Table of Contents
- 1. Product Overview
- 2. In-Depth Technical Parameter Analysis
- 2.1 Photometric Characteristics
- 2.2 Electrical Parameters
- 2.3 Thermal Characteristics
- 3. Binning System Explanation
- 3.1 Wavelength Binning
- 3.2 Forward Voltage Binning
- 4. Performance Curve Analysis
- 4.1 Current vs. Voltage (I-V) Curve
- 4.2 Temperature Characteristics
- 3.3 Spectral Distribution
- 5. Mechanical and Package Information
- 5.1 Dimension Drawing
- 5.2 Pad Layout Design (for SMD)
- 5.3 Polarity Identification
- 6. Soldering and Assembly Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Precautions
- 6.3 Storage Conditions
- 7. Packaging and Ordering Information
- 7.1 Packaging Specification
- 7.2 Packing Quantity
- 7.3 Labeling Information
- 7.4 Model Number Naming Rules
- 8. Application Recommendations
- 8.1 Typical Application Scenarios
- 8.2 Design Considerations
- 9. Technical Comparison
- 10. Frequently Asked Questions (FAQs)
- 11. Practical Use Cases
- 12. Principle Introduction
- 13. Development Trends
1. Product Overview
Wannan takarda tana ba da cikakkun bayanai na fasaha don kayan aikin infrared (IR) light-emitting diode (LED). Babban aikace-aikacen irin waɗannan sassa shine a cikin tsarin da ke buƙatar hanyoyin haske da ba a iya gani, kamar na'urorin sarrafa nesa, na'urori masu auna kusanci, hasken hangen dare, da watsa bayanai na gani. Babban fa'idar wannan takamammen sashi shine fitowar sa a mafi girman tsayin raƙuman 940nm, wanda ya dace da aikace-aikacen da ake son ƙarancin fitowar haske da ake iya gani, domin galibi ba a iya ganinsa da idon ɗan adam. Kasuwar da aka yi niyya ta haɗa da na'urorin lantarki na masu amfani, sarrafa masana'antu, tsarin tsaro, da aikace-aikacen motoci.
2. In-Depth Technical Parameter Analysis
The provided content specifies a key photometric parameter: the peak wavelength (λp). This is a critical specification for IR LEDs.
2.1 Photometric Characteristics
Peak Wavelength (λp): 940 nanometers (nm). O lea fa'amatalaga e fa'amatala ai le galu o lo'o fa'aolaina ai e le LED lona malosi fa'apitoa fa'apitoa. O le galu 940nm e pa'ū i totonu o le fusi fa'alatalata infrared. O lenei galu e masani ona fa'aoga ona o le silicon photodiodes, o lo'o masani ona maua i faiga IR, e maualuga le ma'ale'ale i lenei vaega. E le gata i lea, o le malamalama 940nm e itiiti le iloa o se susulu mumu vaivai pe a fa'atusatusa i galu IR pupuu e pei o le 850nm, ma ua avea ai ma mea e sili ona lelei mo le fa'amalamalamaga faalilolilo.
Analysis: O le filifiliga o le 940nm e fa'ailoa mai ai o lenei vaega ua fa'amanino mo le lelei i faiga e iloa ai e fa'aaoga ai masini silicon masani ma mo fa'aoga e mana'omia ai le maualalo o le fa'aleagaina o le malamalama va'aia. O le malosi fa'aola ma le va'aiga mata, fa'amatalaga fa'aopoopo masani, e le o tu'uina atu ae e taua tele mo le fuafuaina o le mamao aoga ma le vaega o lo'o ufiufi i se mamanu.
2.2 Electrical Parameters
Ko da ba'a lissafta ƙayyadaddun ƙimar wutar lantarki ta gaba (Vf), ƙimar wutar lantarki ta gaba (If), da ƙimar wutar lantarki ta baya (Vr) a cikin abin da aka tsinke, waɗannan muhimman abubuwa ne ga kowane LED. Dole ne masu ƙira su duba cikakken takardar bayanai don cikakkun ƙididdiga na iyaka da yanayin aiki na yau da kullun don tabbatar da aiki mai dogaro da tsawon rai. Wuce iyakar ƙimar wutar lantarki ta gaba shine babban dalilin gazawar LED saboda yawan zafi.
2.3 Thermal Characteristics
Thermal management is paramount for LED performance and lifespan. Key parameters include the thermal resistance from the junction to the ambient air (RθJA) and the maximum junction temperature (Tj max). Efficient heat sinking through the LED's package and the printed circuit board (PCB) is necessary to maintain Tj within safe limits, especially when operating at high currents or in elevated ambient temperatures.
3. Binning System Explanation
LED manufacturing involves natural variations. A binning system categorizes components based on key parameters to ensure consistency within a production batch.
3.1 Wavelength Binning
For an IR LED, the peak wavelength is the primary binning parameter. Components might be sorted into bins with a tight tolerance around the nominal 940nm (e.g., 935nm to 945nm). This ensures that all LEDs in a system have nearly identical emission characteristics, which is critical for the performance of optical filters and sensor tuning in the receiver.
3.2 Forward Voltage Binning
LEDs are also binned by forward voltage (Vf) at a specified test current. Grouping LEDs with similar Vf values helps in designing driver circuits, particularly when multiple LEDs are connected in series, to ensure uniform current distribution and brightness.
4. Performance Curve Analysis
Graphical data is essential for understanding component behavior under various conditions.
4.1 Current vs. Voltage (I-V) Curve
The I-V curve shows the relationship between the forward voltage and the current through the LED. It is non-linear. The "knee" voltage is the approximate point where the LED begins to conduct significantly and emit light. The curve's slope in the operating region helps determine the dynamic resistance of the LED.
4.2 Temperature Characteristics
LED performance is temperature-dependent. Typically, the forward voltage (Vf) decreases as the junction temperature increases. Conversely, the luminous intensity or radiant power also decreases with rising temperature. Graphs showing relative intensity vs. junction temperature and forward voltage vs. temperature are critical for designing circuits that compensate for thermal effects.
3.3 Spectral Distribution
A spectral distribution graph plots radiant power against wavelength. For a 940nm LED, this graph would show a dominant peak at or near 940nm with a certain spectral bandwidth (e.g., Full Width at Half Maximum - FWHM). A narrower FWHM indicates a more monochromatic light source, which can be important for applications using optical filters.
5. Mechanical and Package Information
The excerpt mentions packaging types but not the specific LED package (e.g., 5mm, 3mm, surface-mount device like 0805 or 1206). A complete datasheet would include a detailed mechanical drawing.
5.1 Dimension Drawing
A dimensioned diagram is required, showing the length, width, height, lead spacing (for through-hole), or pad dimensions (for SMD). Tolerances for all dimensions must be specified.
5.2 Pad Layout Design (for SMD)
For surface-mount packages, a recommended PCB land pattern (footprint) is provided. This includes the size, shape, and spacing of the copper pads to ensure proper soldering and mechanical stability.
5.3 Polarity Identification
Hanyoyin gano anode da cathode dole a bayyana a sarari. Ga LEDs masu rami, cathode yawanci shine gajeren jagora ko jagora kusa da wuri mai lebur a kan ruwan tabarau. Ga SMD LEDs, alamar kamar digo, tsaga, ko kusurwa mai inuwa akan kunshin tana nuna cathode.
6. Soldering and Assembly Guidelines
6.1 Reflow Soldering Profile
For SMD components, a detailed reflow profile is necessary. This includes preheat temperature and time, soak time, peak temperature, time above liquidus (TAL), and cooling rate. Adherence to this profile prevents thermal shock and ensures reliable solder joints.
6.2 Precautions
General precautions include: avoiding mechanical stress on the LED lens, using ESD protection during handling (as LEDs are sensitive to electrostatic discharge), and ensuring no contamination on the optical surface. For through-hole parts, lead bending should be done at a sufficient distance from the package body.
6.3 Storage Conditions
LEDs should be stored in a cool, dry environment, typically within a specified temperature and humidity range. They are often supplied in moisture-sensitive packaging with a desiccant, and may require baking before use if the packaging has been opened for an extended period.
7. Packaging and Ordering Information
The PDF excerpt explicitly lists packaging elements, which is a key part of the provided content.
7.1 Packaging Specification
The packaging hierarchy is defined as:
- Electrostatic Bag: The primary container, designed to protect the components from electrostatic discharge (ESD) and moisture.
- Inner Carton: A box or tray that holds multiple ESD bags or reels of components.
- Outside Carton: The master shipping carton containing multiple inner cartons.
7.2 Packing Quantity
The specific quantity of LED components per ESD bag, per inner carton, and per outside carton must be specified. Common quantities are in multiples of 1000, 2000, or 5000 pieces for SMD parts on reels, or specific counts for bulk packaging.
7.3 Labeling Information
Each packaging level should have a label indicating the part number, quantity, date code, lot number, and ESD/moisture sensitivity level (MSL).
7.4 Model Number Naming Rules
The full part number typically encodes key attributes. For example, a model number might indicate the package size, peak wavelength, viewing angle, and flux bin. A code like "IR940-45D" could imply an IR LED, 940nm, 45-degree viewing angle, and a specific radiant intensity bin 'D'.
8. Application Recommendations
8.1 Typical Application Scenarios
This 940nm IR LED is suitable for:
- Infrared Remote Controls: For TVs, audio systems, and set-top boxes.
- Proximity and Presence Sensors: In smartphones, appliances, and automatic faucets.
- Night Vision Illumination: Paired with IR-sensitive cameras in security and surveillance systems.
- Optical Switches and Encoders: For detecting position or rotation.
- Data Transmission: In IrDA-compliant devices for short-range wireless communication.
8.2 Design Considerations
Driver Circuit: A constant current source is recommended over a voltage source with a series resistor for stable output, especially over temperature variations. The driver must be rated for the LED's forward current.
Optical Design: The lens or cover material between the LED and the target must be transparent to 940nm light. Many plastics are suitable, but some types of glass or tinted materials may attenuate the signal.
Heat Sinking: Ensure adequate PCB copper area or an external heatsink if operating at high continuous currents.
Receiver Matching: The photodetector (e.g., phototransistor, photodiode) should have peak sensitivity around 940nm. An optical filter matched to the LED's spectrum can improve signal-to-noise ratio by blocking ambient light.
9. Technical Comparison
Compared to other IR LEDs, a 940nm component offers specific advantages and trade-offs.
vs. 850nm IR LEDs: 850nm LEDs often provide slightly higher radiant output for the same electrical input due to better material efficiency at that wavelength. However, 850nm emits a faint red glow that can be visible in dark conditions, which may be undesirable for covert applications. 940nm is virtually invisible, making it superior for discreet illumination.
vs. Visible LEDs: The primary differentiator is the wavelength. IR LEDs enable functionality invisible to users, allowing for features like automatic operation (sensors) or control (remotes) without emitting distracting light.
10. Frequently Asked Questions (FAQs)
Q: Why is the peak wavelength 940nm important?
A: It matches the high sensitivity range of common silicon photodetectors while minimizing visible light emission, making it ideal for sensor and covert illumination applications.
Q: How do I drive this LED?
A: Yi amfani da da'irar direban halin yanzu na akai-akai. Aiwatar da sauƙi shine tushen ƙarfin lantarki tare da resistor mai iyakancewar halin yanzu, wanda aka ƙididdige ta amfani da ƙimar gaba na yau da kullun na LED (Vf) da kuma halin yanzu na gaba da ake so (If) daga cikakken bayanan bayanai: R = (Vsource - Vf) / If.
Q: Zan iya ganin hasken daga wannan LED?
A: Tsawon raƙuman 940nm yana waje da bakan gani ga yawancin mutane. Wasu mutane na iya ganin haske mai zurfi mai ja a ƙarƙashin yanayi masu duhu sosai, amma galibi ba a iya gani. Kamarar wayar hannu, duk da haka, yawanci tana iya ganin ta a sarari, kamar yadda na'urori masu ɗaukar hoto suke da hankali ga kusa-IR.
Q: Menene manufar jakar electrostatic?
A: It protects the LED from electrostatic discharge (ESD), which can damage the semiconductor junction even if the discharge is not felt by a person.
11. Practical Use Cases
Case Study 1: Automatic Soap Dispenser. A 940nm IR LED is paired with a phototransistor to create a proximity sensor. The LED constantly emits an invisible beam. When a hand interrupts the beam, the change in detected light triggers the pump motor. The 940nm wavelength ensures the operation is seamless and without any visible light indication.
Case Study 2: Long-Range TV Remote. An array of 940nm LEDs is used in a universal remote control. The high radiant intensity (ensured by proper binning and drive current) allows the signal to reach the TV sensor from wide angles and longer distances. The lack of visible light prevents distraction in a dark home theater.
12. Principle Introduction
Infrared Light Emitting Diode (IR LED) diode ne na semiconductor p-n junction. Lokacin da aka yi amfani da shi a hanyar gaba, electrons daga yankin n suna haɗuwa da ramuka daga yankin p a cikin yankin aiki. Wannan tsarin haɗuwa yana sakin makamashi a cikin nau'in photons (haske). Takamaiman tsayin raƙuman ruwa na photons da aka fitar an ƙaddara shi ta hanyar makamashin bandgap na kayan semiconductor da aka yi amfani da su wajen gina LED (yawanci aluminum gallium arsenide - AlGaAs don 940nm). Babban bandgap yana haifar da gajeren tsayin raƙuman ruwa (haske mai shuɗi), kuma ƙaramin bandgap yana haifar da tsayin raƙuman ruwa (ja ko infrared haske). Fitar 940nm sakamako ne kai tsare na injiniyan abun da ke cikin semiconductor don cimma wannan takamaiman makamashin bandgap.
13. Development Trends
The field of IR LEDs is driven by demands for higher efficiency, smaller packages, and greater integration.
Increased Efficiency: Research focuses on improving the internal quantum efficiency (the percentage of electron-hole recombinations that produce photons) and the light extraction efficiency (getting the generated photons out of the semiconductor material). This leads to higher radiant output for the same electrical input, enabling longer battery life in portable devices.
Miniaturization: The trend towards smaller consumer electronics drives the development of IR LEDs in ever-smaller surface-mount packages (e.g., 0402, 0201 metric sizes) while maintaining or improving performance.
Integrated Solutions: There is a move towards combining the IR LED, photodetector, and control logic into a single module or chip. This simplifies design for end-users, reduces PCB footprint, and improves system reliability by ensuring matched optical characteristics.
New Wavelengths: While 850nm and 940nm dominate, other wavelengths are being developed for specialized applications, such as spectroscopy, gas sensing, and optical communications using plastic optical fibers.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), misal, 2700K/6500K | Hasara/raraya haske, ƙananan ƙimomi suna da rawaya/dumi, mafi girma fari/sanyi. | Yana ƙayyade yanayin haske da yanayin da ya dace. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Halin zazzabi aiki na ainihi a cikin guntun LED. | Kowane raguwa na 10°C na iya ninka tsawon rayuwa; yana da yawa yana haifar da lalacewar haske, canjin launi. |
| Kupungua kwa Lumen | L70 / L80 (masaa) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | An rarrabe ta hanyar kewayon ƙarfin lantarki na gaba. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | An rarraba ta hanyar daidaitawar launi, tabbatar da kewayon matsi. | Yana ba da tabbacin daidaiton launi, yana guje wa rashin daidaiton launi a cikin na'urar. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Standard ya kukadiria maisha | Inakadiria maisha chini ya hali halisi kulingana na data ya LM-80. | Inatoa utabiri wa kisayansi wa maisha. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Takardun muhalli | Tabbatar da babu abubuwa masu cutarwa (dariya, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |