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LTW-C235DSKF-5A Dual-Color SMD LED Datasheet - White and Orange Light - 20-30mA - 72-75mW - Technical Documentation

A technical datasheet for a dual-color (white/orange) SMD LED, containing detailed specifications, electrical/optical characteristics, binning codes, package dimensions, and assembly guidelines.
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PDF Document Cover - Dual-Color SMD LED LTW-C235DSKF-5A Datasheet - White & Orange Light - 20-30mA - 72-75mW - Chinese Technical Document

1. Product Overview

This document details the specifications of a high-performance dual-color Surface-Mount Device (SMD) LED. The component integrates two independent LED chips within a single package: one emitting white light and the other emitting orange light. This design is specifically intended for applications requiring multiple indication states or color-coded signaling from a compact space.

Wannan LED yana amfani da kayan semiconductor na ci-gaba. Farin haske yana fitowa daga guntu na tushen InGaN (Indium Gallium Nitride), yayin da hasken orange ya samo asali daga guntu na tushen AlInGaP (Aluminum Indium Gallium Phosphide). Wannan haɗin yana amfani da cikakken inganci da haske na tsarin kayan biyu.

Muhimman fa'idodin wannan samfurin sun haɗa da bin umarnin RoHS (Restriction of Hazardous Substances), an ayyana shi azaman samfurin kore, da kuma dacewa da tsarin samarwa na yau da kullun na yawan jumla. Yana amfani da kunshe na kayan murɗa da ya dace da na'urorin haɗawa ta atomatik, kuma an ƙididdige shi don dacewa da tsarin haɗa IR (Infrared) reflow, shine zaɓi mai kyau na layin haɗa PCB na zamani.

2. Cikakken Bayanin Ƙayyadaddun Fasaha

2.1 Matsakaicin Ƙimar Ƙididdiga

Yin aiki fiye da waɗannan iyakoki na iya haifar da lalacewa ta dindindin. An ƙayyade ƙididdiga a yanayin zafin muhalli (Ta) na 25°C.

2.2 Halaye na Lantarki da na Gani

These are typical performance parameters measured at Ta=25°C and a test current (IF) of 5mA, unless otherwise specified.

Electrostatic Discharge (ESD) Precautions:LEDs are sensitive to electrostatic discharge. Proper ESD precautions, such as using grounded wrist straps, anti-static mats, and equipment, must be taken during handling to prevent potential or catastrophic damage.

3. Bayanin Tsarin Rarrabawa

Don tabbatar da daidaito a cikin samarwa mai yawa, ana rarraba LED bisa aikin su. Ana yiwa takamaiman rukunin rukunin kwayar alama akan marufinsa.

3.1 Rarrabawar Ƙarfin Lantarki na Gaba (VF) na LED mai haske Fari

Ana rarraba LED bisa ƙarfin lantarki na gaba a lokacin IF=5mA. Kowane matsayi yana da ƙimar sallama na ±0.1V.
- Mataki A: 2.55V - 2.70V
- Mataki B: 2.70V - 2.85V
- Mataki C: 2.85V - 3.00V
- Mataki D: 3.00V - 3.15V

3.2 Rarrabawar Ƙarfin Haskakawa (Iv)

White LED (at IF=5mA, each bin tolerance ±15%):
- Bin P: 45.0 mcd - 71.0 mcd
- Bin Q: 71.0 mcd - 112.0 mcd
- Bin R: 112.0 mcd - 180.0 mcd

Orange LED (at IF=5mA):
- Bin L: 11.2 mcd - 18.0 mcd
- Bin M: 18.0 mcd - 28.0 mcd
- Bin N: 28.0 mcd - 45.0 mcd
- Bin P: 45.0 mcd - 71.0 mcd

3.3 Rarrabawar Launi (Kala) na LED mai haske Fari

The white light color point is graded according to its chromaticity coordinates (x, y) on the CIE 1931 diagram at IF=5mA. Six grades (S1 to S6) are defined by specific quadrilateral regions on the chromaticity diagram. A tolerance of ±0.01 applies to the (x, y) coordinates within each grade. This ensures visual color consistency across different production batches.

4. Bincike kan Lakatunan Aiki

The datasheet references typical characteristic curves to graphically represent device behavior. Although the specific charts are not reproduced in the text, they typically include:

These curves are crucial for designers to predict performance under non-standard conditions (different currents, temperatures) and to optimize application circuits.

5. Bayanin Injiniya da Kunshewa

5.1 Lambar Kaya da Rarraba Fil

Part Number:LTW-C235DSKF-5A
Lens Color:Yellow (affects light diffusion and appearance when off).
Emitting Color and Pin Assignment:
- InGaN white LED chip: Connected to pins 1 and 2.
- AlInGaP orange LED chip: Connected to pins 3 and 4.
This 4-pin configuration allows independent control of the two colors.

5.2 Girman Kunshewa

This LED conforms to the EIA (Electronic Industries Alliance) standard SMD package outline. All dimensions are in millimeters, with a standard tolerance of ±0.10 mm unless otherwise specified. The datasheet includes a detailed dimensional drawing showing the package length, width, height, lead pitch, and other key mechanical features critical for PCB pad design.

5.3 Girman Fil ɗin Gwangwani da Ake Shawarwari

Recommended PCB pad layout is provided to ensure reliable solder joint formation during reflow soldering. Adhering to these dimensions aids in proper solder fillet formation, mechanical stability, and thermal relief.

6. Soldering, Assembly, and Handling Guidelines

6.1 Soldering Process

This device is fully compatible with infrared (IR) reflow soldering processes. A recommended reflow profile is provided, with a peak temperature condition of 260°C for 10 seconds, meeting common lead-free solder requirements. Following the recommended profile is crucial to prevent thermal damage to the LED package or die.

6.2 Cleaning

If post-solder cleaning is required, only specified chemicals should be used. Unspecified solvents may damage the epoxy lens or package. The recommended method is immersion in ethanol or isopropyl alcohol at room temperature for a duration not exceeding one minute.

6.3 Storage Conditions

Sealed package (with desiccant):Store at ≤30°C and ≤90% relative humidity (RH). The shelf life under these conditions is one year.
Opened package:Components must be stored at ≤30°C and ≤60% RH. It is strongly recommended to complete the IR reflow soldering process within one week after opening the moisture barrier bag.
Long-term storage (opened):For storage exceeding one week, place the components in a sealed container with desiccant or a nitrogen dry cabinet.
Re-baking:LEDs stored outside the original packaging for more than one week require baking at approximately 60°C for at least 20 hours before soldering to remove absorbed moisture and prevent "popcorn" effect (package cracking) during reflow.

7. Kunshe da Bayanin Oda

7.1 Siffofin Nadar Kirtani

LEDs are supplied in embossed carrier tape with protective cover tape, wound on 7-inch (approx. 178 mm) diameter reels. This packaging complies with the ANSI/EIA 481-1-A-1994 standard.

The datasheet provides detailed dimensional drawings of the carrier tape (pocket size, pitch, etc.) and the reel (hub diameter, flange diameter, etc.) to ensure compatibility with automatic assembly equipment.

8. Bayanin Aikace-aikace da La'akari da Zane

8.1 Amfanin Da Ake Tsammani

This LED is designed for use in standard electronic equipment, including office automation equipment, communication equipment, and household appliances. For applications requiring extremely high reliability where failure could endanger life or health (e.g., aviation, medical systems, safety equipment), specific consultation and qualification are required prior to design adoption.

8.2 Circuit Design

8.3 Typical Application Scenarios

9. Technical Comparison and Differentiation

This dual-color LED has distinct advantages in specific applications:

10. Frequently Asked Questions (FAQ)

Q1: Can I drive both the white and amber LEDs at their maximum DC current simultaneously?
A1: Yes, but the total power dissipation on the package must be considered. Driving the white at 20mA (~2.85V=57mW) and the amber at 30mA (~2.00V=60mW) totals ~117mW, which exceeds their individual power ratings (72mW, 75mW). Operating at full current simultaneously may require derating or enhanced thermal management to keep the junction temperature within safe limits.

Q2: What is the difference between Peak Wavelength and Dominant Wavelength?
A2: Peak Wavelength (λP=611 nm) is the physical wavelength at which the LED emits the most optical power. Dominant Wavelength (λd=605 nm) is a perceptual metric; it is the wavelength of monochromatic light that has the same color as the LED's output for a standard human observer. They are often different, especially for saturated colors.

Q3: Why are the storage humidity requirements stricter after the bag is opened?
A3: The sealed bag contains desiccant to maintain a very low humidity level, protecting the LEDs from moisture absorption. Once opened, the components are exposed to ambient humidity. Moisture absorbed by the plastic package can rapidly expand into steam during high-temperature reflow soldering, potentially causing internal delamination or cracking ("popcorn" effect).

Q4: How to understand the binning codes when ordering?
A4: Domin don samfurin ya yi daidai, yakamata ka ƙayyade VF, Iv, da kuma rarrabawar launi da ake buƙata lokacin yin oda. Misali, za ka iya neman "LTW-C235DSKF-5A, matakin VF B, matakin Iv farin haske Q, matakin Iv lemu haske M, matakin launi S3". Wannan yana tabbatar da cewa duk LED ɗin da ke cikin rukunin samarwa suna da halayen lantarki da na gani masu kama da juna sosai.

11. Misalin Nazarin Shari'ar Zane

Yanayi:Ɗora alamar yanayi don sauya hanyar sadarwa, tana da yanayi guda uku: kashewa, aikin hanyar haɗi (farin haske) da canja wurin bayanai (lemu haske yana ƙyalkyalo).
Aiwatarwa:Amfani da LTW-C235DSKF-5A guda ɗaya. Microcontroller (MCU) yana da filayen GPIO guda biyu, kowannensu yana haɗuwa da launin LED ta hanyar resistor mai iyakancewar kwarara.
Lissafi:Amfani da wutar lantarki 3.3V, manufar kwarara ita ce 10mA, don samun kyakkyawan ganuwa da kuma adana ƙarfin wuta.
- For white light (VF~2.85V): R = (3.3V - 2.85V) / 0.01A = 45 Ω. Use a standard 47 Ω resistor.
- For orange light (VF~2.00V): R = (3.3V - 2.00V) / 0.01A = 130 Ω. Use a standard 130 Ω or 120 Ω resistor.
PCB Layout:Use the recommended pad layout. Maintain a small keep-out area under the LED to prevent solder wicking. The MCU firmware controls the pins to achieve the desired steady and blinking states.
Results:Using only a single component footprint, a compact, reliable, and clear multi-state indicator is achieved.

12. Yadda Ake Aiki

An LED is a semiconductor diode. When a forward voltage exceeding the chip's bandgap energy is applied, electrons and holes recombine in the active region, releasing energy in the form of photons (light). The color of the light is determined by the bandgap energy of the semiconductor material. InGaN material has a wider bandgap, enabling emission in the blue/violet/ultraviolet range; white light is typically generated by coating a blue InGaN chip with yellow phosphor, mixing the light to appear white. The bandgap of AlInGaP material is suitable for direct emission in the red, orange, amber, and yellow parts of the spectrum, as used in the orange chip of this device. The dual-chip package electrically isolates the two semiconductor junctions, allowing them to be controlled independently.

13. Trends na Fasaha

Optoelektronik endüstrisi sürekli gelişmektedir. Bu iki renkli LED ile ilgili trendler şunları içerir:
Verimlilik Artışı:İç kuantum verimliliği ve ışık çıkarma teknolojilerindeki sürekli iyileştirmeler, aynı veya daha düşük sürücü akımında daha yüksek ışık şiddeti (mcd) elde edilmesine yol açarak sistem enerji verimliliğini artırır.
Küçültme:Bu ürün standart paket kullanmasına rağmen, endüstri yüksek yoğunluklu elektronik ürünlere uyum sağlamak için (toplam ışık çıkışı veya ısı dağılımından ödün verme pahasına da olsa) daha küçük paket boyutlarına (örneğin 0402, 0201 metrik) doğru sürekli bir itiş göstermektedir.
Renk Tutarlılığı ve Sınıflandırma:Epitaksiyel büyüme ve üretim kontrolündeki ilerlemeler, VF ve kromatiklikteki doğal varyasyonu azaltarak daha sıkı sınıflandırma dağılımları sağlamakta, geniş sınıflandırma ihtiyacını azaltmakta veya envanter yönetimini basitleştirmektedir.
Integrated Solution:The trend of integrating LED driver ICs (constant current source, PWM controller) directly with LED packages or modules simplifies end-circuit design. This specific component remains a discrete, driverless LED.
Reliability and Lifetime:Continuous improvements in packaging materials (epoxy, silicone) and chip-attach technology enhance long-term reliability, lumen maintenance, and resistance to thermal and environmental stresses.

Cikakken Bayani akan Kalmomin LED Specifications

Complete Explanation of LED Technical Terminology

I. Core Indicators of Photoelectric Performance

Term Unit/Representation Layman's Explanation Why It's Important
Luminous Efficacy lm/W (Lumens per Watt) The luminous flux per watt of electrical energy, the higher the more energy-efficient. Directly determines the energy efficiency rating and electricity cost of the luminaire.
Luminous Flux lm (lumen) The total amount of light emitted by a light source, commonly known as "brightness". Determines whether the luminaire is bright enough.
Kwanan Wuta (Viewing Angle) ° (digiri), misali 120° Kwanan da ƙarfin haske ya ragu zuwa rabi, yana ƙayyade faɗin hasken. Yana rinjayar iyakar haske da daidaito.
Yanayin Zafi na Launi (CCT) K (Kelvin), misali 2700K/6500K The warmth or coolness of light color; lower values lean yellow/warm, higher values lean white/cool. Determines the lighting ambiance and suitable application scenarios.
Color Rendering Index (CRI / Ra) Unitless, 0–100 The ability of a light source to reproduce an object's true colors; Ra≥80 is considered good. Affects color authenticity; used in high-demand places like shopping malls, art galleries, etc.
Standard Deviation of Color Matching (SDCM) MacAdam ellipse steps, e.g., "5-step" A quantitative metric for color consistency; a smaller step number indicates higher color consistency. Ensures no color variation among luminaires from the same batch.
Dominant Wavelength nm (nanometer), e.g., 620nm (red) Wavelength values corresponding to the colors of colored LEDs. Determines the hue of monochromatic LEDs such as red, yellow, and green.
Spectral Distribution Wavelength vs. Intensity curve Shows the intensity distribution of light emitted by an LED across various wavelengths. Affects color rendering and color quality.

II. Electrical Parameters

Term Symbol Layman's Explanation Design Considerations
Forward Voltage Vf The minimum voltage required to light up an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf; the voltage adds up when multiple LEDs are connected in series.
Forward Current If The current value that makes the LED emit light normally. Constant current drive is commonly used; the current determines brightness and lifespan.
Maximum Pulse Current Ifp Peak current that can be withstood for a short time, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled, otherwise overheating damage may occur.
Reverse Voltage Vr The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. The circuit must be protected against reverse connection or voltage surges.
Thermal Resistance Rth (°C/W) The resistance to heat flow from the chip to the solder joint; a lower value indicates better heat dissipation. High thermal resistance requires a more robust heat dissipation design; otherwise, the junction temperature will rise.
ESD Immunity V (HBM), e.g., 1000V Electrostatic discharge immunity; a higher value indicates greater resistance to ESD damage. Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Term Key Indicators Layman's Explanation Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, lifespan may double; excessively high temperature leads to lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) Lokacin da ake buƙata don haske ya ragu zuwa 70% ko 80% na ƙimar farko. Kai tsaye ayyana "rayuwar aiki" na LED.
Lumen Maintenance % (misali 70%) Kashi na hasken da ya rage bayan amfani na ɗan lokaci. Yana nuna ikon riƙe haske bayan amfani na dogon lokaci.
Color Shift Δu′v′ or MacAdam Ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Material performance degradation Deterioration of packaging materials due to prolonged high temperatures. May lead to decreased brightness, color shift, or open-circuit failure.

IV. Packaging and Materials

Term Common Types Layman's Explanation Characteristics and Applications
Package Types EMC, PPA, Ceramics The housing material that protects the chip and provides optical and thermal interfaces. EMC has good heat resistance and low cost; ceramics offer superior heat dissipation and long lifespan.
Chip Structure Front-side, Flip Chip The arrangement method of chip electrodes. Flip-chip design offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating YAG, silicate, nitride Coated on the blue LED chip, it partially converts to yellow/red light, mixing to form white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/optical design Flat, microlens, total internal reflection Optical structure on the package surface, controlling light distribution. Determines the emission angle and light distribution curve.

V. Quality Control and Binning

Term Binning Content Layman's Explanation Purpose
Luminous Flux Binning Codes such as 2G, 2H Grouped by brightness level, each group has a minimum/maximum lumen value. Ensure consistent brightness for products from the same batch.
Voltage Binning Codes such as 6W, 6X Group by forward voltage range. Facilitates driver matching and improves system efficiency.
Color binning 5-step MacAdam ellipse Group by color coordinates to ensure colors fall within a very narrow range. Ensures color consistency and avoids color variation within the same luminaire.
Color Temperature Grading 2700K, 3000K, etc. Group by color temperature, each group has a corresponding coordinate range. To meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Term Standard/Test Layman's Explanation Ma'ana
LM-80 Jarabawar Kiyaye haske A cikin yanayin zafi na dindindin, ana kunna dogon lokaci, ana rubuta bayanan raguwar haske. Ana amfani da shi don ƙididdige rayuwar LED (haɗe da TM-21).
TM-21 Standard for Life Projection Projecting lifespan under actual use conditions based on LM-80 data. Providing scientific life prediction.
IESNA Standard Illuminating Engineering Society Standard Covers optical, electrical, and thermal testing methods. Industry-recognized testing basis.
RoHS / REACH Environmental certification. Ensure the product does not contain harmful substances (such as lead, mercury). Entry requirements for the international market.
ENERGY STAR / DLC Energy Efficiency Certification Energy efficiency and performance certification for lighting products. Commonly used in government procurement and subsidy programs to enhance market competitiveness.