65-11 Series Micro Top-View LED Datasheet - SMT Package - Blue 468nm - 120° Wide Viewing Angle - Typical 3.2V - 20mA - Technical Documentation

1. Product Overview

Jerin 65-11 yana wakiltar nau'in ƙananan LED na saman haske na fasahar haɗawa ta saman (SMT). Waɗannan abubuwan suna da siffa ta amfani da ƙanƙantar farin kunshe da ƙira mai haske na sama-zuwa-ƙasa, inda haske ke fitowa ta hanyar allon da'ira (PCB) kanta. Wannan takamaiman samfurin yana fitar da hasken shuɗi, tare da madaidaicin tsayin raƙuman ruwa na 468 nanometers.

Babban fa'idar wannan jerin ya haɗa da fa'idar kallon da ya fi fadi, wanda aka tsara don haɗawa mai inganci zuwa bututun jagorar haske ko bututun haske. Ƙirarsa ta haɗa da sifofi masu haɓaka aikin gani, kuma cikakke ne da ka'idojin muhalli na maras gubar (Pb-free) da RoHS. Aikin kariya na fitar da wutar lantarki (ESD) da aka gina yana kare na'urar yayin sarrafawa da haɗawa.

2. Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits that may cause permanent damage to the device. Operation under these conditions is not guaranteed.

• Reverse Voltage (V_R):5 V
• Forward Current (I_F):25 mA (Continuous)
• Peak Forward Current (I_FP):100 mA (duty cycle 1/10 @ 1 kHz)
• Power consumption (P_d):110 mW
• ESD protection (HBM):2000 V
• Operating temperature (T_opr):-40°C to +100°C
• Storage temperature (T_stg):-40°C to +110°C
• Soldering temperature:Reflow Soldering: Maximum 260°C, up to 10 seconds; Hand Soldering: Maximum 350°C, up to 3 seconds per pin.

2.2 Electro-Optical Characteristics

Unless otherwise specified, measurements are taken at a standard ambient temperature of 25°C and a forward current of 20 mA. Tolerance is critical for design.

• Luminous intensity (I_v):112 to 285 mcd (millicandela). Tolerance is ±11%.
• Viewing angle (2θ_1/2):120 degrees (typical value). This angle defines the angular distribution range where the luminous intensity is at least half of the peak value.
• Peak wavelength (λ_p):468 nm (typical value).
• Dominant wavelength (λ_d):464.5 to 476.5 nm. Tolerance is ±1 nm.
• Spectral Bandwidth (Δλ):20 nm (typical). This indicates the spectral purity of the blue light.
• Forward Voltage (V_F):2.90 zuwa 3.60 V. Tazarar shine ±0.1 V.
• Kwararar baya (I_R):A ƙarancin baya na 5 V, matsakaicin 50 µA.

3. Grading System Description

LEDs are binned according to key parameters to ensure consistency across production batches. Designers can specify bins to meet application requirements for color and brightness uniformity.

3.1 Dominant Wavelength Binning (Group A)

Defines the precise hue of blue. Bins are labeled A9 through A12, where A9 represents the shortest wavelength range (464.5-467.5 nm) and A12 represents the longest wavelength range (473.5-476.5 nm).

3.2 Luminous Intensity Binning

Define the brightness grade. The grading ranges from R1 (lowest, 112-140 mcd) to S2 (highest, 225-285 mcd).

3.3 Forward Voltage Binning (B2 Group)

Define electrical characteristics. The bin numbers range from 36 to 42, corresponding to voltage ranges from 2.90-3.00 V (Bin 36) to 3.50-3.60 V (Bin 42).

4. Mechanical and Packaging Information

4.1 Package Outline Dimensions

This device features a compact SMT package size. Key dimensions include body size, lead pitch, and overall height. All unspecified tolerances are ±0.1 mm. Polarity is indicated by specific markings on the package or pin configuration, which must be noted during PCB layout and assembly.

4.2 Tape and Reel Packaging

LEDs are supplied in tape and reel format, suitable for automatic SMT assembly. Reel dimensions and tape pocket design are specified to ensure compatibility with standard SMT equipment. The standard loading quantity is 2000 pieces per reel.

4.3 Moisture Sensitivity and Storage

Components are packaged in moisture barrier aluminum foil bags with desiccant. Precautions are crucial: the bag must not be opened until the components are ready for use. Before opening, store at ≤30°C and ≤90% RH. After opening, to prevent damage from moisture during reflow soldering, it is recommended that the component's floor life be one year under conditions of ≤30°C and ≤60% RH.

5. Soldering and Assembly Guide

The primary recommended soldering method is infrared (IR) reflow soldering. The maximum allowable peak temperature is 260°C, with a duration not exceeding 10 seconds. Hand soldering is permitted but must be limited to 350°C, with a maximum of 3 seconds per pin, to prevent thermal damage to the plastic package and semiconductor chip.

6. Application Recommendations

6.1 Typical Application Scenarios

• Optical Indicator:Status indicator lights on consumer electronics, industrial control equipment, and automotive dashboards.
• Light Guide Coupling:The characteristics of top emission and wide viewing angle are very suitable for edge-lit lighting or injecting light into acrylic or polycarbonate light guide tubes, commonly used for key backlighting, panel indicator lights, and decorative lighting.
• Backlighting:Suitable for small LCD displays, keyboards, switch illumination, and general decorative or accent lighting.
• Automotive Interior Lighting:For example, applications such as dashboard switch backlighting, where reliability and color consistency are crucial.

6.2 Design Considerations

• Current limiting:The external current limiting resistor isAbsolutely essentialLED forward voltage has a negative temperature coefficient, meaning a small increase in voltage can cause a large, potentially destructive increase in current. The resistor value should be calculated based on the supply voltage and the desired forward current (typically 20 mA or less).
• Thermal Management:Although power consumption is low, ensuring the PCB provides sufficient heat dissipation, especially under high ambient temperatures or when driven at maximum continuous current, will help improve long-term reliability.
• ESD Precautions:Although the device has built-in ESD protection, standard ESD handling procedures should still be followed during assembly and installation.

7. Reliability Testing

The product undergoes a series of comprehensive reliability tests with a confidence level of 90% and a Lot Tolerance Percent Defective (LTPD) of 10%. Key tests include:

• Reflow Soldering Resistance
• Temperature Cycling (-40°C to +100°C)
• Thermal Shock
• High and Low Temperature Storage
• DC Operating Life (1000 hours at 20mA)
• High Temperature High Humidity (85°C/85% RH, 1000 hours)

These tests verify the robustness of the device under typical environmental and operational stresses encountered in electronic products.

8. Frequently Asked Questions (Based on Technical Data)

Q: What are the main advantages of the "top-emitting" design?
A: It emits light perpendicular to the PCB plane, through the circuit board itself. This is optimal for applications using light guide tubes placed directly above the LED, as it maximizes coupling efficiency and provides uniform illumination with a wide viewing angle.

Q: Ina iya haɗa wannan LED kai tsaye zuwa tushen wutar lantarki na 5V ba tare da resistor ba?
A:No.This will almost certainly damage the LED. The forward voltage is approximately 3.2V. Connecting it directly to 5V will force a current far exceeding the maximum rating, leading to immediate failure. A series resistor is essential.

Q: How to interpret the luminous intensity value?
A: Luminous intensity (in millicandelas, mcd) indicates the brightness perceived by the human eye from a specific direction. A wide viewing angle of 120° means this brightness is maintained over a very broad area, but the peak intensity value is measured along the central axis (0°).

Q: What does the binning information on the label mean?
A: The label contains codes for the luminous intensity grade (CAT), chromaticity coordinates (HUE), and forward voltage grade (REF). This allows for traceability and ensures that the components you receive have the specific optical and electrical characteristics you specified in your order, which is crucial for color matching in multi-LED applications.

9. Working Principle

The device is a semiconductor light source. It is based on an indium gallium nitride (InGaN) chip, which is a direct bandgap semiconductor material. When a forward voltage exceeding the device's threshold voltage is applied, electrons and holes recombine within the active region of the chip. In this specific material system (InGaN), this recombination process primarily releases energy in the form of photons in the blue wavelength spectrum (approximately 468 nm). The chip is encapsulated in a water-clear lens material, which helps shape the emitted light into the desired wide-angle pattern.

10. Design and Use Case Studies

Scenario: Thin-Film Switch Panel Backlighting
A designer is creating a user interface panel with multiple membrane switches, requiring blue backlighting for visibility under low-light conditions. The panel uses individual light pipes for each switch icon, routed from a central PCB.

Component Selection:The 65-11 series blue LED is selected because its top-emitting design efficiently couples to the bottom of the light pipe. The 120° wide viewing angle ensures uniform illumination of the icon area, even with imperfect alignment.

Circuit Design:The system power supply is 5V. Calculate the current-limiting resistor for each LED. Using a typical V_Fof 3.2V, target I_Fof 20mA, the resistor value is R = (5V - 3.2V) / 0.02A = 90 Ω. Select a standard 91 Ω resistor. The power dissipation on the resistor is (1.8V)^2 / 91Ω ≈ 36 mW, which is well within the rating of a standard 1/8W resistor.

PCB Layout:LED pads are precisely placed below the light guide tube mounting holes. The polarity markings on the PCB silkscreen match the LED's anode/cathode indicators. Use small thermal relief connections on the pad connected to the LED cathode (if it has a thermal pad) to aid soldering while providing some heat dissipation.

Results:The final product achieved uniform, bright blue backlighting for all switches, with extremely low power consumption, high reliability, and validation through the component-specified reliability tests.