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LTR-516AD Phototransistor Datasheet - Dark Green Package - 30V Reverse Voltage - 150mW Power Dissipation - Technical Documentation

Complete technical specifications and performance data for the LTR-516AD phototransistor. This device features high sensitivity to infrared radiation, fast switching characteristics, and utilizes a dark green package to block visible light.
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PDF Document Cover - LTR-516AD Phototransistor Datasheet - Deep Green Package - 30V Reverse Voltage - 150mW Power Dissipation - Technical Documentation

1. Product Overview

LTR-516AD is a high-performance silicon NPN phototransistor specifically designed for detecting infrared radiation. Its core function is to convert incident infrared light into an electrical current. A key feature of this component is its special dark green plastic package, which is designed to filter out most of the visible light spectrum. This makes it particularly suitable for application scenarios where the sensor must primarily respond to infrared signals, minimizing interference from ambient visible light. The device combines high photosensitivity, low junction capacitance, and fast switching times, making it an ideal choice for various infrared sensing and communication systems.

2. In-depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

To ensure reliability and prevent damage, this device is rated to operate within specific environmental and electrical limits. At an ambient temperature (TA) of 25°C, the maximum power dissipation is 150 mW. It can withstand a reverse voltage (VR). The operating temperature range is -40°C to +85°C, while the storage temperature range is -55°C to +100°C. For assembly, the pins can be soldered at 260°C for a maximum duration of 5 seconds, with the solder point at least 1.6mm away from the package body.

2.2 Electrical and Optical Characteristics

All electrical and optical parameters are specified at TA= 25°C. Under reverse current (I(BR)R) is 100µA, the reverse breakdown voltage (VR) is typically 30V. The reverse dark current (ID(R)), which is the leakage current when no light is incident, reaches a maximum of 30 nA at VR= 10V. Under an irradiance (Ee) of 0.5 mW/cm² from a 940nm light source, the phototransistor generates an open-circuit voltage (VOC). Its dynamic performance characteristics are manifested as, at Vr=10V, 940nm pulse, and 1 kΩ load resistance test conditions, the rise and fall times (Tf, TR) are each 50 nanoseconds. The short-circuit current (IS) is the key indicator for measuring sensitivity, at VR=5V, λ=940nm, and Ee=0.1 mW/cm², the typical value is 2 µA. The summary capacitance (CT) at VR=3V and 1 MHz is a maximum of 25 pF. The peak spectral sensitivity wavelength (λSMAX) is 900 nm.

3. Performance Curve Analysis

The datasheet provides several characteristic curves crucial for circuit design. Figure 1 plots the dark current (ID) versus reverse voltage (VR), showing the device's leakage behavior in darkness. Figure 2 illustrates how the junction capacitance (CT) decreases with increasing reverse voltage, which is very important for high-frequency applications. Figure 3 shows the variation of photocurrent with ambient temperature, indicating that the sensor's output may drift with temperature changes. Figure 4 similarly plots dark current versus temperature. Figure 5 is the relative spectral sensitivity curve, graphically confirming the peak response at 900nm and the effectiveness of the dark green package in attenuating sensitivity in the visible light range. Figure 6 shows the photocurrent (Ip) versus infrared irradiance (Ee) arasındaki doğrusal ilişkiyi göstermektedir. Şekil 7, hassasiyetin açıya bağımlılığını gösteren bir kutupsal diyagramdır. Şekil 8, ortam sıcaklığı 25°C'yi aştığında izin verilen maksimum toplam güç tüketiminin nasıl düşürüleceğini ayrıntılı olarak açıklamaktadır.

4. Mechanical and Packaging Information

LTR-516AD uses a special dark green plastic package. Key dimension specifications include: all dimensions are in millimeters, with a general tolerance of ±0.25mm unless otherwise specified. The maximum resin protrusion under the flange is 1.5mm. Pin pitch is measured at the point where the pins extend from the package body. This package is designed for through-hole mounting. The dark green color is an integral part of its function, acting as a visible light filter to improve the signal-to-noise ratio for infrared detection.

5. Soldering and Assembly Guide

Don tabbatar da amincin walda, bin ƙa'idodin yanayi daidai yana da mahimmanci. Ya kamata a yi wa fil ɗin walda a zafin jiki na 260°C, ba wuce daƙiƙa 5 ba. Dandalin walda dole ne ya kasance aƙalla 1.6mm (0.063 inci) daga jikin kullin filastik, don hana lalacewar zafi ga guntuwar semiconductor da kullin filastik. Idan aka bi matsanancin zafi da lokaci daidai, ana iya amfani da daidaitattun fasahohin walda na igiyar ruwa ko na hannu. Bayyanawa na tsawon lokaci ga zafin jiki fiye da iyakar da aka ƙayyade zai iya rage aiki ko haifar da gazawa ta dindindin.

6. Application Recommendations

6.1 Typical Application Scenarios

LTR-516AD is very suitable for various infrared-based applications. These applications include object detection and proximity sensing in automation and security systems, slot sensors in printers and vending machines, non-contact switches, and infrared data communication links (such as old IRDA interfaces). Its fast switching time makes it suitable for systems that require fast pulse detection.

6.2 Design Considerations

When designing with this phototransistor, several factors must be considered. First, the operating point should be selected based on the required sensitivity and speed; a higher reverse voltage typically reduces capacitance and increases speed but raises the dark current. The load resistor (RL) value is a critical design choice: a larger RLprovides a higher voltage output but slows the response time (increases the RC time constant). The dark green package reduces interference from ambient visible light, but designers should still consider the infrared background in the application environment. For stable operation under temperature variations, the changes shown in Figure 3 and Figure 4 should be considered, potentially necessitating temperature compensation in the signal conditioning circuit.

7. Technical Comparison and Differentiation

The primary differentiating feature of the LTR-516AD is its deep green package, specifically designed to suppress visible light, which is not common among all standard phototransistors. This gives it a significant advantage in environments with fluctuating visible light. Its combination of parameters—a relatively high short-circuit current (typical 2 µA), low capacitance (max 25 pF), and fast switching time (50 ns)—makes it a well-balanced component suitable for high-sensitivity and moderate high-speed applications. Compared to photodiodes, phototransistors like the LTR-516AD provide internal gain, resulting in higher output current for the same light input and simplifying subsequent amplification stages.

8. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the purpose of the dark green package?
A: The dark green plastic acts as a built-in optical filter. It significantly attenuates wavelengths in the visible spectrum while allowing infrared light (especially near 900-940nm) to pass through. This minimizes the sensor's response to ambient indoor light, sunlight, or other visible light sources, making it more reliable for detecting dedicated infrared signals.

Q: How to understand "Short-Circuit Current (IS)" parameters?
Answer: ISis under the condition of collector and emitter short-circuit (VCEIt is measured under the condition of zero bias voltage (V = 0V). It represents the photogenerated current per unit irradiance under specific test conditions (940nm, 0.1 mW/cm²). In your circuit, when a load resistor or bias voltage is applied, the actual output current will be less than IS, but ISis a key indicator for comparing the fundamental sensitivity of different devices.

Q: Why are rise time and fall time important?
A: These parameters (Trand Tf) define the phototransistor's response speed to changes in light intensity. A value of 50 ns means the device can theoretically handle signal frequencies up to several megahertz, making it suitable for pulsed infrared systems, data transmission, or high-speed counting applications.

Q: How does temperature affect performance?
A: As shown by the curve, both the dark current (noise) and the photocurrent (signal) increase with rising temperature. The increase in dark current can be significant and may elevate the noise floor. Designers must ensure the signal conditioning circuit can handle this variation, especially when the device operates across the full temperature range from -40°C to +85°C.

9. Practical Design Cases

Consider designing a simple infrared object detection circuit. The LTR-516AD is paired with an infrared LED emitter. The phototransistor is connected in a common-emitter configuration: the collector is connected to the supply voltage (e.g., 5V) through a load resistor RL, and the emitter is grounded. When no object is present, infrared light from the LED reaches the phototransistor, causing it to conduct and pulling the collector voltage (VOUT) is pulled low. When an object interrupts the beam, the phototransistor turns off, and VOUTgoes high. RLmust be chosen based on the required output voltage swing and speed. For a 5V supply and typical IS=2µA, when illuminated, the 10 kΩ RLproduces a voltage drop of approximately 20 mV, which is quite small. Therefore, an operational amplifier comparator stage is typically added after the phototransistor to provide a clean digital output. The dark green package helps suppress ambient light, enabling the system to operate robustly under various lighting conditions.

10. Working Principle

A phototransistor is essentially a bipolar junction transistor (BJT) whose base current is generated by light rather than supplied electrically. In the LTR-516AD (NPN type), incident photons with energy greater than the silicon bandgap generate electron-hole pairs in the base-collector junction region. These photogenerated carriers are swept out by the electric field, effectively creating a base current. This base current is then amplified by the transistor's current gain (β), resulting in a much larger collector current. The device typically operates with the base terminal left floating or disconnected, and a reverse bias is applied across the collector-base junction to widen the depletion region, thereby improving sensitivity and speed.

11. Industry Trends

The field of optical sensing continues to evolve. There is a trend towards integration, combining photodetectors, amplifiers, and digital logic onto a single chip (e.g., integrated ambient light sensors, proximity sensors). For automated assembly, surface-mount device (SMD) packages are becoming increasingly prevalent over through-hole types. Materials and designs are also advancing to improve sensitivity, reduce noise (dark current), and extend spectral range. However, discrete components like the LTR-516AD remain crucial for applications requiring specific performance characteristics, customized optical paths, or high-voltage handling capabilities, which may not be available in integrated solutions. The principle of using filtered packages to achieve specific spectral responses remains a common and effective design practice.

Detailed Explanation of LED Specification Terminology

Complete Explanation of LED Technical Terminology

I. Core Indicators of Photoelectric Performance

Terminology Unit/Representation Popular Explanation Why It Matters
Luminous Efficacy lm/W The luminous flux emitted per watt of electrical power, the higher the more energy efficient. Directly determines the energy efficiency rating and electricity cost of the lighting fixture.
Luminous Flux lm (lumen) Total light output from a light source, commonly known as "brightness". Determines if a luminaire is bright enough.
Viewing Angle ° (degrees), e.g., 120° The angle at which luminous intensity drops to half, determining the beam width. Affects the illumination range and uniformity.
Color Temperature (CCT) K (Kelvin), such as 2700K/6500K The color temperature of light; lower values are yellowish/warm, higher values are whitish/cool. Determines the lighting ambiance and suitable application scenarios.
Color Rendering Index (CRI / Ra) Unitless, 0–100 The ability of a light source to restore the true color of an object, Ra≥80 is recommended. Affects color authenticity, used in high-demand places such as shopping malls and art galleries.
Color tolerance (SDCM) MacAdam ellipse steps, e.g., "5-step" A quantitative indicator of color consistency; a smaller step number indicates better color consistency. Ensure no color variation among luminaires from the same batch.
Dominant Wavelength nm (nanometer), e.g., 620nm (red) Rangi ya LED ya rangi inayolingana na thamani ya urefu wa wimbi. Inaamua rangi ya LED ya rangi moja kama nyekundu, manjano, kijani, n.k.
Spectral Distribution Wavelength vs. Intensity Curve Shows the intensity distribution of light emitted by an LED at each wavelength. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbol Popular Explanation Design Considerations
Forward Voltage Vf The minimum voltage required to light up an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf, and the voltage accumulates when multiple LEDs are connected in series.
Forward Current If The current value that makes the LED emit light normally. Constant current drive is often used, as current determines brightness and lifespan.
Maximum Pulse Current (Pulse Current) Ifp Peak current that can be withstood for a short period, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur.
Reverse Voltage Vr The maximum reverse voltage that an LED can withstand; exceeding this may cause breakdown. The circuit must be protected against reverse connection or voltage surges.
Thermal Resistance Rth (°C/W) The resistance to heat transfer from the chip to the solder joint; a lower value indicates better heat dissipation. High thermal resistance requires a stronger heat dissipation design; otherwise, the junction temperature will increase.
Electrostatic Discharge Immunity (ESD Immunity) V (HBM), e.g., 1000V ESD strike resistance, the higher the value, the less susceptible to ESD damage. Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Key Indicators Popular Explanation Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, the lifespan may double; excessively high temperatures lead to lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) Time required for brightness to drop to 70% or 80% of its initial value. Directly define the "useful life" of an LED.
Lumen Maintenance % (e.g., 70%) The percentage of remaining brightness after a period of use. Characterization of luminance maintenance capability after long-term use.
Color Shift Δu′v′ or MacAdam ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Material performance degradation Degradation of packaging materials due to prolonged high temperatures. May lead to decreased brightness, color shift, or open-circuit failure.

IV. Packaging and Materials

Terminology Common Types Popular Explanation Features and Applications
Package Types EMC, PPA, Ceramic The housing material that protects the chip and provides optical and thermal interfaces. EMC has good heat resistance and low cost; ceramic has excellent heat dissipation and long lifespan.
Chip structure Front side, Flip Chip Chip electrode arrangement method. Flip Chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating YAG, silicate, nitride Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical Design Planar, microlens, total internal reflection Optical structure on the encapsulation surface, controlling light distribution. Determines the emission angle and light distribution curve.

V. Quality Control and Binning

Terminology Binning Content Popular Explanation Purpose
Luminous Flux Binning Codes such as 2G, 2H Group by brightness level, each group has a minimum/maximum lumen value. Ensure consistent brightness for products within the same batch.
Voltage binning Codes such as 6W, 6X Grouped by forward voltage range. Facilitates driver power matching and improves system efficiency.
Color binning. 5-step MacAdam ellipse Group by color coordinates to ensure colors fall within an extremely small range. Ensure color consistency and avoid color unevenness within the same luminaire.
Color temperature binning 2700K, 3000K, etc. Group by color temperature, each group has a corresponding coordinate range. Meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standard/Test Popular Explanation Significance
LM-80 Lumen Maintenance Test Long-term operation under constant temperature conditions, recording brightness attenuation data. Used for estimating LED lifespan (in conjunction with TM-21).
TM-21 Life Extrapolation Standard Estimating lifespan under actual use conditions based on LM-80 data. Providing scientific life prediction.
IESNA Standard Illuminating Engineering Society Standard Covering optical, electrical, and thermal testing methods. Industry-recognized testing basis.
RoHS / REACH Environmental Certification Ensure products are free from hazardous substances (e.g., lead, mercury). Conditions for market entry into the international market.
ENERGY STAR / DLC Energy efficiency certification Energy Efficiency and Performance Certification for Lighting Products. Commonly used in government procurement and subsidy programs to enhance market competitiveness.