Takardar Bayani na SSR - Nau'in DIP Mai Filaye 6 - Fitowar 60V zuwa 600V - Halin Lodi 50mA zuwa 800mA

1. Bayyani Game da Samfur Wannan takarda ta yi cikakken bayani game da jerin relay na jiki mai ƙarfi (SSR) na gama-gari a cikin tsarin DIP mai filaye 6 (Dual In-line Package). Waɗannan na'urori relay ne guda ɗaya, mai jefa guda ɗaya (Form A), ma'ana suna ba da tuntuɓar buɗe (NO) na al'ada. An ƙera su don maye gurbin relay na lantarki na gargajiya (EMR) a cikin aikace-aikace masu yawa, suna ba da ingantaccen aminci, dogon rayuwa, da aiki shiru saboda rashin sassan motsi.

Fasahar ainihin ta ƙunshi LED infrared na AlGaAs a gefen shigarwa, wanda aka haɗa ta hanyar haske zuwa na'urar gano fitarwa mai ƙarfi. Wannan na'urar gano ta ƙunshi jerin diode na hasken rana da MOSFETs, suna ba da damar sarrafa duka lodin AC da DC. Keɓewar haske yana ba da babban ƙarfin wutar lantarki (5000 Vrms) tsakanin ƙaramin da'irar sarrafawa da babban da'irar lodi, yana haɓaka amincin tsarin da juriyar amo.

2. Muhimman Fasali da Fa'idodi Tsarin Buɗe na Al'ada (Form A): Sauya tashar guda ɗaya mai sauƙi. Ƙaramin Halin Aiki: LED na shigarwa yana buƙatar ƙaramin ƙarfin tuƙi, yana sa ya dace da ƙananan da'irori na dabaru da microcontrollers. Fadin Kewayon Ƙarfin Fitarwa: Ana samun su a cikin samfuran tare da juriyar ƙarfin fitarwa daga 60V zuwa 600V (EL606A, EL625A, EL640A, EL660A), suna biyan buƙatun matakan ƙarfin wutar lantarki daban-daban. Ƙananan Juriya akan (On-Resistance): Fitarwar tushen MOSFET tana ba da ƙananan asarar gudana, yana inganta inganci da rage samar da zafi. Fadin Yanayin Zafi na Aiki: Amini aiki daga -40°C zuwa +85°C, ya dace da masana'antu da mawuyacin yanayi. Babban Ƙarfin Wutar Lantarki na Keɓewa: Keɓewar 5000 Vrms tsakanin shigarwa da fitarwa yana tabbatar da aminci da kare na'urorin sarrafawa masu hankali. Amincewar Masana'antu: An ba da izini ga ƙa'idodin UL 1577, UL 508, VDE, SEMKO, NEMKO, DEMKO, FIMKO, da CQC, suna tabbatar da bin ƙa'idodin aminci da ayyuka na duniya. Zaɓuɓɓukan Fakitin: Ana samun su a cikin madaidaicin DIP mai ramuka da nau'ikan filaye na saman (SMD).

3. Cikakken Bayanin Ƙayyadaddun Fasaha 3.1 Matsakaicin Matsakaicin Ƙimar Waɗannan su ne iyakokin damuwa waɗanda sama da su lalacewar dindindin na na'ura na iya faruwa. Aiki ya kamata koyaushe ya kasance cikin waɗannan iyakokin. Shigarwa (Gefen LED): Matsakaicin halin gaba (IF) shine 50 mA, tare da kololuwar halin gaba (IFP) na 1 A a ƙarƙashin yanayin bugun jini. Juyin ƙarfin wutar lantarki (VR) yana iyakance zuwa 5 V. Fitarwa (Gefen Sauya): Ƙarfin wutar lantarki (VL) yana ayyana matsakaicin ƙarfin wutar lantarki da fitarwa zai iya toshewa, daga 60V (EL606A) zuwa 600V (EL660A). Ci gaba da halin lodi (IL) ya bambanta da samfurin da nau'in haɗin (A, B, C), daga 50 mA zuwa 800 mA. Halin bugun lodi (ILPeak) kuma an ƙayyade shi don ƙarar gajeren lokaci. Keɓewa: Yana jure 5000 Vrms na minti 1 tsakanin shigarwa da fitarwa. Thermal: Kewayon zafin aiki shine -40°C zuwa +85°C. Zafin ajiya ya kai 125°C. Matsakaicin zafin solder shine 260°C na dakika 10. 3.2 Halayen Lantarki da Haske Waɗannan sigogi suna ayyana aikin aikin SSR a 25°C. Halayen Shigarwa: Matsakaicin ƙarfin wutar lantarki na gaba (VF) don LED shine 1.18V a 10mA. Juyin zubar da ruwa (IR) yana da ƙasa sosai (<1 µA). Halayen Fitarwa - Matsayin Kashe: Halin zubar da ruwa (Ileak) lokacin da SSR ya kashe an ƙayyade shi azaman matsakaicin 1 µA, yana nuna kyakkyawan iyawar toshewa. Halayen Fitarwa - Matsayin Kunna: Muhimmin sigogi shine Juriya akan (Rd(ON)). Wannan ya bambanta sosai tsakanin samfuran da nau'ikan haɗin: Haɗin A: Mafi girman ƙimar halin yanzu, mafi girman Rd(ON) (misali, EL606A: 0.75Ω typ, 2.5Ω max). Haɗin B: Matsakaicin ƙimar, matsakaicin Rd(ON). Haɗin C: Ƙananan ƙimar halin yanzu, mafi ƙanƙanta Rd(ON) (misali, EL606A: 0.2Ω typ, 0.5Ω max). Zaɓin ya ƙunshi ciniki tsakanin matsakaicin halin lodi da ɓarnar wutar lantarki (asarar I²R). Ƙarfin Wutar Lantarki na Fitarwa (Cout): Ya kewayo daga 30 pF zuwa 85 pF. Ƙananan ƙarfin wutar lantarki yana da amfani ga sauya mitar girma don rage asara. Halayen Canja wuri: Yana ayyana halin shigarwa da ake buƙata don kunna fitarwa cikin aminci (IF(on), max 3 mA) da kashewa (IF(off), min 0.4 mA). Wannan yana tabbatar da bayyanannun ƙofofin sauya. Saurin Sauya: Lokacin kunna (Ton) yawanci yana tsakanin 0.35 ms da 1.3 ms. Lokacin kashewa (Toff) yana da sauri sosai, yawanci 0.1 ms. Waɗannan sun fi jinkiri fiye da wasu SSR amma sun isa ga yawancin aikace-aikacen sarrafa masana'antu. Sigogi na Keɓewa: Juriya keɓewa (RI-O) yana da girma sosai (>5×10¹⁰ Ω), kuma ƙarfin wutar lantarki na keɓewa (CI-O) yana da ƙasa (1.5 pF typ).

• 4. Lanƙwasa Ayyuka da Bayanan Hotuna Takardar bayani ta haɗa da lanƙwasa halaye na yau da kullun (ko da yake ba a cikakken bayani a cikin rubutun da aka bayar). Waɗannan za su kasance yawanci suna nuna: Ƙarfin Wutar Lantarki na Gaba vs. Halin Gaba (Vf-If): Ga LED na shigarwa, yana nuna halayensa kamar diode. Juriya akan vs. Halin Lodi (Rd(ON)-IL): Yana nuna yadda Rd(ON) zai iya canzawa tare da adadin halin da ake sauya. Juriya akan vs. Yanayin Yanayi (Rd(ON)-Ta): Mahimmanci don ƙirar thermal, kamar yadda Rd(ON) yawanci yana ƙaruwa tare da zafin jiki, yana haifar da mafi girman asara. Hotunan Halayen Canja wuri: Yana tsara matsayin fitarwa (kunna/kashe) da halin LED na shigarwa, yana ayyana ƙofofin kunna/kashe da hysteresis a zahiri. Waɗannan lanƙwasan suna da mahimmanci ga masu ƙira don fahimtar halayen na'ura a ƙarƙashin yanayin da ba daidai ba ko bambanta fiye da ƙimar yau da kullun na 25°C.5. Bayanan Injiniya, Fakitin, da Tari 5.1 Tsarin Filaye da Tsarin Makirci DIP mai filaye 6 yana da daidaitaccen fitarwa: Filaye 1: LED Anode (+) Filaye 2: LED Cathode (-) Filaye 4, 6: MOSFET Drain (Tashoshin fitarwa, yawanci masu musanya don DC) Filaye 5: MOSFET Source (Tashar fitarwa gama gari) Filaye 3: Ba a haɗa shi (NC) a ciki, ana iya amfani dashi don kwanciyar hankali na injiniya. Tsarin makirci na ciki yana nuna LED yana tuƙa jerin hasken rana wanda ke samar da ƙarfin wutar lantarki don kunna matakin fitarwa na MOSFET na N-channel. 5.2 Girman Fakitin da Hanyar Haɗawa An ba da cikakkun zane-zane na injiniya don: Daidaitaccen Nau'in DIP: Don haɗa PCB mai ramuka. Zaɓin Nau'in S1 (Ƙananan Hoton Saman): Don taron SMD. Shimfidar Pad da aka ba da shawarar: Don sigar SMD, yana tabbatar da ingantaccen tsarin solder yayin sake kwarara. Girma ya haɗa da girman jiki, tazarar filaye (2.54mm pitch na al'ada don DIP), tsawon jagora, da tsayin tsayawa. 5.3 Alamar Na'ura Ana yiwa na'urori alama a saman tare da lamba: Prefix "EL", lambar sashi (misali, 660A), lambar shekara mai lamba 1 (Y), lambar mako mai lamba 2 (WW), da lambar zaɓin VDE (V). Wannan yana ba da damar gano asali. 5.4 Jagororin Solder da Gudanarwa Dangane da Matsakaicin Matsakaicin Ƙimar: Solder na Reflow (SMD): Kololuwar zafin jiki bai kamata ya wuce 260°C ba, kuma lokacin sama da 260°C ya kamata a iyakance shi zuwa dakika 10 don hana lalacewa. Solder na Wave/ Hannu (DIP): Ayyuka na al'ada suna aiki, amma ya kamata a rage damuwa na thermal. Matakan Kariya na ESD: Ko da yake tushen MOSFET, an kare fitarwa ta hanyar tuƙin hasken rana. Ana ba da shawarar gudanar da ESD na al'ada don abubuwa masu hankali. Ajiya: Ajiye a cikin bushe, yanayin anti-static a cikin kewayon zafin jiki -40°C zuwa +125°C.
• 6. Bayanan Fakitin da Oda 6.1 Tsarin Lambar Samfur Lambar sashi tana bin tsari: EL6XXA(Y)(Z)-V XX: Lambar sashi da ke ayyana ƙarfin wutar lantarki/halin yanzu na fitarwa (06, 25, 40, 60). Y: Zaɓin nau'in jagora. 'S1' yana nuna ƙananan hoton saman. Fili yana nuna daidaitaccen DIP. Z: Zaɓin tef da reel don sassan SMD (TA, TB, TU, TD). Fili don fakitin bututu. V: Yana nuna zaɓin amincewar amincin VDE. Misali: EL660AS1(TA)-V SSR ne na 600V, 50-80mA a cikin fakitin SMD akan tef da reel na TA, an amince da VDE. 6.2 Ƙayyadaddun Fakitin Daidaitaccen DIP: An cika shi a cikin bututu, raka'a 65 a kowace bututu. Saman Mount (S1): An cika shi akan tef da reel, raka'a 1000 a kowace reel. An ba da cikakkun bayanai na girman tef (girman aljihu A, B, rami Do, D1, pitch E, F) da ƙayyadaddun reel don saitin na'urar ɗauka da sanyawa ta atomatik.7. Jagororin Aikace-aikace da Abubuwan Ɗauka a Zaman Ɗaki 7.1 Aikace-aikacen Manufa Waɗannan SSR sun dace da faffadan aikace-aikacen da ke buƙatar amintaccen sauya keɓewa: Kayan Aikin Sadarwa & Musanya: Hanyoyin siginar, musanyar katunan layi. Kayan Aikin Gwaji & Ma'auni: Sauya shigarwar firikwensin, siginar haɗaɗɗiya. Kayan Aikin Sarrafa Masana'antu (FA) & Kayan Aikin Ofis (OA): Sarrafa solenoids, ƙananan motoci, fitilu, da masu dumama. Tsarin Sarrafa Masana'antu (ICS): Modules na fitarwa na PLC, musanya tsakanin dabaru da da'irori na wutar lantarki. Tsarin Tsaro: Sauya ƙararrawa, makullan ƙofofi, ko wutar lantarki na kyamara. 7.2 Muhimman Abubuwan Ɗauka a Zaman Ɗaki Da'irar Tuƙi na Shigarwa: Yi amfani da resistor mai iyakance halin yanzu a jere tare da LED. Ƙididdige ƙimar resistor dangane da ƙarfin wutar lantarki (misali, 3.3V, 5V, 12V), halin LED da ake so (5-10mA na al'ada don tabbatar da kunna), da VF na LED. Tabbatar da da'irar tuƙi na iya samar da aƙalla matsakaicin IF(on) (3mA) kuma yana iya jawo ƙasa da IF(off) (0.4mA) don tabbatar da kashewa. Abubuwan Ɗauka a Zaman Ɗaki na Fitarwa: Ƙimar Ƙarfin Wutar Lantarki: Zaɓi samfuri (EL606A/625A/640A/660A) inda matsakaicin ƙarfin lodi (gami da na wucin gadi) ya kasance ƙasa da ƙimar VL na na'ura. Rage ƙimar (misali, amfani da sashi na 400V don layin 240VAC) kyakkyawan aiki ne. Ƙimar Halin Yanzu: Zaɓi dangane da ci gaba da RMS ko halin lodi na DC. Yi la'akari da cinikin nau'in haɗin (A/B/C). Halin lodi bai kamata ya wuce ƙayyadaddun IL don zaɓaɓɓen haɗin da samfurin a ƙarƙashin mafi munin yanayin zafin jiki ba. Lodi na Inductive: Lokacin sauya lodin inductive (relay, solenoids, motoci), da'irar snubber (cibiyar sadarwa RC) ko diode na komawa (don DC) a kan lodi yana da mahimmanci don danne ƙararrakin ƙarfin wutar lantarki waɗanda zasu iya wuce ƙarfin wutar lantarki na SSR. Halin Shigarwa: Don lodin kamar fitilu ko lodin capacitive tare da babban ƙarar kunna, tabbatar da kololuwar halin ƙarar yana cikin ƙimar ILPeak. Ana iya buƙatar thermistor mai ƙimar zafin jiki mara kyau (NTC) ko wasu masu iyakance shigarwa. Gudanar da Thermal: An ƙididdige ɓarnar wutar lantarki (Pout) a cikin SSR kamar I_load² * Rds(on). A matsakaicin halin yanzu da haɓakar zafin jiki, wannan na iya zama mahimmanci. Tabbatar da shimfidar PCB tana ba da isasshen yanki na tagulla don sanyaya zafi, musamman don sigar SMD. Kada ku wuce matsakaicin zafin haɗin gwiwa, wanda aka haɗa shi da yanayin yanayi (Ta) da juriyar thermal. Shimfidar PCB: Kiyaye nisa da tsarkakewa akan PCB tsakanin shigarwa da fitar da alamun kamar yadda ƙa'idodin aminci suka tanada (misali, IEC 61010-1). Kiyaye fitar da babban halin yanzu gajere da fadi.
• 8. Kwatancen Fasaha da Jagorar Zabi Samfuran huɗu a cikin wannan jerin sun zama sararin samaniya a fili dangane da ƙarfin wutar lantarki da iyawa: EL606A (60V): Don aikace-aikacen DC na ƙaramin wutar lantarki. Yana ba da mafi girman halin yanzu na ci gaba (har zuwa 800mA a Haɗin C) da mafi ƙanƙanta juriya akan. EL625A (250V): Ya dace da aikace-aikacen ƙarfin layin 120VAC (tare da rage ƙimar) ko tsarin DC na tsakiya. Kyakkyawan ma'auni na halin yanzu (har zuwa 300mA) da ƙarfin wutar lantarki. EL640A (400V): Mafi dacewa da aikace-aikacen ƙarfin layin 240VAC. Ƙimar halin yanzu har zuwa 150mA. EL660A (600V): Don babban ƙarfin wutar lantarki na DC ko layukan AC na masana'antu masu ƙarfi tare da manyan abubuwan wucin gadi. Ƙimar halin yanzu har zuwa 80mA. Idan aka kwatanta da Relay na Lantarki (EMR): Waɗannan SSR ba sa tuntuɓar tuntuɓar, dogon rayuwa (biliyoyin zagayowar), aiki shiru, da mafi kyawun juriya ga girgiza da rawar jiki. Gabaɗaya suna da jinkiri, suna da mafi girman farashi na farko, kuma suna da juriya akan wanda ba sifili ba wanda ke haifar da ɓarnar zafi. Idan aka kwatanta da wasu SSR: Haɗin MOSFET na hasken rana yana ba da ƙananan zubar da ruwa na fitarwa da kwanciyar hankali akan juriya. Ya bambanta da SSR na tushen triac da ake amfani da su don sauya AC, kamar yadda waɗannan relay na tushen MOSFET zasu iya sauya DC.9. Tambayoyin da ake yawan yi (FAQ) 9.1 Shin wannan SSR zai iya sauya lodin AC? Fitarwar MOSFET tana da alaƙa biyu lokacin da ta kashe. Duk da haka, diode na jiki na MOSFET guda ɗaya yana sa ya zama mara alaƙa lokacin da yake kunna. Don ainihin sauya AC, ana yawan amfani da MOSFETs biyu baya da baya. Takardar bayani ta ce "kunna haɗin AC/DC da DC kawai". Tsarin makirci da zane-zanen haɗin (A, B, C) suna nuna MOSFET guda ɗaya. Don haka, don sauya AC, da'irar waje ko takamaiman tsarin haɗin (mai yiwuwa ya haɗa da filaye biyu na magudanar ruwa 4 & 6) ana nufin toshe halin yanzu a duka hanyoyin biyu lokacin da yake kunna. Dole ne mai ƙira ya tuntubi cikakkun zane-zanen haɗin don aiwatar da sauya AC daidai. 9.2 Menene bambanci tsakanin Haɗin A, B, da C? Waɗannan nau'ikan haɗin ciki ko waje ne daban-daban na jerin hasken rana da MOSFET(s) waɗanda ke ciniki da matsakaicin halin lodi (IL) don ƙananan juriya akan (Rd(ON)). Haɗin A yana ba da fifiko ga babban iyawar halin yanzu. Haɗin C yana ba da fifiko ga mafi ƙanƙanta yiwuwar asarar gudana (mafi ƙanƙanta Rd(ON)). Haɗin B yana ba da matsakaici. Zaɓin ya dogara da ko ƙirar ku ta iyakance ta hanyar sarrafa halin yanzu ko ɓarnar wutar lantarki/faɗuwar ƙarfin wutar lantarki. 9.3 Ta yaya zan iya ƙididdige ɓarnar wutar lantarki da zafin da aka samar? Wutar lantarki da aka ɓata a cikin SSR (P_ssr) kusan gaba ɗaya daga MOSFET na fitarwa ne: P_ssr = I_load² * Rds(on). Yi amfani da matsakaicin Rds(on) daga takardar bayani a yanayin zafin haɗin gwiwar aiki da kuke tsammani don ƙididdiga mai ra'ayin mazan jiya. Misali, EL606A a cikin Haɗin C (Rds(on)_max = 0.5Ω) yana sauya 500mA DC yana ɓata P = (0.5)² * 0.5 = 0.125W. Dole ne a fitar da wannan zafi ta hanyar filaye da tagulla na PCB don kiyaye zafin haɗin gwiwa a cikin iyakoki. 9.4 Shin ana buƙatar mai sanyaya zafi? Don fakitin SMD a mafi girma halin yanzu, eh. Bukatar ta dogara da ƙididdigar ɓarnar wutar lantarki, juriyar thermal daga haɗin gwiwa-zuwa-yanayi (RθJA) don shimfidar PCB ɗinku, da matsakaicin yanayin yanayi. Idan ƙididdigar zafin haɗin gwiwa (Tj = Ta + (P_ssr * RθJA)) ya kusanci ko ya wuce 85°C, ingantaccen sanyaya zafi (ƙarin tagulla, ramukan thermal, heatsink na waje) yana da mahimmanci.
• 10. Ka'idar Aiki SSR yana aiki akan ka'idar keɓewar haske da samar da ƙarfin wutar lantarki na hasken rana. Lokacin da halin yanzu ya gudana ta hanyar shigarwar LED infrared na AlGaAs, yana fitar da haske. Wannan hasken na'urar gano ta jerin diode na hasken rana a gefen fitarwa ke gano shi. Wannan jeri yana samar da ƙarfin wutar lantarki buɗe da'ira wanda ya isa ya haɓaka ƙofar MOSFET(s) na N-channel a matakin fitarwa gaba ɗaya. Wannan yana kunna MOSFET, yana haifar da hanyar juriya ƙasa tsakanin tashoshin magudanar ruwa da tushensa, don haka yana rufe "maɓalli". Lokacin da aka cire halin LED, ƙarfin wutar lantarki na hasken rana ya rushe, ƙofar MOSFET ta zubar, kuma na'urar ta kashe. Hanyar haske tana ba da babban keɓewar lantarki.11. Mahallin Masana'antu da Trends Relay na jiki mai ƙarfi suna ci gaba da samun kaso na kasuwa akan relay na lantarki a yawancin aikace-aikace saboda buƙatun mafi girman aminci, dogon rayuwa, da ƙanƙanta. Trends da ke tafiyar da haɓakar SSR sun haɗa da: Mafi Girman Ƙarfin Wutar Lantarki: Haɓaka SSR tare da ƙananan Rds(on) don sarrafa ƙarin halin yanzu a cikin ƙananan fakitoci, rage sararin allo. Haɗin kai: Haɗa fasali na kariya kamar gano wuce gona da iri, kashewa na thermal, da martani na jiha a cikin fakitin SSR. Fadin Kewayon Ƙarfin Wutar Lantarki: Na'urori don duka ƙananan wutar lantarki (misali, 12V/24V mota/masana'antu) da aikace-aikacen ƙarfin layin suna cikin buƙata. Ingantattun Kayan Keɓewa: Haɓaka ƙimar aminci da aminci ta hanyar haɗaɗɗun kayan gyare-gyare da ginin ciki. Iyalin na'urar da aka kwatanta a cikin wannan takardar bayani yana wakiltar cikakkiyar mafita, mai kyawawan halaye don buƙatun sauya keɓewa na gama-gari a cikin masana'antu da yawa.
• Wide Operating Temperature:Reliable operation from -40°C to +85°C, suitable for industrial and harsh environments.
• High Isolation Voltage: Vrms isolation between input and output ensures safety and protects sensitive control electronics.
• Industry Approvals:Certified to UL 1577, UL 508, VDE, SEMKO, NEMKO, DEMKO, FIMKO, and CQC standards, ensuring compliance with international safety and performance requirements.
• Package Options:Available in standard through-hole DIP and surface-mount (SMD) lead form variants.

. Technical Specifications Deep Dive

.1 Absolute Maximum Ratings

These are the stress limits beyond which permanent damage to the device may occur. Operation should always be within these limits.

• Input (LED Side):Maximum forward current (IF) is 50 mA, with a peak forward current (IFP) of 1 A under pulsed conditions. Reverse voltage (VR) is limited to 5 V.
• Output (Switch Side):Breakdown voltage (VL) defines the maximum voltage the output can block, ranging from 60V (EL606A) to 600V (EL660A). Continuous load current (IL) varies by model and connection type (A, B, C), from 50 mA to 800 mA. Pulse load current (ILPeak) is also specified for short-duration surges.
• Isolation:Withstands 5000 Vrms for 1 minute between input and output.
• Thermal:Operating temperature range is -40°C to +85°C. Storage temperature extends to 125°C. Maximum soldering temperature is 260°C for 10 seconds.

.2 Electro-Optical Characteristics

These parameters define the operational performance of the SSR at 25°C.

• Input Characteristics:Typical forward voltage (VF) for the LED is 1.18V at 10mA. Reverse leakage current (IR) is very low (<1 µA).
• Output Characteristics - Off State:Leakage current (Ileak) when the SSR is off is specified as a maximum of 1 µA, indicating excellent blocking capability.
• Output Characteristics - On State:The key parameter is On-Resistance (Rd(ON)). This varies significantly between models and connection types:
  • Connection A:Highest current rating, highest Rd(ON) (e.g., EL606A: 0.75Ω typ, 2.5Ω max).
  • Connection B:Balanced rating, medium Rd(ON).
  • Connection C:Lower current rating, lowest Rd(ON) (e.g., EL606A: 0.2Ω typ, 0.5Ω max).
  The choice involves a trade-off between maximum load current and power dissipation (I²R loss).
• Output Capacitance (Cout):Ranges from 30 pF to 85 pF. Lower capacitance is beneficial for high-frequency switching to reduce losses.
• Transfer Characteristics:Defines the input current required to reliably turn the output on (IF(on), max 3 mA) and off (IF(off), min 0.4 mA). This ensures clear switching thresholds.
• Switching Speed:Turn-on time (Ton) is typically between 0.35 ms and 1.3 ms. Turn-off time (Toff) is very fast, typically 0.1 ms. These are slower than some SSRs but sufficient for many industrial control applications.
• Isolation Parameters:Isolation resistance (RI-O) is extremely high (>5×10¹⁰ Ω), and isolation capacitance (CI-O) is low (1.5 pF typ).

. Performance Curves and Graphical Data

The datasheet includes typical characteristic curves (though not detailed in the provided text). These would typically illustrate:

• Forward Voltage vs. Forward Current (Vf-If):For the input LED, showing its diode-like behavior.
• On-Resistance vs. Load Current (Rd(ON)-IL):Showing how Rd(ON) may change with the amount of current being switched.
• On-Resistance vs. Ambient Temperature (Rd(ON)-Ta):Critical for thermal design, as Rd(ON) typically increases with temperature, leading to higher losses.
• Transfer Characteristics Graph:Plotting output status (on/off) versus input LED current, visually defining the turn-on/off thresholds and hysteresis.

These curves are essential for designers to understand device behavior under non-standard or varying conditions beyond the 25°C typical values.

. Mechanical, Package, and Assembly Information

.1 Pin Configuration and Schematic

The 6-pin DIP has a standard pinout:

• Pin 1: LED Anode (+)
• Pin 2: LED Cathode (-)
• Pin 4, 6: MOSFET Drain (Output terminals, typically interchangeable for DC)
• Pin 5: MOSFET Source (Common output terminal)
• Pin 3: Not connected (NC) internally, may be used for mechanical stability.

The internal schematic shows the LED driving a photovoltaic array which generates a voltage to turn on the N-channel MOSFET output stage.

.2 Package Dimensions and Mounting

Detailed mechanical drawings are provided for:

• Standard DIP Type:For through-hole PCB mounting.
• Option S1 Type (Low Profile Surface Mount):For SMD assembly.
• Recommended Pad Layout:For the SMD version, ensuring proper solder joint formation during reflow.

Dimensions include body size, pin spacing (2.54mm pitch typical for DIP), lead length, and standoff height.

.3 Device Marking

Devices are marked on the top with a code: "EL" prefix, part number (e.g., 660A), a 1-digit year code (Y), a 2-digit week code (WW), and a VDE option code (V). This allows for traceability.

.4 Soldering and Handling Guidelines

Based on the Absolute Maximum Ratings:

• Reflow Soldering (SMD):Peak temperature must not exceed 260°C, and the time above 260°C should be limited to 10 seconds to prevent damage.
• Wave/Hand Soldering (DIP):Standard practices apply, but thermal stress should be minimized.
• ESD Precautions:Although MOSFET-based, the output is protected by the photovoltaic drive. Standard ESD handling for sensitive components is recommended.
• Storage:Store in dry, anti-static conditions within the -40°C to +125°C temperature range.

. Packaging and Ordering Information

.1 Model Numbering System

The part number follows the format:EL6XXA(Y)(Z)-V

• XX:Part number defining output voltage/current (06, 25, 40, 60).
• Y:Lead form option. 'S1' denotes surface mount low-profile. Blank denotes standard DIP.
• Z:Tape and reel option for SMD parts (TA, TB, TU, TD). Blank for tube packaging.
• V:Denotes VDE safety-approved option.

Example: EL660AS1(TA)-V is a 600V, 50-80mA SSR in SMD package on TA tape and reel, VDE approved.

.2 Packing Specifications

• Standard DIP:Packed in tubes, 65 units per tube.
• Surface Mount (S1):Packed on tape and reel, 1000 units per reel. Detailed tape dimensions (pocket size A, B, hole Do, D1, pitch E, F) and reel specifications are provided for automated pick-and-place machine setup.

. Application Guidelines and Design Considerations

.1 Target Applications

These SSRs are suited for a broad spectrum of applications requiring reliable, isolated switching:

• Telecommunication & Exchange Equipment:Signal routing, line card interfaces.
• Test & Measurement Equipment:Switching sensor inputs, multiplexing signals.
• Factory Automation (FA) & Office Automation (OA):Controlling solenoids, small motors, lamps, and heaters.
• Industrial Control Systems (ICS):PLC output modules, interface between logic and power circuits.
• Security Systems:Switching alarms, door locks, or camera power.

.2 Critical Design Considerations

1. Input Drive Circuit:Use a current-limiting resistor in series with the LED. Calculate resistor value based on supply voltage (e.g., 3.3V, 5V, 12V), desired LED current (5-10mA typical for guaranteed turn-on), and the LED's VF. Ensure the drive circuit can supply at least the maximum IF(on) (3mA) and can pull below IF(off) (0.4mA) to guarantee turn-off.
2. Output Load Considerations:
   • Voltage Rating:Select a model (EL606A/625A/640A/660A) where the maximum load voltage (including transients) is below the device's VL rating. Derating (e.g., using a 400V part for a 240VAC line) is good practice.
   • Current Rating:Choose based on the continuous RMS or DC load current. Consider the connection type (A/B/C) trade-off. The load current must not exceed the specified IL for the chosen connection and model under worst-case temperature conditions.
   • Inductive Loads:When switching inductive loads (relays, solenoids, motors), a snubber circuit (RC network) or a flyback diode (for DC) across the load isessentialto suppress voltage spikes that can exceed the SSR's breakdown voltage.
   • Inrush Current:For loads like lamps or capacitive loads with high turn-on surge, ensure the peak surge current is within the ILPeak rating. A negative temperature coefficient (NTC) thermistor or other inrush limiter may be needed.
3. Thermal Management:Power dissipation (Pout) in the SSR is calculated as I_load² * Rds(on). At maximum current and elevated temperature, this can be significant. Ensure the PCB layout provides adequate copper area for heat sinking, especially for the SMD version. Do not exceed the maximum junction temperature, which is linked to the ambient temperature (Ta) and thermal resistance.
4. PCB Layout:Maintain creepage and clearance distances on the PCB between input and output traces as per safety standards (e.g., IEC 61010-1). Keep high-current output traces short and wide.

. Technical Comparison and Selection Guide

The four models in this series form a clear hierarchy based on voltage and current capability:

• EL606A (60V):For low-voltage DC applications. Offers the highest continuous current (up to 800mA in Connection C) and the lowest on-resistance.
• EL625A (250V):Suitable for 120VAC line voltage applications (with derating) or mid-range DC systems. Good balance of current (up to 300mA) and voltage.
• EL640A (400V):Ideal for 240VAC line voltage applications. Current rating up to 150mA.
• EL660A (600V):For high-voltage DC or demanding industrial AC lines with significant transients. Current rating up to 80mA.

Compared to Electromechanical Relays (EMRs):These SSRs offer no contact bounce, much longer life (billions of cycles), silent operation, and better resistance to shock and vibration. They are generally slower, have a higher initial cost, and have a non-zero on-resistance leading to heat dissipation.

Compared to other SSRs:The photovoltaic MOSFET coupling provides very low output leakage and stable on-resistance. It is different from triac-based SSRs used for AC switching, as these MOSFET-based relays can switch DC.

. Frequently Asked Questions (FAQ)

.1 Can this SSR switch AC loads?

Yes.The MOSFET output is bidirectional when off. However, the body diode of a single MOSFET makes it unidirectional when on. For true AC switching, two MOSFETs are often used back-to-back. The datasheet states "enable AC/DC and DC only output connections." The schematic and connection diagrams (A, B, C) show a single MOSFET. Therefore, for AC switching, external circuitry or a specific connection configuration (likely involving both drain pins 4 & 6) is implied to block current in both directions when on. The designer must consult the detailed connection diagrams to implement AC switching correctly.

.2 What is the difference between Connection A, B, and C?

These are different internal or external wiring configurations of the photovoltaic array and MOSFET(s) that trade off maximum load current (IL) for lower on-resistance (Rd(ON)).Connection Aprioritizes high current capability.Connection Cprioritizes lowest possible conduction loss (lowest Rd(ON)).Connection Boffers a middle ground. The choice depends on whether your design is limited by current handling or power dissipation/voltage drop.

.3 How do I calculate the power dissipation and heat generated?

Power dissipated in the SSR (P_ssr) is almost entirely from the output MOSFET:P_ssr = I_load² * Rds(on). Use the maximum Rds(on) from the datasheet at your expected operating junction temperature for a conservative estimate. For example, an EL606A in Connection C (Rds(on)_max = 0.5Ω) switching 500mA DC dissipates P = (0.5)² * 0.5 = 0.125W. This heat must be conducted away via the pins and PCB copper to keep the junction temperature within limits.

.4 Is a heat sink required?

For the SMD package at higher currents, yes. The need depends on the calculated power dissipation, the thermal resistance from junction-to-ambient (RθJA) for your PCB layout, and the maximum ambient temperature. If the calculated junction temperature (Tj = Ta + (P_ssr * RθJA)) approaches or exceeds 85°C, improved heat sinking (more copper, thermal vias, external heatsink) is necessary.

. Operational Principle

The SSR operates on the principle of optical isolation and photovoltaic voltage generation. When a current flows through the input AlGaAs infrared LED, it emits light. This light is detected by a photovoltaic diode array on the output side. This array generates an open-circuit voltage sufficient to fully enhance the gate of the N-channel MOSFET(s) in the output stage. This turns the MOSFET on, creating a low-resistance path between its drain and source terminals, thus closing the "switch." When the LED current is removed, the photovoltaic voltage collapses, the MOSFET gate discharges, and the device turns off. The optical path provides the high electrical isolation.

. Industry Context and Trends

Solid-state relays continue to gain market share over electromechanical relays in many applications due to demands for higher reliability, longer lifespan, and miniaturization. Trends driving SSR development include:

• Higher Power Density:Developing SSRs with lower Rds(on) to handle more current in smaller packages, reducing board space.
• Integration:Incorporating protection features like over-current detection, thermal shutdown, and state feedback into the SSR package.
• Wider Voltage Ranges:Devices for both low-voltage (e.g., 12V/24V automotive/industrial) and mains-voltage applications are in demand.
• Improved Isolation Materials:Enhancing safety ratings and reliability through advanced mold compounds and internal construction.

The device family described in this datasheet represents a mature, well-characterized solution for general-purpose isolated switching needs across multiple industries.