T-1 3mm White LED Lamp Bead Datasheet - 3.0x5.0mm Package - Typical Voltage 3.2V - Drive Current 20mA - Luminous Intensity 14.25-28.5 Kilo-millicandela - Chinese Technical Documentation

1. Product Overview

This document elaborates on the technical specifications of a high-brightness white light-emitting diode (LED) utilizing the mainstream T-1 (3mm) round package. This device is designed to deliver exceptional luminous output, suitable for application scenarios requiring bright, clear indication or illumination.

Its core technology employs an indium gallium nitride (InGaN) semiconductor chip, which emits blue light. This blue light is converted into broad-spectrum white light via a phosphor coating deposited inside the LED reflector cup. The resulting white light possesses specific chromaticity coordinate characteristics defined by the CIE 1931 chromaticity diagram standard.

1.1 Core Advantages and Target Market

The primary advantage of this LED series lies in achieving high optical power within a compact, industry-standard form factor. The device is designed for reliability and complies with modern environmental and safety standards.

• High Optical Output:It provides high intensity brightness at the same size.
• Standard Package:T-1 round package ensures compatibility with existing PCB pads and sockets.
• Regulatory Compliance:The product complies with RoHS (Restriction of Hazardous Substances), EU REACH regulations, and is classified as a halogen-free product, meeting specific limits for bromine (Br) and chlorine (Cl) content.
• ESD Protection:It features an electrostatic discharge (ESD) withstand voltage of up to 4kV, enhancing handling robustness.

The target applications are extensive, primarily concentrated in fields requiring clear and bright signal indication. Key markets include backlighting for information panels and displays, status or optical indicators in consumer and industrial electronics, as well as various sign lighting applications.

2. In-depth Technical Parameter Analysis

A thorough understanding of the device's absolute maximum ratings and operating characteristics is crucial for reliable circuit design and long-term performance.

2.1 Absolute Maximum Ratings

These ratings define the stress limits that may cause permanent damage to the device. Operation at or beyond these limits is not guaranteed and should be avoided to ensure reliable performance.

• Continuous Forward Current (I_F):30 mA
• Peak Forward Current (I_FP):100 mA (under conditions of 1/10 duty cycle, 1 kHz frequency)
• Reverse Voltage (V_R):5 V
• Power Consumption (P_d):100 mW
• Operating temperature (T_opr):-40°C to +85°C
• Storage temperature (T_stg):-40°C to +100°C
• Soldering temperature (T_sol):Maximum 260°C, up to 5 seconds (wave soldering or reflow soldering).

2.2 Electro-Optical Characteristics (Ta=25°C)

These parameters are measured under standard test conditions and represent the typical performance of the device when driven at a forward current (I_F) of 20 mA.

• Forward voltage (V_F):2.8 V (min), 3.2 V (typ), 3.6 V (max). The typical voltage drop across the LED is 3.2V.
• Luminous intensity (I_V):14,250 mcd (minimum), 28,500 mcd (maximum). The actual intensity has been binned (see Section 3).
• Viewing angle (2θ_1/2):15 degrees (typical). This narrow viewing angle concentrates the light output, contributing to high axial luminous intensity.
• Chromaticity coordinates:According to the CIE 1931 chromaticity space, x=0.29, y=0.30 (typical). This defines the specific white point of the emitted light.
• Reverse current (I_R):At V_RAt =5V, maximum 50 µA.

3. Explanation of the Grading System

To manage production variations and allow for precise selection, LEDs are sorted into different bins based on key parameters.

3.1 Luminous Intensity Grading

LEDs are sorted based on their luminous intensity measured at 20 mA. This allows designers to select the appropriate brightness grade for their application.

• W Grade:14,250 to 18,000 mcd
• X grade:18,000 to 22,500 mcd
• Y Grade:22,500 to 28,500 mcd

The overall tolerance of luminous intensity is ±10%.

3.2 Forward Voltage Binning

LEDs are also binned according to their forward voltage drop, which is crucial for power supply design and ensuring current uniformity in parallel configurations.

• Grade 0: V_F= 2.8V to 3.0V
• 1 gear: V_F= 3.0V to 3.2V
• 2nd gear: V_F= 3.2V to 3.4V
• 3rd gear: V_F= 3.4V to 3.6V

The measurement uncertainty of the forward voltage is ±0.1V.

4. Performance Curve Analysis

The datasheet provides several characteristic curves to illustrate the device's behavior under different conditions.

4.1 Relative Light Intensity vs. Forward Current

This curve shows that the light output (relative luminous intensity) increases with the forward current, but the relationship is not entirely linear, especially at higher currents. Driving the LED beyond the recommended continuous current (30mA) may lead to reduced efficiency and accelerated aging.

4.2 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve exhibits the typical exponential relationship of a diode. For this white LED, the "knee" voltage, where the current begins to increase significantly, is approximately between 2.8V and 3.0V. A stable constant current drive, rather than a constant voltage drive, is crucial for maintaining consistent light output.

4.3 Relative Luminous Intensity vs. Ambient Temperature

The light output of an LED is temperature-dependent. This curve typically shows that as the ambient temperature (T_a) increases, the luminous intensity decreases. Effective thermal management is required in applications to maintain brightness, especially when operating near the maximum temperature limit.

4.4 Chromaticity Coordinates vs. Forward Current

This graph reveals how the white light color (its chromaticity coordinates) shifts slightly with changes in drive current. For applications with strict color requirements, a constant current driver must be used to maintain a stable white point.

4.5 Spectral Distribution

The relative intensity vs. wavelength plot shows the emission spectrum. A white LED using a blue chip + phosphor system will show a strong blue peak (from the InGaN chip) and a broader yellow/red emission band (from the phosphor). The combined spectrum determines the Color Rendering Index (CRI) and Correlated Color Temperature (CCT), although specific CCT values are not listed in this datasheet.

5. Mechanical and Packaging Information

5.1 Package Size

The LED uses a standard T-1 (3mm) radial lead package. Key dimensions include:

• Overall diameter: approximately 5.0 mm (max).
• Pin pitch: 2.54 mm (standard 0.1-inch pitch, measured at the point where the pin extends from the package).
• Total height: Variable, includes epoxy lens and pins. The protruding resin below the flange is a maximum of 1.5mm.
• Lead diameter: Complies with standard component insertion requirements.

Unless otherwise specified, all dimensional tolerances are ±0.25mm. Designers must refer to the detailed mechanical drawings to determine the precise PCB hole locations and keep-out areas.

5.2 Polarity Identification

For radial lead LEDs, polarity is typically indicated by two features: the longer lead is the anode (positive), and there is usually a flat or notch on the plastic lens edge near the cathode (negative) lead. Correct polarity must be observed during assembly to prevent damage from reverse bias.

6. Welding and Assembly Guide

Proper handling and soldering are crucial to prevent mechanical or thermal damage to the LED.

6.1 Lead Forming

• Bending must be performed at a distance of at least 3mm from the base of the epoxy lens.
• Pin forming should always be completedSoldering processBefore.
• Avoid applying stress to the LED package during the bending process.
• Cut the leads at room temperature; using hot cutters may cause failure.
• PCB holes must be perfectly aligned with the LED leads to avoid mounting stress.

6.2 Storage Conditions

• Recommended storage conditions: ≤ 30°C, relative humidity (RH) ≤ 70%.
• Shelf life in the original transport bag: 3 months.
• For longer storage (up to 1 year), place in a sealed container filled with nitrogen and containing a desiccant.
• Avoid sudden temperature changes in humid environments to prevent condensation.

6.3 Welding Process

The minimum distance from the solder joint to the epoxy resin lamp body must be 3mm.

Manual Welding:

• Soldering iron tip temperature: maximum 300°C (for irons up to 30W).
• Soldering time per pin: maximum 3 seconds.

Wave soldering or dip soldering:

• Preheat temperature: maximum 100°C (maximum 60 seconds).
• Solder pot temperature: up to 260°C.
• Contact time in the pot: maximum 5 seconds.

Key Considerations:

• Avoid applying stress to the pins while the LED is hot from soldering.
• Do not subject the LED to more than one soldering cycle (dip soldering/hand soldering).
• Protect the epoxy resin lens from flux splashes and cleaning solvent damage.

7. Packaging and Ordering Information

7.1 Packaging Specifications

LED packaging is designed to prevent electrostatic discharge (ESD) and moisture damage during transportation and storage.

• Primary packaging:Anti-static bag.
• Quantity per bag:200 zuwa 500.
• Tufafi na biyu:5 jakunkuna a cikin akwatin ciki.
• Tufafi na uku:10 inner boxes are packed into one master (outer) carton.

7.2 Label Description

The labels on the bags and cartons contain the following information for traceability and identification:

• P/N:Part number (specific product code).
• CAT:Code ya daraja, inayoonyesha mchanganyiko wa nguvu ya mwanga na voltage ya mbele (kwa mfano, nambari inayowakilisha daraja Y ya nguvu na daraja 1 ya voltage).
• HUE:Daraja ya rangi au daraja ya kiwango cha rangi.
• LOT No:Production batch number, used for quality tracking.
• QTY:Quantity in package.

8. Application Description and Design Considerations

8.1 Typical Application Scenarios

• Information Panel and Backlight:Its high intensity and narrow viewing angle make it ideal for backlit segmented or dot-matrix displays, where bright, easily readable characters are required.
• Optical Indicator:Perfect for status lights, power indicators, or warning lights in equipment, requiring high visibility even under ambient light.
• Sign lights:Suitable for position indicators, exit signs, or low-illumination architectural decorative lighting.

8.2 Circuit Design Considerations

• Current Limiting:Always use a series current-limiting resistor or a constant current driver. Use the formula R = (V_{Power Supply}- V_F) / I_FCalculate the resistance value. Use the maximum V from the grading or datasheet_Fvalue to ensure at V_FWhen the current is low, it does not exceed the limit.
• Parallel connection:Avoid directly connecting LEDs in parallel without independent current-limiting components._FDifferences in Vf can cause uneven current distribution, where one LED draws most of the current and fails prematurely.
• Thermal Management:Despite low power consumption (max. 100mW), ensure adequate ventilation and avoid placing the LED on the PCB near other heat sources. High junction temperature reduces light output and lifespan.
• Reverse Voltage Protection:The maximum reverse voltage is only 5V. In AC or bipolar signal applications, or in situations where reverse connection may occur, a protection diode should be connected in parallel with the LED (cathode to anode, anode to cathode) to clamp the reverse voltage.

9. Technical Comparison and Differentiation

Compared to generic 3mm white LEDs, this device offers significant advantages:

• Higher intensity setting:Maximum intensity reaches 28,500 mcd, significantly brighter than standard 3mm LEDs which typically range from 2,000 to 10,000 mcd.
• Narrow viewing angle (15°):Concentrating luminous flux into a narrower beam results in higher axial (on-axis) luminous intensity compared to LEDs with wider viewing angles (e.g., 30° or 60°). This is a key differentiating factor for directional lighting applications.
• Integrated Zener diode (optional/protected version):The Zener reverse voltage (V_z) and current (I_z) indicates that some models may include an integrated reverse voltage protection Zener diode, which is not common in basic LED packages.
• Full Compliance:Clear compliance with halogen-free, REACH, and RoHS standards is a key factor for designers targeting regulated markets such as Europe and for companies with strict environmental policies.

10. Frequently Asked Questions (FAQ)

Q1: What drive current should I use?
A1: The standard test condition and recommended operating point is 20 mA. You can drive it up to the absolute maximum rating of 30 mA continuous current, but this will increase power consumption, generate more heat, and may shorten the operating lifetime. For the best balance between brightness, efficiency, and lifetime, 20 mA is recommended.

Q2: How to interpret the luminous intensity binning?
A2: Lambobin rarrabuwa akan alamar kunshin (W, X, Y) suna gaya muku mafi ƙarancin da mafi girman ƙarfin da aka tabbatar da shi na wannan rukunin LED. Misali, LED na rukunin Y zai kasance mafi haske a cikin wannan jeri. Lokacin yin oda, ku ƙayyade rukunin da ake buƙata don tabbatar da daidaiton haske a cikin samarwa.

Q3: Zan iya amfani da wannan LED don aikace-aikacen waje?
A3: Kewayon zafin aiki (-40°C zuwa +85°C) yana goyan bayan yawancin yanayin waje. Duk da haka, kayan ruwan tabarau na epoxy na iya zama mai saukin lalacewa ta UV da launin rawaya a ƙarƙashin hasken rana kai tsaye na dogon lokaci, wanda zai rage fitar da haske kuma ya canza launi. Don amfani mai tsanani na waje, LED tare da ruwan tabarau na silicone mai jure UV ya fi dacewa.

Q4: Why is the viewing angle so narrow?
A4: The 15° narrow viewing angle is a design feature intended to achieve very high axial luminous intensity (in millicandelas). The light is focused into a narrower beam. If you need to illuminate a wider area, you should choose an LED with a wider viewing angle (e.g., 60°), but its axial light intensity will be lower.

11. How It Works

This LED operates based on the principle of electroluminescence in semiconductors. When a forward voltage exceeding the diode's bandgap is applied, electrons and holes recombine within the InGaN active region, releasing energy in the form of photons. The specific composition of the InGaN alloy results in the emission of blue light with a wavelength of approximately 450-470 nm.

This blue light is not emitted directly. Instead, it strikes a layer of phosphor material (typically cerium-doped yttrium aluminum garnet, i.e., YAG:Ce) deposited inside the reflector cup. The phosphor absorbs the high-energy blue photons and re-emits lower-energy photons across a broad spectrum in the yellow and red regions. The human eye perceives the mixture of the remaining blue light and the converted yellow/red light as white light. The exact white "tone" (cool white, neutral white, warm white) is determined by the ratio of blue to yellow/red light, which is controlled by the phosphor's composition and thickness.

12. Teknoloji Trendleri

Bahsedilen teknoloji, LED'den beyaz ışık üretmek için olgun ve yaygın olarak benimsenmiş bir yöntemi temsil etmektedir. "Mavi çip + fosfor" yöntemi uygun maliyetlidir ve renk sıcaklığı üzerinde iyi bir kontrol sağlar. Mevcut endüstri trendleri şunları içerir:

• Verimlilik artışı (lm/W):InGaN chip design, phosphor efficiency, and packaging architecture continue to improve, driving up luminous efficacy and reducing energy consumption for the same light output.
• Color quality improvement:Development of multi-phosphor mixtures (adding red phosphors) to increase the Color Rendering Index (CRI), providing more natural and accurate color reproduction under LED light.
• Miniaturization and high-density packaging:Although this is a through-hole component, the broader market trend is toward smaller surface-mount device (SMD) packages (e.g., 2835, 2016, 1515) to enable automated assembly and higher-density lighting arrays.
• Specialized Spectra:LEDs are being engineered with specific spectral outputs for applications beyond general lighting, such as horticultural lighting (optimized for plant growth) or human-centric lighting (tunable white light to mimic natural daylight cycles).