Bicolor SMD LED RF-P3S155TS-B54 Datasheet - Size 3.2x2.7x0.7mm - Voltage 1.8-3.4V - Power Consumption 72-102mW - Orange/Green - Technical Documentation

1. Product Overview

This document provides the complete technical specifications for the RF-P3S155TS-B54 bi-color surface-mount LED device. Designed for modern electronic assembly, it offers reliable optical indication within a compact form factor.

1.1 General Description

The RF-P3S155TS-B54 is a bi-color LED manufactured using a combination of a green semiconductor chip and an orange semiconductor chip. These chips are integrated into a single, industry-standard surface-mount device (SMD) package. The primary function of this component is to provide visual status indication, capable of emitting two distinct colors (orange and green) from a single package footprint. Its compact dimensions (3.2 mm length, 2.7 mm width, 0.7 mm height) make it ideally suited for high-density PCB designs where board space is limited.

1.2 Core Features and Advantages

• Ultra-Wide Viewing Angle:This device features a typical viewing angle of 140 degrees (2θ1/2). This broad emission pattern ensures the LED's light is visible from a wide range of angles, which is crucial for status indicators in consumer electronics, industrial panels, and automotive dashboards where the user's viewing position may vary.
• SMT Assembly Compatibility:The package is fully compatible with standard Surface Mount Technology (SMT) assembly lines and all common reflow soldering processes (e.g., using SAC305 or similar lead-free solder paste). This enables high-speed, automated pick-and-place manufacturing, thereby reducing assembly costs and improving production yield.
• Moisture Sensitivity:This component has a Moisture Sensitivity Level (MSL) of 3. According to the IPC/JEDEC J-STD-033 standard, this means the device can be exposed to factory floor conditions (≤ 30°C/60% RH) for up to 168 hours (7 days) before reflow soldering requires a bake. For most manufacturing environments, this level offers a good balance between handling convenience and reliability.
• Environmental Compliance:This product complies with the RoHS (Restriction of Hazardous Substances) Directive, meaning it is free of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl ethers (PBDE). This compliance is essential for products sold in the EU and many other global markets.

1.3 Target Applications and Market

This bicolor LED is designed for a wide range of applications requiring multi-state indication. Its primary uses include:

• Optical Status Indicators:Provides clear visual feedback for power on/off, standby mode, network activity, battery charging status, or system errors in devices such as routers, modems, chargers, and smart home appliances.
• Switch and Symbol Illumination:Used for backlighting membrane switches, buttons, or engraved symbols in control panels, medical equipment, and automotive interiors.
• General Display:For segment displays, cluster indicator lights, or as simple pixel elements in low-resolution information displays.
• Target Market:Consumer electronics, telecommunications hardware, industrial automation control, automotive interior electronics, and portable electronic devices.

2. In-depth Technical Parameter Analysis

This section provides a detailed and objective interpretation of the electrical, optical, and thermal parameters specified for the RF-P3S155TS-B54 LED. Understanding these parameters is crucial for proper circuit design and ensuring long-term reliability.

2.1 Photoelectric Characteristics

Unless otherwise specified, all measurements are defined under standard test conditions with a solder point temperature (Ts) of 25°C and a forward current (IF) of 20mA.

• Forward Voltage (VF):This is the voltage drop across the LED when operating at a specified current.
  • Orange Chip (Code O):Ranges from a minimum of 1.8V to a maximum of 2.4V, with a typical value implied within this range. The specific bin (e.g., 1L) determines the exact VF grouping.
  • Green Chip (Code G):Has a higher forward voltage, ranging from 3.0V to 3.4V (Bin 3E). This difference is due to the use of different semiconductor materials for each color (e.g., AlInGaP for orange, InGaN for green), which have different bandgap energies.
• Luminous Intensity (Iv):Measures the perceived power of light emitted in a specific direction, in units of millicandelas (mcd). The device offers multiple intensity bins for each color, allowing designers to select an appropriate brightness level.
  • Orange bin:Examples include 1AP (90-120 mcd) and G20 (120-150 mcd).
  • Green bin:Provides a wider range of high intensity, from 1AU (260-330 mcd) to 1CM (700-900 mcd).
• Dominant Wavelength (λd):The single wavelength that best represents the perceived color of the light.
  • Orange:Offers bins such as E00 (620-625 nm) and F00 (625-630 nm), producing pure orange hues.
  • Green:Provides finer grading, such as E10 (520-522.5 nm), E20 (522.5-525 nm), etc., allowing precise color matching, which is crucial in applications requiring consistent green hues.
• Spectral Half Bandwidth (Δλ):The width of the emission spectrum at half its maximum intensity. Typical bandwidth for orange chips is 15nm, while for green chips it is wider at 30nm. A narrower bandwidth indicates a spectrally purer color.
• Reverse Current (IR):The leakage current when a 5V reverse voltage (VR) is applied. The specified maximum is 10 µA. Exceeding the absolute maximum reverse voltage (not explicitly stated but implied by the ESD rating) may cause immediate damage.
• Viewing Angle (2θ1/2):The full angle at which the luminous intensity is half of the intensity at 0 degrees (on-axis). The specified 140-degree angle confirms the "extremely wide viewing angle" characteristic.

2.2 Absolute Maximum Ratings and Thermal Management

These ratings define the limits beyond which permanent damage to the device may occur. Operation at or beyond these limits is not guaranteed and should be avoided to ensure reliable performance.

• Power Dissipation (Pd):The maximum allowable power that can be dissipated as heat.
  • Orange chip: 72 mW
  • Green chip: 102 mW
  This difference is directly related to the higher forward voltage of the green chip (Pd ≈ IF * VF).
• Forward Current (IF):The maximum continuous DC current for both chips is 30 mA.
• Peak Forward Current (IFP):A higher current of 60 mA is only permitted under pulse conditions (0.1ms pulse width, 1/10 duty cycle) to prevent excessive heating.
• Junction Temperature (Tj):The maximum allowable temperature at the semiconductor junction is 95°C. This is a key parameter affecting lifespan. At higher junction temperatures, the light output of the LED degrades faster, and exceeding this limit may lead to catastrophic failure.
• Thermal Resistance (RθJ-S):This parameter is specified as 450 °C/W, quantifying the efficiency of heat transfer from the semiconductor junction (J) to the package solder point (S). A lower value is better. This value is used to calculate the temperature rise of the junction relative to the board temperature: ΔTj = Pd * RθJ-S. For example, the green chip operating at its maximum Pd of 102mW will cause the junction temperature to rise approximately 46°C above the solder point temperature. Therefore, maintaining a low PCB temperature is crucial to keep Tj below 95°C.
• Electrostatic Discharge (ESD):This device can withstand 1000V using the Human Body Model (HBM). While this provides basic handling protection, proper ESD control measures must still be taken during assembly.
• Operating and Storage Temperature:This device is rated for environments from -40°C to +85°C.

2.3 Binning System Description

This product employs a comprehensive binning system to ensure consistency of key parameters. Designers must specify the required bin code when ordering to guarantee the desired performance.

• Forward Voltage Binning:Orange chips are grouped under code "1L" (1.8-2.4V), and green chips are grouped under "3E" (3.0-3.4V).
• Dominant Wavelength Binning:This is particularly detailed for green chips, with multiple 2.5nm wide bins (E10, E20, F10, F20) for precise color selection. Orange has wider bins (E00, F00).
• Luminous Intensity Binning:Both colors have multiple intensity bins. For example, green intensity ranges from 1AU (260-330 mcd) to 1CM (700-900 mcd). Selection depends on the required brightness and the drive current used.

3. Performance Curve Analysis

The datasheet provides typical characteristic curves, which are crucial for understanding device behavior under non-standard conditions.

3.1 Ƙarfafawa Gaba vs. Gaba Halin yanzu (IV Curve)

The provided curve (Figure 1-6) shows the nonlinear relationship between LED voltage and current. This curve demonstrates the "turn-on" voltage characteristic: a small increase in voltage beyond the threshold leads to an exponential, large increase in current. This is why LEDs are always driven with current-limiting devices (resistors or constant-current drivers), not directly with a voltage source. This curve visually confirms the different threshold voltages of the orange and green chips.

3.2 Gaba Halin yanzu vs. Dangi Haske Ƙarfi

This curve (Figure 1-7) illustrates how light output increases with drive current. Within the normal operating range (e.g., up to 20-30mA), it typically shows a nearly linear relationship. However, designers must note that at very high currents, efficiency (lumens per watt) usually decreases due to increased heating (efficiency droop effect). This curve helps in selecting an appropriate drive current to achieve the desired brightness while maintaining efficiency and staying within thermal limits.

4. Bayanin Injiniya da Kunshewa

4.1 Girman Kunshewa da Tolerances

The mechanical drawings (Figures 1-1 to 1-4) provide all key dimensions for PCB pad design and clearance checking.

• Includes a section dedicated to reflow soldering (Section 3). While the provided excerpt does not detail the specific temperature profile, the standard lead-free (SAC305) reflow profile is generally applicable. Key considerations include:3.20 mm (L) x 2.70 mm (W) x 0.70 mm (H). Unless otherwise specified, the tolerance is ±0.2 mm.
• Terminal details:Four solder terminals are spaced at 2.35 mm. The terminal itself measures 0.80 mm x 0.50 mm.
• Polarity identification:Figure 1-4 clearly indicates the polarity. The cathode is typically identified by a marking on the top of the package (such as a dot, notch, or color bar) and/or a different shape or size of the bottom pad. The exact marking should be verified from the drawing to ensure correct orientation during assembly.

4.2 Recommended Pad Design

Figure 1-5 provides recommended pad patterns for PCB design. Adhering to this pattern is crucial for achieving reliable solder joints, proper self-alignment during reflow soldering, and effective heat transfer from the LED to the PCB. The recommended pattern typically includes thermal relief connections to copper pads used for heat dissipation, which is essential for managing junction temperature.

5. Soldering and Assembly Guide

5.1 SMT Reflow Soldering Instructions

A dedicated section (Section 3) is included for reflow soldering. While specific temperature profiles are not detailed in the provided excerpt, standard lead-free (SAC305) reflow profiles are generally applicable. Key considerations include:

• Preconditioning:Due to the MSL 3 rating, if the device exceeds the 168-hour floor life exposure time, it must be baked according to IPC/JEDEC standards (e.g., 5-48 hours at 125°C, depending on packaging) to remove moisture and prevent "popcorning" (package cracking) during reflow.
• Profile Parameters:Peak reflow temperature must be controlled to avoid damage to the internal materials and bonding wires of the LED. The curve should have a controlled ramp-up rate, sufficient time above liquidus (TAL), and a controlled cooling rate.
• No-Clean Flux:The use of no-clean flux is recommended. If cleaning is required, it must be compatible with the epoxy lens material of the LED to avoid hazing or chemical attack.

5.2 Handling and Storage Precautions

Section 4 outlines general handling precautions:

• ESD Protection:Handle using grounded equipment within an ESD Protected Area.
• Mechanical Stress:Avoid applying direct force to the transparent lens.
• Contamination:Keep the lens clean and avoid fingerprints, dust, and flux residues, as these can affect light output and appearance.
• Storage:Store the device in the original moisture barrier bag with desiccant in a cool, dry environment. Adhere to the MSL 3 exposure limits.

6. Bayanin Marufi da Oda

6.1 Ƙayyadaddun Marufi

This product is supplied in tape-and-reel packaging suitable for automated SMT assembly machines.

• Carrier Tape:Specifies the dimensions of the embossed cavity that accommodates the LED to ensure compatibility with feeder equipment.
• Reel Dimensions:Specifies standard reel dimensions (e.g., 7-inch or 13-inch diameter), including reel width, hub diameter, and maximum component count per reel.
• Label Information:The reel label contains key information such as part number (RF-P3S155TS-B54), quantity, wavelength and intensity bin codes, date code, and lot number for traceability.

6.2 Marufin Hana Danshi

For long-term storage and transportation, the reels are packaged in sealed Moisture Barrier Bags (MBB) with Humidity Indicator Cards (HIC) and desiccants to maintain MSL Level 3.

7. Amincewa da Ingancin Inganci

7.1 Reliability Test Items and Conditions

Section 2.4 lists the standard reliability tests performed for product verification, for example:

• High Temperature Storage Life (HTSL):Expose the device to its maximum storage temperature (+85°C) for an extended period (e.g., 1000 hours) to test material stability.
• Temperature Cycling (TC):Cycle between extreme temperatures (e.g., -40°C to +85°C) to test failures caused by thermal expansion mismatch of materials.
• Humidity Testing:Conduct tests such as 85°C/85% RH to evaluate moisture resistance performance.
• Resistance to Soldering Heat:Subject the device to multiple reflow cycles to simulate assembly conditions.

7.2 Failure Criteria

Section 2.5 defines the criteria for determining device failure after reliability testing. This typically includes:

• Catastrophic failure (no light output).
• Parametric failure (e.g., luminous intensity degradation exceeding 30%, forward voltage shift beyond the specified range).
• Cosmetic defects (package cracking, lens discoloration).

8. Application Notes and Design Considerations

8.1 Drive Circuit Design

Current limiting is mandatory:Due to the exponential I-V characteristic, for indicator light applications, a simple series resistor is the most common and cost-effective driving method. The resistor value is calculated using Ohm's Law: R = (Vcc - VF) / IF, where Vcc is the supply voltage, VF is the forward voltage of the specific LED bin, and IF is the desired drive current (e.g., 20mA).

Green LED Example:Assuming Vcc = 5V, VF = 3.2V (typical), IF = 20mA. R = (5 - 3.2) / 0.02 = 90 Ω. The resistor's power rating should be at least P = IF² * R = (0.02)² * 90 = 0.036W, so a standard 1/8W (0.125W) or 1/10W resistor is sufficient.

Bi-Color Control:To independently control the two colors, two separate drive circuits (resistors or transistors) are required, connected to their respective anode terminals while sharing a common cathode (or vice versa, depending on the internal chip configuration shown in the polarity diagram).

8.2 Gudanar da Zafi a Tsarin PCB

To ensure the junction temperature (Tj) remains below 95°C, heat dissipation must be effective.

• Haɗin filin sanyaya.Haɗa filin (musamman idan filin cathode yana da ƙarfin zafi) zuwa babban yanki na tagulla akan PCB. Wannan tagulla tana aiki azaman mai sanyaya.
• Ramin zuwa filin ciki.Yi amfani da ramuka masu sanyaya da yawa a ƙasa ko kusa da filin LED, don kai zafi zuwa filin ƙasa na ciki ko filin wutar lantarki masu babban ƙarfin zafi.
• Guji keɓewa.Kada a keɓe filin LED akan ƙananan "tsibiran zafi". Ya kamata a haɗa su zuwa manyan yankuna na tagulla.
• Lissafin Tj.Use formula to estimate Tj: Tj = Ts + (Pd * RθJ-S). Ts (solder point temperature) can be estimated as slightly higher than the ambient temperature (Ta) near the PCB. If Ta=50°C and the board temperature rise is 10°C, then Ts=60°C. For a green LED with power dissipation Pd=102mW, Tj = 60 + (0.102 * 450) = 60 + 45.9 = 105.9°C. This exceeds the 95°C limit, indicating a need for better heat dissipation (larger copper area, vias) or reduced drive current/power dissipation.

8.3 La'akari da Zane na Gani

• Viewing Angle:A 140-degree viewing angle means light is emitted in a nearly hemispherical pattern. For applications requiring a more directional beam, secondary optics (lenses) can be placed above the LED.
• Color Mixing:When the orange and green chips are powered simultaneously, they undergo additive color mixing. The resulting perceived color will be a yellowish hue, depending on the relative intensity of each chip. This can be used to create a third color state without adding another component.
• Contrast:When designing the surrounding environment or light guide for an indicator, consider the contrast between the LED's "on" state and the non-luminous surface. A dark environment can enhance perceived brightness.

9. Kwatanta Fasaha da Bambance-bambance

The RF-P3S155TS-B54 offers specific advantages within its category:

• Compared to monochrome LEDs:The primary advantages are space savings and simplified assembly. It provides two distinct indication states (or three, including mixed color) within the footprint of a single component, reducing PCB area and pick-and-place machine time compared to using two separate LEDs.
• Compared to RGB LEDs:When only two specific colors (orange and green) are needed, such as for standard "status/activity" or "normal/warning" indicators, this device is simpler and often more cost-effective than a full-color RGB LED. It avoids the complexity and cost of a three-channel driver.
• Compared to larger packages:The 3.2x2.7mm footprint is a common industry size, offering a good balance between handling/manufacturing convenience and space savings compared to larger packages like 5.0mm round LEDs or 0603/0805 chip LEDs.

10. Tambayoyin da ake yawan yi (FAQ)

Q1: Can I drive this LED directly from a 5V microcontroller pin?
A: No. Microcontroller GPIO pins typically cannot continuously supply 20mA and are voltage sources, not current sources. You must use a series current-limiting resistor, and potentially a transistor if the MCU pin cannot provide the required current.

Q2: What happens if the maximum junction temperature of 95°C is exceeded?
A: Exceeding the maximum Tj will accelerate the degradation of the LED's light output (lumen depreciation). It can also lead to increased forward voltage, color shift, and ultimately catastrophic failure such as bond wire breakage or chip delamination.

Q3: How do I choose the correct binning code?
A: Select the bin based on your application's requirements. For consistent color between products, specify a tight wavelength bin (e.g., E20 for green). For brightness, choose an intensity bin that meets your design goals at your chosen drive current. Consult the manufacturer's full binning code list for available combinations.

Q4: An lens din yi silicone ko epoxy resin ne aka yi?
A: Takardar bayanin ba ta fayyace ba, amma yawancin irin waɗannan SMD LED suna amfani da high-temperature epoxy resin ko kuma modified epoxy resin a matsayin kayan lens na hulɗa. An zaɓi wannan kayan saboda gaskiyar gani na gani, kwanciyar hankali na zafi a lokacin sakewa, da kuma ikon kare guntu.

11. Case Studies on Practical Design and Application

Yanayi: Ƙira don Alamun Halaye Biyu na Network Switch
Mai ƙira yana buƙatar ƙirar alamun nuni guda ɗaya akan kowane tashar network switch: kore mai haske akai-akai yana nufin "Haɗin kai ya kunna," orange mai walƙiya yana nufin "aikin bayanai."