ELCS14B-KB4050J6J9283910-F4Z LED Datasheet - High-Efficiency White LED - 250 Lumens at 1A - Max 3.95V - 5.9W Pulse Power - Technical Documentation

1. Product Overview

Takardar ta yi cikakken bayani game da ƙayyadaddun ƙayyadaddun fitilun LED na farin haske mai ƙarfi, mai hawa a saman. Na'urar an tsara ta musamman don aikace-aikacen da ke buƙatar fitowar haske mai ƙarfi da inganci a cikin ƙaramin siffa. Babban fa'idodinsa sun haɗa da: a cikin 1 Amper na yanayin tuƙi, madaidaicin ƙarfin haske ya kai 250 lumens, yana cimma ingantaccen ingancin haske na 73.5 lumens/watt. LED ɗin ya ƙunshi kariya mai ƙarfi na ESD, wanda ya dace da aiki a kowane yanayi na haɗawa. Ya cika daidai da ƙa'idodin muhalli da aminci na zamani, gami da RoHS, EU REACH da buƙatun marasa halogen. Manyan kasuwannin da aka yi niyya sun haɗa da tsarin na'urorin hannu, kayan lantarki na masu amfani, hasken gabaɗaya da hasken ciki da waje na mota.

2. Technical Parameters and Specifications

2.1 Absolute Maximum Ratings

It defines the operational limits of the device to ensure reliability and prevent permanent damage. Key ratings include: a DC forward current (Flashlight Mode) of 350 mA, and a peak pulse current capability of 1500 mA under specific conditions (maximum duration 400 ms, maximum duty cycle 10%). The junction temperature must not exceed 150°C. According to the JEDEC JS-001-2017 (HBM) standard, the device can withstand ESD pulses up to 2 KV. The operating temperature range is -40°C to +85°C. It is crucial to avoid applying multiple maximum rating parameters simultaneously and to avoid prolonged operation at these limits to prevent reliability degradation.

2.2 Electro-Optical Characteristics

All photoelectric data are specified at a pad temperature (Ts) of 25°C. The main performance indicators are as follows:

• Luminous Flux (Iv):At IF=1000mA, minimum 220 lumens, typical 250 lumens. Measurement tolerance is ±10%.
• Forward Voltage (VF):At IF=1000mA, minimum 2.85V, maximum 3.95V. Measurement tolerance is ±0.1V. Electrical and optical data tested under 50 ms pulse conditions.
• Correlated Color Temperature (CCT):The range is from 4000K to 5000K, with a typical value of 4500K, falling within the neutral white light region.
• Color Rendering Index (CRI):The minimum value is 80, with a typical value of 83. The measurement tolerance is ±2.
• Viewing Angle (2θ1/2):120 degrees, with a tolerance of ±5°. This wide viewing angle is a typical characteristic of Lambertian radiation pattern.

2.3 Thermal Management and Reliability Considerations

Proper thermal management is crucial for performance and longevity. When operating at a current of 1000mA, the maximum allowable substrate temperature (Ts) is 70°C. This device can withstand a maximum soldering temperature of 260°C for up to two reflow cycles. All specified parameters are guaranteed through a 1000-hour reliability test, with the criterion being a luminous flux degradation of less than 30%. This test is conducted under good thermal management conditions using a 1.0 x 1.0 cm² Metal Core Printed Circuit Board (MCPCB).

3. Explanation of the Binning System

To ensure consistency in applications, LEDs are sorted (binned) according to three key parameters. The binning code is part of the product ordering code (e.g., J6, 4050, 2832 in ELC...J6J9283910).

3.1 Luminous Flux Binning

LEDs are grouped according to their total light output at 1000mA. The binning structure is as follows:

• J6 gear:The luminous flux ranges from 220 lumens to 250 lumens.
• J7 gear:Luminous flux from 250 lumens to 300 lumens.
• J8 gear:Luminous flux from 300 lumens to 330 lumens.
• J9 gear:Luminous flux from 330 lumens to 360 lumens.

The provided device belongs to J6 bin.

3.2 Forward Voltage Binning

LEDs are classified based on their voltage drop at 1000mA to aid driver design and power management.

• 2832 Binning:Forward voltage from 2.85V to 3.25V.
• 3235 grade:Forward voltage from 3.25V to 3.55V.
• 3539 grade:Forward voltage from 3.55V to 3.95V.

The provided devices belong to the 2832 voltage bin.

3.3 Chromaticity (Color) Binning

The chromaticity coordinates on the CIE 1931 diagram are strictly controlled. This device uses the "4050" color bin, which defines a specific quadrilateral area on the diagram, ensuring the emitted white light falls within a consistent color gamut. The coordinates are measured at IF=1000mA, with a permissible deviation of ±0.01. This bin corresponds to a correlated color temperature range of 4000K to 5000K.

4. Performance Curve Analysis

4.1 Spectral Distribution

The relative spectral distribution curve (as shown in the datasheet) is typical for phosphor-converted white LEDs. It features a dominant blue peak from the InGaN chip (the λp wavelength is specified, e.g., around 450-455nm) and a broad secondary emission band from the phosphor in the yellow-green-red region. The combination of both produces white light. The exact shape and peak wavelengths determine the CCT and CRI.

4.2 Radiation Pattern

The typical polar radiation pattern confirms a Lambertian distribution. The relative luminous intensity is plotted against viewing angle. The pattern shows the intensity is highest at 0° (perpendicular to the emitting surface) and decreases following the cosine law, falling to half of its peak value at ±60° from the centerline, thereby defining a full viewing angle of 120°.

4.3 Forward Characteristics

Although the specific graphs for forward voltage-current and relative luminous flux-current are marked as "To Be Determined" (TBD) in this preliminary datasheet, their general behavior is standard for LEDs. The forward voltage (VF) increases logarithmically with current. The relative luminous flux typically increases sublinearly with current, while the efficiency (lumens per watt) usually peaks at a certain current value below the maximum rated current. The correlated color temperature (CCT) may also shift slightly with drive current due to changes in junction temperature and phosphor efficiency.

5. Mechanical and Package Information

5.1 Package Dimensions

This LED is packaged as a Surface Mount Device (SMD). The datasheet includes detailed dimension drawings (top view, side view, and bottom view) in millimeters. Key dimensions typically include package length, width, height, pad size, and pad pitch. Unless otherwise specified, the tolerance is generally ±0.05mm. The bottom view clearly shows the anode and cathode pad markings to facilitate correct PCB pad design and assembly polarity identification.

5.2 Polarity Identification

Correct polarity is crucial for operation. The package features asymmetric pads or markings (visible in the bottom view) to distinguish the anode (+) and cathode (-). The PCB pad design must match this asymmetry to prevent misplacement.

6. Welding and Assembly Guide

6.1 Reflow Soldering Temperature Profile

This device is suitable for reflow soldering processes. The maximum soldering temperature is 260°C, and it can withstand up to two reflow cycles. Designers must follow the standard lead-free reflow soldering temperature profile to ensure that the peak temperature and the time above the liquidus are controlled to prevent thermal damage to the LED chip, phosphor, or package.

6.2 Moisture Sensitivity and Storage

The Moisture Sensitivity Level (MSL) of this LED is Level 1. This means its floor life is unlimited under conditions of ≤30°C / 85% relative humidity. However, best practices should still be followed:

• Before opening:将密封的防潮袋存放在≤30°C / <90% RH的环境中。
• After opening:及时使用元件。如不立即使用，请存放在≤30°C / <85% RH的环境中。建议在准备用于生产之前不要打开袋子。

7. Packaging and Ordering Information

7.1 Carrier Tape and Reel Specifications

LEDs are supplied in embossed carrier tape, wound on reels for automatic SMT assembly. The datasheet provides carrier pocket dimensions, pitch, and overall reel dimensions. The standard loading quantity is 2000 pieces per reel, with a minimum order quantity of 1000 pieces.

7.2 Product Label

Reel and packaging labels contain key information for traceability and verification:

• CPN:Customer Part Number.
• P/N:Manufacturer Part Number (e.g., ELC...F4Z).
• LOT NO:Production batch number, used for traceability.
• QTY:Quantity of devices inside the package.
• CAT:Luminous flux bin (e.g., J6).
• HUE:Color binning (e.g., 4050).
• REF:Forward voltage binning (e.g., 2832).
• MSL-X:Humidity Sensitivity Level.

8. Application Notes and Design Considerations

8.1 Typical Application Scenarios

• Mobile Device Camera Flash:High pulse current capability (1500mA) and high light output make it suitable for camera flash/strobe applications in smartphones and tablets.
• Flashlight and Portable Lighting:Due to its high efficiency, it is very suitable for flashlight mode in devices or dedicated handheld flashlights.
• Backlight:Can be used for TFT-LCD backlighting of small to medium-sized displays.
• General and Decorative Lighting:Suitable for accent lighting, signage, step lights, and other indoor/outdoor architectural applications.
• Automotive Lighting:Applicable to interior map lights, door lights, and other non-exterior headlamp functions.

8.2 Key Design Considerations

1. Thermal Management:This is the most critical factor affecting performance and lifespan. LEDs must be mounted on a PCB with sufficient thermal conductivity (e.g., MCPCB or FR4 with thermal vias) to keep the pad and junction temperatures within limits. The specified 70°C substrate temperature at 1000mA current is a key design goal.
2. Current Drive:Use a constant-current LED driver, not a constant-voltage source. The driver's rating must meet the required forward current (DC or pulsed) and the forward voltage range of the specific bin used.
3. ESD Precautions:Although the device has built-in ESD protection, standard ESD handling procedures should still be followed during assembly and operation.
4. Optical Design:If beam shaping or specific illumination patterns are required, the Lambertian emission pattern needs appropriate secondary optics (lenses, reflectors).

9. Technical Comparison and Differentiation

Compared to standard mid-power LEDs, this device offers significantly higher luminous flux in a potentially similar package size, pushing the boundaries of efficiency (73.5 lumens per watt at 1A). Its robust 2KV ESD protection exceeds the typical 1KV level common in many consumer-grade LEDs, providing better operational robustness. The combination of high luminous flux, high efficiency, and strong ESD protection in a single package is a key differentiating advantage for demanding applications like camera flash, where space, light output, and reliability are critical.

10. Frequently Asked Questions (FAQ)

10.1 What is the difference between flashlight mode current and pulse mode current?

Flashlight mode (IF=350mA):This is used forContinuousThe maximum recommended DC forward current for applications that keep the light on (such as an always-on flashlight).

Pulse mode (IPulse=1500mA):This is used forPeak pulseCurrent, applicable for extremely short durations (up to 400ms) and low duty cycles (max 10%), such as in camera flash applications. Continuous operation at this current will lead to overheating and failure.

10.2 Why is thermal management so important for this LED?

LED performance (light output, color, voltage) and lifetime are highly sensitive to junction temperature (Tj). Overheating reduces light output (efficiency droop), can cause color shift, and significantly accelerates the degradation of LED materials, leading to premature failure. The 70°C substrate temperature limit at 1A current is a practical design guideline aimed at keeping Tj within a safe operating range.

10.3 How to interpret the bin code when ordering?

Complete part number (e.g., ELC...J6J92832...4050...F4Z) contains binning information. You must specify the required luminous flux bin (J6), forward voltage bin (2832), and chromaticity bin (4050) to ensure receipt of LEDs with the precise performance characteristics designed for, enabling consistent and expected functionality.

11. Design and Use Case Studies

Scenario: Designing a Smartphone Camera Flash Module

A design engineer's task is to create a dual-LED flash system for a high-end smartphone. Key requirements are: to provide very high light output to illuminate the scene for a duration of approximately 200ms, occupy minimal space, and operate reliably throughout the device's lifespan.

Implementation Plan:Two such LEDs were selected. They are driven in parallel by a dedicated flash driver IC. When the flash is triggered, this driver IC is programmed to deliver a 1500mA, 200ms pulse to each LED, utilizing the peak pulse rating. The PCB uses a compact multilayer design with dedicated thermal pads connected to the phone's mid-frame for heat dissipation, ensuring the substrate temperature stays below 70°C during the pulse. A 2KV ESD rating provides a safety margin against electrostatic discharge during phone assembly and user handling. By specifying strict binning (e.g., luminous flux bin J6, color bin 4050), the light output and color temperature of the two LEDs are matched, resulting in consistent, high-quality flash photography.

12. Working Principles

This is a phosphor-converted white LED. At its core is a semiconductor chip made of indium gallium nitride (InGaN), which emits blue light (electroluminescence) when an electric current passes through it. Part of the blue light is absorbed by a layer of yellow (or green-red mixture) phosphor material coated on the chip. The phosphor re-emits the absorbed energy as light of longer wavelengths (yellow/red). The remaining unabsorbed blue light mixes with the yellow/red light emitted by the phosphor, creating the perception of white light. The precise ratio of blue light to phosphor light determines the correlated color temperature (CCT) — the more blue light, the cooler the white light (higher CCT); the more yellow/red light, the warmer the white light (lower CCT).

13. Technology Trends

The development of such white LEDs is driven by continuous improvements in the following areas:

• Efficiency (lumens/watt):Ongoing research focuses on enhancing the internal quantum efficiency of blue InGaN chips (extracting more light per electron) and developing more efficient phosphors with narrower emission bands (for better color rendering and reduced Stokes shift losses).
• Luminous Density:The trend is to package more lumens into smaller packages, enabling brighter applications or using fewer LEDs for the same light output, saving cost and space.
• Reliability and Robustness:Improvements in packaging materials, die-attach technology, and phosphor stability are extending lifetime and enabling operation at higher temperatures and currents.
• Color Quality and Consistency:更严格的分档、改进的荧光粉配方以及新方法（如采用RGB荧光粉的紫光泵浦LED）旨在实现更高的CRI（Ra >90, R9 >80）以及随时间推移和温度变化下更一致的色彩。