips, compared to older technologies like GaAsP, offers higher efficiency and better temperature stability, resulting in brighter and more consistent orange light output.
• Process Compatibility:Fully compatible with reflow soldering and automated placement, making it suitable for modern, high-volume production lines.

10. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive the green and orange chips simultaneously at their maximum DC currents (20mA and 30mA)?
A1: Yes, but total power dissipation must be considered. Simultaneous operation at maximum currents will dissipate approximately (3.2V * 0.02A) + (2.0V * 0.03A) = 0.124W. This is below their individual Pd ratings but close to their sum. Adequate thermal design on the PCB is necessary to prevent the junction temperature from exceeding safe limits, especially within a sealed enclosure.

Q2: Why is the reverse voltage rating only 5V, and what does "not for continuous operation" mean?
A2: Haɗin gwiwar LED semiconductor ba a ƙirƙira shi don hana babban ƙarfin lantarki na baya ba. Ƙimar 5V ta zama kamar haka. Wannan jimla tana nufin cewa ko da a ci gaba da amfani da ƙarfin lantarki na baya ƙasa da 5V ba a ba da shawarar ko ƙayyadadde shi ba. A cikin ƙirar da'ira, ya kamata a tabbatar cewa LED ba za ta taɓa ɗaukar ƙarfin lantarki na baya ba, ko kuma a yi amfani da diode na kariya a lokacin da ake buƙata.

Q3: Yaya ake fassara lambobin rarrabuwa lokacin yin oda?
A3: Kuna buƙatar ƙayyade lambobin rarrabuwar ƙarfin haske da ake buƙata (don kore da orange) da lambobin rarrabuwar babban tsayin raƙuman ruwa (don kore), don tabbatar da cewa samfurinku yana samun LED mai halayen haske da launi da ake buƙata. Misali, kuna iya yin oda na'urar mai rarrabuwa "kore: ƙarfi T, tsayin raƙuman ruwa AQ; orange: ƙarfi R". Ku tuntubi masana'anta don samun ainihin tsarin lambobin oda.

11. Practical Design Cases

Yanayi:Ƙirƙirar alamar yanayin na'ura, wanda ke buƙatar launuka daban-daban guda biyu (kore don "shirye", orange don "jiran aiki/gargadi"), kuma sararin da ake da shi akan PCB yana da ƙarancin sarari sosai, yana kan gefen PCB da aka ɗora a tsaye a cikin akwatin samfurin.

Hanyar aiwatarwa:LTST-S115TGKFKT shine ne mai. Single component footprint e amfani. Microcontroller GPIO pin daya mai sauƙi zai iya haɗawa da kowane cathode (C1 yana dace da orange, C2 yana dace da kore) ta hanyar resistor mai iyakancewar da ta dace (gwargwadon kwararar da ake buƙata, har zuwa 20/30mA, da lissafin ƙarfin lantarki), gabaɗayan anode yana haɗawa da ingantaccen wutar lantarki. Hasken gefe yana ba da izinin fitar da haske ta ƙaramin rami a gefen na'urar ko mai jagorar haske. Faɗin kusurwar hangen nesa yana tabbatar da cewa ana iya ganin alamar daga faɗin kusurwoyi. Marufi mai jujjuyawa yana ba da damar haɗa shi tare da duk sauran abubuwan SMD a cikin aikin garkuwa ɗaya.

12. Principle Introduction

Haskakawa a cikin LED ya dogara ne akan hasken lantarki a cikin haɗin p-n na semiconductor. Lokacin da ake amfani da ƙarfin lantarki mai kyau, ana shigar da electrons da ramuka cikin yanki mai aiki, inda suke haɗuwa, suna sakin makamashi a cikin nau'in photons. Launin hasken da aka fitar (tsawon zango) yana ƙaddara ta hanyar makamashin tazarar band na kayan semiconductor.

• Guntu kore (InGaN):Indium Gallium Nitride wani fili ne na semiconductor wanda za'a iya daidaita tazarar band ɗinsa ta hanyar daidaita ma'aunin indium/gallium don fitar da haske mai shuɗi zuwa kore. A nan, an ƙera shi don fitar da hasken kore mai kusan 530 nm.
• Guntu orange (AlInGaP):Aluminum Indium Gallium Phosphide wani fili ne na semiconductor wanda aka sani da ingantacciyar inganci a cikin yankunan jan, orange, da rawaya. An daidaita tazarar band ɗinsa a nan don fitar da hasken orange mai kusan 611 nm.

An shigar da guntu biyu akan firam ɗin jagora, an haɗa su a cikin ɗaya mai rufi na epoxy, tare da ruwan tabarau mai gani wanda ke da ƙaramin sha na hasken da ake fitarwa, yana ba da damar ingantaccen ingancin gani.

13. Development Trends

The SMD LED field continues to evolve, with several distinct trends associated with such components including:

• Efficiency Improvement (lm/W):Ongoing advancements in material science and chip design aim to extract more light (lumens) from the same electrical input power (watts), thereby reducing energy consumption and thermal load.
• Higher Reliability and Lifespan:Improvements in packaging materials, die-attach technology, and phosphor technology (where applicable) are extending operational lifespan and enhancing performance under harsh environmental conditions.
• Miniaturization:The drive for smaller electronic devices is pushing LEDs towards smaller package sizes and lower profile heights while maintaining or increasing light output.
• Color Accuracy and Consistency:Tighter binning tolerances and improved manufacturing processes result in smaller variations in color and brightness between batches, which is crucial for applications requiring a uniform appearance.
• Integration:Beyond dual-color, there is a trend towards integrating more functions—such as RGB chips, driver ICs, and even photodetectors—into a single package to create smarter, more compact lighting solutions.