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8-Pin DIP High Speed 10Mbit/s Logic Gate Photocoupler EL263X Series Datasheet - 10Mbps - 5000Vrms Isolation - English Technical Document

Cikakken bayanin fasaha na jerin EL263X na high-speed logic gate photocoupler. Yana da saurin 10Mbit/s, keɓewa na 5000Vrms, 10kV/μs CMTI, da aiki daga -40°C zuwa 85°C.
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Murfin Takarda na PDF - 8-Pin DIP Mai Sauri 10Mbit/s Logic Gate Photocoupler EL263X Series Datasheet - 10Mbps - 5000Vrms Keɓewa - Takardar Fasaha Turanci

1. Product Overview

The EL263X series represents a family of high-speed, logic gate output photocouplers (optoisolators). These devices are engineered to provide electrical isolation between input and output circuits while transmitting digital logic signals at high speeds. The core function is to translate an input logic level (HIGH/LOW) into a corresponding, but electrically isolated, output logic level.

The primary application is in scenarios where ground loop elimination, noise immunity, and voltage level shifting are critical. They are commonly used as replacements for pulse transformers in data transmission, providing a solid-state, potentially more reliable and compact solution.

1.1 Core Advantages and Target Market

The EL263X series is designed for applications demanding both high-speed digital signal integrity and robust electrical isolation. Its key advantages stem from its specific technical parameters.

The target market includes designers of industrial automation, power supplies (AC-DC, DC-DC converters), data acquisition systems, communication interfaces, and any electronic system where galvanic isolation of digital signals is necessary for safety, noise reduction, or level shifting.

2. In-Depth Technical Parameter Analysis

The datasheet provides comprehensive electrical and switching characteristics. A detailed interpretation is essential for proper circuit design.

2.1 Absolute Maximum Ratings

These are stress limits that must not be exceeded under any conditions, even momentarily. Operating the device beyond these ratings may cause permanent damage.

2.2 Electrical and Transfer Characteristics

These parameters define the device's performance under normal operating conditions (TA = -40°C to 85°C).

2.3 Switching Characteristics

Wadannan sigogi suna da mahimmanci ga nazarin lokaci a cikin da'irori masu sauri. Yanayin gwaji: VCC=5V, IF=7.5mA, CL=15pF, RL=350Ω.

3. Performance Curve Analysis

While the provided PDF excerpt mentions "Typical Electro-Optical Characteristics Curves" on page 5, the specific graphs are not included in the text. Typically, such curves for a photocoupler would include:

Designers should consult the full datasheet from the manufacturer for these graphs to understand performance boundaries and derating.

4. Mechanical, Packaging & Assembly Information

4.1 Pin Configuration and Schematic

The device is housed in a standard 8-pin Dual In-line Package (DIP).

4.2 Soldering and Handling

The absolute maximum rating for soldering is 260°C for 10 seconds. This corresponds to a standard lead-free reflow profile. For wave or hand soldering, contact time and temperature should be controlled to prevent package damage. Standard ESD (Electrostatic Discharge) precautions should be observed during handling.

5. Application Guidelines and Design Considerations

5.1 Typical Application Circuits

EL263X ni versatile. Key applications ni:

5.2 Critical Design Considerations

6. Technical Comparison and Differentiation

Compared to standard 4N25/4N35 series photocouplers (which are transistor output), the EL263X offers decisive advantages for digital systems:

Compared to other high-speed couplers or digital isolators (based on capacitive or magnetic coupling), photocouplers like the EL263X offer the advantage of being based on well-understood optical technology with high intrinsic immunity to magnetic fields.

7. Frequently Asked Questions (Based on Parameters)

Q: What is the maximum data rate I can achieve?
A: The device is characterized for 10 Mbit/s operation. The limiting factors are the propagation delays and pulse width distortion. For a 50% duty cycle square wave, the maximum frequency is approximately 1/(2 * tPHL) or 1/(2 * tPLH), whichever is smaller. Using max delays (100 ns), this gives ~5 MHz. However, for non-return-to-zero (NRZ) data, the 10 Mbit/s rate is valid.

Q: Why is a bypass capacitor mandatory?
A: The high-speed switching of the internal output stage causes sudden current spikes on the VCC line. Without a local, low-inductance capacitor, these spikes can cause the internal supply voltage to droop or spike, leading to erratic operation, reduced noise margin, and failure to meet the CMTI specification.

Q: Can I drive the input directly from a microcontroller pin?
A> Yes, but you must tumia kipingamanishi cha kuzuia mkondo. Pini ya kawaida ya microcontroller kwenye 3.3V au 5V inaweza kutoa/kupokea mkondo wa kutosha. Kwa mfano, kupata IF ≈ 10mA kutoka kwa pini ya 3.3V: R = (3.3V - 1.4V) / 0.01A = 190Ω (tumia thamani ya kawaida ya 180Ω au 200Ω). Daima thibitisha uwezo wa mkondo wa pini ya MCU.

Q: What does the "strobable output" feature mean?
A: This refers to the ability to force the output into a high-impedance state. While the provided truth table doesn't show a disable function, some logic gate photocouplers have an output enable pin. The EL263X description mentions it, but the pinout and table do not show a dedicated pin for this. Designers should confirm this feature's implementation in the specific variant.

8. Practical Design Case Study

Scenario: Isolating a 1 Mbit/s UART signal between a 3.3V sensor node and a 5V system controller in an industrial setting with motor noise.

Design Steps:

  1. Part Selection: Choose EL2631 for its higher guaranteed CMTI (10 kV/µs) to withstand noise from nearby motors.
  2. Input Circuit: The TX pin of the 3.3V sensor drives the photocoupler input. Calculate series resistor for IF = 10mA: RIN = (3.3V - 1.4V) / 0.01A = 190Ω. Use a 180Ω resistor. Connect anode (pin 1 or 4) to the resistor, cathode (pin 2 or 3) to sensor GND.
  3. Output Circuit: Supply VCC = 5V from the controller side. Place a 0.1 µF ceramic capacitor directly between pin 8 (VCC) and pin 5 (GND). Connect the output pin (6 or 7) to the RX pin of the 5V controller. A series resistor (e.g., 100Ω) may be added to limit current if needed, but is not strictly required for logic input.
  4. PCB Layout: Place the photocoupler straddling the isolation gap on the PCB. Ensure >8mm creepage/clearance (consult safety standards for 5000Vrms) between all input-side and output-side copper pours, components, and traces. Keep the bypass capacitor leads very short.
  5. Verification: With this setup, a logic HIGH (3.3V) from the sensor TX will turn on the LED, causing the output to go LOW (<0.6V), which the 5V controller reads as a logic LOW. The signal is inverted, which can be corrected in software if necessary.

9. Operating Principle

The EL263X operates on the principle of optical coupling. An electrical input signal drives an infrared Light Emitting Diode (LED). When forward-biased, the LED emits infrared light. This light traverses a transparent isolation barrier (typically a molded plastic gap). On the other side, a monolithic silicon photodetector and integrated circuit detect this light. The IC includes a high-gain amplifier, a Schmitt trigger for noise immunity, and a totem-pole output driver stage. The driver actively pulls the output pin HIGH (towards VCC) or LOW (towards GND) based on the presence or absence of light, creating a clean, buffered logic signal that is electrically isolated from the input. The isolation barrier provides high voltage withstand capability and prevents ground loops.

10. Technology Trends

Photocoupler technology continues to evolve. Trends relevant to devices like the EL263X include:

The EL263X series sits in a well-established performance bracket, offering a robust balance of speed, isolation strength, and noise immunity for a wide range of industrial and communication applications.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Zazzabin Launi) K (Kelvin), misali, 2700K/6500K Gyalang/ngyilang na gyalang, gyalang na gyalang na gyalang, gyalang na gyalang na gyalang. Gyalang na gyalang na gyalang na gyalang na gyalang.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Halin zazzabi na aiki a cikin LED chip. Kowane raguwar 10°C na iya ninka tsawon rayuwa; yana da yawa yana haifar da lalacewar haske, canjin launi.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. O nifẹ si iṣọkan awọ ninu awọn ayẹyẹ itansan.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.