1. Product Overview
This document provides the complete technical specifications and application guidelines for a specific LED (Light Emitting Diode) component. The core information presented indicates this is a stable, mature product. The lifecycle phase is documented as "Revision 2," signifying this is the second official revision of its technical data sheet, implying prior iterations and refinements based on manufacturing experience or minor design updates. Crucially, the "Expired Period" is listed as "Forever," denoting that this revision of the specifications is considered permanently valid and will not be superseded by an expiration date, a common marker for obsolete parts. The official release date for this revision is 2014-12-01. This combination of a revision number and a "forever" status suggests a component that has reached a final, standardized specification state, suitable for long-term design projects requiring stable part parameters.
LED din da aka tsara don haske na gaba ɗaya ko aikace-aikacen nuna alama, yana ba da dogaro da ayyuka masu daidaito. Babban fa'idarsa ta ta'allaka ne akan ƙayyadaddun ƙayyadaddun sa na ƙarshe kuma na dindindin, yana ba masu injiniyan ƙira tabbataccen tabbaci game da samuwa na dogon lokaci da halayen fasaha. Kasuwar da aka yi niyya ta haɗa da na'urorin lantarki na mabukaci, hasken cikin mota, alamun kasuwanci, da kuma ƙirar haske na gabaɗaya inda ake fifita ingantaccen kayan aiki mai ƙarfi akan sabbin zaɓuɓɓuka, waɗanda ƙila ba a tabbatar da su ba.
2. Zurfin Fassarar Manufa ta Ƙididdiga na Fasaha
Yayin da abin da aka ba da ya mayar da hankali kan bayanan bayanan takarda, cikakken takardar bayanan LED zai ƙunshi cikakkun ƙididdiga na fasaha. Sasannin da ke gaba suna zayyana mahimman bayanai da yawanci ana samun su da mahimmancinsu.
2.1 Photometric and Color Characteristics
The photometric properties define the light output and quality. Key parameters include:
- Luminous Flux (Φv): Measured in lumens (lm), this indicates the total perceived power of light emitted. A typical value for a mid-power LED could range from 20 lm to 120 lm depending on the chip technology and driving conditions.
- Luminous Efficacy: Expressed in lumens per watt (lm/W), this is a measure of energy efficiency, calculated as luminous flux divided by electrical input power. Higher values indicate more efficient conversion of electricity to visible light.
- Dominant Wavelength (λd) or Correlated Color Temperature (CCT): For colored LEDs (e.g., red, blue, green), the dominant wavelength specifies the peak color. For white LEDs, the CCT, measured in Kelvin (K), defines the shade of white (e.g., 2700K for warm white, 6500K for cool white).
- Color Rendering Index (CRI or Ra): For white LEDs, CRI indicates how accurately the light source reveals the true colors of objects compared to a natural reference light. A CRI above 80 is considered good for general lighting.
- Viewing Angle: The angular span over which the luminous intensity is at least half of its maximum value (often denoted as 2θ1/2). Common angles are 120° or 140° for wide dispersion.
2.2 Electrical Parameters
These parameters are crucial for circuit design and driver selection.
- Forward Voltage (Vf): The voltage drop across the LED when operating at a specified forward current. It varies with chip material (e.g., ~2.0V for red, ~3.2V for blue/white) and increases slightly with temperature.
- Forward Current (If): The recommended operating current, typically between 20mA and 150mA for standard packages. Exceeding the maximum rated current drastically reduces lifespan.
- Reverse Voltage (Vr): The maximum voltage the LED can withstand when connected in reverse bias without damage. This is usually a low value (e.g., 5V).
- Power Dissipation (Pd): The maximum allowable power the package can dissipate as heat, calculated as Vf * If Under typical conditions.
2.3 Thermal Characteristics
LED performance and longevity are highly temperature-dependent.
- Junction Temperature (Tj): The temperature at the semiconductor chip's p-n junction. The maximum rated Tj (e.g., 125°C) is a critical limit; operation above this temperature causes rapid degradation.
- Thermal Resistance (RθJA or RθJC): Measured in °C/W, this indicates how effectively heat travels from the junction to the ambient air (JA) or to the case/board (JC). Lower values mean better heat dissipation.
- Storage Temperature Range: The allowable temperature range for the LED when not powered.
3. Binning System Explanation
Manufacturing variations lead to slight differences between individual LEDs. Binning groups parts with similar characteristics to ensure consistency in mass production.
3.1 Wavelength/Color Temperature Binning
LEDs are sorted into bins based on their dominant wavelength (for colors) or CCT (for white). A typical binning scheme might have a 2.5nm or 5nm wavelength step. For white LEDs, bins may be defined in MacAdam ellipses on the CIE chromaticity diagram, with a "3-step" or "5-step" bin indicating color consistency.
3.2 Luminous Flux Binning
LEDs are categorized by their light output at a standard test current (e.g., 65mA). Bins are defined as a percentage range or a minimum flux value (e.g., Bin A: 20-23 lm, Bin B: 23-26 lm). This allows designers to select the required brightness level.
3.3 Forward Voltage Binning
Domin don daidai ginin direba da kuma tabbatar da haske iri ɗaya a cikin jeri, ana rarraba LED ta hanyar ƙarfin lantarki na gaba a takamaiman halin yanzu. Rukunonin gama gari na iya zama Vf @ 65mA: 2.8V-3.0V, 3.0V-3.2V, da sauransu.
4. Performance Curve Analysis
Graphical data provides deeper insight into LED behavior under varying conditions.
4.1 Current-Voltage (I-V) Characteristic Curve
This curve shows the relationship between forward current and forward voltage. It is non-linear, with a sharp increase in current once the turn-on voltage is exceeded. The curve shifts with temperature; higher temperature leads to a lower Vf for the same If.
4.2 Temperature Characteristics
Key graphs include Luminous Flux vs. Junction Temperature and Forward Voltage vs. Junction Temperature. Luminous flux typically decreases as Tj increases. Understanding this derating is essential for thermal management to maintain target light output.
3.3 Spectral Power Distribution (SPD)
For white LEDs, the SPD graph shows the relative intensity across the visible spectrum. It reveals the peaks of the blue pump LED and the broad phosphor emission, helping to assess color quality and CRI.
5. Mechanical and Package Information
The physical construction ensures reliable mounting and electrical connection.
5.1 Dimensional Outline Drawing
A detailed diagram shows the LED package's exact dimensions, including length, width, height, and lens shape, with critical tolerances indicated.
5.2 Pad Layout and Solder Pad Design
The recommended footprint for PCB (Printed Circuit Board) layout is provided, including pad size, shape, and spacing. This is crucial for achieving a reliable solder joint and proper heat sinking.
5.3 Polarity Identification
The method for identifying the anode (+) and cathode (-) terminals is shown, typically via a marking on the package (e.g., a notch, a green dot, or a cut corner) or an asymmetric pad design.
6. Soldering and Assembly Guidelines
6.1 Reflow Soldering Profile
A recommended temperature profile for reflow soldering is provided, including preheat, soak, reflow (peak temperature), and cooling rates. Maximum temperature and time above liquidus are specified to prevent thermal damage to the LED package or silicone lens.
6.2 Precautions and Handling
Instructions include avoiding mechanical stress on the lens, preventing contamination, using ESD (Electrostatic Discharge) precautions, and not applying solder directly to the LED body.
6.3 Storage Conditions
Recommended storage environment (typically <30°C, <60% relative humidity) and shelf life are specified to maintain solderability and prevent moisture absorption, which can cause \"popcorning\" during reflow.
7. Packaging and Ordering Information
7.1 Packaging Specifications
Details on reel packaging: tape width, pocket dimensions, reel diameter, and quantity per reel (e.g., 2000 pieces/13-inch reel).
3.2 Label Information
Explanation of the information printed on the reel label, including part number, quantity, date code, lot number, and bin codes.
7.3 Model Number Nomenclature
A breakdown of the part number code, explaining how each segment denotes characteristics like color, flux bin, voltage bin, package type, and special features.
8. Application Recommendations
8.1 Typical Application Circuits
Schematics for basic drive circuits: constant current driver circuits (using dedicated ICs or transistors) are emphasized, as LEDs require current regulation, not voltage regulation, for stable operation. Simple resistor-limited circuits for low-current applications may also be shown.
8.2 Design Considerations
- Thermal Management: The importance of PCB copper area (thermal pad), thermal vias, and possibly heatsinks to keep Tj within limits.
- Optical Design: Considerations for secondary optics (lenses, diffusers) to achieve desired beam patterns.
- Electrical Layout: Keeping drive traces short to minimize voltage drop and noise.
- Dimming: Compatibility with PWM (Pulse Width Modulation) dimming and recommended frequency ranges.
9. Technical Comparison
While specific competitor names are omitted, this LED's "Forever" lifecycle and Revision 2 status imply key differentiators: Long-Term Stability: Unlike parts with planned obsolescence, this component's specs are fixed, reducing requalification needs for long-life products. Maturity: A second revision suggests any initial production issues have been resolved, leading to higher reliability. Supply Predictability: The permanent datasheet status supports stable long-term sourcing. Potential trade-offs might include slightly less advanced efficiency or color metrics compared to the latest-generation LEDs, but it offers proven performance and reliability.
10. Frequently Asked Questions (Based on Technical Parameters)
Q1: What does "Lifecycle Phase: Revision 2" mean for my design?
A1: Yana nuna cewa an sabunta ƙayyadaddun abin sau ɗaya daga fitowar farko. Ana ɗaukar wannan bita a matsayin mai girma kuma mai tsayayye. Ga sabbin zane-zane, zaɓi ne mai aminci. Ga zane-zanen da ke amfani da Bita 1, duba bayanan canjin bita (idan akwai) don kowane sabuntawar sigogi da za ta iya shafar aiki.
Q2: "Expired Period: Forever" – Shin wannan yana nufin LED ɗin zai kasance akwai har abada?
A2: Ba lallai ba ne. Yana nufin wannan takamaiman sigar takardar bayanan fasaha (Bita 2) ana ɗaukarta a matsayin mai inganci har abada kuma ba za a ba ta ranar ƙarewa da za ta nuna ta zama tsohuwa ba. Duk da haka, masana'anta na iya ci gaba da dakatar da samar da kayan ɗin kanta saboda dalilai na kasuwanci. Matsayin "har abada" yana nufin ingancin takardar, ba garantin samarwa mara iyaka ba.
Q3: The release date is 2014. Is this product outdated?
A3: Not necessarily. In electronics, a 2014 datasheet revision for a mature component is common. It signifies a well-established, reliable part. While peak efficiency might be lower than 2024's best-in-class LEDs, its parameters are fully characterized, and it is often chosen for cost-sensitive or long-lifecycle applications where design stability is paramount.
Q4: How do I select the correct current for this LED?
A4: Always refer to the Absolute Maximum Ratings and Typical Characteristics tables. Operate at or below the recommended forward current (If). Using a constant current driver is highly recommended to ensure consistent brightness and longevity, as Vf can vary with temperature and between units.
11. Practical Use Case
Scenario: Designing a backlight unit for an industrial control panel display.
The display requires even, reliable illumination for 10+ years in an environment with ambient temperatures up to 50°C. An LED with a "Forever" lifecycle datasheet is selected. The designer uses the maximum junction temperature (Tjmax) and thermal resistance (RθJA) data to calculate the necessary PCB copper area to keep Tj below 100°C at the rated current. The stable, binned luminous flux values allow precise calculation of the number of LEDs needed to achieve the target panel brightness without over-driving them. The mature Revision 2 status gives confidence that the part's behavior is well-understood, minimizing risk in a long-life product.
12. Principle Introduction
LED wata diode ce ta semiconductor p-n junction. Lokacin da aka yi amfani da ƙarfin lantarki na gaba, electrons daga yankin n-type suna haɗuwa da ramuka daga yankin p-type a cikin Layer mai aiki. Wannan haɗuwa yana sakin makamashi a cikin nau'in photons (haske). Tsawon zango (launi) na hasken da aka fitar yana ƙayyadaddun ta hanyar bandgap na makamashi na kayan semiconductor da aka yi amfani da su (misali, Gallium Arsenide Phosphide don ja, Indium Gallium Nitride don shuɗi). Ana yin LED na fari yawanci ta hanyar lulluɓe da guntu LED shuɗi da phosphor rawaya; wasu daga cikin hasken shuɗi suna canzawa zuwa rawaya, kuma cakuda hasken shuɗi da rawaya ana ganinsa azaman fari. Bambance-bambancen gaurayawan phosphor suna haifar da inuwa daban-daban (CCT) na hasken fari.
13. Trends na Ci gaba
LED industry continues to evolve. Key objective trends include: Increased Efficiency (lm/W): Ongoing improvements in internal quantum efficiency and light extraction techniques push luminous efficacy higher. Improved Color Quality: Development of phosphors and multi-color chip designs (e.g., RGB, violet pump + multi-phosphor) to achieve higher CRI (Ra >90, R9 >50) and more consistent color rendering. Miniaturization and Higher Power Density: Development of smaller packages (e.g., micro-LEDs) capable of handling higher current densities, enabling new display and lighting form factors. Smart and Connected Lighting: Integration of control electronics and communication protocols (Zigbee, Bluetooth) directly into LED modules. Human-Centric Lighting: Tunable white LEDs that can adjust CCT and intensity to mimic natural daylight cycles, aimed at improving well-being and productivity. The component described in this datasheet represents a stable point in this ongoing technological progression.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Haske ko haske mai zafi/sanyi, ƙananan ƙimomi suna da rawaya/da zafi, mafi girma fari/sanyi. | Yana ƙayyade yanayin haske da yanayin da ya dace. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Halin zazzabi na aiki a cikin LED chip. | Kowane raguwar 10°C na iya ninka tsawon rayuwa; yana da yawa yana haifar da lalacewar haske, canjin launi. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | O nifa si iṣeṣi awọ ninu awọn iṣẹlẹ itansẹ. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |