ELCH07-5070J6J7294310-N8 LED Datasheet - 7.0x7.0x?mm Package - 2.95-4.35V Forward Voltage - 240lm Luminous Flux - 6000K White Light - Simplified Chinese Technical Documentation

1. Product Overview

ELCH07-5070J6J7294310-N8 is a high-power white LED device, specifically designed for applications requiring high luminous output and reliability. It belongs to the CHIN series and is characterized by its compact surface-mount package. This device is designated for mass production, indicating its maturity and stability in high-volume manufacturing.

Teknolojia yake ya msingi inategemea nyenzo za semiconductor za InGaN (indium gallium nitride), zilizoundwa kutoa mwanga mweupe. LED hii haijaundwa kwa ajili ya uendeshaji wa voltage ya nyuma, ambayo ni jambo muhimu la kuzingatia kwa wabunifu wa saketi.

Kiwango cha Unyeti wa Unyevu (MSL)

This section provides a detailed and objective analysis of the key technical parameters specified in the datasheet.

2.1 Absolute Maximum Ratings

Absolute Maximum Ratings define the limits beyond which permanent damage to the device may occur. Continuous operation at or near these limits is strongly discouraged.

• DC Forward Current (I_F): 350 mA. This is the maximum continuous forward current the LED can withstand.
• Peak Pulse Current (I_Pulse): 1500 mA. This high current is only permitted under specific pulse conditions: maximum pulse width 400ms, maximum duty cycle 10% (e.g., on 400ms, off 3600ms). This mode is typically used for camera flash applications.
• ESD withstand voltage (V_B): 8000 V (Human Body Model). This high level indicates robust electrostatic discharge protection capability, which is crucial for assembly processes and handling in final applications.
• Junction temperature (T_J)125 °C. Maximum temperature allowed by the semiconductor junction itself.
• Thermal Resistance (R_θ): 10 °C/W (junction to pin). This parameter is crucial for thermal management design. It indicates that for every watt of power dissipated, the junction temperature will rise by 10°C above the pin (pad) temperature. Effective heat dissipation is required to keep T_Jwithin the limit.
• Operating and Storage Temperature: -40°C to +85°C / -40°C to +110°C, respectively.
• Power Consumption (Pulse Mode): 6 W. This is the maximum power the package can handle in pulsed operation and is related to the peak pulse current rating.
• Welding temperature: Maximum 260°C, up to 2 reflow cycles allowed.
• Viewing angle (2θ_1/2): 125 degrees (±5°). This wide viewing angle is typical of Lambertian or near-Lambertian emission patterns.

2.2 Optoelectronic Characteristics

These parameters are tested under standard conditions (T_{solder pad}= 25°C, 50ms pulse), representing typical performance.

• Luminous flux (Φ_v): 200-300 lm, at I_FThe typical value is 240 lm at = 1000mA. The measurement tolerance is ±10%. This high output makes it suitable for lighting tasks.
• Forward Voltage (V_F): At I_F= 1000mA, it is 2.95V to 4.35V, with a measurement tolerance of ±0.1V. This wide range requires careful driver design and is managed through binning.
• Correlated Color Temperature (CCT): 5000K to 7000K. The typical value is 6000K, which falls within the "cool white" range.
• Luminous Efficacy: 65 lm/W at 1000mA. This is a key metric for measuring energy efficiency.

2.3 Reliability and Operation

• Moisture Sensitivity Level (MSL): Level 1. This is the most robust level, meaning the device has unlimited floor life at ≤30°C/85% RH conditions and does not require baking before reflow soldering under standard conditions.
• Reliability Testing: All specifications are guaranteed through 1000-hour reliability testing, with the standard being less than 30% luminous flux depreciation.
• Test Condition DescriptionAll reliability and correlation data are tested under "excellent thermal management" conditions, using a 1.0 x 1.0 cm² Metal Core Printed Circuit Board (MCPCB). Performance may vary if actual thermal management is inferior.

3. Explanation of the Grading System

To ensure consistency in mass production, LEDs are sorted (binned) according to key parameters. The part number ELCH07-5070J6J7294310-N8 encodes some of this binning information.

3.1 Forward Voltage Grading

The forward voltage is divided into five codes (2932, 3235, 3538, 3841, 4143). The code indicates the minimum and maximum voltage in units of one-tenth of a volt. For example, the bin "2932" covers a V_Frange of 2.95V to 3.25V. The "2932" in the part number indicates that this specific LED belongs to this voltage bin.

3.2 Luminous Flux Binning

Luminous flux is divided into two main codes at 1000mA: J6 (200-250 lm) and J7 (250-300 lm). The "J6" in the part number specifies the luminous flux bin.

3.3 Color (White) Binning

The white point chromaticity coordinates are defined on the CIE 1931 chromaticity diagram and are associated with a Correlated Color Temperature (CCT) range. Two main bins are defined:

• Bin 5057: CCT range from 5000K to 5700K. Defined by a quadrilateral on the CIE diagram.
• Bin 5770: CCT range 5700K to 7000K. Defined by another quadrilateral.

The "72943" in the part number most likely corresponds to a specific chromaticity coordinate within these bins. The measurement tolerance for chromaticity coordinates is ±0.01.

4. Performance Curve Analysis

The datasheet provides several charts to illustrate performance trends. Understanding these is crucial for design optimization.

4.1 Forward Voltage vs. Forward Current (V_F-I_FCurve)

The curve shows a nonlinear relationship. V_Fincreases with I_Fincreasing, approximately 2.4V at very low current, reaching about 4.0V at 1500mA. This curve is crucial for selecting the appropriate constant current driver and calculating power dissipation (P_d= V_F* I_F) crucial.

4.2 Luminous Flux vs. Forward Current

Relative luminous flux increases sublinearly with current. While output increases with current, efficiency (lm/W) typically decreases at higher currents due to increased heat and the "efficiency droop" effect in semiconductors. This curve shows relative output, with 1000mA as the reference point (1.0 on the Y-axis).

4.3 Correlated Color Temperature (CCT) vs. Forward Current

CCT varies slightly with drive current, increasing from approximately 5600K at low current to about 6000K at 1000mA. This shift is important for applications where color consistency is critical.

4.4 Forward Current Derating Curve

This can be said to be the most critical chart for ensuring reliable operation. It shows the maximum allowable continuous forward current as a function of the pad temperature (T_{solder pad}). This curve is based on maintaining the junction temperature (T_J) at or below its maximum value of 125°C. For example:

• At T_{solder pad}At 25°C, the maximum current is approximately 600mA.
• At T_{solder pad}At 75°C, the maximum current drops to about 300mA.
• At T_{solder pad}At 100°C, the maximum current is almost 0mA.

This chart necessitates effective thermal design. The 1000mA test condition is a pulse or short-term rating and is not a continuous operating point without special cooling.

4.5 Relative Spectral Distribution and Radiation Pattern

The spectrum shows a broad emission peak of the InGaN chip in the blue region (around 450nm), combined with the broader emission of the yellow phosphor, resulting in white light. The radiation pattern confirms a Lambertian distribution (cosine law), with identical intensity patterns on the X and Y axes, providing a wide and uniform viewing angle of 125 degrees.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED uses a surface-mount package with a footprint of approximately 7.0mm x 7.0mm (as indicated by "5070" in the part number, which may be 5.0mm x 7.0mm or 7.0mm x 7.0mm). The detailed dimension drawing shows key features, including pads, lens shape, and polarity indicator. Unless otherwise specified, tolerances are typically ±0.1mm. The package incorporates an integrated lens to shape a 125-degree viewing angle.

5.2 Polarity Marking

The package includes markings or physical features (such as a notch) to identify the anode and cathode. Correct polarity during assembly is crucial to prevent damage from reverse connection.

6. Soldering and Assembly Guide

• Reflow Soldering: Maximum soldering temperature is 260°C. Components can withstand up to 2 reflow cycles. The standard lead-free reflow profile (IPC/JEDEC J-STD-020) applies.
• Thermal Management: This is the primary concern. Low thermal resistance (10°C/W) is only effective when the pad is connected to a sufficiently large thermal pad on the PCB, which in turn must be connected to a heat sink. For any application driving the LED close to its maximum rating, the use of an MCPCB or Insulated Metal Substrate (IMS) is strongly recommended.
• ESD Precautions: Despite an 8kV HBM rating, standard ESD handling procedures (grounded workstation, wrist strap) should still be followed.
• Storage: As an MSL Level 1 device, no special dry storage is required under normal factory conditions.

7. Packaging and Ordering Information

7.1 Tape and Reel Packaging

LEDs are supplied in moisture barrier packaging on embossed carrier tape. Each reel contains 2000 pieces. The carrier tape dimensions ensure secure holding and correct orientation (polarity) during automated pick-and-place assembly. Reel dimensions are provided for integration into automated assembly equipment.

7.2 Label Description

The packaging label contains several key fields:

• P/N: Full part number (e.g., ELCH07-5070J6J7294310-N8).
• LOT NO: The traceability code for the manufacturing batch.
• QTYQuantity in package.
• CAT (Luminous Flux Binning)For example, J6.
• HUE (Color Binning): For example, 72943.
• REF (Forward Voltage Binning): For example, 2932.
• MSL-X: Moisture Sensitivity Level.

8. Application Suggestions

8.1 Typical Application Scenarios

The datasheet lists several applications, which can be prioritized based on the characteristics of the LED:

1. Mobile Phone Camera Flash/Strobe LightHigh peak pulse current (1500mA) and high luminous flux make it the primary application. Short high-power pulses are ideal for providing illumination in photography scenes.
2. DV/Portable Lighting FlashlightHigh continuous output (with proper heat dissipation) is suitable for handheld video lights or flashlights.
3. Professional Indoor/Outdoor Lighting: Includes directional indicators (exit signs, step lights), decorative lighting, and automotive interior/exterior lighting. Wide viewing angle is beneficial for area lighting.
4. TFT Backlight: Suitable for large displays requiring high brightness, but requires secondary optics to guide the light.

8.2 Design Considerations

• Drive Selection: A constant current drive must be used. The drive must be able to provide the required current (considering derating) and withstand the maximum V of the selected bin._FFor flash applications, a driver capable of providing high-current pulses is required.
• Thermal Design: This point cannot be overemphasized. Calculate the expected power dissipation (V_F* I_F). Use thermal resistance (R_θ) and derating curves to determine the necessary heat dissipation so that the pad temperature is sufficiently low to allow the required drive current. For critical designs, finite element analysis (FEA) thermal simulation is recommended.
• Optical Design: The Lambertian pattern provides wide coverage. For a focused beam (e.g., a flashlight), a secondary reflector or collimating lens will be required.
• Binning Consistency: For applications where multiple LEDs are used together (e.g., arrays for video lights), strict forward voltage, luminous flux, and especially color binning should be specified to ensure uniform appearance and current balance.

9. Technical Comparison and Differentiation

Although the datasheet does not include direct competitor comparisons, the key differentiating features of this LED can be inferred:

• High Pulsed Current Capability: The 1500mA pulse rating is a standout feature specifically tailored for camera flash applications, which many general-purpose high-power LEDs do not emphasize.
• Robust ESD Protection: 8kV HBM matakin kariya ne mai girma, yana haɓaka amincin mai amfani na ƙarshe a cikin ayyukan sarrafawa da haɗawa.
• MSL Level 1: Ya sauƙaƙa sarrafa kayayyaki da tsarin haɗawa idan aka kwatanta da LED masu mafi girman matakan MSL (3, 2a, da sauransu) waɗanda ke buƙatar fakitin bushewa da gasa.
• Clear reliability data: 提及1000小时测试，并以<30%光通量衰减为标准，提供了量化的可靠性声明。
• Comprehensive binningThe detailed binning structure for voltage, luminous flux, and color allows designers to select the precise performance grade required for their application, thereby achieving higher quality and consistency in the final product.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Can I operate this LED continuously at 1000mA?

Answer: Unless there is special thermal management, no. The 1000mA rating is given under specific test conditions (50ms pulse, T_{solder pad}=25°C). The derating curve shows that for continuous operation (DC), the maximum current is much lower—about 600mA at a 25°C pad temperature, and lower at higher temperatures. Continuous operation at 1000mA will almost certainly exceed the maximum junction temperature, leading to rapid degradation and failure.

10.2 What is the difference between the J6 and J7 luminous flux bins?

Answer: The J6 bin covers a luminous flux of 200 to 250 lumens at 1000mA, while the J7 bin covers 250 to 300 lumens. The "J6" in the part number specifies the guaranteed minimum luminous flux for this particular device in the lower range. For applications requiring maximum brightness, the J7 bin must be specified.

10.3 How to interpret the voltage binning code "2932"?

Answer: The code "2932" indicates that the forward voltage of the LEDs in this bin is between 2.95 volts ("29" represents 2.9, with the last digit specifying the hundredths place) and 3.25 volts ("32"). This allows designers to more accurately predict power consumption and the required driver voltage headroom.

10.4 Is a heat sink absolutely necessary?

Answer: Yes, it is necessary for any operation beyond very low current. A thermal resistance of 10°C/W means that even at a moderate 350mA and V_Fof 3.5V (dissipating approximately 1.23W), the junction temperature will be 12.3°C higher than the pad temperature. Without a heatsink, the pad temperature will quickly rise to ambient temperature plus this temperature difference, pushing the junction temperature toward its limit. Proper thermal design is non-negotiable for performance and longevity.

11. Design Case Study

Scenario: Design a smartphone camera flash module.

1. Requirements: 需要非常明亮、持续时间短的闪光。假设脉冲宽度为300ms，占空比<10%。
2. LED Selection: This LED is suitable due to its 1500mA peak pulse rating and high light output.
3. Drive Conditions: Decided to drive at 1200mA during the pulse. Check V_F-I_Fcurve: V_F~ 4.1V. Pulse power = 4.92W.
4. Thermal Check: The pulse is very short (300ms), so the average power is low due to the low duty cycle. The main thermal concern is the heat accumulated during continuous photo capture. The size of the phone limits heat dissipation. The design must ensure that the pad temperature does not exceed, for example, 80°C during the photo-taking process, referencing the derating curve.
5. Driver: Select a compact, Li-ion battery-compatible flash LED driver IC capable of delivering 1200mA pulses and featuring a safety timer.
6. Optics: Use a simple diffuser or reflector to spread the light and avoid hot spots in photos.
7. Binning: Specify strict color binning (e.g., 5770) and single voltage binning (e.g., 3538) to ensure consistency in flash color and driver performance across all manufactured mobile phones.

12. Technical Principle Introduction

This LED employs a common and efficient method to generate white light:Phosphor-converted white light.

1. A semiconductor chip made of InGaN emits high-energy blue light when an electric current passes through it (electroluminescence).
2. Part of the blue light is absorbed by a yellow (or yellow and red) phosphor layer deposited directly on or near the chip.
3. Phosphor yana sake fitar da makamashin da ya karɓa ta hanyar da ake kira photoluminescence zuwa haske mai ƙarancin kuzari na rawaya (da ja).
4. Sauran hasken shuɗi da ba a karɓa ba yana haɗuwa da hasken rawaya/ja da aka fitar, idon mutum yana ganin wannan haɗakar haske a matsayin farin haske. Madaidaicin rabo yana ƙayyade CCT – ƙarin hasken shuɗi yana haifar da "farin haske mai sanyi" (mafi girma CCT, kamar 6000K), yayin da ƙarin hasken rawaya/ja ke haifar da "farin haske mai dumi" (ƙananan CCT).

Wide viewing angle is achieved by encapsulating the chip and phosphor in a dome-shaped silicone lens, which also provides environmental protection.

13. Industry Trends and Background

This datasheet reflects several ongoing trends in the high-power LED industry:

• Increased integration for specific applicationsThis LED is not a general-purpose component but is clearly optimized for camera flash and portable lighting, with specifications such as high pulse current prioritized over extreme continuous drive ratings. This indicates a shift towards application-specific optimization.
• Emphasis on reliability and quantification.: 包含明确的可靠性测试标准（1000小时，<30%衰减）和详细的热降额数据，响应了市场对可预测寿命的需求，尤其是在关注保修成本的消费电子产品中。
• Advanced Binning for Quality Assurance: Multi-parameter binning (luminous flux, voltage, color) results in higher quality and consistency of the final product. This is crucial for applications such as display backlighting or architectural lighting, where color uniformity is visible and important.
• Robustness Designed for Automated AssemblyFeatures such as MSL Level 1, tape and reel packaging, and clear polarity marking are designed to be compatible with high-speed, automated Surface Mount Technology (SMT) assembly lines, thereby reducing manufacturing costs and defect rates.
• Thermal management as the primary design constraintThermal data (R_θ, derating curves) highlights that the performance of modern high-power LEDs is fundamentally limited by heat dissipation, not just by electrical or optical characteristics. A successful design treats the LED and its heat sink as an integrated system.