5050 Full-Color SMD LED Datasheet - 5.0x5.0x1.6mm - Red/Green/Blue - 150mA - Chinese Technical Document

1. Product Overview

This document elaborates on the technical specifications of a high-performance full-color Surface Mount Technology (SMT) LED. The device integrates independent red, green, and blue semiconductor chips within a single 5050 package, capable of generating a broad color spectrum through the principle of additive color mixing. Its primary design objectives are to achieve high luminous output, a wide viewing angle, and suitability for automated assembly processes.

1.1 Core Features and Advantages

• High-Brightness Chips:Utilizes advanced semiconductor materials (GaInAlP for red light, InGaN for green and blue light) to achieve excellent light output.
• SMT Package:White plastic SMT package, designed to be compatible with standard infrared (IR) reflow soldering processes, facilitating high-volume, automated PCB assembly.
• Independent chip control:It adopts a 6-pin lead frame package, and the anode and cathode of each color (red, green, blue) are independently accessible. This enables precise independent driving and control of each color channel, which is crucial for color calibration and series connection of multiple LEDs.
• Wide viewing angle:The packaging design achieves a typical viewing angle of 120 degrees (2θ_1/2), ensuring good visibility from a wide range of viewing angles.
• Environmental Compliance:产品为无铅（Pb-free）设计，符合欧盟REACH法规，并满足无卤标准（Br < 900ppm, Cl < 900ppm, Br+Cl < 1500ppm）。产品本身符合RoHS指令。
• Reliability:Preconditioning is based on the JEDEC J-STD-020D Level 3 standard, indicating its ability to effectively resist moisture-induced stress during the soldering process.

1.2 Target Applications

The combination of high brightness, full-color capability, and SMT form factor makes this LED suitable for a variety of applications requiring vibrant, controllable lighting.

• Entertainment and Gaming Devices:For decorative lighting, status indicators, and interactive lighting effects.
• Information Display Boards:For signage, information boards, and other displays requiring multi-color indication.
• Mobile device flash:With its compact size and color capabilities, it is suitable for use as a camera flash or fill light for mobile phones and digital cameras.
• Light guide tube application:Its wide viewing angle and point source characteristics make it an ideal choice for coupling into light guides or light pipes, used in edge-lit panels or indicator light systems.

2. Technical Specifications and In-depth Interpretation

2.1 Absolute Maximum Ratings

These ratings define the limits that may cause permanent damage to the device. Operation under these conditions is not guaranteed.

• Forward Current (I_F):Each color (red, green, blue) is 150 mA. This is the maximum continuous DC current recommended for reliable operation.
• Peak Forward Current (I_FP):Each color is 200 mA, allowed only under pulse conditions (duty cycle 1/10, frequency 1 kHz). Even briefly exceeding the continuous rating may lead to chip performance degradation.
• Power Dissipation (P_d):Red light: 420 mW; Green/Blue light: 555 mW. This is the maximum heat the package can dissipate at an ambient temperature of 25°C. Proper PCB thermal design is crucial to ensure this limit is not exceeded during operation.
• Junction Temperature (T_j):Maximum 115°C. The temperature of the semiconductor chip itself must not exceed this value.
• Operating and Storage Temperature:-40°C to +85°C (operating), -40°C to +100°C (storage).
• Soldering temperature:Reflow soldering: peak temperature 260°C, maximum 10 seconds. Hand soldering: 350°C, maximum 3 seconds. These temperature profiles are critical to prevent package cracking or internal bond wire damage.

2.2 Photoelectric Characteristics (Ta=25°C)

These are typical performance parameters measured under standard test conditions (ambient temperature 25°C, each color I_F=150mA).

• Luminous Flux (I_v):Total visible light output.
  • Red light: typical value 25 lumens (lm), range 13.9-39.8 lm.
  • Green light: typical value 40 lm, range 13.9-51.7 lm.
  • Blue light: typical value 8.5 lm, range 4.9-18.1 lm.
• Luminous intensity (I_v):Light output in a specific direction (candela). Typical values are 7550 mcd (red), 12100 mcd (green), and 2550 mcd (blue).
• Viewing angle (2θ_1/2):Typical value 120 degrees (range 110-130 degrees). This is the full angle at which the luminous intensity is at least half of the peak value.
• Dominant Wavelength (λ_d):Perceived color of light.
  • Red light: typical value 622 nm (617-629 nm).
  • Green light: typical value 525 nm (518-530 nm).
  • Blue light: typical value 457 nm (455-470 nm).
• Forward voltage (V_F):Voltage drop across the LED under test current.
  • Red light: typical value 2.3V (1.8-2.8V).
  • Green light: typical value 3.4V (2.7-3.7V).
  • Blue: Typical value 3.2V (2.7-3.7V).
  Please note the significant difference in voltage between red and blue/green LEDs, which requires designing independent current-limiting circuits for each channel.
• Reverse current (I_R):Maximum 10 μA at 5V reverse bias. LED is not designed for reverse voltage operation.

3. Binning System Description

To ensure consistency in mass production, LEDs are sorted (binned) based on key optical and electrical parameters. This allows designers to select devices that meet the color and brightness uniformity requirements of specific applications.

3.1 Luminous Flux Binning

LEDs are classified based on their light output measured at 150mA. The binning range for each color overlaps to cover the full min-max specification range.

• Red (R):Binning R1 to R4, covering 13.9 lm to 39.8 lm.
• Green light (G):Binning G1 to G5, covering 13.9 lm to 51.7 lm.
• Blue light (B):Grading B1 to B5, covering 4.9 lm to 18.1 lm.

The luminous flux value within each grade allows a tolerance of ±11%.

3.2 Forward Voltage Binning

LEDs are binned according to their forward voltage to aid in circuit design and power supply selection.

• Red Light:Single bin "1828", covering 1.8V to 2.8V.
• 绿光 & Blue light:Single bin "2737", covering 2.7V to 3.7V.

A tolerance of ±0.1V is allowed.

3.3 Dominant Wavelength Binning

For color-sensitive applications, this is the most critical binning to ensure tonal consistency.

• Red Light:Binning RA (617-621 nm), RB (621-625 nm), RC (625-629 nm).
• Green light:Binning GA to GD (518-530 nm, approximately in 3nm steps).
• Blue light:Classification BA to BE (455-470 nm, approximately in 3nm steps).

The dominant wavelength allows a tolerance of ±1nm.

4. Performance Curve Analysis

4.1 Spectral Distribution

Typical spectral distribution curves show the relative intensity of light emitted by each chip at different wavelengths. The red chip emits light in a narrow band centered around 622nm. The green chip emits around 525nm, and the blue chip emits around 457nm. The purity of these spectral peaks is crucial for achieving saturated colors. This curve should be compared with the standard human eye response curve (V(λ)) to understand perceived brightness.

4.2 Radiation Pattern

The radiation pattern illustrates the spatial distribution of light intensity (relative intensity vs. angle). The curve confirms its broad, Lambertian-like emission pattern, with a typical viewing angle of 120 degrees, fairly uniform intensity in the central region, and attenuation towards the edges.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve of blue chips (and other chips) shows an exponential relationship between current and voltage. Below the turn-on voltage (approximately 2.7V for blue/green, 1.8V for red), almost no current flows. Beyond this threshold, current increases rapidly with a small increase in voltage. This characteristic necessitates the use of a constant current driver, not a constant voltage source, to prevent thermal runaway and ensure stable light output.

4.4 Dominant Wavelength vs. Forward Current

These curves for the red, green, and blue chips show how the emission color (dominant wavelength) changes with the drive current. Typically, as the current increases, the junction temperature rises, causing a slight shift in wavelength (usually towards longer wavelengths for InGaN-based green/blue LEDs). This effect is crucial for applications requiring precise color stability across different brightness levels.

4.5 Relative Luminous Intensity vs. Forward Current

This curve describes the light output (relative to a reference) as a function of the drive current. It is typically linear at lower currents, but may exhibit saturation or roll-off at higher currents due to thermal effects and efficiency droop. The curve reveals the trade-off between brightness and efficiency/heat.

4.6 Maximum Allowable Forward Current vs. Temperature

This derating curve is crucial for thermal management. It shows the maximum safe continuous forward current as a function of ambient (or case) temperature. As the temperature increases, the maximum allowable current decreases linearly. For example, at 85°C, the allowable current is significantly lower than the 150mA rating at 25°C. Designers must use this graph to ensure the LED is not overdriven in the application's operating environment.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED uses a standard 5050 SMT package. Key dimensions are as follows:

• Package length: 5.0 mm
• Package width: 5.0 mm
• Package height (typical): 1.6 mm

Unless otherwise specified, the tolerance is ±0.1mm. The datasheet provides detailed dimension drawings (top view, side view, and bottom view) showing the pin layout and mechanical features.

5.2 Pin Arrangement and Polarity Identification

This package has six pins arranged in two rows of three each. When viewed from the top, pins are typically numbered counterclockwise. The datasheet diagram clearly marks the anode and cathode pins for the red, green, and blue chips. Correct polarity identification is crucial to prevent reverse biasing of the LED during assembly. The bottom view usually includes a polarity mark (such as a notch or a dot) to aid in PCB orientation.

6. Welding and Assembly Guide

6.1 Reflow Soldering Parameters

Recommended infrared (IR) reflow soldering temperature profile is a critical process parameter.

• Peak temperature:Maximum 260°C.
• Time above liquidus (TAL):The time the solder joint spends above its melting point should be controlled, typically recommending a dwell of 10 seconds at peak temperature.
• Ramp-up/Ramp-down Rate:It is recommended to control the heating and cooling rates (e.g., 1-3°C/sec) to minimize thermal shock to the plastic package and internal bond wires.

Precautions according to JEDEC J-STD-020D Level 3 Moisture Sensitivity Level (MSL) must be followed. If the device has been exposed to ambient air longer than its specified floor life, it must be baked prior to reflow soldering to prevent "popcorning" (package cracking due to rapid moisture expansion).

6.2 Manual Soldering

If hand soldering is required, extreme care must be taken:

• Limit the soldering iron tip temperature to a maximum of 350°C.
• Limit the contact time for each pin to a maximum of 3 seconds.
• Use a heat sink (e.g., tweezers) on the pin between the solder joint and the package body to prevent excessive heat from transferring to the LED.

6.3 Storage Conditions

Devices should be stored in their original moisture barrier bag with desiccant, at a temperature between -40°C and +100°C, in a non-condensing environment. Once the sealed bag is opened, the duration for which the device is exposed to ambient humidity is limited by its MSL rating (Level 3).

7. Packaging and Ordering Information

7.1 Reel and Carrier Tape Specifications

LEDs are supplied in embossed tape on reels, suitable for automated placement machines.

• Tape dimensions:Pocket dimensions (Dimension A): 5.70±0.10 mm, (Dimension B): 5.38±0.10 mm, Depth (Dimension C): 1.60±0.10 mm.
• Reel dimensions:Standard 13-inch (330mm) reel dimensions are provided.
• Quantity per reel:Standard packaging is 1000 pieces per reel. Minimum order quantity can be 250 or 500 pieces per reel.

7.2 Label Description

The reel label contains a code specifying the LED binning on that reel:

• CAT:Luminous intensity class (based on luminous flux binning).
• HUE:Primary Wavelength Grade (Wavelength Binning Code).
• REF:Forward Voltage Grade (Voltage Binning Code).
• LOT No:Traceable lot number.
• P/N:Full product number.
• QTY:Quantity on reel.

It is essential to consult these codes when ordering to ensure receipt of devices with the specific optical and electrical characteristics required for the application.

8. Application Design Considerations

8.1 Drive Circuit Design

Due to the different forward voltages of red light (∼2.3V) and green/blue light (∼3.4V) chips, using a single current-limiting resistor for a simple series connection is not optimal if uniform current is desired. The recommended approach is to use independent current-limiting resistors for each color channel, or better yet, to use a dedicated multi-channel constant-current LED driver IC. This ensures that regardless of power supply voltage variations or V_FHow the gear difference is, can maintain consistent brightness and color. Pulse Width Modulation (PWM) is the preferred method for dimming and color mixing because it can maintain a constant current (and thus a stable color point) while changing the duty cycle.

8.2 Thermal Management

The power consumption of each LED can be up to 0.555W (green/blue light at 150mA). When multiple LEDs are used on a circuit board, the total heat generation can be considerable. Proper thermal design is crucial:

• PCB Layout:Use a PCB with sufficient copper foil area (thermal pad) and connect it to the LED's thermal pad (if available) or pins to conduct heat.
• Thermal vias:Arrange a set of thermal vias under the LED pad to transfer heat to the internal ground plane or the back of the circuit board.
• Derating:Always refer to the derating curve for maximum current versus temperature. In applications with high ambient temperatures, the drive current should be reduced accordingly to ensure the junction temperature remains below 115°C.

8.3 Optical Design

The 120-degree wide viewing angle is beneficial for general lighting, but for applications requiring a focused beam, secondary optics (lenses, reflectors) may be necessary. For light guide tube applications, its small light-emitting area and wide viewing angle facilitate efficient coupling. When designing color mixing, the spatial overlap of the red, green, and blue emission patterns must be considered to achieve uniform mixed color at the target location.

9. Technical Comparison and Differentiation

Compared to earlier RGB LED packages or discrete monochromatic LEDs, this device offers several key advantages:

• Integration Level:Three chips are integrated into one SMT package, saving PCB space and simplifying assembly compared to using three separate LEDs.
• Independent Control:The 6-pin design provides truly independent anode/cathode access for each color, offering greater flexibility compared to common-anode or common-cathode 4-pin RGB LEDs. This enables more complex driving schemes, such as series connection for higher voltage operation.
• Performance:The use of "ultra-high brightness" chips indicates higher efficiency and light output compared to standard products in the same package size.
• Compliance:Full compliance with modern environmental regulations (RoHS, REACH, halogen-free) is a basic requirement, but it is explicitly confirmed here.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Can I drive all three colors using a single 5V power supply and one resistor?

Not the optimal solution. The forward voltage of green and blue LEDs (∼3.4V) leaves only ∼1.6V for the current-limiting resistor under a 5V supply, which allows for stable current control. However, the red LED (∼2.3V) will have ∼2.7V dropped across its resistor. Using the same resistor value for all three colors will result in vastly different currents and brightness levels due to the different V_Fvalues. Independent resistors or constant current drivers are required.

10.2 What is the difference between luminous flux (lm) and luminous intensity (mcd)?

Luminous flux (lumens) measures the total amount of visible light emitted by a light source in all directions. Luminous intensity (candela) measures how bright a light source appears in a specific direction. For wide-viewing-angle LEDs like this one, the intensity value is typically the peak measured on-axis. Total luminous flux better reflects the overall light output for illumination, while luminous intensity is relevant for indicator lights viewed from a specific angle.

10.3 How to use this RGB LED to achieve white light?

White light is produced by mixing red, green, and blue light at appropriate intensities. The exact ratio depends on the specific chromaticity target (e.g., cool white, warm white) and the spectral characteristics of the individual LEDs. Due to variations in chip efficiency and binning, achieving a consistent, high-quality white point typically requires individual calibration within the system or the use of a color sensor for feedback. This is more complex than using a dedicated white LED phosphor.

10.4 Why is the maximum junction temperature only 115°C?

The junction temperature limit is determined by the materials used in the LED chip, bond wires, and package. Overheating accelerates performance degradation mechanisms, reduces light output (lumen depreciation), and can lead to catastrophic failure. Operating at the maximum T_jor near the maximum T

will significantly shorten the device's service life. Good thermal design aims to keep the junction temperature as low as possible during operation.

11. Practical Design and Usage Examples

11.1 Example: Status Indicator for Consumer Electronic Devices

In smart home devices, a 5050 RGB LED can provide various status codes: red indicates an error, green indicates ready, blue indicates Bluetooth pairing, yellow (red+green) indicates standby, etc. The wide viewing angle ensures visibility from any direction. A simple microcontroller with three GPIO pins featuring PWM functionality and three current-limiting resistors (e.g., 15-20Ω when driving approximately 20mA from a 3.3V or 5V power supply) is sufficient to drive this LED. Low current extends lifespan and minimizes heat generation.

11.2 Example: Backlight for Small Signage

Don hasken gefen alamar acrylic, ana iya sanya ƴan irin waɗannan LED ɗin a gefe. Faɗin hangen nesa nasu yana taimakawa wajen haɗa haske cikin acrylic. Ta hanyar jera su a jere (misali, duk haske ja a jere, duk kore a jere, duk shuɗi a jere), ana iya amfani da injin tuƙi mafi girma ƙarfin lantarki, ƙananan ƙarfin lantarki, don haka ƙara inganci. Sarrafa kai tsaye yana ba da damar shirya launi na alama ta hanyar tsari mai ƙarfi. Gudanar da zafi ya ƙunshi tabbatar da cewa acrylic ko tushen shigarwa zai iya watsar da zafi daga dukan tsararrun LED.

12. Working Principle

This device operates based on the principle of electroluminescence in semiconductor materials. When the forward voltage applied across the p-n junction exceeds the bandgap energy of the chip, electrons and holes recombine, releasing energy in the form of photons (light). The color (wavelength) of the emitted light is determined by the bandgap energy of the semiconductor material: red light (∼622 nm) uses GaInAlP material, while green light (∼525 nm) and blue light (∼457 nm) use InGaN material. Three separate semiconductor chips made from these different materials are mounted within a reflector cup and encapsulated in transparent or diffused resin to form a complete LED package.

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