ALFS1H-C010001H-AM LED Datasheet - SMD Ceramic Package - 450lm @ 1000mA - 3.3V - 120° Viewing Angle - English Technical Document

1. Product Overview

This document details the specifications for a high-performance, surface-mount LED designed for demanding automotive lighting applications. The device is housed in a robust ceramic package, offering superior thermal management and reliability. Its primary design focus is on exterior automotive lighting systems where consistent performance, long life, and resilience to harsh environmental conditions are paramount.

1.1 Core Advantages

The LED offers several key advantages for automotive design engineers:

• High Luminous Output: Delivers a typical luminous flux of 450 lumens at a drive current of 1000mA, enabling bright and efficient light sources.
• Wide Viewing Angle: Features a 120-degree viewing angle, providing excellent spatial light distribution suitable for various lighting functions.
• Automotive Grade Reliability: Qualified according to the AEC-Q102 standard, ensuring it meets the stringent quality and reliability requirements for automotive electronic components.
• Environmental Robustness: Demonstrates high resistance to electrostatic discharge (ESD up to 8kV HBM) and sulfur corrosion (Class A1), critical for long-term operation in automotive environments.
• Compliance: The product is compliant with RoHS, REACH, and Halogen-Free directives, supporting global environmental regulations.

1.2 Target Market & Applications

This LED is specifically targeted at the automotive exterior lighting market. Its performance characteristics make it ideal for several key applications:

• Headlamps: Can be used in high-beam, low-beam, or adaptive driving beam systems.
• Daytime Running Lights (DRL): Provides high visibility and distinctive styling.
• Fog Lamps: Yana ba da ingantaccen aiki a cikin yanayi mara kyau.

2. In-Depth Technical Parameter Analysis

Wannan sashe yana ba da cikakken bayani, fassarar haƙiƙa ta mahimman sigogi na lantarki, na gani, da na zafi da aka ƙayyade a cikin takardar bayanai.

2.1 Photometric & Electrical Characteristics

The core performance is defined under a test condition of IF=1000mA, with the thermal pad held at 25°C.

• Luminous Flux (Φv): The typical value is 450 lm, with a minimum of 400 lm and a maximum of 500 lm. An ±8% measurement tolerance applies. This parameter is highly dependent on junction temperature.
• Forward Voltage (VF): Typically 3.30V, ranging from 2.90V to 3.80V at 1000mA. The ±0.05V measurement tolerance is important for precise power supply design and binning consistency.
• Forward Current (IF): The device is rated for a continuous forward current up to 1500mA absolute maximum, with a typical operating point of 1000mA. Operation below 50mA is not recommended.
• Viewing Angle (φ): The nominal 120° angle has a tolerance of ±5°. This defines the angular spread where luminous intensity is at least half of its peak value.
• Correlated Color Temperature (CCT): The color temperature range is specified from 5391K to 6893K, classifying it as a cool white LED.

2.2 Thermal Characteristics

Effective thermal management is crucial for maintaining performance and longevity.

• Thermal Resistance (Rth JS): An haƙiƙan ƙimar gudun zafi (junction zuwa wurin solder) na 4.4 K/W mafi girma, da kuma daidaitaccen na'urar lantarki na 3.4 K/W mafi girma an bayar da su. Ƙimar lantarki mafi ƙasa ana amfani da ita yawanci don kimanta yanayin zafi na junction a cikin simintin da'ira. Wannan ƙaramin juriya yana samuwa ta hanyar fakitin yumbu.
• Yanayin Zafi na Junction (TJ): Matsakaicin yanayin zafi na junction da aka yarda shine 150°C.
• Operating & Storage Temperature: The device can operate and be stored within a wide temperature range of -40°C to +125°C.

2.3 Absolute Maximum Ratings

Stresses beyond these limits may cause permanent damage.

• Power Dissipation (Pd): 5700 mW maximum.
• Reverse Voltage (VR): The device is not designed for reverse bias operation.
• ESD Sensitivity (HBM): Withstands up to 8 kV, which is robust for automotive applications.
• Reflow Soldering Temperature: Can withstand a peak temperature of 260°C during assembly.

3. Binning System Explanation

LED inaainishwa katika makundi kulingana na vigezo muhimu vya utendaji ili kuhakikisha uthabiti ndani ya kundi la uzalishaji.

3.1 Luminous Flux Binning

Mwanga wa luminous umegawanywa chini ya "Group C" na makundi manne (6, 7, 8, 9). Kwa mfano, Bin 7 inashughulikia safu ya mwanga kutoka 425 lm hadi 450 lm. Hii inawawezesha wabunifu kuchagua LED kulingana na kiwango cha mwangaza kinachohitajika.

3.2 Forward Voltage Binning

Forward voltage is binned into three codes: 1A (2.90V-3.20V), 1B (3.20V-3.50V), and 1C (3.50V-3.80V). Matching VF bins in an array helps achieve uniform current distribution when LEDs are connected in parallel.

3.3 Color Coordinate Binning

Ana haske farin LED ɗin ana rarrabe su akan zanen launi na CIE 1931. An ayyana rukunoni da yawa (misali, 63M, 61M, 58M, 56M, 65L, 65H, 61L, 61H), kowanne yana wakiltar ƙaramin yanki mai siffar huɗu a sararin launi na x,y. Matsakaicin iyaka na ±0.005 yana tabbatar da ƙarancin bambancin launi a cikin kowane rukuni. Zanen tsarin rukunin yana nuna takamaiman iyakokin daidaitawa na kowane rukuni.

4. Performance Curve Analysis

The graphs provide critical insight into the LED's behavior under varying operating conditions.

4.1 Spectral Distribution & Radiation Pattern

The Relative Spectral Distribution graph shows a peak in the blue wavelength region, typical for a phosphor-converted white LED. The Typical Diagram Characteristics of Radiation illustrates the spatial intensity distribution, confirming the 120° viewing angle where intensity falls to 50% of the peak.

4.2 Current vs. Voltage (I-V) and Efficacy

The Forward Current vs. Forward Voltage curve is non-linear, showing the typical exponential relationship for a diode. The Relative Luminous Flux vs. Forward Current curve shows that light output increases with current but may exhibit saturation or efficiency droop at very high currents (beyond 1000mA).

4.3 Temperature Dependence

The graphs clearly show the significant impact of temperature:

• Relative Forward Voltage vs. Junction Temperature: Forward voltage decreases linearly with increasing temperature (negative temperature coefficient), which can be used for junction temperature monitoring.
• Relative Luminous Flux vs. Junction Temperature: Light output decreases as temperature rises. Maintaining a low junction temperature is essential for stable light output.
• Chromaticity Shift vs. Junction Temperature: The color coordinates (CIE x, y) shift with temperature, which is important for applications requiring stable color points.
• Chromaticity Shift vs. Forward Current: Color also shifts slightly with drive current, emphasizing the need for constant current drivers.

4.4 Forward Current Derating Curve

This is a crucial graph for thermal design. It plots the maximum allowable forward current against the solder pad temperature (Ts). As Ts increases, the maximum permissible current must be reduced to prevent exceeding the 150°C junction temperature limit. For example, at Ts=125°C, the maximum current is 1200mA; at Ts=110°C, it is 1500mA.

5. Mechanical & Package Information

The SMD ceramic package provides mechanical stability and excellent thermal conduction.

5.1 Mechanical Dimensions

The datasheet includes a detailed mechanical drawing (Section 7) specifying the package's length, width, height, lead spacing, and tolerances. This information is vital for PCB footprint design and assembly clearance checks.

5.2 Recommended Soldering Pad Layout

Section 8 provides the recommended PCB land pattern (pad geometry and dimensions) to ensure reliable solder joint formation during reflow soldering and to optimize heat transfer from the LED's thermal pad to the PCB.

5.3 Polarity Identification

The mechanical drawing indicates the anode and cathode terminals. Correct polarity must be observed during assembly to prevent damage.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

Section 9 specifies the recommended reflow soldering temperature profile. The profile includes preheat, soak, reflow, and cooling stages, with a peak temperature not exceeding 260°C. Adhering to this profile prevents thermal shock and ensures reliable solder connections.

6.2 Precautions for Use

General handling and application notes are provided (Section 11), covering topics such as avoiding mechanical stress on the lens, preventing contamination, and ensuring proper ESD precautions during handling.

6.3 Storage Conditions

The device should be stored within the specified temperature range (-40°C to +125°C) and in a moisture-controlled environment. The Moisture Sensitivity Level (MSL) is rated at Level 2.

7. Packaging & Ordering Information

7.1 Packaging Information

Details on how the LEDs are supplied are found in Section 10. This typically includes the reel type, tape width, pocket dimensions, and orientation of components on the reel for automated pick-and-place machines.

7.2 Part Number & Ordering Information

Sections 5 and 6 detail the part number structure and ordering codes. The full part number "ALFS1H-C010001H-AM" encodes specific information such as the product series, flux bin, voltage bin, and color bin. Understanding this nomenclature is essential for procuring the exact device with the desired performance characteristics.

8. Application Design Suggestions

8.1 Typical Application Circuits

This LED requires a constant current driver for stable operation. The driver should be designed to provide the required current (e.g., 1000mA) while accommodating the forward voltage range of the selected bin. Thermal management is critical; the PCB should have a sufficient copper area or thermal via array under the LED's thermal pad to dissipate heat effectively, keeping the junction temperature as low as possible.

8.2 Design Considerations

• Thermal Design: Use the derating curve and thermal resistance to calculate the necessary heatsinking. The low Rth JS is an advantage but does not eliminate the need for a good thermal path to the ambient.
• Optical Design: The 120° viewing angle may require secondary optics (lenses, reflectors) to shape the beam for specific applications like headlamps.
• Electrical Design: Consider the forward voltage binning when designing for parallel strings to ensure current balance. Implement reverse polarity protection on the board.
• Reliability: The AEC-Q102 and sulfur robustness qualifications are key for automotive use, but the application's specific environmental tests (vibration, thermal cycling) must still be validated.

9. Technical Comparison & Differentiation

While a direct competitor comparison is not provided in the datasheet, key differentiators of this product can be inferred:

• Ceramic vs. Plastic Package: The ceramic package offers superior thermal conductivity and long-term reliability compared to standard plastic SMD packages, especially under high power and high temperature conditions.
• Automotive Focus: Full AEC-Q102 qualification and sulfur resistance (Class A1) are not always present in general-purpose high-power LEDs, making this device specifically suited for the harsh automotive environment.
• Performance Balance: The combination of high flux (450lm), relatively wide viewing angle (120°), and robust construction presents a balanced solution for exterior lighting.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 1500mA continuously?
A: Only if the solder pad temperature (Ts) is maintained at or below 110°C, as per the derating curve. At higher ambient temperatures, the current must be reduced (e.g., to 1200mA at Ts=125°C) to avoid exceeding the maximum junction temperature.

Q: Rth JS real ne Rth JS el suna bambanta da juna?
A: Rth JS real shine ma'aunin juriya na zafi da aka auna daga junction zuwa wurin solder. Rth JS el wani daidaitaccen darajar da aka samo ta hanyar lantarki, sau da yawa ya fi ƙasa, wanda aka saba amfani da shi a cikin samfuran SPICE don kwaikwayon zafin jiki. Don ƙira mai amfani na zafi, ya kamata a yi amfani da ƙimar "real" (4.4 K/W max) don lissafin tsari mai tsauri.

Q: Yaya muhimmanci zaɓin bin ke ga aikace-aikacena?
A: E taua tele mo le tumau. Mo talosaga e tele LED (fa'ata'ita'iga, se fasi DRL), o le fa'ailoaina o le flux tutusa, voltage, ma le lanu lanu e mautinoa ai le malamalama tutusa, lanu, ma amioga eletise i iunite uma.

Q: E mana'omia se heatsink?
A> Yes, absolutely. Despite the low package thermal resistance, the total power dissipation (up to ~3.3W at 1000mA) necessitates an effective thermal management system, usually involving a thermally enhanced PCB and possibly an external heatsink, to maintain performance and longevity.

11. Practical Design Case Study

Scenario: Designing a Daytime Running Light (DRL) module.
A designer selects this LED for its brightness and automotive-grade reliability. They choose Bin 7 for flux (425-450lm) and Bin 1B for voltage (3.20-3.50V) to ensure good yield. The module uses 6 LEDs in series. The driver is specified for 1000mA constant current with an output voltage range covering 6 * VF_max (approx. 21V). The PCB is a 2oz copper board with a large exposed pad area connected to an internal ground plane for heat spreading. Thermal vias under the LED pad transfer heat to the back side of the PCB, which is attached to the metal housing of the vehicle. Using the derating curve and estimating the thermal resistance of the system, the designer confirms the junction temperature will remain below 110°C in the worst-case ambient temperature, allowing the LEDs to be driven at the full 1000mA.

12. Operating Principle

This is a phosphor-converted white LED. The core is a semiconductor chip (typically based on InGaN) that emits blue light when forward biased (electroluminescence). This blue light strikes a phosphor layer deposited on or around the chip. The phosphor absorbs a portion of the blue light and re-emits it as a broader spectrum of longer wavelengths (yellow, red). The mixture of the remaining blue light and the phosphor-converted yellow/red light is perceived by the human eye as white light. The specific blend of phosphors determines the correlated color temperature (CCT), which for this device is in the cool white range (5391K-6893K).

13. Technology Trends

The automotive LED lighting market continues to evolve with clear trends:

• Increased Efficiency (lm/W): Ongoing improvements in chip technology and phosphor efficiency lead to higher luminous efficacy, allowing for brighter lights or lower power consumption.
• Higher Power Density: E kikini ana i nā mea hana e hoʻouna i ka mālamalama hou aʻe mai nā pūʻolo liʻiliʻi, e hiki ai ke hoʻolālā ʻana i nā kukui ʻoi aku ka paʻakikī a me ke ʻano.
• Nā Hana Kiʻekiʻe: ʻO ka hoʻohui ʻana i nā uila hoʻomalu (e laʻa, no ke kālai ʻana i ke kukuna hoʻololi) pū me nā pūʻolo LED he wahi e ulu nei.
• Color Tuning & Quality: There is a focus on improving color rendering index (CRI) and enabling dynamic color temperature adjustment, especially for interior lighting.
• Standardization & Reliability: Adherence to standards like AEC-Q102 becomes even more critical as LEDs penetrate safety-critical applications like headlights. Testing for novel stress factors (like laser light from LIDAR systems) may emerge.