LED Lamp Array A694B/2SYG/S530-E2 Datasheet - Brilliant Yellow Green - 20mA - 2.4V - English Technical Document

1. Product Overview

The A694B/2SYG/S530-E2 is a low-power, high-efficiency LED lamp array designed for indicator applications. It consists of a plastic holder combined with multiple LED lamps, offering a versatile and cost-effective solution for visual status indication in electronic equipment. The product is characterized by its stackable design, allowing for both vertical and horizontal assembly to meet various spatial requirements. It is compliant with major environmental and safety standards, including RoHS, EU REACH, and halogen-free requirements, making it suitable for a wide range of global applications.

1.1 Core Advantages

• Low Power Consumption: Designed for energy-efficient operation.
• High Efficiency and Low Cost: Provides excellent luminous output relative to input power at a competitive price point.
• Flexible Assembly: Features a stackable design (both vertically and horizontally) and is easy to assemble, offering good mechanical lock.
• Versatile Mounting: Can be mounted on printed circuit boards (PCBs) or panels.
• Environmental Compliance: The product is Pb-free, RoHS compliant, REACH compliant, and meets halogen-free specifications (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

1.2 Target Market & Applications

This LED array is primarily intended for use as an indicator in electronic instruments. Its typical applications include indicating operational status, degree, function modes, or positional information. The brilliant yellow-green color provides high visibility, making it ideal for user interface panels, control systems, and instrumentation where clear visual feedback is required.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

The following table lists the absolute maximum ratings for the device. Exceeding these values may cause permanent damage.

Parameter	Symbol	Rating	Unit
Continuous Forward Current	IF	25	mA
Peak Forward Current (Duty 1/10 @ 1kHz)	IFP	60	mA
Reverse Voltage	VR	5	V
Power Dissipation	Pd	60	mW
Operating Temperature	Topr	-40 to +85	°C
Storage Temperature	Tstg	-40 to +100	°C
Soldering Temperature	Tsol	260 (for 5 sec)	°C

Interpretation: The device is rated for a standard continuous current of 20mA (as per the characteristics table), with a maximum allowable continuous current of 25mA. The peak current rating allows for brief pulses of higher current, which is useful in multiplexing applications. The low reverse voltage rating (5V) highlights the need for proper circuit design to avoid accidental reverse bias, which could easily damage the LED. The operating temperature range of -40°C to +85°C makes it suitable for industrial and consumer applications.

2.2 Electro-Optical Characteristics

The electro-optical characteristics are specified at a junction temperature (T_j) of 25°C and a forward current (I_F) of 20mA, which is the standard test condition.

Parameter	Symbol	Min.	Typ.	Max.	Unit	Condition
Forward Voltage	VF	—	2.0	2.4	V	IF=20mA
Reverse Current	IR	—	—	10	µA	VR=5V
Luminous Intensity	IV	25	50	—	mcd	IF=20mA
Viewing Angle (2θ1/2)	—	—	60	—	deg	IF=20mA
Peak Wavelength	λp	—	575	—	nm	IF=20mA
Dominant Wavelength	λd	—	573	—	nm	IF=20mA
Spectrum Radiation Bandwidth	Δλ	—	20	—	nm	IF=20mA

Interpretation:

• Forward Voltage (V_F): The typical voltage drop across the LED is 2.0V, with a maximum of 2.4V at 20mA. This parameter is crucial for designing the current-limiting resistor in series with the LED. Designers must use the maximum V_F to ensure the LED current does not exceed the rated value under worst-case conditions.
• Luminous Intensity (I_V): The minimum luminous intensity is 25 mcd, with a typical value of 50 mcd. This specifies the amount of visible light emitted in the primary direction. The value is sufficient for indicator purposes.
• Viewing Angle (60°): This is the angle at which the luminous intensity drops to half of its maximum value (on-axis). A 60° viewing angle provides a reasonably wide cone of visibility, suitable for panel indicators that need to be seen from various angles.
• Wavelength Parameters: The peak wavelength (575 nm) and dominant wavelength (573 nm) confirm the "Brilliant Yellow Green" color. The spectrum bandwidth (Δλ) of 20 nm indicates the spectral purity of the emitted light.

2.3 Thermal Characteristics

While not explicitly listed in a separate table, thermal management is addressed in the handling notes. The power dissipation (P_d) is rated at 60 mW. Effective heat sinking or proper PCB layout is necessary to maintain the junction temperature within safe limits, especially when operating at the maximum continuous current or in high ambient temperatures. Failure to manage heat can lead to reduced luminous output, accelerated degradation, and shortened lifespan.

3. Binning System Explanation

The datasheet references a "Device Selection Guide" which implies the existence of a binning system, though specific bin codes for the A694B/2SYG/S530-E2 are not detailed in the provided excerpt. Based on industry standards and the listed parameters, binning likely occurs across several key characteristics:

• Forward Voltage (V_FBinning: LEDs are sorted into groups based on their forward voltage drop (e.g., 2.0V-2.1V, 2.1V-2.2V, etc.) to ensure consistent brightness when driven by a constant voltage source or to simplify current-limiting resistor selection.
• Luminous Intensity (I_VBinning: Devices are categorized by their minimum luminous output (e.g., 25-30 mcd, 30-35 mcd, etc.). This ensures a uniform appearance in multi-LED arrays or displays.
• Dominant Wavelength (λ_dBinning: Also known as chromaticity or color binning. LEDs are grouped by their dominant wavelength to guarantee a consistent color hue. For yellow-green LEDs, bins might be defined in 2-5 nm steps around the 573 nm typical value.

The part number suffix (e.g., /S530-E2) may encode specific bin information. Designers should consult the full selection guide or manufacturer for precise binning details to ensure color and brightness consistency in their application.

4. Performance Curve Analysis

The datasheet includes several typical characteristic curves, which are essential for understanding device behavior under non-standard conditions.

The part number suffix (e.g., /S530-E2) may encode specific bin information. Designers should consult the full selection guide or manufacturer for precise binning details to ensure color and brightness consistency in their application. 4. Performance Curve Analysis

This curve plots the spectral power distribution of the emitted light. It typically shows a single peak centered around 575 nm (yellow-green) with a full width at half maximum (FWHM) of approximately 20 nm, as indicated by the Δλ parameter. This curve confirms the monochromatic nature of the LED's output.

Luminous Intensity (IV) Binning: Devices are categorized by their minimum luminous output (e.g., 25-30 mcd, 30-35 mcd, etc.). This ensures a uniform appearance in multi-LED arrays or displays.

This polar plot illustrates the spatial distribution of light intensity. For a standard LED lamp with a diffused resin, the pattern is expected to be roughly Lambertian, showing the 60° viewing angle where intensity falls to 50% of the on-axis value. The pattern is symmetrical around the optical axis.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

Wannan shine ainihin halayyar diode na semiconductor. Lankwali yana nuna alaƙar ƙima. Ga LED, ƙarfin lantarki na "gwiwa" inda babban kwarara ya fara gudana yana kusa da 1.8-2.0V. Sama da wannan gwiwar, ƙarfin lantarki yana ƙaruwa kaɗan kawai tare da babban haɓakar kwarara. Wannan yana nuna mahimmancin sarrafa kwarara (ba sarrafa ƙarfin lantarki ba) don tuƙi LEDs. Ƙananan canji a cikin ƙarfin lantarki da aka yi amfani da shi bayan gwiwar zai iya haifar da babban canji, mai yuwuwar lalacewa, a cikin kwarara.

4.4 Relative Intensity vs. Forward Current

Wannan lankwali yana nuna alaƙar tsakanin kwararar tuƙi da fitarwar haske (ƙarfin haske). Gabaɗaya yana da layi ko ɗan ƙasa da layi a cikin kewayon aiki na yau da kullun (har zuwa 20-25mA). Tuƙi LED sama da ƙimar sa zai samar da ƙarin haske amma a farashin rage inganci (lumens a kowace watt), haɓakar samar da zafi, da yuwuwar gajeriyar rayuwa.

4.5 Relative Intensity vs. Ambient Temperature

This curve shows the thermal quenching effect. As the ambient (and consequently, junction) temperature rises, the luminous output of the LED decreases. This is a critical consideration for applications operating in high-temperature environments. The curve allows designers to derate the expected light output based on the operating temperature.

4.6 Forward Current vs. Ambient Temperature

This derating curve indicates the maximum allowable forward current as a function of ambient temperature. To prevent overheating and ensure reliability, the maximum continuous current must be reduced when operating at high ambient temperatures. For example, the absolute maximum of 25mA at 25°C may need to be reduced to 20mA or 15mA at 85°C.

5. Mechanical & Package Information

5.1 Package Dimensions

The datasheet includes a detailed package dimension drawing. Key mechanical specifications include:

• All dimensions are in millimeters (mm).
• General tolerance is ±0.25 mm unless otherwise specified.
• Lead spacing is measured at the point where the leads emerge from the plastic package body.

The drawing provides critical information for PCB footprint design, including pad size, spacing (pitch), package body length and width, lead diameter, and overall height. Accurate adherence to these dimensions is necessary for proper soldering and mechanical stability.

5.2 Polarity Identification

LED polarity is typically indicated by features such as a flat edge on the package body, a notch, or by having one lead shorter than the other (the cathode). The dimension drawing should clearly show this identifying feature. Correct polarity is essential for circuit operation; reverse biasing the LED beyond its low 5V rating can cause immediate failure.

6. Soldering & Assembly Guidelines

Proper handling is crucial to maintain LED performance and reliability.

6.1 Lead Forming

• Bending must occur at least 3 mm from the base of the epoxy bulb to avoid stress on the internal die and wire bonds.
• Lead forming should always be performed before soldering.
• Excessive stress during bending can crack the epoxy or damage the semiconductor, altering characteristics or causing failure.
• Cutting leads should be done at room temperature. Hot cutting can induce thermal shock.
• PCB holes must align perfectly with LED leads to avoid mounting stress.

6.2 Storage

• Recommended storage conditions: ≤ 30°C and ≤ 70% Relative Humidity (RH).
• Shelf life under these conditions is 3 months from shipment.
• For longer storage (up to 1 year), devices should be kept in a sealed container with a nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation on the devices.

6.3 Soldering Process

General Rule: Kula epoxy daga gurbin solder aƙalla milimita 3.

Tsari	Parameter	Ƙima / Yanayi
Hand Soldering	Iron Tip Temperature	300°C Max. (30W iron max.)
	Soldering Time	3 seconds Max. per lead
Wave/Dip Soldering	Preheat Temperature	100°C Max. (60 sec Max.)
	Soldering Bath Temperature & Time	260°C Max., 5 seconds Max.
	Recommended Profile	Follow the provided time-temperature graph.

Critical Notes:

• Avoid mechanical stress on the leads while the LED is at high temperature.
• Do not perform dip or hand soldering more than once.
• Protect the LED from shock or vibration until it cools to room temperature after soldering.
• Use the lowest possible soldering temperature that achieves a reliable joint.
• Cool the assembly at a natural rate; forced rapid cooling is not recommended.

6.4 Cleaning

• If cleaning is necessary, use isopropyl alcohol (IPA) at room temperature.
• Immersion time should not exceed one minute.
• Allow to air dry at room temperature before use.
• Avoid ultrasonic cleaning. If absolutely required, extensive pre-qualification is necessary to ensure the specific ultrasonic power and conditions do not damage the LED's internal structure.

6.5 Heat Management in Application

Thermal management must be considered during the system design phase. The current driving the LED should be appropriately derated according to the derating curve (Forward Current vs. Ambient Temperature). The ambient temperature around the LED in the final application must be controlled. Inadequate heat dissipation will cause the junction temperature to rise, leading to reduced light output, color shift, and accelerated lumen depreciation over time.

7. Packaging & Ordering Information

7.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture damage during transport and storage.

• Primary Packing: LEDs are mounted on anti-static trays or plates.
• Standard Packing Quantity: 270 plates per bag.
• Inner Carton: Contains 4 plates.
• Master/Outside Carton: Contains 10 inner cartons (total of 40 plates or 10,800 pieces, assuming 270 pieces/plate).

7.2 Label Explanation

Carton labels contain the following information for traceability and identification:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., A694B/2SYG/S530-E2).
• QTY: Packing Quantity in the carton.
• CAT: Ranks or Binning Category.
• HUE: Dominant Wavelength (λ_d) code.
• REF: Forward Voltage (V_F) code.
• LOT No: Manufacturing Lot Number for traceability.

8. Application Recommendations

8.1 Typical Application Scenarios

• Instrument Panel Indicators: Power status, mode selection (e.g., Run, Standby, Fault), range or scale illumination.
• Consumer Electronics: Power-on lights, charging status indicators, function activity lights on routers, modems, or audio equipment.
• Industrial Controls: Machine status (On, Off, Error), position sensing feedback, level indicators.
• Automotive Interior: Dashboard indicator lights (for aftermarket or specific non-critical functions, noting the operating temperature range).

8.2 Design Considerations

• Current Limiting: Always use a series resistor or constant current driver. Calculate the resistor value using the maximum V_F (2.4V) and the supply voltage (V_CC) to ensure I_F does not exceed 20mA (or a lower derated value for high-temperature operation): R = (V_CC - V_{F_max}) / I_{F_desired}.
• PCB Layout: Design the footprint exactly per the dimension drawing. Ensure adequate copper area around the LED pads to act as a heat sink, especially if operating at or near maximum current.
• ESD Protection: Although not explicitly stated as highly sensitive, standard ESD precautions during handling and assembly are recommended.
• Optical Design: The 60° viewing angle provides good off-axis visibility. For narrower beams, external lenses or light pipes may be required. The diffused resin helps reduce glare and provides a more uniform appearance.
• Environmental Sealing: If used in harsh environments, consider conformal coating or potting, ensuring the coating material is compatible with the LED's epoxy resin.

9. Technical Comparison & Differentiation

While a direct side-by-side comparison with other part numbers is not provided, the A694B/2SYG/S530-E2 offers several distinct advantages based on its datasheet specifications:

• Versatility in Assembly: The unique stackable array design (both vertical and horizontal) is a key differentiator, allowing for compact, multi-LED indicator blocks without complex mechanical design.
• Comprehensive Compliance: It meets a full suite of modern environmental standards (RoHS, REACH, Halogen-Free), which may not be true for older or lower-cost alternatives.
• Balanced Performance: It offers a good balance of brightness (50 mcd typ), viewing angle (60°), and power consumption, making it a general-purpose indicator suitable for many applications.
• Robust Construction: The emphasis on lead forming distance (3mm) and detailed soldering guidelines suggests a package designed for reliable assembly in volume production.

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