Table of Contents
- 1. Product Overview
- 2. In-depth Technical Parameter Analysis
- 2.1 Photometric and Color Characteristics
- 2.2 Electrical Parameters
- 2.3 Thermal Characteristics
- 3. Detailed Explanation of the Grading System
- 3.1 Wavelength/Color Temperature Grading
- 3.2 Luminous Flux Binning
- 3.3 Forward Voltage Binning
- 4. Performance Curve Analysis
- 4.1 Current-Voltage (I-V) Characteristic Curve
- 4.2 Temperature Characteristics
- 4.3 Spectral Power Distribution
- 5. Mechanical and Packaging Information
- 5.1 Outline Dimensions Drawing
- 5.2 Pad Layout Design
- 5.3 Polarity Marking
- 6. Welding and Assembly Guide
- 6.1 Reflow Soldering Temperature Profile
- 6.2 Precautions and operating specifications
- 6.3 Storage Conditions
- 7. Packaging and Ordering Information
- 7.1 Packaging Specifications
- 7.2 Label Information
- 7.3 Model Naming Rules
- 8. Application Suggestions
- 8.1 Typical Application Scenarios
- 8.2 Key Design Considerations
- 9. Technical Comparison
- 10. Frequently Asked Questions (FAQ)
- 11. Practical Application Cases
- 12. Brief Introduction to Working Principles
- 13. Technology Development Trends
1. Product Overview
This technical specification provides comprehensive information for the LED device, focusing on its lifecycle management and revision history. The document structure is designed to offer engineers and procurement specialists clear insight into the product's status, ensuring compatible and informed decisions when integrating it into new designs or maintaining existing production lines. The core information presented indicates the product is in a stable "Revision 2" phase, signifying its maturity and established performance characteristics.
The core advantage of this device lies in its documented and controlled lifecycle. A "Permanent" validity period implies long-term supply and support, which is crucial for applications with long lifecycle requirements such as industrial, automotive, or infrastructure. This stability reduces the risk of product obsolescence and simplifies supply chain planning. The target markets include applications requiring reliable, long-lasting lighting solutions, where consistent performance and device availability are paramount.
2. In-depth Technical Parameter Analysis
Although the provided PDF fragment focuses on management data, a complete LED technical specification typically includes the following parameter categories, which are crucial for design selection.
2.1 Photometric and Color Characteristics
Key parameters include dominant wavelength or correlated color temperature (CCT), which define the color of the emitted light (e.g., cool white, warm white, specific monochromatic light). Luminous flux, measured in lumens (lm), represents the perceived total light output. Chromaticity coordinates (e.g., CIE x, y) provide the precise color point on the chromaticity diagram. The Color Rendering Index (CRI) is crucial for applications requiring high color accuracy, indicating how naturally colors appear under LED light compared to a reference light source.
2.2 Electrical Parameters
Forward voltage (Vf) is a key parameter that specifies the voltage drop across an LED at a specific test current. This is crucial for designing drive circuits. The forward current (If) rating defines the maximum continuous current an LED can withstand, directly affecting light output and lifetime. Reverse voltage (Vr) specifies the maximum reverse voltage that can be applied without damaging the device. Electrostatic discharge (ESD) sensitivity, typically classified according to JEDEC or MIL-STD standards, indicates the device's robustness against static electricity.
2.3 Thermal Characteristics
LED performance and lifetime depend heavily on thermal management. The junction-to-ambient thermal resistance (RθJA) quantifies the efficiency of heat transfer from the LED semiconductor junction to the surrounding environment. A lower value indicates better heat dissipation. The maximum junction temperature (Tj max) is the highest temperature the semiconductor material can withstand without permanent degradation or failure. Maintaining the LED operating temperature below this limit through adequate heat sinking is critical to achieving the rated lifetime (typically defined as L70 or L50, the time for luminous flux output to decay to 70% or 50% of its initial value).
3. Detailed Explanation of the Grading System
Variations in the manufacturing process necessitate a binning system to group LEDs with similar characteristics.
3.1 Wavelength/Color Temperature Grading
LEDs are sorted into different bins based on their precise wavelength (for monochromatic LEDs) or correlated color temperature (for white LEDs). This ensures color consistency within a single batch and across different batches. Designers must specify the required bin or acceptable bin range to maintain uniform color appearance in their application.
3.2 Luminous Flux Binning
LEDs are also binned according to their light output at standard test current. This allows designers to select devices that meet specific brightness requirements and accurately predict the final light output of their assemblies.
3.3 Forward Voltage Binning
Grouping LEDs by forward voltage (Vf) helps design more efficient and consistent drive circuits. Using LEDs from the same Vf bin can improve current matching in parallel arrays and make power consumption more predictable.
4. Performance Curve Analysis
Graphical data is crucial for understanding device behavior under various conditions.
4.1 Current-Voltage (I-V) Characteristic Curve
This curve shows the relationship between the forward current through an LED and the voltage across its terminals. It is nonlinear, exhibiting a turn-on voltage threshold. This curve is essential for selecting appropriate current-limiting components or designing constant-current drivers.
4.2 Temperature Characteristics
Graphs typically show how forward voltage and luminous flux vary with junction temperature. Forward voltage generally decreases as temperature increases, while luminous flux decays. Understanding these relationships is key to thermal design and predicting performance in real-world operating environments.
4.3 Spectral Power Distribution
This chart plots the relative intensity of emitted light at each wavelength. For white LEDs, it shows the peak of the blue pump LED and the broader phosphor-converted spectrum. It is used to calculate CCT, CRI, and understand the color quality of the light.
5. Mechanical and Packaging Information
PCB layout and assembly require precise physical dimensions.
5.1 Outline Dimensions Drawing
Detailed drawings including top, side, and bottom views, with all critical dimensions (length, width, height, lens shape) and tolerances. This ensures the device fits the designed footprint on the printed circuit board (PCB).
5.2 Pad Layout Design
Provides recommended PCB pad patterns (pad size, shape, and spacing) to ensure reliable solder joint formation during the reflow process and to provide adequate thermal and electrical connection.
5.3 Polarity Marking
Clear markings indicate the anode and cathode. This is typically shown via notches, dots, bevels, or different lead lengths. Correct polarity is crucial for the proper operation of the device.
6. Welding and Assembly Guide
6.1 Reflow Soldering Temperature Profile
Provides the recommended reflow soldering time-temperature profile, including preheating, soaking, reflow, and cooling stages. Specifies the maximum peak temperature and time above liquidus to prevent thermal damage to the LED package (especially the silicone lens and internal bonding).
6.2 Precautions and operating specifications
The guidelines include avoiding mechanical stress on the lens, preventing contamination of optical surfaces, and implementing appropriate ESD protection measures during handling. Recommendations for cleaning agents compatible with LED materials may also be included.
6.3 Storage Conditions
Specifies the ideal storage temperature and humidity range to maintain solderability and prevent moisture absorption. If the device is not properly baked before use, moisture absorption may cause the "popcorn" phenomenon during reflow soldering.
7. Packaging and Ordering Information
7.1 Packaging Specifications
Details the LED supply method: reel type (e.g., tape width, pocket size), number of reels, and device orientation within the reel (for automatic placement machines).
7.2 Label Information
Explains the information printed on the reel label, including part number, quantity, date code, lot number, and binning codes for luminous flux, color, and voltage.
7.3 Model Naming Rules
Parsed the structure of the part number, showing how different codes within the number represent specific attributes, such as color, luminous flux bin, voltage bin, package type, and special functions.
8. Application Suggestions
8.1 Typical Application Scenarios
Based on its technical parameters, this LED is suitable for general lighting (bulbs, tubes, panels), architectural lighting, signage, display backlighting, automotive lighting (interior, signal lights), and industrial lighting. The "permanent" lifetime indicates its suitability for applications with long service life expectations.
8.2 Key Design Considerations
Key considerations include: employing constant current drivers for stable operation; designing effective thermal paths to manage junction temperature; ensuring optical design (lenses, reflectors) matches the LED's viewing angle and luminous intensity distribution; and protecting the LED from electrical transients and reverse voltage.
9. Technical Comparison
While a direct comparison requires specific competitor devices, the advantages of devices with a clear "Revision 2" and "Permanent" lifecycle status include: reduced risk of premature obsolescence, reliability verification from mature designs, and potentially better supply and cost stability compared to newly introduced or discontinued devices. Technical parameters (when fully specified) will be compared against alternatives in terms of efficiency (lm/W), color quality (CRI, CCT consistency), reliability (lifetime rating), and package size.
10. Frequently Asked Questions (FAQ)
Q: What does "Lifecycle Stage: Revision 2" mean?
A: This indicates the product is in the mature stage of its lifecycle. The design is finalized and has entered mass production. "Revision 2" implies at least one prior version exists, and this version incorporates improvements or fixes.
Q: What does "Validity: Permanent" mean?
A: This typically means the manufacturer currently has no planned End-of-Life (EOL) date for this product. It is intended for long-term supply, which is beneficial for designs requiring a stable supply chain for many years.
Q: How should I interpret the Release Date?
A: The release date (2014-12-05) marks the official publication time of this specific revision of the specification or product. It helps track document versions and can be used to ensure designs are using the latest specifications.
Q: Can I mix LEDs of different bins in my product?
A: It is generally not recommended to mix bins, especially for color and luminous flux bins, as this can lead to visible color and brightness differences in the final product. For consistent performance, use LEDs from the same or adjacent bins.
11. Practical Application Cases
Scenario: Designing a Linear LED Luminaire for Office Lighting
A design engineer is designing a 4-foot LED troffer for an office ceiling. Using this datasheet, they will:
1. Select the appropriate luminous flux gear to achieve the target lumen value for each luminaire.
2. Select a specific CCT gear (e.g., 4000K) to meet office lighting standards.
3. Utilize the Vf gear and I-V curve to design the series-parallel array and specify the constant current driver.
4. Refer to the thermal resistance (RθJA) and derating curve to design an aluminum heat sink, keeping the junction temperature below Tj max to ensure the 50,000-hour L70 lifetime claim is met.
5. Use the mechanical drawing to create the PCB footprint dimensions and ensure proper spacing between LEDs on the Metal Core PCB (MCPCB).
6. Follow the reflow soldering temperature profile during SMT assembly to avoid damaging components.
12. Brief Introduction to Working Principles
A Light Emitting Diode (LED) is a semiconductor device that emits light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type region recombine with holes from the p-type region, releasing energy in the form of photons. The wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material used (e.g., InGaN for blue/green light, AlInGaP for red/amber light). White LEDs are typically created by coating a blue or ultraviolet LED chip with phosphor materials. Part of the blue light is converted by the phosphor to longer wavelengths (yellow, red light), and the mixture of blue light and phosphor-converted light is perceived as white light.
13. Technology Development Trends
The LED industry continues to evolve, showing several key trends. Efficiency (lumens per watt) is steadily increasing, reducing energy consumption for the same light output. Color quality is constantly improving, with high-CRI LEDs becoming more common and affordable. Miniaturization continues, enabling new form factors for displays and lighting. There is growing focus on horticultural lighting, with spectra customized for plant growth. Smart lighting integrating built-in drivers and controls is expanding. Furthermore, reliability and lifetime predictions are becoming more accurate through advanced testing and modeling, supporting long-life claims as demonstrated in this document.
Detailed Explanation of LED Specification Terminology
Complete Explanation of LED Technical Terminology
I. Core Indicators of Photoelectric Performance
| Terminology | Unit/Representation | Popular Explanation | Aiseā e Tāua ai |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | The luminous flux emitted per watt of electrical power; higher values indicate greater energy efficiency. | It directly determines the energy efficiency rating of the luminaire and the electricity cost. |
| Luminous Flux | lm (lumen) | The total amount of light emitted by a light source, commonly known as "brightness". | Determines whether the luminaire is bright enough. |
| Viewing Angle | ° (degree), e.g., 120° | The angle at which luminous intensity drops to half, determining the beam width. | Affects the range and uniformity of illumination. |
| Correlated Color Temperature (CCT) | K (Kelvin), such as 2700K/6500K | Launin haske mai dumi da sanyi, ƙananan ƙima sun karkata zuwa rawaya/dumi, manyan ƙima sun karkata zuwa fari/sanyi. | Yana ƙayyade yanayin hasken wuta da yanayin da ya dace. |
| Color Rendering Index (CRI / Ra) | Unitless, 0–100 | The ability of a light source to reproduce the true colors of objects, with Ra≥80 being considered good. | Affects color authenticity, used in high-demand places such as shopping malls and art galleries. |
| Color tolerance (SDCM) | MacAdam ellipse step, such as "5-step" | A quantitative metric for color consistency; a smaller step number indicates better color consistency. | Ensure no color difference among luminaires from the same batch. |
| Dominant Wavelength | nm (nanometer), e.g., 620nm (red) | Wavelength values corresponding to the colors of colored LEDs. | Determines the hue of monochromatic LEDs such as red, yellow, and green. |
| Spectral Distribution | Wavelength vs. Intensity Curve | Shows the intensity distribution of light emitted by an LED at each wavelength. | Affects color rendering and color quality. |
II. Electrical Parameters
| Terminology | Symbol | Popular Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage (Forward Voltage) | Vf | The minimum voltage required to light up an LED, similar to a "starting threshold". | The driving power supply voltage must be ≥ Vf; the voltages add up when multiple LEDs are connected in series. |
| Forward Current | If | The current value that makes the LED emit light normally. | Constant current drive is often used, as the current determines brightness and lifespan. |
| Maximum Pulse Current | Ifp | Peak current that can be withstood for a short period, used for dimming or flashing. | Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur. |
| Reverse Voltage | Vr | The maximum reverse voltage that an LED can withstand; exceeding this may cause breakdown. | The circuit must be protected against reverse connection or voltage surges. |
| Thermal Resistance (Thermal Resistance) | Rth (°C/W) | The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. | High thermal resistance requires stronger cooling design, otherwise junction temperature rises. |
| Electrostatic Discharge Immunity (ESD Immunity) | V (HBM), such as 1000V | Electrostatic discharge immunity; a higher value indicates greater resistance to damage from static electricity. | Anti-static measures must be implemented during production, especially for high-sensitivity LEDs. |
III. Thermal Management and Reliability
| Terminology | Key Indicators | Popular Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift. |
| Lumen Depreciation | L70 / L80 (hours) | The time required for the brightness to drop to 70% or 80% of its initial value. | Directly define the "service life" of LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | The degree of color change during use. | Affects the color consistency of the lighting scene. |
| Thermal Aging | Material performance degradation | Degradation of packaging materials due to prolonged high temperatures. | It may lead to a decrease in brightness, color change, or open-circuit failure. |
IV. Packaging and Materials
| Terminology | Common Types | Popular Explanation | Characteristics and Applications |
|---|---|---|---|
| Package Types | EMC, PPA, Ceramic | The housing material that protects the chip and provides optical and thermal interfaces. | EMC offers good heat resistance and low cost; ceramic provides superior heat dissipation and long lifespan. |
| Chip Structure | Front-side, Flip Chip | Chip electrode arrangement method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating. | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Different phosphors affect luminous efficacy, color temperature, and color rendering. |
| Lens/Optical Design | Flat, microlens, total internal reflection | Optical structure on the packaging surface, controlling light distribution. | Determines the emission angle and light distribution curve. |
V. Quality Control and Grading
| Terminology | Grading Content | Popular Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Binning | Codes such as 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products in the same batch. |
| Voltage binning | Code such as 6W, 6X | Grouped by forward voltage range. | Ease of matching the drive power supply, improving system efficiency. |
| Color binning | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within a minimal range. | Ensure color consistency to avoid uneven colors within the same luminaire. |
| Color Temperature Grading | 2700K, 3000K, etc. | Group by color temperature, each group has a corresponding coordinate range. | Meet the color temperature requirements of different scenarios. |
VI. Testing and Certification
| Terminology | Standard/Test | Popular Explanation | Meaning |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Long-term operation under constant temperature conditions, recording luminance attenuation data. | For estimating LED lifetime (in conjunction with TM-21). |
| TM-21 | Lifetime projection standard | Estimating lifespan under actual operating conditions based on LM-80 data. | Providing scientific life prediction. |
| IESNA Standard | Illuminating Engineering Society Standard | Covers optical, electrical, and thermal testing methods. | Industry-recognized testing basis. |
| RoHS / REACH | Environmental Certification | Ensure the product does not contain harmful substances (e.g., lead, mercury). | Entry requirements for the international market. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting products. | Commonly used in government procurement and subsidy programs to enhance market competitiveness. |