LTW-C195DSKF-5A Dual-Color SMD LED Datasheet - White and Orange Light - 20-30mA - 72-75mW - Technical Documentation

1. Product Overview

LTW-C195DSKF-5A is a dual-color surface-mount device (SMD) LED designed for modern electronic applications requiring compact, reliable, and high-brightness indicator or backlight solutions. It integrates two different semiconductor chips within a standard EIA package: an InGaN chip for white light emission and an AlInGaP chip for orange light emission. This configuration enables dual-color operation within a single component footprint, thereby saving valuable PCB space. The device is packaged on 8mm tape and reel, wound on a 7-inch diameter reel, and is fully compatible with high-speed automated pick-and-place assembly equipment. It is classified as a green product and complies with the RoHS directive.

2. Detailed Technical Parameters

2.1 Absolute Maximum Ratings

These ratings define the stress limits that may cause permanent damage to the device. Operation at or near these limits is not guaranteed. To ensure long-term reliability, such operation should be avoided.

• Power Dissipation:White light chip: 72 mW, Orange light chip: 75 mW. This is the maximum allowable thermal dissipation power. Exceeding this value may lead to excessive junction temperature and accelerate performance degradation.
• Peak forward current_FP：White light: 100 mA, Orange light: 80 mA. This is the maximum instantaneous current, typically specified under pulse conditions (1/10 duty cycle, 0.1ms pulse width) to prevent thermal overload during brief transients.
• Direct forward current_F：White light: 20 mA, orange light: 30 mA. This is the recommended maximum continuous forward current during normal operation. Orange light chips can withstand higher continuous current.
• Reverse voltage_R：Both chips are 5 V. Applying a reverse voltage higher than this value may cause breakdown and damage. The datasheet clearly states that reverse voltage operation cannot be continuous.
• Temperature range:Operating Temperature: -20°C to +80°C; Storage Temperature: -30°C to +100°C. These define the environmental limits for functional use and non-operational storage.
• Infrared Reflow Soldering:Can withstand a peak temperature of 260°C for 10 seconds, which aligns with common lead-free solder reflow profiles.

2.2 Electrical and Optical Characteristics

These are typical and guaranteed performance parameters measured under standard test conditions Ta=25°C and I_F=5mA (unless otherwise specified).

• Luminous Intensity_V：Key indicator for measuring brightness.
  • White light: min 45.0 mcd, typ not specified, max 180.0 mcd.
  • Orange light: min 11.2 mcd, typ not specified, max 71.0 mcd.
  • Measurement follows the CIE human eye response curve, using specified test equipment (e.g., CAS140B).
• Viewing angle_1/2：Both colors have a viewing angle of 130 degrees (typical). This wide viewing angle is characteristic of the package lens design, providing a broad emission pattern suitable for indicator light applications.
• Wavelength Parameters (Orange Chip):
  • Peak Emission Wavelength_P: 611 nm (typical). The wavelength at which the spectral power output is highest.
  • Dominant Wavelength_d: 605 nm (typical). The single wavelength perceived by the human eye that matches the LED color.
  • Spectral Line Half-Width: 20 nm (typical). The emission spectral bandwidth at half the peak intensity, indicating color purity.
• Chromaticity Coordinates (Orange Light Chip):x=0.3, y=0.3 (typical values). These CIE 1931 coordinates define the precise orange point on the chromaticity diagram. The tolerance for these coordinates is ±0.01.
• Forward voltage_F：
  • White light: typical value 2.75V, maximum value 3.15V (at I_F=5mA).
  • Orange: Typical value 2.00V, maximum value 2.40V (at I_F=5mA).
  • The lower V_FConsistent with the AlInGaP material system.
• Reverse current_R：Maximum 10 µA (white) and 100 µA (orange) (at V_R(at V = -5V). This is the small leakage current when the device is reverse biased.

Electrostatic Discharge Precautions:LEDs are sensitive to electrostatic discharge. Handling procedures must include the use of wrist straps, antistatic gloves, and properly grounded equipment and workstations to prevent damage from ESD or surge events.

3. Bin System Description

To manage natural variations in semiconductor manufacturing, LEDs are binned according to performance. The LTW-C195DSKF-5A uses independent binning for luminous intensity and forward voltage.

3.1 Luminous Intensity Binning_VWhite Chip:

• Gear P (45.0-71.0 mcd), Q (71.0-112.0 mcd), R (112.0-180.0 mcd). Tolerance within each gear is ±15%.Orange LED chip:
• Gear L (11.2-18.0 mcd), M (18.0-28.0 mcd), N (28.0-45.0 mcd), P (45.0-71.0 mcd). Tolerance within each gear is ±15%.The specific bin code is marked on the packaging, allowing designers to select LEDs with consistent brightness for their applications.
• 3.2 Forward Voltage Binning (White LED Chip Only)

Bin A (2.55-2.75V), B (2.75-2.95V), C (2.95-3.15V). The tolerance within each bin is ±0.1V._FBinning V

• helps in designing more consistent current drive circuits, especially when multiple LEDs are connected in series.
• 3.3 Chromaticity Binning (Orange LED Chip Color)_FOrange is precisely controlled through six chromaticity bins (S1 to S6) defined on the CIE 1931 chromaticity diagram. Each bin has specific (x, y) coordinate boundaries (e.g., S1: x 0.274-0.294, y 0.226-0.286). The tolerance for the chromaticity coordinates (x, y) within each bin is ±0.01. This ensures very tight color consistency in applications requiring precise orange hues.

4. Performance Curve Analysis

The datasheet references typical characteristic curves, which are crucial for understanding the device's behavior under non-standard conditions. Although the provided text does not fully detail the specific charts, standard LED curves typically include:

Forward Current vs. Forward Voltage Curve:

Shows an exponential relationship. Due to the different semiconductor band gaps of InGaN (white light) and AlInGaP (orange light) chips, the curves will differ, which explains the different typical V

• Luminous Intensity vs. Forward Current Curve:It shows how the light output increases with current, typically exhibiting sublinear growth at higher currents due to thermal effects and efficiency droop._F values.
• Luminous Intensity vs. Ambient Temperature Curve:It shows that as the junction temperature increases, the light output decreases. This is crucial for thermal management design.
• Spectral Power Distribution:For the orange LED chip, this graph will show an emission peak at approximately 611 nm with a specified 20 nm FWHM, thereby confirming the color characteristics.
• 5. Mechanical and Packaging Information5.1 Package Dimensions and Pin Definitions

The device adopts the standard EIA package outline. Unless otherwise specified, critical dimension tolerances are ±0.10 mm. The pin definitions for the dual-color function are clearly defined:

Pin 1 and Pin 3: Anode/Cathode of the InGaN white light chip.

Pin 2 and Pin 4: Anode/Cathode of the AlInGaP orange light chip.

• This 4-pin configuration allows for independent control of the two colors. The lens material is specified as yellow, which may act as a diffuser or wavelength converter for the white LED chip and could slightly affect the hue of the orange light output.
• 5.2 Recommended Land Pattern

The datasheet includes a recommended pad layout (pad dimensions) for PCB design. Following this guideline ensures good solder joint formation during reflow, good mechanical stability, and optimal heat dissipation from the LED package to the PCB.

6. Soldering and Assembly Guide

6.1 Reflow Soldering Process

This LED is compatible with infrared reflow soldering processes. The maximum conditions it can withstand are 260°C for 10 seconds, which is the standard for lead-free assembly. The datasheet implies a recommended reflow profile, typically including a preheat zone, rapid ramp-up to peak temperature, a brief time above liquidus, and a controlled cooling stage. Following this profile prevents thermal shock and soldering defects.

6.2 Storage and Handling

Marufi Mai Rufi:

Store at ≤30°C and ≤90% relative humidity. Use within one year when the moisture barrier bag with desiccant is intact.

• Opened package:For components removed from the sealed bag, the storage environment should not exceed 30°C / 60% relative humidity. It is strongly recommended to complete the infrared reflow soldering process within one week after opening.
• Long-term storage (opened):If storage exceeds one week, LEDs should be kept in a sealed container with desiccant or in a nitrogen desiccator. Components stored outside the bag for more than one week require a pre-baking treatment (approximately 60°C for at least 20 hours) prior to soldering to remove absorbed moisture and prevent the "popcorn" effect during reflow.
• 6.3 CleaningIf post-assembly cleaning is required, use only specified solvents. Immersing the LED in ethanol or isopropyl alcohol at room temperature for no more than one minute is acceptable. The use of unspecified chemical cleaners is prohibited as they may damage the LED's epoxy lens or package.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

Products are packaged in industry-standard embossed carrier tape with cover tape, wound on 7-inch (178 mm) diameter reels.

Quantity per reel:

3000 pieces.

• Minimum Order Quantity:The remaining quantity is 500 pieces.
• Tape Width:8 mm.
• Packaging standard:Compliant with ANSI/EIA-481-1-A-1994 component packaging specification.
• Quality:The maximum number of consecutive missing components (empty cavities) in the tape is two.
• Detailed dimensional drawings of the carrier tape (cavity pitch, depth) and reel (hub diameter, flange diameter) are provided to ensure compatibility with automated equipment feeders.8. Application Recommendations

8.1 Typical Application Scenarios

Dual-color Status Indicator:

Suitable for equipment panels, a single LED can display multiple statuses (e.g., white indicates "On/Active", orange indicates "Standby/Warning").

• Backlighting for Consumer Electronics:Can be used for button or decorative lighting in devices requiring dual-color effects.
• Automotive Interior Lighting:For ambient lighting that can switch between white and orange tones.
• Industrial control panel:Provides clear, bright status indication under various operating modes.
• 8.2 Design ConsiderationsCurrent Limiting:

Always use a series current-limiting resistor or constant current driver for each chip. Calculate based on the supply voltage and the desired operating current (not exceeding I

• ) and the maximum forward voltage at DC.Thermal Management:_{Although the power consumption is low, ensuring sufficient PCB copper area around the pads helps with heat dissipation, maintaining light output and lifespan, especially under higher ambient temperatures or drive currents.}ESD Protection:_FIn environments prone to electrostatic discharge, add ESD protection diodes to the signal lines driving the LEDs.
• Optical Design:A 130-degree viewing angle provides broad coverage. For more directional light, secondary optical elements (lenses, light guides) may be required.
• 9. Technical Comparison and DifferentiationThe LTW-C195DSKF-5A has specific advantages in its category:
• Dual-Chip Integration:It combines two different semiconductor technologies (InGaN for white light, AlInGaP for orange light) within a single package, providing superior color performance and brightness for each color compared to single-chip LEDs that attempt to achieve dual colors through phosphor coating.

Independent Control:

Independent anodes/cathodes allow for completely independent driving and dimming of each color, enabling dynamic color mixing or sequence control that cannot be achieved with common-cathode/common-anode dual-color LEDs.

• High-brightness orange light:The orange light chip utilizes AlInGaP technology, which typically offers higher efficiency and brighter output at specific wavelengths compared to older technologies.
• Sturdy Package:Compatible with infrared reflow soldering and tape-and-reel packaging, making it suitable for fully automated, high-volume surface-mount production lines.
• 10. Frequently Asked Questions (Based on Technical Parameters)Q1: Can I drive the white and orange LED chips simultaneously at their maximum DC current?
• A: Not necessarily. You must consider the total power consumption. Driving the white LED at 20mA (approximately 2.75V) and the orange LED at 30mA (approximately 2.00V) simultaneously results in a total power of about 112.5 mW. If heat dissipation is insufficient, this may exceed the thermal design limits of a small package. A safer approach is to operate below the absolute maximum ratings or implement thermal derating.Q2: What is the difference between peak wavelength and dominant wavelength?

A: Peak wavelength (λ

=611 nm) is the physical peak of the LED emission spectrum. The dominant wavelength (λ
=605 nm) is the perceptual peak—the single wavelength of pure spectral light that the human eye perceives as matching the LED's color. They are often different, especially for broader spectra.

Q3: Why are the storage humidity requirements stricter for opened packages?
A: Epoxy molding compound used in SMD LEDs absorbs moisture from the air. During the high-temperature reflow soldering process, this trapped moisture rapidly vaporizes, creating internal pressure that can lead to package cracking (the "popcorn" effect). Pre-soldering baking can remove this absorbed moisture._PQ4: How to interpret the chromaticity bin coordinates (e.g., S1)?_dA: The four (x,y) coordinate pairs for a bin like S1 define the corner points of a quadrilateral on the CIE chromaticity diagram. Any LED whose measured chromaticity coordinates fall within this quadrilateral is classified into the S1 bin. This is a more precise method for defining color space than simple wavelength binning.

11. Practical Design Cases
Scenario:

Design a multi-state power button for a consumer audio amplifier. The button needs to indicate: Off (off), Standby (orange pulse), On (white steady light).
Implement using LTW-C195DSKF-5A:

1. Place the LED behind the translucent button cap.

2. The microcontroller drives the two colors via two independent GPIO pins, each with its own series current-limiting resistor, calculated for a 5mA drive current (to achieve long life and moderate brightness).4. Off state:

5. Both MCU pins are set to high-impedance input or output low level.
Standby state:
The MCU pin connected to the orange LED (pin 2/4) is driven by a PWM signal to create a pulsing effect. The white LED pin remains off.
3. On state:The MCU pin for the white LED (pins 1/3) maintains a continuous high-level output. The orange LED pin is off.
4. This design occupies only a single component footprint, simplifies assembly, and utilizes the high-quality, consistent light from the two chips to provide clear, distinctive visual feedback.12. Introduction to Technical Principles
5. LTW-C195DSKF-5A employs two distinct solid-state lighting technologies:InGaN (White Light Chip):

Typically, a blue-emitting InGaN LED chip is combined with a yellow phosphor coating (YAG:Ce). Some blue light escapes, while the rest is down-converted by the phosphor into yellow light. The mixture of blue and yellow light is perceived by the human eye as white light. The yellow encapsulating lens may also aid in color mixing or diffusion.

AlInGaP (Orange Chip):

This material system is grown on a substrate (typically GaAs) and engineered so that its direct bandgap corresponds to light emission in the red, orange, and yellow regions of the spectrum (approximately 590-650 nm). It is highly efficient at producing saturated colors within this range. The orange light output is generated directly by electron-hole recombination within the semiconductor material itself, without the need for a phosphor.

• Electroluminescence shine aiki na tsakiya: Lokacin da aka yi amfani da madaidaicin ƙarfin lantarki akan semiconductor p-n junction, electrons da ramuka suna haɗuwa, suna sakin makamashi a cikin nau'in photon (haske). Tsawon haske (launi) yana ƙaddara ta hanyar ƙarfin tazarar band na kayan semiconductor.13. Trends in Development
• Yankin SMD LED yana ci gaba da haɓakawa, waɗannan yanayin suna ba da mahallin ga na'urori kamar LTW-C195DSKF-5A:Ingantaccen aiki da haɓakar haske:

Continuous improvements in epitaxial growth, chip design, and package extraction efficiency enable higher mcd output per mA of input current, resulting in lower power consumption or brighter displays.

Miniaturization:

Although this is a standard EIA package, the industry is pushing for smaller footprints (e.g., 0402, 0201) to accommodate ultra-compact devices, albeit often at the expense of total light output or thermal performance.

• Color Consistency and Binning Improvements:Advances in manufacturing process control have enabled V
• , IThe distribution of luminance and chromaticity is more concentrated, reducing the required number of bins and ensuring more uniform performance in mass production.
• Integrated Solution:The trend is towards LEDs with built-in current regulators, ESD protection, and even simple control logic ("smart LEDs") to simplify circuit design for end-users._FFocus on Reliability and Lifespan:_VEnhanced lens and packaging materials provide better resistance to heat, humidity, and short-wavelength light, thereby extending operational lifespan, which is particularly important for industrial and automotive applications.
• Integrated Solutions:A trend towards LEDs with built-in current regulators, ESD protection, or even simple control logic ("smart LEDs") to simplify circuit design for the end user.
• Focus on Reliability and Lifetime:Lens and encapsulant materials with improved resistance to heat, humidity, and short-wavelength light, resulting in extended operational lifespans—particularly critical for industrial and automotive applications.