LTPL-P033RGB RGB High-Power LED Datasheet - Red/Green/Blue Tri-Color - 150mA - Technical Documentation

1. Product Overview

LTPL-P033RGB is a high-power, high-efficiency, ultra-compact solid-state light source. It combines the advantages of long lifespan and high reliability of light-emitting diodes with a brightness level sufficient to replace traditional lighting technologies. This device provides designers with great freedom to create innovative lighting solutions in a wide range of application fields.

1.1 Main Features

• High-power LED light source
• Instantaneous luminescence (less than 100 nanoseconds)
• Low-voltage DC drive
• Low Thermal Resistance Package
• RoHS Compliant, Lead-Free
• Compatible with lead-free reflow soldering process

1.2 Target Applications

This LED is designed for a variety of lighting applications, including but not limited to:

• Interior reading lights for automobiles, buses, and aircraft.
• Portable lighting, such as flashlights and bicycle lights.
• Architectural Lighting: Downlights, Guide Lights, Cove Lighting, Under-shelf Lighting, Task Lighting
• Decorative and Entertainment Lighting
• Outdoor Lighting: Bollard Lights, Security Lights, Garden Lights
• Signal Applications: Traffic Lights, Beacons, Railroad Crossing Lights
• Edge-Lit Signs for Exit Indicators and Point-of-Sale Displays
• General indoor and outdoor commercial and residential building lighting

2. Outline and Mechanical Dimensions

This device is housed in a compact surface-mount package. Unless otherwise specified, all critical dimensions are provided in the datasheet with a standard tolerance of +/- 0.2 mm. The mechanical drawing indicates the package footprint, pin locations, and overall height, which are critical for PCB layout and thermal management design.

3. Absolute Maximum Ratings and Characteristics

All ratings are specified at an ambient temperature (Ta) of 25°C. Exceeding these limits may cause permanent damage to the device.

3.1 Electrical Ratings

• Forward Current (I_F)): All colors (red, green, blue) are 150 mA (continuous).
• Forward Pulse Current (I_FP)): All colors are at 300 mA (pulse). Conditions: Duty cycle 1/10, pulse width ≤10μs.
• Power consumption (P_D)): Red: 360 mW; Green: 540 mW; Blue: 540 mW.

3.2 Thermal and Environmental Ratings

• Operating Temperature Range (T_opr)): -30°C to +85°C.
• Storage temperature range (T_stg)): -40°C to +100°C.
• Maximum Junction Temperature (T_j)): 125°C.

Important Note:Avoid prolonged operation under reverse voltage conditions. It is strongly recommended to follow the provided derating curve when operating near the maximum ratings to ensure normal and reliable LED operation.

4. Photoelectric Characteristics

Typical performance parameters are measured under the conditions of Ta=25°C, I_F=150mA.

4.1 Light Output

• Luminous Flux (Typical): Red: 21 lm; Green: 50 lm; Blue: 9 lm. Luminous flux is the total light output measured using an integrating sphere.
• Luminous Intensity (Typical, for reference): Red: 6.8 cd; Green: 12.5 cd; Blue: 3.0 cd.

4.2 Spectral and Electrical Characteristics

• Dominant Wavelength: Red: 610-630 nm; Green: 515-535 nm; Blue: 450-470 nm.
• Forward Voltage (V_F)): Red: 1.5-2.6 V; Green: 2.8-3.8 V; Blue: 2.8-3.8 V.
• Viewing Angle: 120 degrees (typical for all colors).

Test Standard:Luminous flux, dominant wavelength, and forward voltage measurements refer to the CAS-140B standard.

5. Analysis of Typical Performance Curves

The datasheet provides several key charts that are crucial for circuit and thermal design.

5.1 Spectral Distribution

Figure 1 shows the relationship between the relative spectral intensity and wavelength for each color. This curve is crucial for understanding color purity and its potential applications in color mixing systems.

5.2 Radiation Pattern

Figure 2 shows the spatial radiation (intensity) pattern, confirming its wide viewing angle of 120 degrees. For this type of package, the pattern is typically Lambertian.

5.3 Current vs. Voltage (I-V Curve)

Figure 3 plots the forward current versus forward voltage for each color. Compared to green/blue LEDs (typical ~3.2V-3.4V at 150mA), red LEDs show a lower forward voltage (typical ~2.0V at 150mA). This is a key parameter for driver design, as each color channel in an RGB system requires a different drive voltage or current-limiting resistor.

5.4 Current vs. Luminous Flux

Figure 4 shows the relationship between forward current and relative luminous flux. Within the normal operating range, the output is typically linear with current, but at extremely high currents, efficiency may decrease due to effects such as junction temperature rise.

5.5 Thermal Performance

Figure 5 is one of the most important charts, showing the relationship between relative luminous flux and board temperature. It serves as a derating curve. Output decreases as temperature increases. The note states that this data is based on over 80% pad coverage to ensure good thermal contact and recommends not driving the LED when the board temperature exceeds 85°C to maintain performance and lifetime.

5.6 Current vs. Dominant Wavelength

Figure 6 shows how the dominant wavelength shifts with forward current. Typically, the wavelength increases slightly with current due to junction heating and other semiconductor physics effects. This is very important for applications with strict color requirements.

6. Binning and Classification System

LEDs are binned according to their luminous flux output at 150mA to ensure consistency.

6.1 Red LED Binning (R1 to R5)

The binning range is from R1 (18-21 lm) to R5 (30-33 lm).

6.2 Green LED Binning (G1 to G7)

The binning range is from G1 (35-39 lm) to G7 (59-63 lm).

6.3 Blue LED Binning (B1 to B4)

The binning range is from B1 (6-9 lm) to B4 (15-18 lm).

A +/-10% tolerance is applied to each luminous flux bin. The bin code is marked on each package bag for traceability.

7. Soldering and Assembly Guide

7.1 Reflow Soldering Temperature Profile

The device is compatible with lead-free reflow soldering. A detailed temperature-time profile is provided:

• Peak temperature (T_P)): maximum 260°C.
• Time above 217°C (T_L)): 60-150 seconds.
• Time within ±5°C of peak temperature (t_P)): Maximum 5 seconds.
• Preheating: 150-200°C, kwa sekunde 60-180.
• Kasi ya kupanda joto: hadi 3°C/sekunde (kutoka T_SmaxTo T_P).
• Cooling rateMaximum 6°C/s.
• Total cycle timeFrom 25°C to peak temperature, maximum 8 minutes.

7.2 Manual Soldering

If manual soldering is necessary, the recommended conditions are a maximum soldering iron temperature of 350°C, a maximum of 2 seconds per solder joint, and only one attempt.

7.3 Key Assembly Precautions

• All temperature specifications refer to the top surface of the package body.
• The temperature profile may need to be adjusted according to specific solder paste characteristics.
• Rapid cooling (quenching) from the peak temperature is not recommended.
• Always use the lowest soldering temperature that achieves reliable solder joints.
• Device performance is not guaranteed if assembled using the dip soldering method.

8. Recommended PCB Pad Layout

Detailed pad design drawings are provided, with all dimensions in millimeters. This design ensures proper solder fillet formation and achieves electrical isolation between the anode/cathode pads and any thermal pads or board metallization. Adhering to this layout is crucial for mechanical stability, electrical performance, and optimal heat transfer from the LED chip to the PCB.

9. Tape and Reel Packaging Specification

LEDs are supplied in tape and reel format, suitable for automated assembly.

• Reel size: 7 inches.
• Quantity: 1000 pieces per full tray. Minimum packaging quantity for the remainder is 500 pieces.
• Bag Sealing: Empty component bags are sealed with top cover tape.
• Quality: A maximum of two consecutive missing LEDs is allowed.
• Standard: Packaging complies with EIA-481-1-L23 specification.

10. Reliability and Certification Testing

Extensive reliability testing has been conducted on the sample batch.

10.1 Test Conditions and Results

Twenty-two samples were tested under each condition, with zero failures reported:

• Rayuwar aiki mai zafi/ sanyi/ zafin daki (kowanne awa 1000).
• Rayuwar ajiya mai zafi/ sanyi (awa 500-1000).
• Damp heat (85°C/85% RH, 500 hours).
• Temperature cycling (-40°C to 100°C, 100 cycles).
• Thermal shock (-40°C to 100°C, 100 cycles).

10.2 Failure Criteria

If, after testing, during measurement at I_F=150mA condition, the device exceeds any of the following limits, it shall be considered a failure:

• Forward Voltage (V_f）> 其初始值的110%。
• 光通量<< 其初始值的70%。

11. Application Design Considerations

11.1 Drive Circuit Design

Since red (V_flower) and green/blue (V_f(Relatively high) The forward voltage of LEDs varies. A typical RGB driver will use independent current-limiting circuits or a constant-current driver with separate channels. The maximum continuous current for each color is 150mA. For pulse operation (e.g., PWM dimming), ensure the pulse parameters remain within the I_FP rating.

11.2 Thermal Management

Effective heat dissipation is crucial. The data in Figure 5 clearly shows that output decreases as temperature rises. To maintain brightness and lifespan:

• Use the recommended pad layout with high thermal conductivity.
• When designing the PCB, provide sufficient copper area (thermal pad) connected to the LED's thermal path.
• Consider using thermal vias to transfer heat to inner layers or the backside of the board.
• In the final application, if driven with high current or in a high-temperature environment, ensure sufficient airflow or other cooling mechanisms.
• Monitor the circuit board temperature to avoid exceeding 85°C.

11.3 Optical Design

The 120-degree viewing angle provides a wide and uniform beam, suitable for general lighting and signage. For a focused beam, secondary optical elements (lenses or reflectors) are required. Designers should consider the different luminous intensities of each color when creating white light or specific color mixes.

12. Comparison and Product Positioning

LTPL-P033RGB is positioned as a versatile high-power RGB LED, suitable for a wide range of applications requiring mixed-color or single-color output. Its main advantages include standardized packaging, wide viewing angle, clear binning structure to ensure consistency, and robust specifications suitable for reliable manufacturing (reflow compatibility, tape and reel). It is designed to be a workhorse component in solid-state lighting designs replacing older technologies.

13. Frequently Asked Questions (Based on Technical Data)

Q: Can I drive all three colors (RGB) using the same constant voltage source and resistor?
A: This is not the optimal solution. The forward voltage of the red LED (approximately 2.0V) is significantly lower than that of the green/blue LEDs (approximately 3.2V). Using a single voltage requires different resistor values for each channel to achieve the same 150mA current. It is recommended to use independent constant current drivers or PWM channels for control and color mixing.

Q: What is the main reason for the decrease in LED brightness over time?
A: The main reason is high junction temperature. Operating an LED above the recommended temperature range (see Figure 5) accelerates the aging process of the semiconductor material and phosphor (if present), leading to a permanent reduction in light output. Proper thermal management is the most critical factor for long-term reliability.

Q: How to interpret the luminous flux binning code?
A: The code printed on the packaging bag (e.g., R3, G5, B2) tells you the guaranteed minimum and maximum light output range of that specific LED at 150mA. This allows designers to select brightness-matched LEDs for multi-LED luminaires to achieve a uniform appearance, or to guarantee a minimum light output for their design.

Q: Is this LED suitable for outdoor use?
A: The operating temperature range (-30°C to +85°C) and successful passing of the damp heat test (85°C/85% RH) indicate its robustness against environmental factors. However, for long-term outdoor exposure, the LED itself must be properly encapsulated or placed within a luminaire to provide protection against moisture, UV radiation, and physical damage, as the LED package itself is not waterproof.

14. Practical Design Example: RGB Ambient Light

Scenario:Design a microcontroller-based RGB ambient light with adjustable color and brightness.
Implementation Plan:
1. Driver:Use a 3-channel constant-current LED driver IC or three independent MOSFETs controlled by the PWM output of the MCU. Set the current limit per channel to 150mA.
2. Power supply:Provide a sufficiently high and stable DC voltage to accommodate the maximum V_f(Blue/green approximately 3.8V maximum) plus the voltage drop of the current regulator.
3. Thermal Management:Mount the LED on a PCB with a large area of copper pour (connected to the thermal pad). Consider adding a small heatsink to the back of the PCB if a high duty cycle is used.
4. Control:MCU can independently adjust the PWM duty cycle of each color channel (red, green, blue) from 0% to 100%. This allows for the creation of millions of colors by mixing the output of the three primary colors at different intensities.
5. Optics:Use a diffusing lens or cover above the LED to blend the three color points into a single, uniform area of light.

15. Technical Background and Trends

A Light Emitting Diode (LED) is a semiconductor device that emits light when an electric current passes through it. The color of the light is determined by the energy band gap of the semiconductor material used. The LTPL-P033RGB uses separate chips for red (likely based on AlInGaP material) and green/blue (based on InGaN material), packaged within a single housing. The development trend for power LEDs continues towards higher efficiency (more lumens per watt), higher color rendering, higher reliability, and lower cost. This device represents a mature, cost-effective solution for applications requiring versatile color output without needing the ultimate efficiency of the latest monochromatic high-power LEDs.