LTE-C216R-14 Infrared Emitter and Detector Datasheet - 1206 Package - 850nm Wavelength - 60mA Current - Technical Documentation

1. Product Overview

LTE-C216R-14 wani tsari ne na fitarwa da gano hasken infrared (IR) da ake haɗawa a saman, wanda aka ƙera don haɗawa cikin ƙungiyoyin lantarki na zamani. Babban aikinsa shine fitarwa da gano hasken infrared mai tsayin zango na nanometer 850, wanda ya dace da aikace-aikacen firikwensin da yawa, canja wurin bayanai, da gano kusanci. Na'urar tana amfani da ƙunƙuntaccen fakitin 1206, wanda daidaitaccen girman fakitin EIA ne, yana tabbatar da dacewa mai yawa tare da hanyoyin ƙirƙira ta atomatik da tsarin PCB na yanzu.

Babban fa'idar wannan kayan aiki sun haɗa da dacewarsa da na'urorin haɗawa ta atomatik masu yawa, da kuma ƙarfin sa a cikin tsarin walda infrared na yau da kullun. Wannan ya sa ya zama zaɓi mai inganci don samarwa mai girma. Bugu da ƙari, ya bi ka'idodin RoHS (Ƙuntata Abubuwa Masu Cutarwa), yana cikin samfuran da suka dace da muhalli, wanda ke da mahimmanci ga shiga kasuwar duniya da bin ka'idojin muhalli.

Kasuwar da aka yi niyya don wannan na'urar ta ƙunshi kayan lantarki na masu amfani, sarrafa masana'antu, na'urorin sadarwa, da injinan ofis. Amintaccen sa da daidaitaccen kunsa sun sa ya zama ainihin kayan aiki mai amfani da yawa don masu ƙira waɗanda ke neman ingantaccen mafita na infrared.

2. Detailed Technical Parameters

2.1 Absolute Maximum Ratings

Operating any electronic component beyond its absolute maximum ratings may cause permanent damage. For the LTE-C216R-14, these limits are defined under the condition of an ambient temperature (T_A) of 25°C.

• Power consumption (P_DRadiation intensity (I100 mW. This is the maximum power that the device can safely dissipate as heat.
• Peak forward current (I_FP):800 mA. This is the maximum allowable instantaneous current, typically specified under pulse conditions (300 pulses per second, 10 μs pulse width) to prevent thermal overstress during short pulses.
• Continuous Forward Current (I_F):60 mA. This is the maximum DC current that can be continuously applied without degrading performance or lifetime.
• Reverse voltage (V_R):5 V. Applying a reverse bias voltage higher than this value may break down the semiconductor junction.
• Operating temperature range:-40°C to +85°C. The device is guaranteed to operate normally within this ambient temperature range.
• Temperature Range for Storage:-55°C to +100°C. No performance degradation will occur when components are stored within this range.
• Infrared Soldering Conditions:Capable of withstanding 260°C for 10 seconds continuously. This defines its tolerance to the Pb-free reflow soldering temperature profile.

2.2 Electrical and Optical Characteristics

Key performance parameters are measured at T_A=25°C and under specified test conditions, providing a benchmark for design calculations.

• Radiant Intensity (I_E):4 (minimum) to 13 (maximum) mW/sr, with typical value provided. Measured at a forward current (I_F) of 20 mA. This parameter quantifies the emitted optical power per unit solid angle (steradian).
• Peak Emission Wavelength (λ_Peak):850 nm (typical). This is the wavelength at which the emitter outputs maximum optical power. It is a key parameter for matching the spectral sensitivity of the photodetector.
• Spectral Line Half-Width (Δλ):50 nm (typical). This indicates the bandwidth of the emitted light, showing the distribution range of wavelengths around the peak.
• Forward voltage (V_F):1.6 V (typical), 2.0 V (maximum), at I_F= 50 mA condition. This is the voltage drop when the device is conducting. It is crucial for designing current limiting circuits.
• Reverse current (I_R):10 μA (maximum), at V_R= 5V condition. This is the small leakage current that flows when the device is reverse biased.
• Rise/Fall Time (T_r/T_f):30 ns (typical). This specifies the speed at which the optical output turns on and off (measured from 10% to 90% of the output), determining the maximum possible modulation speed for data transmission.
• Viewing Angle (2θ_1/2):75 degrees (typical). This is the full angle at which the radiation intensity drops to half of its maximum (on-axis) value. A wider angle provides broader spatial coverage but lower intensity at any specific point.

3. Performance Curve Analysis

Datasheet ya yi nuni zuwa ga madaidaicin halayen lantarki da na gani. Ko da yake ba a sake yin kwatancin takamaiman zane-zane a cikin rubutun ba, amma manufarsa ita ce samar da fahimtar kai tsaye game da halayen na'urar a yanayi daban-daban.

Waɗannan lanƙwasa yawanci sun haɗa da:

• I-V (Current-Voltage) curve:It shows the relationship between forward current and forward voltage, which is nonlinear for LEDs. This helps determine the dynamic resistance and the drive voltage required for the target current.
• Radiant Intensity vs. Forward Current:It illustrates how the optical output power increases with the drive current. It is typically linear within the operating range but may saturate at extremely high currents.
• Peak Wavelength vs. Temperature:Demonstrates how the emission wavelength shifts with junction temperature, which is critical for temperature-sensitive applications.
• Angular Distribution Pattern:Polar plot showing the spatial distribution of emitted light intensity.

Engineers use these curves to optimize designs, ensuring devices operate in their most efficient and reliable regions, and to predict performance under non-standard conditions.

4. Mechanical and Packaging Information

4.1 Package Dimensions

This component uses the standard 1206 package size. The datasheet provides detailed mechanical drawings, with all critical dimensions given in millimeters. Key dimensions include the overall length, width, and height of the component body, as well as the location and size of the device's own pads. Unless otherwise specified, the tolerance for these dimensions is typically ±0.10 mm. Adhering to these dimensions is crucial for successful PCB pad pattern design and automated assembly.

4.2 Recommended Land Pattern

The recommended pad layout for the PCB is provided. This layout aims to ensure reliable solder joint formation during reflow soldering, minimizing issues such as tombstoning (where one end of the component lifts) or insufficient solder. Following these recommended pad dimensions, which are typically slightly larger than the component's terminals to allow for proper solder fillet formation, is a best practice for achieving good manufacturability and long-term reliability.

4.3 Tape and Reel Packaging

For automated assembly convenience, components are supplied in 8mm tape on 7-inch diameter reels. Each reel contains 3000 pieces. The tape and reel specifications comply with the ANSI/EIA 481-1-A-1994 standard, ensuring compatibility with standard pick-and-place machines. The instructions note that empty component pockets are sealed with cover tape, and a maximum of two consecutive missing components ("lamps") per reel is allowed, which is the standard quality assurance for tape and reel packaging.

5. Soldering and Assembly Guide

5.1 Reflow soldering temperature profile

This device is suitable for infrared (IR) reflow soldering processes, particularly those using lead-free (Pb-free) solder. A recommended reflow soldering temperature profile is provided, with key parameters including a preheat stage (150-200°C), a maximum peak temperature of 260°C, and a time above liquidus (typically around 217°C for lead-free solder) not exceeding 10 seconds. The datasheet emphasizes that the optimal temperature profile depends on the specific PCB design, components, solder paste, and oven, and recommends using the JEDEC standard curve as a baseline while adhering to the solder paste manufacturer's specifications.

5.2 Manual soldering

If manual soldering is necessary, the soldering iron tip temperature should not exceed 300°C, and the contact time should be limited to a maximum of 3 seconds. This operation should be performed only once to prevent thermal damage to the plastic package and the internal semiconductor chip.

5.3 Cleaning

If post-soldering cleaning is required, only the specified cleaning agents should be used. The datasheet explicitly warns against using unspecified chemical liquids, as they may damage the package material. The recommended cleaning method includes immersing the LED in ethanol or isopropyl alcohol at room temperature for no more than one minute.

5.4 Storage and Handling

Haɗarin ɗanɗano shine muhimmin al'amari a cikin na'urorin da aka haɗa a saman. Ana jigilar LED a cikin jakar hana ɗanɗano tare da maganin bushewa. A cikin yanayin rufewa, ya kamata a adana shi a cikin yanayin ≤30°C kuma ƙarancin zafi (RH) ≤90%, kuma a yi amfani da shi cikin shekara guda. Da zarar an buɗe jakar asali, yanayin ajiya bai kamata ya wuce 30°C da 60% RH ba. Abubuwan da aka ciro daga jakar rufewa sun fi dacewa a yi musu walda ta sake kwarara cikin mako guda. Don ajiya na tsawon lokaci fiye da na asali a waje, dole ne a adana su a cikin akwati mai rufewa tare da maganin bushewa ko a cikin yanayin nitrogen. Abubuwan da aka adana fiye da mako guda a waje da jakar bushewa, suna buƙatar tsarin gasa (kimanin 60°C aƙalla sa'o'i 20) kafin walda don kawar da ɗanɗano da aka sha, don hana lalacewar "gwangwani" yayin sake kwararar walda.

6. Application Recommendations

6.1 Typical Application Scenarios

LTE-C216R-14 is suitable for general electronic devices. Common applications include:

• Proximity Sensor:It detects the presence or absence of an object by reflecting its infrared light.
• Photoelectric Switch:Interrupt infrared beams to detect motion or position.
• Data transmission:Implement simple infrared data links through modulation of drive current (e.g., remote controls, short-range serial communication).
• Object counting:Automated production line for objects blocking light beams.
• Integrated into office equipment, communication equipment, and household appliances.

The specification includes an important warning: For applications where failure could endanger life or health (aviation, medical equipment, security systems), consult the manufacturer before adopting the design.

6.2 Drive Circuit Design

It emphasizes a fundamental principle of using LEDs: they are current-driven devices. To ensure uniform brightness when driving multiple LEDs in parallel, the datasheet strongly recommends connecting an independent current-limiting resistor in series with each LED (Circuit Model A). This compensates for minor differences in the forward voltage (V_F) characteristics between different devices. Directly paralleling LEDs without independent resistors (Circuit Model B) is discouraged, as an LED with a slightly lower V_Fwill draw a disproportionately higher current, leading to uneven brightness and potentially overloading that device.

7. Technical Comparison and Differentiation

Although this independent datasheet does not provide a direct side-by-side comparison with other models, the key differentiating features of the LTE-C216R-14 can be inferred:

• Standardized Package (1206/EIA):Compared to proprietary packages, it offers design familiarity for easy direct replacement.
• Lead-free and RoHS compliant:Complies with modern environmental regulations, whereas older or niche components may not.
• Automation-friendly:Its tape and reel packaging, along with compatibility with pick-and-place machines and reflow soldering processes, make it highly suitable for cost-effective, high-volume manufacturing.
• Balanced Performance:A 75-degree viewing angle, 850nm wavelength, and 30ns speed provide a comprehensive set of features for general-purpose infrared applications.

8. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this infrared LED directly from a 5V microcontroller pin?
A: No. At 50mA, its typical forward voltage is 1.6V. Connecting it directly to a 5V pin would attempt to force a very high, destructive current through it. You must use a series current-limiting resistor. For example, to get 20mA from a 5V supply: R = (5V - 1.6V) / 0.02A = 170Ω (a standard 180Ω or 150Ω resistor can be used).

Q2: What is the maximum data rate achievable using this transmitter?
A: A rise/fall time of 30 ns indicates a theoretical maximum modulation bandwidth in the tens of MHz range. However, the practical data rate for reliable communication is lower, typically ranging from several hundred kbps to a few Mbps, depending on the drive circuit, detector, and environmental noise.

Q3: Why are the storage conditions after opening the bag so stringent (≤60% RH)?
A: Surface-mount plastic packages absorb moisture from the air. During high-temperature reflow soldering, this trapped moisture rapidly vaporizes, creating internal pressure that can lead to package cracking or internal connection delamination—a failure known as the "popcorn" effect. Strict storage conditions and baking requirements are implemented precisely to prevent this.

Q4: How to interpret the radiant intensity value (mW/sr)?
A: It measures optical power density. A value of 10 mW/sr means the device emits 10 milliwatts of optical power into a spatial cone of one steradian in its pointing direction. To calculate total power, this intensity must be integrated over the entire viewing angle (75 degrees, approximately 1.84 sr).

9. Design Case Studies

Scenario: Designing a paper presence sensor for a printer.
Objective:Check if there is paper in the paper feed tray.
Implementation Plan:Place the LTE-C216R-14 transmitter on one side of the paper path, and position the matching photodetector (or the detector section using similar components) directly opposite. When there is no paper, the infrared beam reaches the detector, generating a signal (e.g., logic high). When paper is present, it blocks the beam, causing the detector signal to drop (logic low).
Design Considerations:

• Current Setting:Drive the emitter with a series resistor at 20mA for stable, long-life output.
• Alignment:The 75-degree field of view provides a certain tolerance for mechanical alignment.
• Resistance to Ambient Light Interference:Since it uses modulated 850nm light, the system can be made resistant to ambient light interference by adding simple modulation/demodulation circuits or by using detectors with daylight filters.
• Welding:Follow the recommended reflow soldering temperature profile to ensure reliable connections on the PCB without damaging the components.

10. How It Works

Infrared Light Emitting Diode (IR LED) yana aiki bisa ka'idar haske ta lantarki a cikin kayan semiconductor. Lokacin da ake amfani da ƙarfin lantarki mai kyau akan haɗin p-n, electrons daga yankin n-type da ramuka daga yankin p-type ana shigar da su cikin yankin haɗin. Lokacin da waɗannan masu ɗaukar kaya suka haɗu, suna sakin makamashi. A cikin IR LED, an tsara tazarar band na semiconductor ta yadda makamashin da aka saki ya dace da photons a cikin bakan infrared (kimanin 850nm don wannan na'urar). Photons da aka samar suna fitarwa a matsayin haske. Aikin ganowa (idan ya dace da haɗin gwiwa) yana kishiyar haka: photons na infrared masu shigowa tare da isasshen makamashi suna haifar da nau'i-nau'i na electron-ramuka a cikin semiconductor na photodiode, suna haifar da igiyar haske da za a iya aunawa yayin da ake karkatar da su.

11. Technical Trends

Fannin photonics yana ci gaba da bunkasa. Trends masu alaƙa da abubuwan haɗin gwiwa kamar LTE-C216R-14 sun haɗa da:

• Integrated degree improvement:There is a tendency to integrate transmitters, detectors, and control logic (such as modulation drivers and signal conditioners) into a single package to simplify system design.
• Higher efficiency:Development of semiconductor materials and structures that can convert more electrical energy into light output, thereby reducing power consumption and heat generation.
• Miniaturization:Although the 1206 package is a standard size, to save PCB space in increasingly compact devices, smaller package sizes (e.g., 0805, 0603) are being promoted.
• Reliability Enhancement:Improve packaging materials and processes to withstand higher reflow soldering temperatures and harsher environmental conditions, extending product lifespan.
• Intelligent Sensing:Integrate basic intelligence at the component level, such as ambient light cancellation or digital output, to simplify interfacing with microcontrollers.

Wannan yanayin yana nufin samar da ƙarin aiki, amintacce, da sauƙin amfani da kayan aikin gaba na na'urorin lantarki.