ELCH07-NB2025J5J7283910-F3H LED Datasheet - Warm White - 210 Lumens @ 1A - 3.2V Typical - 120° Viewing Angle - Simplified Chinese Technical Document

1. Product Overview

This document provides the complete technical specifications for the ELCH07-NB2025J5J7283910-F3H high-performance surface-mount LED. The device utilizes InGaN chip technology to produce warm white light with a correlated color temperature (CCT) range of 2000K to 2500K. Its primary design objective is to achieve high luminous efficacy within a compact package, making it suitable for applications requiring bright, high-quality illumination in space-constrained environments.

The core advantages of this LED include: a typical luminous flux of 210 lumens at a forward current of 1000mA, achieving an optical efficiency of up to 61.7 lumens per watt. It integrates robust ESD protection up to 8KV (Human Body Model) and complies with key industry standards such as RoHS, REACH, and halogen-free. The target markets are diverse, encompassing consumer electronics, automotive lighting, general lighting, and specialty lighting applications where reliability and performance are critical.

2. In-depth and Objective Interpretation of Technical Parameters

2.1 Absolute Maximum Ratings

Absolute maximum ratings define the stress limits that may cause permanent damage to the device. These are not recommended operating conditions.

• DC Forward Current (Continuous Mode): 350 mA. This is the maximum continuous DC current the LED can withstand.
• Peak Pulse Current: 1200 mA. This high current is only allowed under specific pulse conditions: pulse width 400 ms, off time 3600 ms, up to 30,000 cycles. This is typically used for camera flash applications.
• Junction Temperature (Tj): 145 °C. Maximum temperature allowed for semiconductor junction. Exceeding this limit accelerates performance degradation or leads to risk of failure.
• Operating and Storage Temperature: -40°C to +85°C (operating), -40°C to +100°C (storage).
• Power Consumption (Pulse Mode): 4.74 W. The maximum power that the package can dissipate during pulse operation, which largely depends on thermal management.
• Viewing Angle (2θ_1/2): 120 degrees. This wide viewing angle indicates that it has an emission pattern close to a Lambertian source, making it suitable for area lighting.

Important Notice: It is strongly not recommended to operate at or near these maximum ratings for extended periods, as this will lead to reduced reliability and potential permanent damage. Applying multiple maximum ratings simultaneously is not allowed.

2.2 Electro-Optical Characteristics

These parameters are measured under standard test conditions (Ts=25°C) and represent the typical performance of the device.

• Luminous Flux (I_v): at I_FAt =1000mA, minimum 180 lm, typical 210 lm. Measurement tolerance is ±10%.
• Forward Voltage (V_F): at I_FAt =1000mA, the range is 2.85V to 3.95V. The typical value is approximately 3.2V. Measurement tolerance is ±0.1V. All electrical and optical data are tested using a 50 ms pulse to minimize self-heating effects.
• Correlated Color Temperature (CCT): 2000K to 2500K, defining its warm white appearance.

Performance is guaranteed through a 1000-hour reliability test, with the criterion being luminous flux degradation of less than 30%. All reliability tests assume good thermal management using a 1.0 cm x 1.0 cm Metal Core Printed Circuit Board (MCPCB).

2.3 Thermal and Reliability Characteristics

Effective thermal management is crucial for the performance and lifespan of LEDs. Key thermal parameters include:

• Junction temperature (Tj max): 145°C.
• Substrate temperature (T_s): at I_F=1000mA, must be maintained at 70°C or below during operation. This parameter is crucial for the system's thermal design.
• Soldering temperature: can withstand a peak temperature of 260°C during reflow soldering.
• Number of Allowed Reflows: Maximum 2 times.
• Moisture Sensitivity Level (MSL)Level 1. This is the most robust level, indicating indefinite storage without baking under conditions of ≤30°C/85% RH. This simplifies handling and storage.

3. Explanation of the Grading System

To ensure color and brightness consistency in production, LEDs are sorted into different bins. This device employs a three-dimensional binning system.

3.1 Forward Voltage Grading

LEDs are categorized into three bins based on their forward voltage at 1000mA.

• Bin 2832:V_F= 2.85V to 3.25V
• Gear 3235:V_F= 3.25V to 3.55V
• Gear 3539:V_F= 3.55V to 3.95V

This allows designers to select LEDs with similar electrical characteristics to ensure consistent driver performance.

3.2 Luminous Flux Binning

LEDs are binned according to their total light output at 1000mA:

• Gear J5:I_v= 180 lm to 200 lm
• Gear J6:I_v= 200 lm to 250 lm
• Gear J7:I_v= 250 lm to 300 lm

The "J5" in the model number indicates that this specific device belongs to the J5 brightness bin.

3.3 Chromaticity (Color) Binning

The color is defined within the warm white region of the CIE 1931 chromaticity diagram. The "2025" bin in the model number corresponds to a specific quadrilateral area on this diagram, ensuring that all LEDs within this bin have very similar chromaticity coordinates (x, y), resulting in a consistent warm white appearance between 2000K and 2500K. The measurement tolerance for the chromaticity coordinates is ±0.01.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (V-I Curve)

V-I curve shows a nonlinear relationship. Forward voltage increases with current, starting from about 2.6V at very low current and rising to about 3.6V at 1200mA. This curve is crucial for designing current-limiting circuits or constant-current drivers.

4.2 Relative Luminous Flux vs. Forward Current

Light output increases sublinearly with current. While output increases significantly from 0mA to 1000mA, the rate of increase may diminish at the highest currents due to efficiency droop (a common phenomenon in LEDs where internal efficiency decreases at high current densities). This highlights the importance of operating at recommended currents for optimal luminous efficacy.

4.3 Correlated Color Temperature (CCT) vs. Forward Current

The CCT remains relatively stable across the entire operating current range, varying only slightly between approximately 1900K and 2400K. This stability is crucial for applications requiring consistent color temperature, despite dimming or variations in drive current.

4.4 Spectral Distribution and Radiation Pattern

The relative spectral distribution plot shows the broad emission spectrum characteristic of phosphor-converted white LEDs, with a peak wavelength (λ_p) in the blue region (from the InGaN chip) and a broad yellow/red emission from the phosphor. The typical radiation pattern is Lambertian (cosine law), confirmed by the polar plot, which shows a smooth, wide beam with a 120-degree viewing angle. The intensity on the X-axis and Y-axis is nearly identical.

5. Mechanical and Packaging Information

This LED uses a Surface-Mount Device (SMD) package. The package drawing (not reproduced here but referenced on page 8 of the datasheet) provides key dimensions, including length, width, height, and pad layout. Unless otherwise specified, tolerances are typically ±0.1 mm. The drawing includes key features such as the optical lens shape, cathode marking, and the recommended pad layout for PCB design, which are crucial for ensuring proper soldering, thermal conduction, and optical alignment.

6. Welding and Assembly Guide

• Reflow solderingThis device can withstand a peak soldering temperature of 260°C. It is rated to withstand a maximum of 2 reflow soldering cycles.
• Thermal managementAs specified, the substrate temperature must not exceed 70°C at 1000mA. This requires the use of a suitable PCB (e.g., MCPCB or a design with sufficient thermal vias), and depending on the application's duty cycle and ambient conditions, additional heat sinking may be necessary.
• StorageAs an MSL Level 1 device, no special dry storage is required under normal factory conditions (≤30°C/85% RH).
• Handling: Due to the integration of ESD protection (rated up to 8KV, but may still be damaged by higher energy events), standard ESD precautions should be observed.

7. Packaging and Ordering Information

LEDs are supplied on convex-top carrier reels for automated SMT assembly. Each reel contains 2000 pieces, with a minimum order quantity of 1000 pieces. Carrier tape dimensions are specified in the datasheet and include a polarity indicator to ensure correct orientation during assembly. The product label on the reel includes Customer Part Number (CPN), Manufacturer Part Number (P/N), lot number, quantity, and three binning codes: CAT (Luminous Flux Bin), HUE (Color Bin), and REF (Forward Voltage Bin), as well as the MSL rating.

8. Application Suggestions

8.1 Typical Application Scenarios

• Flash ya kamera ya simuUwezo wake wa mkondo wa juu wa msukumo (1200mA) na mkondo mkubwa wa mwanga hufanya uwe mzuri kwa kutumika kama taa ya flash au tochi katika vifaa vya rununu.
• Taa ya jumlaInterior lighting, decorative lighting, step lights, exit signs, and other architectural or accent lighting.
• BacklightSuitable for TFT display backlight units requiring warm white light.
• Automotive lighting: including interior (ambient lighting, instrument panel lighting) and exterior applications (subject to specific automotive certification requirements).

8.2 Design Considerations

• Driver Design: Use a custom constant current driver based on the forward voltage bin and the required operating current (e.g., 350mA for continuous operation, up to 1200mA for pulsed flash).
• Thermal Design: This is the most critical aspect. Calculate the required thermal resistance from the LED junction to the ambient to maintain T_jAnd T_sWithin the specified limits. For high-current applications, the use of MCPCB or Insulated Metal Substrate (IMS) is strongly recommended.
• Optical Design: The 120-degree Lambertian pattern is suitable for broad, uniform illumination. For focused beams, secondary optics (lenses, reflectors) are required.

9. Technical Comparison and Differentiation

Although this specification does not provide a direct side-by-side comparison with other models, the key differentiating features of this LED can be inferred:

• High luminous efficacy under warm white lightAchieving 61.7 lm/W within the warm white light (2000-2500K) CCT range is a significant performance point, as efficiency typically decreases compared to cool white light.
• Robust pulse handling capabilityThe 1200mA pulse rating under specified conditions is specifically designed for camera flash applications, which is a special requirement.
• Integrated Advanced ESD Protection: 8KV HBM protection exceeds typical industry levels, providing greater robustness during handling and end-use.
• Comprehensive ComplianceCompliance with RoHS, REACH, and halogen-free standards is crucial for modern electronic products, especially in the consumer and automotive markets.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED continuously at 1000mA?
A: The absolute maximum rating for DC forward current is 350mA. The 1000mA value is a test condition used for specifying luminous flux, typically associated with pulsed operation (e.g., flashing). For continuous operation, you must not exceed 350mA and must ensure the substrate temperature (T_s) is maintained at 70°C or below through effective thermal management.

Q: What does "2025" in the model number mean?
A: It refers to the chromaticity (color) bin. LEDs in this bin will have chromaticity coordinates within a defined region on the CIE diagram, producing a warm white light with a correlated color temperature between 2000K and 2500K.

Q: How many of these LEDs can I connect in series on a 12V power supply?
A: Typical V_Fis approximately 3.2V. Theoretically, you can connect 3 LEDs in series (3 * 3.2V = 9.6V), leaving headroom for the current regulator. However, you must consider the maximum and minimum V_F(2.85V to 3.95V) in the binning and design the driver to handle this range for all devices in the series string.

Q: Is a heatsink required?
A: For any operation above low current, yes. The datasheet clearly states that at 1000mA, the board temperature must be ≤ 70°C, and all reliability data is based on using a 1cm² MCPCB. For continuous operation at lower currents, thermal analysis is still necessary to ensure T_j <145°C。

11. Practical Application Cases

Design Case: Portable Work Light
A designer is creating a battery-powered, high-output work light. They selected this LED for its high lumen output and warm white light, which is more comfortable for the eyes. They plan to use a 3.7V lithium-ion battery. To drive the LED, they chose a boost constant current driver set to 300mA (below the 350mA DC maximum) to ensure good efficiency and lifespan. They designed a compact aluminum-based PCB that serves as both the circuit carrier and a heat sink, ensuring the LED's thermal pad is properly soldered to a large area of copper foil and connected via thermal vias. The 120-degree wide beam angle provides good area coverage without the need for additional optics. The MSL Level 1 rating simplifies the assembly process at their manufacturing plant.

12. Introduction to Working Principles

This is a phosphor-converted white LED. Its core is a semiconductor chip made of indium gallium nitride (InGaN). When a forward voltage is applied, electrons and holes recombine within the chip, primarily emitting photons in the blue spectral region. This blue light then irradiates a phosphor coating (typically YAG:Ce or similar) deposited on or near the chip. The phosphor absorbs a portion of the blue light and re-emits it as yellow and red light. The mixture of the remaining blue light and the broad-spectrum yellow/red light from the phosphor is perceived by the human eye as white light. The precise ratio of blue light to phosphor-converted light determines the correlated color temperature (CCT); a higher red/yellow content produces a "warmer" white light, as is the case with this 2000-2500K device.

13. Technology Trends

The LED industry continues to advance along several key directions related to such devices:

• Efficiency improvement (lm/W)Continuous improvements in chip epitaxy, phosphor technology, and packaging design drive higher luminous efficacy, reducing energy consumption and thermal load at the same light output.
• Color Quality and Consistency Improvement: Advances in phosphor systems and binning processes have led to tighter color tolerances (smaller binning areas) and higher Color Rendering Index (CRI) values, even for warm white LEDs.
• Higher Power Density and ReliabilityEncapsulation materials and thermal interface technologies are advancing, enabling higher drive currents and power dissipation while maintaining or improving lifespan (L70, L90 metrics).
• Integration and MiniaturizationThere is a trend toward integrating multiple LED chips, drivers, and control circuits into a single, smarter module. However, discrete high-power LEDs like this remain crucial for applications requiring maximum flexibility in optical and thermal design.
• Pulsed Performance for SensingFor applications beyond illumination, such as LiDAR or structured light for 3D sensing, the ability to handle extremely short, high-current pulses with precise timing is becoming increasingly important.