Table of Contents
- 1. Product Overview
- 1.1 Core Advantages
- 1.2 Target Markets and Applications
- 2. In-depth Analysis of Technical Parameters
- 2.1 Absolute Maximum Ratings
- 2.2 Photoelectric Characteristics (Ta=25°C)
- 2.3 Thermal Characteristics
- 3. Grading System Description
- 4. Performance Curve Analysis
- 4.1 Relationship Between Relative Light Intensity and Wavelength
- 4.2 Directivity Distribution Diagram
- 4.3 Relationship Between Forward Current and Forward Voltage (I-V Curve)
- 4.4 Relationship Between Relative Light Intensity and Forward Current
- 4.5 相对光强与环境温度关系 & 正向电流与环境温度关系
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Polarity Identification
- 6. Welding and Assembly Guide
- 6.1 Lead Forming
- 6.2 Storage Conditions
- 6.3 Welding Process Parameters
- 6.4 Cleaning
- 7. Packaging and Ordering Information
- 7.1 Packaging Specifications
- 7.2 Labeling Instructions
- 8. Application Design Considerations
- 8.1 Drive Circuit Design
- 8.2 Thermal Management
- 8.3 ESD (Electrostatic Discharge) Protection
- 9. Frequently Asked Questions (Based on Technical Specifications)
- 9.1 Ina iya amfani da matakin ma'ana 3.3V don kunna wannan LED?
- 9.2 Me yasa kusurwar kallo ta yi fadi (170°) haka?
- 9.3 What is the difference between peak wavelength (632nm) and dominant wavelength (624nm)?
- 9.4 How many LEDs can I connect in series?
- 10. Working Principle
1. Product Overview
594SURD/S530-A3 is a high-brightness LED lamp bead, specifically designed for applications requiring exceptional luminous intensity and reliability. This device utilizes AlGaInP chip technology to output bright red light. Its design is robust and durable, and it complies with modern environmental and safety standards, including RoHS, REACH, and halogen-free requirements.
This series offers multiple viewing angle options to accommodate different application needs and can be supplied in tape and reel packaging for automated assembly processes. Its primary design objective is to provide stable, high-performance lighting in compact electronic devices.
1.1 Core Advantages
- High Brightness:Designed for applications requiring higher light output.
- Environmental Compliance:The product complies with RoHS standards and adheres to EU REACH regulations.
- Halogen-Free:符合无卤素标准 (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm)。
- High reliability:Sturdy and reliable structure, suitable for long-term operation.
- Packaging Flexibility:Provided in tape and reel packaging for efficient high-volume production.
1.2 Target Markets and Applications
This LED is primarily targeted at the consumer electronics and display backlight markets. Its typical applications include:
- Television
- Computer monitor
- Telephone
- Universal Computer Peripherals and Indicator Lights
This device is suitable for status indication and backlighting applications requiring clear red indication.
2. In-depth Analysis of Technical Parameters
This section provides a detailed and objective interpretation of the key technical parameters listed in the datasheet. Understanding these limits and characteristics is crucial for proper circuit design and reliable operation.
2.1 Absolute Maximum Ratings
These ratings define the stress limits that may cause permanent damage to the device. It is not recommended to operate under conditions close to or at these limits for extended periods.
- Continuous Forward Current (IF):25 mA. This is the maximum direct current that can be continuously applied without degrading the LED's performance or lifespan. Exceeding this value increases junction temperature and accelerates lumen depreciation.
- Peak Forward Current (IFP):60 mA (duty cycle 1/10, frequency 1 kHz). This rating allows brief current pulses, which can be used for multiplexing or achieving higher instantaneous brightness. The 10% duty cycle is crucial; the average current must still comply with the continuous rating.
- Reverse Voltage (VR):5 V. The LED is not designed to withstand significant reverse bias. Applying a reverse voltage exceeding 5V will cause immediate and catastrophic failure due to junction breakdown.
- Power Dissipation (Pd):60 mW. This is the maximum power that the package can dissipate in the form of heat. The calculation formula is forward voltage (VF) * forward current (IF). Designers must ensure the operating point does not exceed this limit.
- Operating and storage temperature:-40°C to +85°C (operating), -40°C to +100°C (storage). The wide temperature range makes it suitable for industrial and automotive environments (non-critical areas).
- Soldering temperature:260°C for 5 seconds. This defines the tolerance for the reflow soldering temperature profile, which is crucial for PCB assembly without damaging the epoxy or internal bonding wires.
2.2 Photoelectric Characteristics (Ta=25°C)
These are typical performance parameters measured under standard test conditions (forward current 20mA, ambient temperature 25°C).
- Luminous Intensity (Iv):Typical value 16 mcd, minimum value 10 mcd. This specifies the amount of visible light emitted in a given direction. The minimum value is the guaranteed lower limit for product acceptance. In designs with strict tolerance requirements, a measurement uncertainty of ±10% should be considered.
- Viewing Angle (2θ1/2):Typical value 170 degrees. This very wide viewing angle indicates the use of a diffuser lens/resin, producing a broad, uniform illumination pattern rather than a narrow beam. It is an ideal choice for LED applications requiring visibility from multiple angles.
- Peak Wavelength (λp):Typical value 632 nm. This is the wavelength at which the spectral power distribution reaches its maximum. It defines the "color" of the light emitted by the semiconductor chip itself.
- Dominant Wavelength (λd):Typical value 624 nm. This is the monochromatic wavelength that matches the color of the LED as perceived by the human eye. For color specification, it is generally more relevant than the peak wavelength. Please note the measurement uncertainty of ±1.0nm.
- Spectral Radiant Bandwidth (Δλ):Typical value 20 nm. This is the spectral width at Full Width at Half Maximum (FWHM). The 20nm value is characteristic of AlGaInP red LEDs, indicating relatively pure color saturation.
- Forward Voltage (VF):Min 1.7V, Typ 2.0V, Max 2.4V (at IF=20mA condition). This is the voltage drop across the LED during operation. The drive circuit design must accommodate this range. The specification notes a measurement uncertainty of ±0.1V.
- Reverse Current (IR):Maximum value 10 μA (at VR=5V condition). This is the leakage current when the device is reverse biased. 10μA is a standard value for indicator LEDs.
2.3 Thermal Characteristics
Although not explicitly listed in a separate table, the importance of thermal management can be inferred from the power dissipation rating and operating temperature range. The performance curves show the dependence of light output and forward current on ambient temperature, which is a key design consideration. When operating at high ambient temperatures, effective heat dissipation or current derating is required to maintain performance and lifetime.
3. Grading System Description
The datasheet mentions a binning system for key parameters, as indicated by the labeling on the packaging material. Binning is the process of classifying LEDs into groups (bins) based on measured performance to ensure consistency within the same production batch.
- CAT (Luminous Intensity Bin):LEDs are binned according to measured luminous intensity (e.g., 10-12 mcd, 13-15 mcd, 16-18 mcd). This allows designers to select the appropriate brightness grade for their application.
- HUE (Dominant Wavelength Bin):LED binning is performed based on the dominant wavelength (e.g., 622-624 nm, 624-626 nm). This ensures color consistency among multiple LEDs used within a single product.
- REF (Forward Voltage Bin):Forward voltage is also binned (e.g., 1.9-2.1V, 2.1-2.3V). This is important for designs with multiple LEDs in series, as it affects the total voltage requirement in series configuration and current matching in parallel configuration.
The specific binning code ranges are not detailed in this public specification. They are typically defined in a separate binning document or negotiated during the ordering process.
4. Performance Curve Analysis
The provided charts offer valuable information for understanding the device's behavior under non-standard conditions.
4.1 Relationship Between Relative Light Intensity and Wavelength
This spectral distribution curve confirms a typical peak wavelength of approximately 632 nm and a full width at half maximum of about 20 nm, which are characteristic of bright red AlGaInP LEDs. Its shape is typical, with a steep cutoff on the long-wavelength side and a more gradual decline on the short-wavelength side.
4.2 Directivity Distribution Diagram
The polar plot shows a viewing angle of 170 degrees. The luminous intensity is nearly uniform over a very wide area, confirming the diffusing characteristics of the lens. There are no significant side lobes or narrow hot spots, which is ideal for wide-angle indicator light applications.
4.3 Relationship Between Forward Current and Forward Voltage (I-V Curve)
This graph illustrates the typical exponential relationship of a diode. The "knee" voltage at which the LED begins to conduct significantly is approximately 1.6V. At the recommended operating current of 20mA, the forward voltage is about 2.0V. This curve is crucial for designing constant current drivers or simple resistor-based current limiting circuits.
4.4 Relationship Between Relative Light Intensity and Forward Current
The light output (relative luminous intensity) increases linearly with forward current until the rated maximum is reached. This linear relationship simplifies brightness control via current modulation (analog dimming). However, at extremely high currents, efficiency may decrease due to increased thermal effects.
4.5 相对光强与环境温度关系 & 正向电流与环境温度关系
These are derating curves, which can be said to be the most critical part of reliable design.
- Relationship between Light Output and Temperature:Relative light intensity decreases as the ambient temperature rises. For example, at 85°C, the light output may be only about 70-80% of that at 25°C. This must be compensated for in applications requiring consistent brightness across a temperature range.
- For radial LED packages, the cathode is typically identified by a flat edge on the plastic lens, a shorter lead, or a notch on the flange. The specific identification method should be indicated on the package outline drawing. Correct polarity is crucial; a reverse bias exceeding 5V can damage the device.This curve likely illustrates the maximum allowable forward current as a function of ambient temperature to remain within power dissipation limits. To ensure reliability, the operating current must be reduced (derated) as the ambient temperature increases. Operating at the absolute maximum current of 25mA is only safe at lower ambient temperatures.
5. Mechanical and Packaging Information
5.1 Package Dimensions
This LED uses a standard radial leaded package (commonly referred to as "3mm" or "T1" package, but specific dimensions should be based on the drawing). Key dimension descriptions include:
- All dimensions are in millimeters.
- The height of the flange (the edge at the base of the dome) must be less than 1.5mm (0.059"). This is important for clearance during PCB mounting.
- The standard tolerance for dimensions not specified is ±0.25mm.
The dimensional drawing is crucial for PCB pad design, ensuring correct hole spacing and component placement.
5.2 Polarity Identification
For radial LED packages, the cathode is typically identified by a flat spot on the rim of the plastic lens, a shorter lead, or a notch in the flange. The specific identification method should be indicated on the package dimension drawing. Correct polarity is essential; reverse biasing beyond 5V can destroy the device.
6. Welding and Assembly Guide
Strict adherence to these guidelines is necessary to prevent mechanical and thermal damage during the assembly process.
6.1 Lead Forming
- Bend the leads at least 3mm away from the base of the epoxy LED.
- Lead forming operationMust be soldering.
- Perform before soldering. Avoid applying stress to the LED package during the molding process. Stress may cause epoxy cracking or damage internal bonding wires.
- Cut the leads at room temperature. High-temperature cutting may cause thermal shock.
- Ensure perfect alignment between PCB holes and LED pins to avoid installation stress.
6.2 Storage Conditions
- After receipt, store under conditions of ≤30°C and relative humidity ≤70%.
- Shelf life in original bag: 3 months.
- For longer storage (up to 1 year): use a nitrogen-sealed container with desiccant.
- Avoid sudden temperature changes in humid environments to prevent condensation.
6.3 Welding Process Parameters
General Rules:Maintain a minimum distance of 3mm from the solder joint to the epoxy resin LED.
Manual Soldering:
- Soldering Iron Tip Temperature: Maximum 300°C (Soldering Iron Power Maximum 30W).
- Soldering time: maximum 3 seconds per pin.
Wave soldering (DIP):
- Preheating temperature: up to 100°C (max. 60 seconds).
- Solder pot temperature and time: up to 260°C, max. 5 seconds.
Key considerations:
- Avoid applying stress to the pins when the LED is in a high-temperature state.
- Do not perform soldering (dip soldering or hand soldering) more than once.
- After soldering, protect the LED from mechanical shock/vibration before it cools down to room temperature.
- Cool down gradually from the peak temperature; rapid cooling is not recommended.
- Always use the lowest possible soldering temperature that achieves a reliable solder joint.
6.4 Cleaning
- If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
- Air-dry at room temperature.
- Unless pre-validated as acceptable under specific conditions,Do not use ultrasonic cleaning as it may damage the internal structure.
7. Packaging and Ordering Information
7.1 Packaging Specifications
LED packaging is designed to prevent electrostatic discharge (ESD) and moisture ingress:
- Primary packaging:Anti-static bag, containing a minimum of 200 to 1000 pieces.
- Secondary packaging:Four anti-static bags are placed into one inner box.
- Tertiary packaging:Ten inner boxes are placed into one master carton.
7.2 Labeling Instructions
The packaging bag label contains multiple codes for traceability and specification identification:
- CPN:Customer Production Number (optional customer reference number).
- P/N:Production Number (manufacturer part number, e.g., 594SURD/S530-A3).
- QTY:Number of pieces per inner bag.
- CAT, HUE, REF:The grading codes for luminous intensity, dominant wavelength, and forward voltage, respectively.
- LOT No:Production lot number, used for traceability.
8. Application Design Considerations
8.1 Drive Circuit Design
The most common driving method is to connect a current-limiting resistor in series. The formula for calculating the resistor value (R) is: R = (VPower Supply- VF) / IF. Use the maximum VFvalue (2.4V) from the datasheet for calculation to ensure proper operation even with a low VFThe LED current will not exceed the desired value. For example, using a 5V power supply with a target IFof 20mA: R = (5V - 2.4V) / 0.02A = 130Ω. The closest standard value (120Ω or 150Ω) should be selected, with 150Ω being more conservative. For critical applications requiring high brightness uniformity or a wide operating temperature range, a constant current driver is recommended.
8.2 Thermal Management
Even for small indicator LEDs, thermal management is still important for extending lifespan. Ensure the PCB has sufficient copper foil area around the LED pins to act as a heat sink. Avoid placing LEDs near other heat-generating components. When designing for high ambient temperature environments, adhere to the current derating guidelines shown in the performance curves.
8.3 ESD (Electrostatic Discharge) Protection
The datasheet indicates this product is sensitive to ESD. Standard ESD handling precautions must be followed during assembly: use grounded workstations, wrist straps, and conductive floor mats. Transport and store in ESD-shielded packaging.
9. Frequently Asked Questions (Based on Technical Specifications)
9.1 Ina iya amfani da matakin ma'ana 3.3V don kunna wannan LED?
Yes. Use a series resistor: At a typical VFWhen it is 2.0V, the required resistance value is (3.3V - 2.0V)/0.02A = 65Ω. However, if the LED's maximum VFis 2.4V, then with a 3.3V power supply and a 65Ω resistor, the current will be only about 14mA, resulting in reduced brightness. A smaller resistor (e.g., 47Ω) can be used, but it must be verified that at the minimum VF conditions.
The current does not exceed 25mA under the conditions.
9.2 Me yasa kusurwar kallo ta yi fadi (170°) haka?
The "SURD" in the part number and the "Red Diffused" resin description indicate the use of a diffused lens. This scatters light, creating a very wide and uniform viewing angle, making it ideal for status indicators that need to be visible from multiple directions, not just head-on.
9.3 What is the difference between peak wavelength (632nm) and dominant wavelength (624nm)?
Peak wavelength is the physical peak of the chip's emission spectrum. Dominant wavelength is the "color point" perceived by the human eye, influenced by the entire spectral shape and human eye sensitivity (photopic response). For color matching applications, dominant wavelength is generally more useful.
9.4 How many LEDs can I connect in series?FThe limit depends on your drive voltage. For a constant current driver, sum the maximum V
Addition. For example, using a 12V driver: 12V / 2.4V = up to 5 LEDs can be connected in series. Always leave some margin. For a series string driven by a voltage source through a resistor, the calculation is more complex, and the total voltage drop and current must be considered.
10. Working Principle
Detailed Explanation of LED Specification Terminology
Complete Interpretation of LED Technical Terminology
I. Core Indicators of Photoelectric Performance
| Terminology | Unit/Representation | Popular Explanation | Aiseā e Taua ai |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | The luminous flux emitted per watt of electrical power, higher values indicate greater energy efficiency. | It directly determines the energy efficiency rating of the luminaire and the electricity cost. |
| Luminous Flux | lm (lumen) | The total amount of light emitted by a light source, commonly known as "brightness". | Determines whether the luminaire is bright enough. |
| Viewing Angle | ° (degree), e.g., 120° | The angle at which luminous intensity drops to half, determining the beam width. | Affects the range and uniformity of illumination. |
| Color Temperature (CCT) | K (Kelvin), such as 2700K/6500K | Launin haske mai dumi ko sanyi, ƙananan ƙima sun karkata zuwa rawaya/dumi, manyan ƙima sun karkata zuwa fari/sanyi. | Yana ƙayyade yanayin hasken wuta da yanayin da ya dace. |
| Color Rendering Index (CRI / Ra) | Unitless, 0–100 | The ability of a light source to reproduce the true colors of objects, with Ra≥80 being preferable. | Affects color fidelity, used in high-demand places such as shopping malls and art galleries. |
| Color tolerance (SDCM) | MacAdam ellipse steps, such as "5-step" | A quantitative indicator of color consistency; a smaller step number indicates better color consistency. | Ensure no color difference among luminaires from the same batch. |
| Dominant Wavelength | nm (nanometer), e.g., 620nm (red) | Wavelength values corresponding to the colors of colored LEDs. | Determines the hue of monochromatic LEDs such as red, yellow, and green. |
| Spectral Distribution | Wavelength vs. Intensity Curve | Shows the intensity distribution of light emitted by an LED at each wavelength. | Affects color rendering and color quality. |
II. Electrical Parameters
| Terminology | Symbols | Popular Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage (Forward Voltage) | Vf | The minimum voltage required to light up an LED, similar to a "starting threshold". | The driving power supply voltage must be ≥ Vf; the voltages add up when multiple LEDs are connected in series. |
| Forward Current | If | The current value that makes the LED emit light normally. | Constant current drive is often used, where the current determines brightness and lifespan. |
| Maximum Pulse Current | Ifp | The peak current that can be withstood for a short period of time, used for dimming or flashing. | Pulse width and duty cycle must be strictly controlled to prevent overheating and damage. |
| Reverse Voltage | Vr | Maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. | Reverse connection or voltage surges must be prevented in the circuit. |
| Thermal Resistance (Thermal Resistance) | Rth (°C/W) | The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. | High thermal resistance requires stronger cooling design, otherwise junction temperature rises. |
| Electrostatic Discharge Immunity (ESD Immunity) | V (HBM), such as 1000V | Electrostatic discharge immunity; a higher value indicates greater resistance to ESD damage. | Anti-static measures must be implemented during production, especially for high-sensitivity LEDs. |
III. Thermal Management and Reliability
| Terminology | Key Indicators | Popular Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift. |
| Lumen Depreciation | L70 / L80 (hours) | The time required for the brightness to drop to 70% or 80% of its initial value. | Directly define the "useful life" of an LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | The degree of color change during use. | Affects the color consistency of the lighting scene. |
| Thermal Aging | Material performance degradation | Degradation of packaging materials due to long-term high temperature. | Zai iya haifar da raguwar haske, canjin launi ko gazawar bude hanya. |
IV. Kullewa da Kayan aiki
| Terminology | Nau'o'in gama gari | Popular Explanation | Characteristics and Applications |
|---|---|---|---|
| Package Types | EMC, PPA, Ceramic | The housing material that protects the chip and provides optical and thermal interfaces. | EMC offers good heat resistance and low cost; ceramic provides superior heat dissipation and long lifespan. |
| Chip Structure | Front-side, Flip Chip | Chip electrode arrangement method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Different phosphors affect luminous efficacy, color temperature, and color rendering. |
| Lens/Optical Design | Flat, microlens, total internal reflection | The optical structure on the packaging surface controls the light distribution. | Determines the emission angle and the light distribution curve. |
V. Quality Control and Grading
| Terminology | Grading Content | Popular Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Binning | Codes such as 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products in the same batch. |
| Voltage binning | Code such as 6W, 6X | Grouped by forward voltage range. | Ease of driving power matching, improving system efficiency. |
| Color binning | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within a minimal range. | Ensure color consistency to avoid uneven colors within the same luminaire. |
| Color Temperature Grading | 2700K, 3000K, etc. | Group by color temperature, each group has a corresponding coordinate range. | Meet the color temperature requirements of different scenarios. |
VI. Testing and Certification
| Terminology | Standard/Test | Popular Explanation | Meaning |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Long-term operation under constant temperature conditions, recording luminance attenuation data. | For estimating LED lifetime (in conjunction with TM-21). |
| TM-21 | Lifetime projection standard | Estimating lifespan under actual usage conditions based on LM-80 data. | Providing scientific life prediction. |
| IESNA Standard | Illuminating Engineering Society Standard | Covers optical, electrical, and thermal test methods. | Industry-recognized testing basis. |
| RoHS / REACH | Environmental Certification | Ensure the product does not contain harmful substances (such as lead, mercury). | Entry conditions for the international market. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting products. | Commonly used in government procurement and subsidy programs to enhance market competitiveness. |