BR15-22C/L586/R/TR8 SMD LED Datasheet - Package Size 3.2x1.6x1.1mm - Voltage 1.3-2.6V - Power 100-125mW - Infrared 905nm and Red Light 660nm - Technical Documentation

1. Product Overview

BR15-22C/L586/R/TR8 is a dual-emitter surface-mount device (SMD) LED that integrates an infrared (IR) and a red light-emitting diode within a miniature top-view flat package. The device employs a transparent plastic encapsulation, enabling efficient light transmission. Its key design feature is the matching of its spectral output with the sensitivity characteristics of silicon photodiodes and phototransistors, making it an ideal light source for optical sensing and detection systems.

该元件的核心优势包括低正向电压，这有助于提高电路设计的能效。它采用无铅（Pb-free）制造，并符合RoHS、欧盟REACH和无卤素标准（Br <900ppm， Cl <900ppm， Br+Cl <1500ppm）等主要环保法规，确保其适用于现代注重环保的电子制造。

Its primary target markets and applications are infrared application systems, such as proximity sensors, object detection, encoders, and other optoelectronic interfaces requiring reliable and matched light emission.

2. Detailed Technical Parameters

2.1 Absolute Maximum Ratings

These ratings define the limits that may cause permanent damage to the device. Operation under these conditions is not guaranteed.

• Continuous Forward Current (IF): Both the IR and red light chips are 50 mA.
• Reverse Voltage (VR): 5 V. Exceeding this value may cause junction breakdown.
• Operating Temperature (Topr):-40°C to +85°C. This defines the ambient temperature range for reliable operation.
• Storage temperature (Tstg):-40°C to +100°C.
• Soldering temperature (Tsol): Maximum 260°C, duration not exceeding 5 seconds. This is crucial for the reflow soldering assembly process.
• Pc: For free air temperature ≤25°C, 100 mW for the infrared emitter and 125 mW for the red light emitter. This parameter is critical for thermal management design.

2.2 Electro-Optical Characteristics

These are typical performance parameters measured at Ta=25°C, providing expected behavior under normal operating conditions.

• Radiant Intensity (IE): For infrared emitters (BR), the typical value is 0.50 mW/sr at IF=20mA. For red light emitters, it is 1.50 mW/sr at the same current. This measures the light power emitted per unit solid angle.
• Peak Wavelength (λp): The peak wavelength for infrared emitters is 905 nm, while for red light emitters it is 660 nm. This defines the dominant color of the emitted light.
• Spectral Bandwidth (Δλ): Both emitters are approximately 30 nm, indicating the wavelength distribution range around the peak wavelength.
• Forward Voltage (VF)At IF=20mA, the typical VF for the infrared chip is 1.30V (max 1.80V), and for the red chip it is 1.80V (max 2.60V). Low VF is a key characteristic for improving energy efficiency.
• Reverse Current (IR)At VR=5V, the maximum reverse current for both chips is 10 µA, indicating the leakage current in the off state.
• Viewing Angle (2θ1/2): 140 degrees. This wide viewing angle is characteristic of top-view lensless packages, providing a broad emission range.

3. Performance Curve Analysis

3.1 Infrared Emitter (905nm) Characteristics

The provided chart illustrates the relationship between key parameters of the infrared chip.Radiant Intensity vs. Forward CurrentThe curve shows that the optical output increases nearly linearly with current until the maximum rating is reached.Forward Current and Forward VoltageThe curve demonstrates the exponential I-V relationship of a diode, which is crucial for designing current-limiting circuits.Spectral DistributionThe graph confirms the peak at 905nm and its defined bandwidth.Forward Current vs. Ambient TemperatureThe curve is crucial for understanding derating requirements; as temperature increases, the maximum allowable continuous current decreases to prevent overheating.

3.2 Red Light Emitter (660nm) Characteristics

Similar curves are provided for the red light emitter. Notably, its radiant intensity is higher than that of the infrared emitter at a given current. The spectral diagram shows a sharp peak at 660nm in the visible red light spectrum. Its electrical characteristics (IV curve) follow the same diode law, but the typical forward voltage is higher.

3.3 Angular Characteristics

Referred to a chart namedRelative photocurrent versus angular displacement. This curve is crucial for application design, showing how the intensity perceived by the detector varies with the angle between the LED and the detector. The 140-degree viewing angle is defined as the angle at which the intensity drops to half of its axial value.

4. Mechanical and Packaging Information

4.1 Package Dimensions

The device employs a compact SMD package. Key dimensions (unit: mm) include a body length of approximately 3.2, a width of 1.6, and a height of 1.1. The detailed drawing specifies the pad layout, component outline, and tolerances (typically ±0.1mm unless otherwise noted), which are crucial for PCB pad design.

4.2 Polarity Identification

The package includes markings or specific pad designs (typically a notch or a dot) to indicate the cathode. Correct polarity identification during assembly is essential to prevent damage from reverse bias.

4.3 Carrier Tape and Reel Specifications

The product is supplied in carrier tape and reel form for automated assembly. Carrier tape dimensions are specified, and the standard reel contains 2000 devices. This information is necessary for setting up the pick-and-place machine.

5. Soldering and Assembly Guide

5.1 Storage and Handling

LEDs are sensitive to moisture. Precautions include: Keep the sealed moisture barrier bag unopened before use; Store unopened bags at ≤30°C/90%RH and use within one year; After opening, store at ≤30°C/60%RH and use within 168 hours (7 days). If the storage time is exceeded, baking at 60±5°C for at least 24 hours is required.

5.2 Reflow Soldering

It is recommended to use a lead-free solder temperature profile. Reflow soldering should not exceed two cycles to avoid thermal stress. During the heating process, no mechanical stress should be applied to the LED body. The PCB should not warp after soldering.

5.3 Manual Welding

If manual soldering is necessary, use a soldering iron with a tip temperature below 350°C, heat each pin for no more than 3 seconds, and use an iron with a power rating of 25W or lower. Allow a cooling interval of more than 2 seconds between soldering each pin.

5.4 Rework and Repair

Repair after soldering is not recommended. If unavoidable, use a dual-tip soldering iron to heat two pins simultaneously to minimize thermal stress on the package. The potential for damage to LED characteristics must be evaluated beforehand.

6. Application Suggestions and Design Considerations

6.1 Typical Application Circuit

The most critical design rule isOvercurrent protectionAn external current-limiting resistor must be used. Due to the exponential IV characteristic of the diode, a small increase in voltage can lead to a large, destructive increase in current. The resistor value must be calculated using the formula based on the supply voltage (Vs), the required forward current (If), and the LED's forward voltage (Vf): R = (Vs - Vf) / If. If driving the infrared and red emitters independently, separate resistors are required.

6.2 Thermal Management

Although the power consumption is low, a reasonable PCB layout helps with heat dissipation. Ensure that the copper foil area connected to the thermal pad (if present) or device pins is sufficient. Follow the power derating guidelines implied by the maximum ratings—reduce the forward current when operating at high ambient temperatures.

6.3 Optical Design

For applications requiring wide coverage, its 140-degree wide viewing angle can be utilized. For longer distances or more directional sensing, external lenses or reflectors may be required. Clear lenses are suitable for applications that require precise chip emission patterns and do not require color filtering.

7. Technical Comparison and Differentiation

The main differentiation of BR15-22C/L586/R/TR8 lies in itsDual-wavelength capabilityIntegrated into a single compact SMD package. This saves board space compared to using two separate LEDs. ItsSpectral match with silicon detectorsAfter optimization, it may improve the signal-to-noise ratio in sensing applications.Low forward voltage, especially for infrared emitters, provides energy efficiency advantages. Compliance with strict environmental standards (RoHS, REACH, halogen-free) makes it suitable for a wide range of global markets.

8. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive the infrared and red LEDs simultaneously at their respective maximum currents of 50mA each?
A: No. The absolute maximum continuous forward current rating for each chip is 50mA. Driving both at 50mA simultaneously may exceed the total power dissipation limit (Pc) of the package and cause overheating. The drive current must be derated based on the total power and thermal conditions.

Q: Why is the current limiting resistor absolutely necessary?
A: LEDs are current-driven devices. Their forward voltage varies slightly with current and temperature. Connecting them directly to a voltage source (even a regulated one) causes current to rise uncontrollably until the device is damaged, as there is no internal resistance to limit it. The resistor provides a stable, predictable current.

Q: What does "spectral matching to silicon photodetectors" mean?
A: Silicon photodiodes and phototransistors have specific spectral response curves; they are most sensitive to certain wavelengths (typically in the near-infrared and red regions). The peak wavelengths of these LEDs (905nm infrared and 660nm red) are chosen to fall within the high-sensitivity regions of these detectors, thereby maximizing the generated electrical signal for a given optical power.

Q: How to understand the 140-degree "viewing angle"?
A: This refers to the full angle at which the radiation intensity drops to half (50%) of its axial (0-degree) measured value. Therefore, the emitted light is effectively usable within a very wide ±70-degree cone from the center.

9. Practical Design and Usage Cases

Case: Designing a Proximity Sensor for Mobile Devices
The BR15-22C/L586/R/TR8 can be used in a proximity sensor to detect if an object (such as a user's ear during a call) is near the phone. The infrared emitter (905nm) is driven in pulses. A nearby silicon photodiode detects the reflected infrared light. The red light emitter is not used in this specific mode but can be utilized for other functions, such as a status indicator. Design steps include: 1) Calculate the current-limiting resistor for the IR LED based on the driver IC's output voltage and the required pulse current (e.g., 20mA for good intensity). 2) Place the LED and photodiode on the PCB and establish an optical barrier between them to prevent direct crosstalk. 3) Precisely follow the reflow soldering temperature profile to avoid damaging the moisture-sensitive package. 4) Implement firmware to drive the LED in pulses and read the photodiode signal, using a threshold to determine the "near" or "far" state.

10. Introduction to Working Principles

Light-emitting diode (LED) is a semiconductor device that emits light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type region recombine with holes from the p-type region. This recombination releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material used. Infrared emitters use gallium aluminum arsenide (GaAlAs), whose bandgap corresponds to 905nm infrared light. Red light emitters use aluminum gallium indium phosphide (AlGaInP), producing 660nm red light. A transparent epoxy resin lens encapsulates the chip, providing mechanical protection and shaping the light output pattern.

11. Teknoloji Trendleri ve Arka Plan

The development of SMD LEDs like the BR15-22C/L586/R/TR8 is driven by trends toward miniaturization, automation, and multifunctionality in electronic products. The shift toward lead-free and halogen-free manufacturing reflects the global push for environmentally sustainable components. In sensing applications, there is a continuous demand for higher efficiency (more light output per watt of electrical power) and tighter spectral matching to improve system performance and reduce power consumption. Integrating multiple wavelengths or functions into a single package is a logical step to save space and cost in increasingly complex devices. Furthermore, improvements in packaging materials and designs aim to enhance reliability under thermal stress and moisture exposure, which is critical for automotive, industrial, and consumer applications.