EHP-C04 High-Power White LED Datasheet - Package Size 2.04x1.64x0.75mm - Voltage 2.95-4.15V - Power 7.5W (Pulse) - Technical Documentation

1. Product Overview

The EHP-C04/NT01H-P01/TR is a compact, high-efficiency white light-emitting diode (LED) designed specifically for demanding applications requiring high luminous output. This surface-mount device (SMD) utilizes InGaN chip technology to generate white light. Its primary design objective is to deliver outstanding optical performance within an extremely small package size, making it ideally suited for space-constrained electronic assemblies.

Babban fa'idar wannan LED ta haɗa da: a cikin 500mA na tuƙi na yanzu, mafi girman haske na yau da kullun ya kai 85 lumens, ingancin gani kusan 47 lumens a kowace watt. Tana da kariya daga watsawar lantarki (ESD) har zuwa 8 kV, wanda ya ƙarfafa ƙarfinta yayin sarrafawa da haɗawa. Na'urar tana cikin matakin hankali na danshi (MSL) 1, wanda ke nufin cewa a cikin yanayi na ≤30°C/85% RH, rayuwarta a cikin ɗakin aiki ba ta da iyaka, wanda ke sauƙaƙe ajiya da kayan aiki. Bugu da ƙari, tana bin umarnin RoHS (Ƙuntata Abubuwa Masu Illa), kuma an ƙera ta azaman kayan aiki marasa gubar (Pb-free).

Kasuwar manufar wannan LED tana da faɗi, tana ɗauke da na'urorin lantarki na masu amfani, hasken ƙwararru, da aikace-aikacen mota. Muhimman ƙayyadaddun bayanai sun sa ta zama mafita mai kyau ga aikace-aikacen da ke buƙatar ƙwaƙƙwaran haske, amintacce, da ƙaramin girma.

2. Cikakken bayani na sigogi na fasaha

2.1 Absolute Maximum Ratings

Matsakaicin matsakaicin matsakaici yana ayyana iyakar damuwa na na'urar, wanda ya wuce wannan iyaka zai iya haifar da lalacewa na dindindin. Waɗannan ƙididdiga an ƙayyade su ne a yanayin zafin jiki (T_Pad) na 25°C, kuma bai kamata a wuce su a kowane yanayi na aiki ba.

• Direct forward current (I_F):350 mA. This is the maximum continuous forward current that the LED can withstand.
• Peak pulse current (I_pulse):1500 mA. This high current is only allowed under specific pulse conditions: maximum pulse width of 400ms, maximum duty cycle of 10% (e.g., on for 400ms, off for 3600ms). This rating is crucial for flash/strobe applications.
• ESD withstand capability (Human Body Model):8000 V. This specifies the LED's robustness against electrostatic discharge.
• Reverse voltage (V_R):The datasheet clearly states that this LED series is not designed for reverse bias operation. Applying reverse voltage is not recommended.
• Junction Temperature (T_J):125 °C. The maximum allowable temperature for the semiconductor junction.
• Operating and Storage Temperature:The device can operate from -40°C to +85°C and can be stored from -40°C to +110°C.
• Power Dissipation (Pulse Mode):7.5 W. This is the maximum power the package can dissipate during pulse operation, dependent on thermal management.
• Soldering Temperature:260 °C, with a maximum of 2 reflow cycles allowed.
• Viewing Angle (2θ_1/2):130 digiri (±5°). Wannan shine cikakken kusurwa lokacin da ƙarfin haske ya ragu zuwa rabin ƙimar kololuwa (tsakiya).

Muhimman bayanan ƙira:Ci gaba da aiki a ƙimar iyakar ƙima na iya haifar da lalacewa na dindindin da lalacewar sigogi. Ba a yarda da aiwatar da sigogi masu yawa na iyakar ƙima a lokaci guda ba. Aiki na dogon lokaci a kusa da iyakoki na iyaka na iya haifar da matsalolin amincin da ke ɗauke da su. Gwajin aminci (sau 1000) yana tabbatar da cewa sigogin suna cikin iyaka inda raguwar IV ya kasance ƙasa da 30%.

2.2 Halayen haske da lantarki

Waɗannan halaye an auna su a cikin yanayi na yau da kullun (T_Pad=25°C, faɗin bugun jini 50ms), suna wakiltar aikin na'urar.

• Kwararar haske (Ф_v):Ƙimar mafi ƙarancin 70 lm, ƙimar al'ada 85 lm. A cikin I_FMeasured at =500mA, tolerance is ±10%.
• Forward Voltage (V_F):At I_F=500mA, minimum 2.95 V, maximum 4.15 V. Measurement tolerance is ±0.1V. Forward voltage is binned; see Section 3 for details.
• Correlated Color Temperature (CCT):At I_F=500mA, range from 4500 K to 7000 K. This covers the color temperature range from cool white to daylight white.

2.3 Halayen zafi

Effective thermal management is crucial for LED performance and lifetime. The junction temperature must be kept below 125°C. The datasheet provides specific guidance for reliability testing under different drive currents, emphasizing the importance of using a suitable thermal substrate:

• For the 1500 mA pulse test, a 1.0 x 1.0 cm² Metal Core Printed Circuit Board (MCPCB) with good thermal management is required.
• For the 1000 mA test, an FR4 substrate of the same size with good thermal management is used.
• A forward current derating curve is provided, showing how the maximum allowable continuous current decreases as the pad temperature increases. This curve is based on maintaining T_J(MAX)= 125°C.

3. Binning System Description

To ensure consistency in mass production, LEDs are binned according to key parameters. The EHP-C04 employs a multi-parameter binning system.

3.1 Forward Voltage (V_F) Binning

LEDs are divided into four bins based on their forward voltage at 500mA:

• Bin 2932: V_F= 2.95V to 3.25V
• Bin 3235: V_F= 3.25V to 3.55V
• Bin 3538: V_F= 3.55V to 3.85V
• Gear 3841: V_F= 3.85V to 4.15V

This allows designers to select LEDs with similar electrical characteristics to ensure consistency in driver design and system performance.

3.2 Luminous Flux (Ф_v) Binning

LEDs are binned according to their minimum luminous flux at 500mA:

• F7:70 lm to 80 lm
• F8:80 lm zuwa 90 lm
• F9:90 lm zuwa 100 lm
• J1:100 lm zuwa 120 lm
• J2:120 lm zuwa 140 lm
• J3:140 lm to 160 lm

The typical value of 85 lm belongs to bin F8. This binning ensures brightness uniformity in multi-LED applications.

3.3 Chromaticity Coordinates (White) Binning

White light chromaticity is defined on the CIE 1931 (x, y) chromaticity diagram. LEDs are divided into three main color bins, each corresponding to a CCT range:

• Color Bin (1) - 4550K:Covers 4500K to 5000K. Defined by a quadrilateral with specific corner coordinates on the (x, y) diagram.
• Color Bin (2) - 5057K:Covers 5000K to 5700K. Defined by its own set of corner point coordinates.
• Color Bin (3) - 5770K:Covers 5700K to 7000K. Defined by the third set of corner point coordinates.

Chromaticity coordinate measurement allows a deviation of ±0.01. All bins are defined under I_F=500mA, 50ms pulse operation. This precise binning is crucial for applications requiring consistent white point and color rendering.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (IV Curve)

The provided curve shows the forward voltage (V_F) and forward current (I_F). As characteristic of an LED, V_Fincreases with I_F, but not linearly. The curve starts at approximately 2.8V at very low current and rises to about 5.0V at 1500mA. This curve is crucial for designing current drive circuits, as it determines power dissipation (V_F* I_F) and the required drive voltage headroom.

4.2 Luminous Flux vs. Forward Current

This curve describes the relative light output as a function of drive current. Light output increases sublinearly with current. While driving at higher currents produces more light, it also generates significantly more heat, reducing efficiency and potentially affecting lifespan. The curve shows that at higher currents (e.g., above 1000mA), the output begins to saturate, indicating diminishing returns and increased stress on the device.

4.3 Correlated Color Temperature (CCT) vs. Forward Current

CCT yana nuna dogaro da ƙarfin kunnawa. Don wannan LED, CCT yawanci yana ƙaruwa da ɗan ƙaramin ƙarfi, yana motsawa daga kusan 5600K a ƙananan ƙarfi zuwa kusan 6000K a 1500mA. Wannan canjin yana da mahimmanci ga aikace-aikacen da ke buƙatar kiyaye daidaiton zafin launi a matakan haske daban-daban.

4.4 Relative Spectral Distribution

Taswirar Rarraba Ƙarfin Bakan tana nuna faɗaɗɗen kololuwar fitarwa daga yankin shuɗi na guntu na InGaN (kimanin 450-460 nm), da kuma faɗaɗɗen kololuwar fitarwa na phosphor mai rawaya. Haɗaɗɗen bakan yana haifar da farin haske. Tabbataccen siffar da kololuwar suna ƙayyade ma'aunin nunin launi (CRI) na LED, ko da yake ba a bayar da takamaiman ƙimar CRI a cikin wannan takamaiman takardar ba.

4.5 Radiation Pattern

An samar da tsarin radiation na polar axis na X-axis da Y-axis. Wannan tsarin yana kusa da rarraba Lambert (cosine), wanda ke da alaƙa da LED da aka ƙera don manyan ruwan tabarau na haske mai faɗi da daidaito. An tabbatar da kusurwar hangen nesa na digiri 130 ta wannan tsarin, inda ƙarfin ya ragu zuwa 50% na ƙimar cibiyar a ±65 digiri.

4.6 Forward Current Derating Curve

Wannan shi ne muhimmin jadawali na zanen zafi. Yana nuna alaƙar mafi girman ƙarfin kwarara mai ci gaba da aka yarda da shi da zafin gindin. Yayin da zafin gindin ya tashi, mafi girman amintaccen ƙarfin kwarara yana raguwa a layi daya. Misali, a zafin gindin na 75°C, mafi girman ƙarfin kwarara mai ci gaba ya ragu zuwa kusan 300mA. Dole ne a yi amfani da wannan lanƙwasa don tabbatar da cewa LED yana aiki a cikin yanayin zafinsa na ainihi a cikin iyakokin zafin haɗin aminci.

5. Mechanical and Package Information

5.1 Girman Kunshewa

EHP-C04 yana amfani da kunshewar manna sama. Muhimman girmomin da aka ciro daga zane-zanen kallon sama da na gefe sun haɗa da:

• Gabaɗayan girman kunshewa: kusan 2.04 mm (tsayi) x 1.64 mm (faɗi) x 0.75 mm (tsayi).
• Matsayin ɗan ƙaramin na'ura: ɗan ƙaramin na'ura mai haskakawa yana tsakiyar kunshewar.
• Anode and cathode pads: The package has two pads for electrical connection. The anode and cathode are clearly marked in the diagram. Correct polarity is crucial for operation.
• Optical center: The point from which the principal optical axis emanates. This is important for optical system alignment.
• Tolerances: Unless otherwise specified, dimensional tolerances are ±0.1 mm.

6. Jagorar Walda da Haɗawa

This LED is suitable for reflow soldering processes with a peak temperature of 260°C. A maximum of two reflow cycles is permitted. The Moisture Sensitivity Level (MSL) is Level 1, meaning no baking is required before reflow as it has unlimited floor life at ≤30°C/85% RH. If baking is deemed necessary for other reasons, the standard JEDEC soak condition (168 hours at 85°C/85% RH) applies. During assembly, standard ESD precautions should be observed due to the sensitive semiconductor structure.

7. Bayanin Marufi da Oda

The device is supplied in moisture barrier packaging, suitable for automated assembly, typically in tape and reel form. The product label on the reel includes the Customer Part Number (CPN), Manufacturer Part Number (P/N - EHP-C04/NT01H-P01/TR), and a lot number for traceability. Specific tape dimensions refer to the definitions in the previous revision of the specification.

8. Shawarar Aikace-aikace

8.1 Yanayin Aikace-aikace na Al'ada

• Mobile Phone Camera Flash/Strobe Light:Its high pulse current capability (1500mA) and high luminous flux make it an ideal choice for camera flash applications in mobile devices and digital cameras.
• Flashlight:Suitable for flashlight applications in handheld flashlights and devices such as digital camcorders.
• General Lighting:Can be used in indoor lighting fixtures, decorative lighting, and entertainment lighting that require compact, bright point light sources.
• Backlighting:Suitable for TFT-LCD backlight units, especially for smaller panels or as an array for larger panels.
• Automotive Lighting:Suitable for automotive interior (instrument panels, dome lights) and exterior (auxiliary lighting, marker lights) applications, provided that relevant automotive certification requirements are met.
• Signal and Indicator Lights:Due to its high brightness and wide viewing angle, it is an ideal choice for exit signs, step lights, and other guidance signage.

8.2 La'akarin Zane

• Thermal Management:This is the most critical design factor. Use a suitable PCB (MCPCB is recommended for high current/pulse operation) and ensure sufficient heat dissipation to minimize the pad temperature as much as possible. Please refer to the derating curve.
• Current Drive:Use a constant-current LED driver, not a constant-voltage source. The driver should be designed to handle the forward voltage binning range (2.95V-4.15V) and provide the required current (continuous or pulsed).
• Optics:ESD Protection:
• Although the LED has built-in ESD protection, implementing additional board-level ESD protection on sensitive lines is good practice.9. Technical Comparison and Differentiation

Ko da yake ba a ba da kwatankwacin kai tsaye tare da sauran nau'ikan a cikin takardar ƙayyadaddun ba, ana iya ƙididdige mahimman halaye na bambance-bambance daga ƙayyadaddun EHP-C04:

High Luminous Flux in a Compact Size:

• Providing a typical luminous flux of 85 lm in a package with a length less than 2.1mm is a significant advantage for miniaturized devices.High Pulse Current Capability:
• The 1500mA pulse rating (10% duty cycle) is very high for its size, specifically targeting camera flash applications.Robust ESD Rating:
• 8kV HBM ESD protection is a robust feature that enhances assembly yield and field reliability compared to LEDs with lower or unspecified ESD ratings.MSL Level 1:
• This simplifies inventory management and assembly processes compared to components with higher MSL levels that require baking.Comprehensive Binning:
• Three-parameter binning (Luminous Flux, V, Color) allows for very tight system performance matching, which is crucial for achieving uniform brightness and color in multi-LED arrays._F10. Frequently Asked Questions (Based on Technical Specifications)

Q1: Zan iya tuka wannan LED a ci gaba da 1000mA?

A1: The absolute maximum rating for DC forward current is 350mA. Continuous operation at 1000mA will exceed this rating and may cause rapid failure. The 1000mA and 1500mA ratings are only applicable for pulse operation and must strictly adhere to the conditions of a maximum pulse width of 400ms and a maximum duty cycle of 10%, requiring excellent thermal management (MCPCB).
Q2: What is the difference between the F8 and J1 luminous flux bins?

A2: The F8 bin guarantees a minimum luminous flux between 80 and 90 lm at 500mA. The J1 bin guarantees a higher minimum luminous flux, between 100 and 120 lm. Choosing a higher bin ensures greater minimum light output, but may come at a higher cost.
Q3: How to interpret the color binning chart?

A3: The chart on page 5 of the datasheet is the CIE 1931 chromaticity diagram. Each numbered bin (1, 2, 3) represents a quadrilateral area on the chart. LEDs are tested, and their measured (x, y) color coordinates must fall within one of these defined areas. Bin 1 corresponds to warmer white light (~4550K), bin 2 to neutral white light (~5057K), and bin 3 to cooler white light (~5770K).
Q4: Why is there such a strong emphasis on thermal management?

A4: LED efficiency decreases as temperature increases (efficiency droop). More importantly, excessively high junction temperatures (above 125°C) accelerate degradation mechanisms such as phosphor thermal quenching and semiconductor defects, drastically shortening lifespan. Proper heat dissipation maintains performance and reliability.
Q5: What does "Moisture Sensitivity Level 1" mean for my production?

A5: MSL Level 1 na nufin cewa kayan aikin na iya kasancewa a cikin yanayin ma'aikata (≤30°C/85% RH) har abada, ba tare da ɗaukar ɗanɗano mai cutarwa ba, wanda zai haifar da "tsawa" (fashewar kulli) yayin sake watsa haɗin gwiwa. Ba kwa buƙatar gasa kafin amfani, yana sauƙaƙe kayan aiki.
11. Nazarin Ƙira da Amfani

Nazarin Shari'a 1: Na'urar toshewar kyamarar wayar hannu

Mai zane yana ƙira walƙiya na LED biyu don wayar hannu. Sun zaɓi EHP-C04 saboda babban fitarwar bugun jini da ƙananan girmansa. Sun ƙirƙiri ƙaramin rukunin MCPCB don sarrafa zafin da aka samar daga bugun 1500mA. Sun ƙayyade LED daga madaidaicin fitarwar haske (misali F8) da madaidaicin launi (misali madaidaici 2) don tabbatar da cewa walƙiyoyin biyu suna samar da haske da launi iri ɗaya. An zaɓi IC mai tuƙi don samar da bugun 400ms mai daidaitaccen lokaci. Faɗin kusurwar gani na digiri 130 ya tabbatar da kyakkyawan ɗaukar hoto, ba tare da buƙatar amfani da ruwan tabarau mai yadawa ba, yana adana sarari.
Nazarin Shari'a 2: Fitilar Hannu Mai Ƙarfi da Ƙarfi

Don fitilar hannu ta dabara mai ƙarami, manufar ita ce samar da mafi girman fitarwa. Mai zane yana amfani da guda ɗaya EHP-C04, yana tuƙa shi da matsakaicin ƙimar ci gaba na 350mA. Ta amfani da PCB na tushen aluminum mai ɗaukar zafi, harsashin fitilar yana aiki azaman mai sanyaya zafi. Da'irar tuƙi ta ƙunshi martanin zafi, wanda ke rage ƙarfin lantarki idan zafin jiki ya yi yawa. Yanayin haske mai faɗi ana daidaita shi ta hanyar mai nuna baka wanda ya daidaita da tsakiyar gani na LED don samar da tabo mai mai da hankali tare da haske mai amfani.
12. Gabatarwar Ka'idar Fasaha

EHP-C04 LED ne mai canza haske zuwa fari ta hanyar phosphor. Ya dogara ne akan guntu na semiconductor na InGaN wanda ke fitar da haske mai shuɗi a cikin bakan (yawanci kusa da 450-460 nm) lokacin da wutar lantarki ta wuce. Wannan guntun LED mai shuɗi an lulluɓe shi da wani Layer na phosphor na YAG:Ce. Wani ɓangare na hasken shuɗi daga guntun yana sha ta phosphor, sannan ya sake fitar da haske mai faɗin bakan wanda ya fi mayar da hankali a yankin rawaya. Idon ɗan adam yana ganin haɗuwar hasken shuɗin da ba a sha ba da hasken rawaya da aka canza a matsayin haske fari. Daidaitaccen rabo na shuɗi da rawaya yana sarrafa ta hanyar abun da ke ciki da kauri na phosphor, wanda ke ƙayyadad da ingantaccen zafin launi (CCT) na fitowar haske fari. Idan aka kwatanta da madadin hanyoyin LED masu haske fari, wannan fasaha tana da rinjaye a masana'antu saboda ingantacciyar inganci da sauƙin tsarin kera ta.

13. Trends in Technological Development

Yankin manyan LED masu haske fari yana tafiya tare da wasu mahimman hanyoyin ci gaba, duk suna nufin haɓaka aiki, inganci da kewayon aikace-aikace. Duk da cewa EHP-C04 yana wakiltar na'ura mai kyawun aiki, ci gaba da abubuwan da ke faruwa sun haɗa da:

Efficiency Improvement (Lumens per Watt):

• Research focuses on increasing the internal quantum efficiency of the blue InGaN chip, enhancing the light extraction efficiency of the package, and developing more efficient phosphors with narrower emission spectra (e.g., using quantum dots or nitride/oxynitride phosphors) to reduce Stokes losses.Color Quality Improvement:
• 超越冷白光，趋势是开发具有高显色指数（CRI >90，甚至>95）和可调CCT的LED，通常使用多荧光粉混合物或多个LED芯片（RGB或RGB+白光）。Higher Power Density and Miniaturization:
• The pursuit of smaller, brighter devices continues. This involves advanced packaging technologies, such as Chip Scale Package (CSP) and flip-chip designs, to improve thermal paths and reduce package size relative to the light-emitting area.Enhanced Reliability and Lifespan:
• Improvements in materials (epitaxial layers, phosphors, packaging materials) and package design (better thermal interfaces, hermetic sealing) are pushing rated lifetimes (L70/B50) from tens of thousands of hours to over 100,000 hours.Application-Specific Optimization:
• LEDs are increasingly being tailored for specific markets. For example, flash LEDs are optimized for very high pulse currents and minimal droop, while horticultural LEDs are tuned to specific plant-growth spectra. The comprehensive binning seen in the EHP-C04 datasheet is part of this trend towards providing precise, application-ready components.LEDs are increasingly being tailored for specific markets. For example, flash LEDs are optimized for very high pulse currents and minimal droop, while horticultural LEDs are tuned to specific plant-growth spectra. The comprehensive binning seen in the EHP-C04 datasheet is part of this trend towards providing precise, application-ready components.