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LTP-181FFM LED Dot Matrix Display Specification Sheet - 1.86 Inch (47.4mm) Height - Green and Super Bright Red - 16x16 Dot Matrix - Simplified Chinese Technical Documentation

LTP-181FFM Complete Technical Specification Sheet for 1.86-inch (47.4mm) Height, 16x16 Dot Matrix LED Display, including Green and AlInGaP Super Bright Red LEDs. Covers specification parameters, pin definitions, electrical ratings, and optical characteristics.
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PDF Document Cover - LTP-181FFM LED Dot Matrix Display Specification Sheet - 1.86 Inch (47.4mm) Height - Green and Super Bright Red - 16x16 Dot Matrix - Simplified Chinese Technical Document

1. Product Overview

LTP-181FFM, net bir şekilde alfasayısal veya sembol bilgisi görüntülemesi gereken uygulamalar için tasarlanmış orta boyutlu, iki renkli bir nokta matrisi görüntüleme modülüdür. Temel işlevi, ızgara düzeninde düzenlenmiş, ayrı ayrı adreslenebilir ışık yayan diyotlardan (LED) oluşan bir görsel çıktı arayüzü sağlamaktır.

1.1 Core Advantages and Target Market

This device is designed with several key advantages, making it suitable for industrial, commercial, and instrumentation applications. It features1.86-inch (47.4 mm) character height, ensuring excellent readability over long distances. The display provideshigh brightness and high contrast, ensuring visibility even in well-lit environments. Itswide viewing angleAllows clear viewing of information from different positions on the display surface.

From a reliability perspective, it possesses the inherentsolid-state reliability, meaning no moving parts and a long service life. ItsLow power consumption requirement, very energy efficient. An important mechanical feature is that the modules can beVertically and horizontally stacked, enabling the creation of larger display panels or multi-line displays without complex interfaces. The LEDs also undergoluminous intensity binning, ensuring brightness consistency between different units and within the dot matrix, which is crucial for uniform appearance.

The target market includes public information displays, industrial control panels, test and measurement equipment, traffic signs, and any system requiring rugged, reliable, and clear status or data display.

2. Detailed Technical Specifications

The LTP-181FFM is a 16-row by 16-column dot matrix display. It utilizes two different LED semiconductor technologies to achieve dual-color display capability.

2.1 Device Description and Technology

The green LED chip employsGaP material on a gallium phosphide (GaP) substrateThese ratings define the limits beyond which permanent damage to the device may occur. They are specified at an ambient temperature (TAluminum Indium Gallium Phosphide (AlInGaP)technology, specifically labeled as "Ultrabright Red," indicating high efficiency and purity in the red spectrum. These red chips are grown onOpaque Gallium Arsenide (GaAs) substrateOn. The display usesBlack panelBy absorbing ambient light to enhance contrast, and adding aDiffusion film, fuses individual light points into a more uniform character appearance, reducing the "dot-like" visual effect.

2.2 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. They are specified at an ambient temperature (TA) of 25°C.

2.3 Electrical and Optical Characteristics

Waɗannan sune a cikin TA= 25°C ƙayyadaddun sharuɗɗan gwaji waɗanda aka tabbatar da su.

2.3.1 Green LED Characteristics

2.3.2 AlInGaP Ultra-Bright Red LED Characteristics

Note: Luminous intensity measurement uses a sensor and filter approximating the CIE photopic response curve.

3. Binning System Description

The datasheet indicates that the LED undergoesluminous intensity binning. This is a critical grading process.

4. Performance Curve Analysis

The datasheet referencesTypical Electrical/Optical Characteristic Curves. Although the provided text does not detail specific charts, the standard curves for such devices typically include:

5. Mechanical and Packaging Information

5.1 Package Dimensions

The datasheet contains detailed mechanical drawings (not shown here). Key notes in the drawings indicateAll dimensions are in millimeters (mm)., andDefault tolerance is ±0.25 mm (0.01 in).Unless otherwise specified by particular feature annotations. This drawing defines the overall outline dimensions, mounting hole locations, the visible area of the LED dot matrix, and the precise positions and spacing of the 48 pins.

5.2 Pin Connections and Circuit Diagram

This device uses a 48-pin dual in-line package. Due to the adoption of a multiplexed 16x16 dot matrix, the pin definitions are relatively complex. The pins are designated asRow Common AnodeColumn Cathode, and has dedicated pins for green and red LEDs. For example, Pin 3 is the Green Column 1 Cathode, while Pin 11 is the Red Column 1 Cathode. This arrangement allows the controller to select a row (by applying a positive voltage to its common anode) and then sink current through the corresponding column cathode pin to illuminate specific green or red dots in that row.

The datasheet references an internal schematic, which typically shows the interconnections of all 256 LEDs (16x16), clarifying which anode row and cathode column control each specific LED dot for each color.

6. Soldering and Assembly Guide

The primary guidance provided isSoldering Temperature Profile: Maintain at 260°C for 3 seconds, with the measurement point located 1/16 inch (1.59 mm) below the package body. This is the standard reference point for wave soldering or hand soldering to prevent overheating damage to the internal LED or plastic package. For reflow soldering, a standard lead-free profile with a peak temperature of approximately 260°C is applicable, but the Time Above Liquidus (TAL) should be controlled to meet the 3-second guideline at the pin level.

Operation should follow standard ESD (Electrostatic Discharge) precautions for semiconductor devices. Storage should be within the specified temperature range of -35°C to +85°C and in a low-humidity environment.

7. Application Recommendations

7.1 Typical Application Scenarios

7.2 Design Considerations

8. Technical Comparison and Differentiation

Compared to generic monochrome or smaller dot-matrix displays, the LTP-181FFM offers distinct advantages:

9. Frequently Asked Questions (Based on Technical Parameters)

Q1: What is the difference between "peak" wavelength and "dominant" wavelength?
A: Peak wavelength (λp) is the wavelength at which the emitted light intensity reaches its maximum. Dominant wavelength (λd) is the wavelength of monochromatic light that matches the perceived color of the LED. For LEDs, λdis typically more relevant to human color perception.

Q2: Why are the test currents for luminous intensity different for green (35mA) and red (15mA)?
A: This reflects the different efficiencies of the two semiconductor technologies. The AlInGaP ultra-bright red LED is more efficient, achieving its typical luminous intensity (1500 µcd) at a lower drive current than the GaP green LED requires to reach its typical intensity (1400 µcd).

Q3: How to calculate the required series resistor for a column?
A: Using Ohm's Law: R = (VPower Supply- VF- VDrive Tube Voltage Drop) / IF. Use the maximum V from the datasheetF(e.g., green is 3.7V at 80mA) to ensure that even for low VFLEDs, the current never exceeds the limit. Consider the voltage drop (VDrive Tube Voltage Drop) of the column drive transistor/MOSFET. Current IFIt is the required peak current per point (e.g., 80mA), but please remember that in a multiplexed design, this current is shared by all points in the columns that are active within the single row's time slot.

Q4: What does "1/16 DUTY" in the test conditions mean?
A: It indicates that the display is driven in a multiplex mode with a 1/16 duty cycle. This is standard for a 16-row dot matrix. Each row is powered on for only 1/16 of the total refresh cycle time. The luminous intensity is measured under this condition, which is also how the display operates in actual use. The peak current during the "on" time is higher than the average current to compensate for the low duty cycle and achieve the desired average brightness.

10. Design Use Case Studies

Scenario: Design a multi-line production counter display.
An engineer needs to design a display for the factory floor to show the current production count and target value of a machine. They choose to vertically stack two LTP-181FFM modules.

Implementation Plan:A single microcontroller drives two display modules. The firmware manages a 16-line multiplexing routine, refreshing each line sequentially. The top module displays "COUNT: [number]" in green. The bottom module displays "TARGET: [number]" in green. If the machine stops due to an error, the relevant line or a separate "ERROR" message can flash in red on the corresponding module. The stackable design simplifies mechanical installation. High brightness and a wide viewing angle ensure operators can see the information from various positions in the workshop. Intensity grading ensures a consistent, uniform appearance when two modules are placed side-by-side.

11. Introduction to Working Principles

LTP-181FFM is based onLED dot matrix multiplexingPrinciple of operation. It is impractical to equip a 16x16 monochrome or bicolor dot matrix with 256 or more independent leads. Instead, LEDs are arranged in a grid where the anodes of all LEDs in a single row are connected together (row common anode), and the cathodes of all LEDs of a specific color in a single column are connected together (column cathode).

To illuminate a specific point (e.g., the green point at row 5, column 3), the controller performs the following steps in rapid succession within a refresh cycle: 1) Set the common anode of row 5 to a positive voltage (e.g., +5V). 2) Connect the cathode of column 3 (green) to ground (0V), completing the circuit and allowing current to flow through that specific green LED. All other rows are turned off, and all other column lines are held high (open circuit). By scanning all 16 rows very quickly (e.g., 100Hz or higher), the persistence of vision creates the illusion that all desired points in the 16x16 dot matrix are lit simultaneously. Bicolor capability simply adds an independent set of cathode pins for the red LEDs, which are controlled independently.

12. Technical Trends

LTP-181FFM olgun GaP (yeşil) ve AlInGaP (kırmızı) teknolojilerini kullanırken, daha geniş LED ekran alanı gelişmektedir. Trendler şunları içerir:

The LTP-181FFM represents a reliable, high-performance solution in its category, balancing size, brightness, dual-color capability, and design flexibility for a wide range of embedded display applications.

LED Specification Terminology Explained

Complete Explanation of LED Technical Terms

I. Core Indicators of Photoelectric Performance

Terminology Unit/Representation Popular Explanation Why is it important
Luminous Efficacy lm/W The luminous flux emitted per watt of electrical power; the higher the value, the more energy-efficient. It directly determines the energy efficiency rating and electricity cost of the luminaire.
Luminous Flux lm (lumen) The total amount of light emitted by a light source, commonly known as "brightness". Determines whether the luminaire is bright enough.
Viewing Angle ° (degree), such as 120° The angle at which light intensity drops to half, determining the beam width. Affects the illumination range and uniformity.
Color Temperature (CCT) K (Kelvin), e.g., 2700K/6500K The color temperature of light: lower values lean yellow/warm, higher values lean white/cool. Determines the lighting ambiance and suitable application scenarios.
Color Rendering Index (CRI / Ra) Unitless, 0–100 The ability of a light source to reproduce the true colors of objects, with Ra≥80 being good. Affects color fidelity, used in high-demand places such as shopping malls and art galleries.
Color tolerance (SDCM) MacAdam ellipse steps, such as "5-step" A quantitative metric for color consistency; a smaller step number indicates better color consistency. Ensure no color variation among luminaires from the same batch.
Dominant Wavelength nm (nanometer), e.g., 620nm (red) The wavelength values corresponding to the colors of colored LEDs. Determines the hue of monochromatic LEDs such as red, yellow, and green.
Spectral Distribution Wavelength vs. Intensity curve Shows the intensity distribution of light emitted by an LED at each wavelength. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbol Popular Explanation Design Considerations
Forward Voltage Vf The minimum voltage required to light up an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf, and the voltage adds up when multiple LEDs are connected in series.
Forward Current If The current value that makes the LED emit light normally. Constant current drive is often used, as the current determines brightness and lifespan.
Maximum Pulse Current Ifp Peak current that can be withstood for a short period of time, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur.
Reverse Voltage Vr LED yana iya jure mafi girman ƙarfin lantarki na baya, wanda ya wuce hakan zai iya lalacewa. A cikin da'ira, ya kamata a hana haɗin baya ko kuma ƙarfin lantarki mai tsanani.
Thermal Resistance Rth (°C/W) The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. High thermal resistance requires a stronger heat dissipation design, otherwise the junction temperature will increase.
Electrostatic Discharge Immunity (ESD Immunity) V (HBM), such as 1000V Anti-static strike capability, the higher the value, the less susceptible to electrostatic damage. Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Key Indicators Popular Explanation Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) The time required for brightness to drop to 70% or 80% of its initial value. Directly define the "service life" of an LED.
Lumen Maintenance % (e.g., 70%) The percentage of remaining brightness after a period of use. Characterizes the ability to maintain brightness after long-term use.
Color Shift Δu′v′ or MacAdam Ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Material performance degradation Degradation of packaging materials due to prolonged high temperature. May lead to decreased brightness, color shift, or open-circuit failure.

IV. Kunshewa da Kayan aiki

Terminology Nau'ikan gama gari Popular Explanation Features and Applications
Package Type EMC, PPA, Ceramic The housing material that protects the chip and provides optical and thermal interfaces. EMC has good heat resistance and low cost; ceramics offer superior heat dissipation and long lifespan.
Chip Structure Face-up, Flip Chip (Flip Chip) Chip Electrode Layout Method. Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating YAG, silicate, nitride Covered on the blue light chip, partially converted into yellow/red light, mixed into white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical Design Flat, microlens, total internal reflection The optical structure on the encapsulation surface controls the distribution of light. Determines the light emission angle and the light distribution curve.

V. Quality Control and Binning

Terminology Grading Content Popular Explanation Purpose
Luminous flux binning Codes such as 2G, 2H Grouped by brightness level, each group has a minimum/maximum lumen value. Ensure consistent brightness within the same batch of products.
Voltage binning Codes such as 6W, 6X Group by forward voltage range. Facilitates driver power matching and improves system efficiency.
Color binning 5-step MacAdam ellipse Group by color coordinates to ensure colors fall within an extremely narrow range. Ensure color consistency to avoid uneven color within the same luminaire.
Color temperature binning 2700K, 3000K, etc. Group by color temperature, each group has a corresponding coordinate range. Satisfying the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standard/Test Popular Explanation Meaning
LM-80 Lumen Maintenance Test Long-term operation under constant temperature conditions, recording brightness attenuation data. Used to estimate LED lifetime (combined with TM-21).
TM-21 Lifetime projection standard Estimating lifespan under actual usage conditions based on LM-80 data. Providing scientific lifespan prediction.
IESNA standard Illuminating Engineering Society Standard Covers optical, electrical, and thermal test methods. Industry-recognized testing basis.
RoHS / REACH Environmental certification. Ensure products do not contain harmful substances (e.g., lead, mercury). Entry requirements for the international market.
ENERGY STAR / DLC Energy Efficiency Certification Energy efficiency and performance certification for lighting products. Commonly used in government procurement and subsidy programs to enhance market competitiveness.