T5C Series 5050 White LED Datasheet - Dimensions 5.0x5.0x1.9mm - Voltage 9.5V - Power 3.8W

1. Product Overview

The T5C series is a high-performance, top-emitting white LED, specifically designed for demanding general lighting applications. This device features an enhanced thermal management package design that effectively controls heat, enabling high luminous flux output and reliable operation under high current conditions. Its compact 5050 package size (5.0mm x 5.0mm) makes it suitable for space-constrained designs, while providing a wide 120-degree viewing angle to ensure uniform light distribution.

The key advantages of this series include its high current-carrying capacity, which enables significant light output, and its compatibility with lead-free reflow soldering processes, ensuring adherence to modern environmental standards. The product design complies with RoHS specifications.

2. Detailed Technical Parameters

2.1 Photoelectric Characteristics

The main performance indicators are defined under the conditions of a junction temperature (Tj) of 25°C and a forward current (IF) of 400mA. Luminous flux varies with the correlated color temperature (CCT) and color rendering index (Ra). For example, the typical luminous flux for a 4000K LED with Ra70 is 600 lumens (minimum 550 lm), while the Ra90 version is 485 lumens (minimum 450 lm). The luminous flux measurement tolerance is ±7%, and the Ra tolerance is ±2.

2.2 Electrical and Thermal Parameters

Absolute Maximum Ratings define the operational limits: Continuous forward current (IF) is 480mA, pulse forward current (IFP) is 720mA (pulse width ≤100μs, duty cycle ≤1/10), and maximum power dissipation (PD) is 5040mW. The junction temperature must not exceed 120°C.

A cikin yanayin aiki na yau da kullun (IF=400mA, Tj=25°C), kewayon ƙarfin lantarki na gaba (VF) yana daga 8.0V zuwa 10.5V, ƙimar al'ada ita ce 9.5V (tolerance ±3%). Ƙimar juriya na zafi daga junction zuwa solder point (Rth j-sp) na al'ada ita ce 2.5°C/W, wannan yana da mahimmanci ga ƙira na sarrafa zafi. Na'urar kuma tana da juriya na electrostatic discharge (ESD) na 1000V (HBM).

3. Grading System Description

3.1 Luminous Flux and Color Temperature/Color Rendering Index Binning

LEDs are binned according to luminous flux output, CCT, and CRI to ensure color and brightness consistency. For example, a 4000K LED with Ra80 (code 82) offers the following luminous flux bins: GL (500-550 lm), GM (550-600 lm), and GN (600-650 lm). Each bin has defined minimum and maximum values.

3.2 Forward Voltage Binning

Don dominin da'awar kewaye, LED kuma ana rarrabe su bisa ga ƙarfin lantarki na gaba. Zaɓuɓɓukan da ake da su sun haɗa da: 1C (8-9V), 1D (9-10V), da 5X (10-12V), duk an auna su a cikin sharuɗɗan IF=400mA, Tj=25°C, tare da ƙimar kuskuren ±3%.

3.3 Chromaticity Coordinate Binning

Ana tabbatar da daidaiton launi ta hanyar rarraba LED cikin iyakokin matsaya na launi da aka ayyana ta hanyar ellips na mataki 5 na MacAdam. An keɓance matsakaicin matsaya (x, y) da sigogin ellips (a, b, Φ) ga kowane lambar CCT (misali, 2700K yana dacewa da 27R5, 4000K yana dacewa da 40R5). Ma'aunin rarrabuwar Energy Star ya shafi duk samfuran da ke cikin kewayon 2600K zuwa 7000K. Ƙimar kuskuren matsaya na launi shine ±0.005.

4. Performance Curve Analysis

The datasheet contains several key charts for design analysis. The Relative Luminous Flux vs. Forward Current (IF) curve shows how light output varies with drive current. The Forward Voltage vs. Forward Current graph is crucial for designing the drive circuit. The Angular Distribution Diagram illustrates a Lambertian-like emission pattern, confirming a wide viewing angle of 120 degrees.

Temperature dependence is reflected in the curves of relative luminous flux vs. solder point temperature (Ts) and forward voltage vs. Ts. The CIE x, y coordinate shift vs. ambient temperature (Ta) graph is crucial for applications with high color stability requirements. Finally, the maximum forward current vs. ambient temperature curve defines the derating requirements to ensure reliable operation.

5. Mechanical and Packaging Information

5.1 Package Size

The LED employs a compact package measuring 5.00mm x 5.00mm, with a height of approximately 1.90mm. The bottom view illustrates the pad layout, which is specifically designed for a 3-series 2-parallel internal chip configuration. The cathode and anode are clearly marked. Unless otherwise specified, all dimensional tolerances are ±0.1mm.

5.2 Polarity Marking

The soldering pattern diagram clearly marks the cathode and anode pads, which is crucial for correct PCB layout and assembly to prevent reverse bias connections.

6. Welding and Assembly Guide

6.1 Reflow Soldering Temperature Profile

This device is suitable for reflow soldering. The recommended temperature profile includes: preheating from 150°C to 200°C within 60-120 seconds, the maximum heating rate to the peak temperature is 3°C/second, and the liquidus temperature (TL) time (tL) must be controlled. The peak soldering temperature can be 230°C or 260°C, with a maximum dwell time of 10 seconds. This curve must be followed to prevent thermal damage to the LED package.

7. Model Numbering Rules

Part number follows a structured format: T [X1][X2][X3][X4][X5][X6]-[X7][X8][X9][X10]. Key elements include: X1 (type code, e.g., 5C for 5050), X2 (CCT code, e.g., 40 for 4000K), X3 (CRI code, e.g., 8 for Ra80), X4 (number of series chips), X5 (number of parallel chips), and X6 (component code). This system allows for precise identification of the LED's electrical and optical characteristics.

8. Application Suggestions

8.1 Typical Application Scenarios

This high-power LED is an ideal choice for indoor lighting fixtures, retrofit lamps designed to replace traditional light sources, general lighting applications, and architectural or decorative lighting requiring high output and compact size.

8.2 Design Considerations

Due to the high power consumption (up to 5.04W), designers must pay close attention to thermal management. Suitable metal-core printed circuit boards (MCPCB) or heat sinks must be used to maintain the junction temperature within a safe range, ensuring long-term reliability and stable light output. The drive circuit must be designed to provide a stable current of up to 480mA (continuous), taking into account forward voltage binning. A wide viewing angle should be considered in the optical design to achieve the desired beam distribution.

9. Technical Comparison and Differentiation

Compared to standard mid-power LEDs, the T5C series offers significantly higher luminous flux per package thanks to its high current capability and enhanced thermal design. Clear binning for luminous flux, voltage, and chromaticity coordinates within a 5-step MacAdam ellipse provides lighting manufacturers with superior color consistency and predictability, reducing the need for secondary sorting. The package is designed for robust reflow soldering, supporting high-volume automated assembly.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the typical power consumption of this LED?
A: At the typical operating point of 400mA and 9.5V, the power consumption is approximately 3.8 watts (P = I*V).

Q: How does the light output vary with temperature?
A: The relative luminous flux vs. Ts curve shows that light output decreases as the solder point temperature increases. Proper heat dissipation is crucial to minimize this decline.

Q: Can I drive this LED with a constant voltage source?
A: It is not recommended. LEDs are current-driven devices. A constant current driver is required to ensure stable light output and prevent thermal runaway, as the forward voltage has a negative temperature coefficient and varies between devices.

Q: What does 5-step MacAdam ellipse binning mean?
A: This means all LEDs within a specific CCT bin (e.g., 4000K) have color coordinates so similar that the human eye cannot perceive a color difference under standard viewing conditions, ensuring uniform white light in an array.

11. Practical Design and Usage Cases

Consider designing an industrial high-bay LED luminaire. By arranging multiple T5C LEDs on a thermally optimized MCPCB, designers can achieve high lumen output. By selecting LEDs from the same luminous flux bin (e.g., GM) and CCT/CRI bin (e.g., 40R5, 82), consistency in brightness and color temperature across the entire luminaire can be ensured. A driver is selected to provide a constant current of 400mA to each LED string. The total number of LEDs in series is determined by the driver's output voltage range and the forward voltage bin (e.g., 1D: 9-10V). The 120-degree wide viewing angle helps reduce the number of secondary optics required to achieve widespread illumination.

12. Introduction to Working Principles

White light LEDs typically utilize a semiconductor chip that emits blue light when forward-biased (electroluminescence). This blue light then excites a phosphor coating deposited on or around the chip. The phosphor down-converts a portion of the blue light into light of longer wavelengths (yellow, red). The remaining blue light mixes with the light emitted by the phosphor, which is perceived by the human eye as white light. The specific mixture ratio of the phosphors determines the correlated color temperature (CCT) and color rendering index (CRI) of the emitted white light.

13. Technology Development Trends

The solid-state lighting industry continues to focus on improving luminous efficacy (lumens per watt), enhancing color rendering quality (particularly the red hue R9), and increasing reliability and lifespan. The trend towards higher power density packages (such as the 5050 form factor) necessitates advanced thermal management materials and designs. Furthermore, the standardization of color coordinate and luminous flux binning, such as adopting standards like ENERGY STAR, is crucial for ensuring product consistency and simplifying design for lighting manufacturers. The pursuit of smarter, connected lighting is also driving LED driver technology towards higher programmability and integration.

Detailed Explanation of LED Specification Terminology

Complete Explanation of LED Technical Terminology

I. Core Indicators of Photoelectric Performance

Terminology	Unit/Representation	Popular Explanation	Why It Is Important
Luminous Efficacy	lm/W	The luminous flux emitted per watt of electrical energy, the higher the more energy-efficient.	Directly determines the energy efficiency class and electricity cost of the luminaire.
Luminous Flux	lm (lumen)	The total amount of light emitted by a light source, commonly known as "brightness".	Determine if the lamp is bright enough.
Viewing Angle	° (degrees), such as 120°	The angle at which light intensity drops to half, determining the beam's width.	Affects the illumination range and uniformity.
Color Temperature (CCT)	K (Kelvin), e.g., 2700K/6500K	The warmth or coolness of light color; lower values are yellowish/warm, higher values are whitish/cool.	Determines the lighting atmosphere and suitable application scenarios.
Color Rendering Index (CRI / Ra)	No unit, 0–100	The ability of a light source to reproduce the true colors of objects, Ra≥80 is recommended.	Affects color fidelity, used in high-demand places such as shopping malls and art galleries.
Color Tolerance (SDCM)	MacAdam Ellipse Steps, e.g., "5-step"	Quantitative indicator of color consistency, the smaller the step number, the more consistent the color.	Ensure no color difference among the same batch of luminaires.
Dominant Wavelength	nm (nanometer), e.g., 620nm (red)	The wavelength value corresponding to the color of a colored LED.	Determine the hue of monochromatic LEDs such as red, yellow, and green.
Spectral Distribution	Wavelength vs. Intensity Curve	Shows the intensity distribution of light emitted by an LED across various wavelengths.	Affects color rendering and color quality.

II. Electrical Parameters

Terminology	Symbols	Popular Explanation	Design Considerations
Forward Voltage	Vf	Minimum voltage required to turn on an LED, similar to a "starting threshold".	The driving power supply voltage must be ≥ Vf, and the voltage adds up when multiple LEDs are connected in series.
Forward Current	If	The current value that allows the LED to emit light normally.	Constant current drive is commonly used, where the current determines brightness and lifespan.
Maximum Pulse Current (Pulse Current)	Ifp	Peak current that can be withstood in a short time, used for dimming or flashing.	Pulse width and duty cycle must be strictly controlled, otherwise overheating damage.
Reverse Voltage	Vr	The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown.	A cikin da'ira, ya kamata a hana haɗin baya ko kuma ƙarfin lantarki mai ƙarfi.
Thermal Resistance	Rth (°C/W)	The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation.	High thermal resistance requires a more robust thermal design; otherwise, the junction temperature will increase.
Electrostatic Discharge Immunity (ESD Immunity)	V (HBM), such as 1000V	Anti-static strike capability, the higher the value, the less susceptible to damage from static electricity.	Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology	Key Indicators	Popular Explanation	Impact
Junction Temperature	Tj (°C)	The actual operating temperature inside the LED chip.	For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift.
Lumen Depreciation	L70 / L80 (hours)	The time required for brightness to drop to 70% or 80% of its initial value.	Directly defines the "useful life" of an LED.
Lumen Maintenance	% (e.g., 70%)	Percentage of remaining brightness after a period of use.	Characterizes the ability to maintain brightness after long-term use.
Color Shift	Δu′v′ or MacAdam Ellipse	The degree of color change during use.	Affects the color consistency of the lighting scene.
Thermal Aging	Material performance degradation	Degradation of packaging materials due to long-term high temperature.	May lead to decreased brightness, color shift, or open-circuit failure.

IV. Encapsulation and Materials

Terminology	Common Types	Popular Explanation	Characteristics and Applications
Package Type	EMC, PPA, Ceramic	Material za kufunika chipi na kutoa mwongozo wa mwanga na joto.	EMC ina uvumilivu mzuri wa joto, gharama nafuu; kauri ina utoaji bora wa joto, maisha marefu.
Muundo wa chipi	Front-side, Flip Chip	Chip Electrode Layout Method.	Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating	YAG, Silicate, Nitride	Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light.	Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical Design	Flat, Microlens, Total Internal Reflection	Optical structure on the encapsulation surface, controlling light distribution.	Determines the emission angle and light distribution curve.

V. Quality Control and Binning

Terminology	Grading Content	Popular Explanation	Purpose
Luminous Flux Grading	Codes such as 2G, 2H	Grouped by brightness level, each group has a minimum/maximum lumen value.	Ensure uniform brightness for products within the same batch.
Voltage binning	Codes such as 6W, 6X	Group by forward voltage range.	Facilitates driver power matching and improves system efficiency.
Color Grading	5-step MacAdam Ellipse	Group by color coordinates to ensure colors fall within a minimal range.	Ensure color consistency to avoid uneven colors within the same luminaire.
Color temperature binning	2700K, 3000K, etc.	Grouped by color temperature, each group has a corresponding coordinate range.	To meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology	Standard/Test	Popular Explanation	Meaning
LM-80	Lumen Maintenance Test	Long-term illumination under constant temperature conditions, recording brightness attenuation data.	Used to estimate LED lifespan (combined with TM-21).
TM-21	Standard for Lifetime Projection	Projecting lifetime under actual use conditions based on LM-80 data.	Provide scientific life prediction.
IESNA standard	Standard of the Illuminating Engineering Society	Covers optical, electrical, and thermal test methods.	Industry-recognized testing basis.
RoHS / REACH	Environmental certification	Ensure the product does not contain harmful substances (e.g., lead, mercury).	Market access requirements for entering the international market.
ENERGY STAR / DLC	Energy Efficiency Certification	Energy efficiency and performance certification for lighting products.	Yawan da ake amfani da shi a cikin sayayyar gwamnati da ayyukan tallafi, don haɓaka gasar kasuwa.

T5C Series 5050 White LED Datasheet - Dimensions 5.0x5.0x1.9mm - Voltage 9.5V - Power 3.8W - Technical Documentation

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