Mini TOP View LED 65-11 Series Datasheet - SMT Package - Blue 468nm - 120° Viewing Angle - 3.2V Typ - 20mA - English Technical Document

1. Product Overview

The 65-11 series represents a family of Mini TOP View Surface-Mount Technology (SMT) LEDs. These components are characterized by their compact white package and a unique top-down emission design where light is emitted through the printed circuit board (PCB). This specific model emits blue light with a typical dominant wavelength of 468 nanometers.

The core advantages of this series include a very wide viewing angle, optimized for efficient light coupling into light guides or pipes. The design incorporates features for enhanced optical performance and is fully compliant with lead-free (Pb-free) and RoHS environmental standards. Built-in Electrostatic Discharge (ESD) protection safeguards the device during handling and assembly.

2. Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Reverse Voltage (V_R): 5 V
• Forward Current (I_F): 25 mA (Continuous)
• Peak Forward Current (I_FP): 100 mA (Duty Cycle 1/10 @ 1 kHz)
• Power Dissipation (P_d): 110 mW
• ESD Protection (HBM): 2000 V
• Operating Temperature (T_opr): -40°C to +100°C
• Storage Temperature (T_stg): -40°C to +110°C
• Soldering Temperature: Reflow: 260°C for 10 seconds max; Hand: 350°C for 3 seconds max.

2.2 Electro-Optical Characteristics

Measured at a standard ambient temperature of 25°C and a forward current of 20 mA, unless otherwise specified. Tolerances are critical for design.

• Luminous Intensity (I_v): 112 to 285 mcd (millicandela). Tolerance is ±11%.
• Viewing Angle (2θ_1/2): 120 degrees (typical). This defines the angular spread where intensity is at least half of the peak value.
• Peak Wavelength (λ_p): 468 nm (typical).
• Dominant Wavelength (λ_d): 464.5 to 476.5 nm. Tolerance is ±1 nm.
• Spectral Bandwidth (Δλ): 20 nm (typical). This indicates the spectral purity of the blue light.
• Forward Voltage (V_F): 2.90 to 3.60 V. Tolerance is ±0.1 V.
• Reverse Current (I_R): Maximum 50 µA at a reverse voltage of 5 V.

3. Binning System Explanation

The LEDs are sorted into bins based on key parameters to ensure consistency in production runs. Designers can specify bins to match application requirements for color and brightness uniformity.

3.1 Dominant Wavelength Binning (Group A)

Defines the precise shade of blue. Bins are labeled A9 through A12, with A9 representing the shortest wavelength range (464.5-467.5 nm) and A12 the longest (473.5-476.5 nm).

3.2 Luminous Intensity Binning

Defines the brightness level. Bins range from R1 (lowest, 112-140 mcd) to S2 (highest, 225-285 mcd).

3.3 Forward Voltage Binning (Group B2)

Defines the electrical characteristic. Bins are numbered 36 through 42, corresponding to voltage ranges from 2.90-3.00 V (Bin 36) to 3.50-3.60 V (Bin 42).

4. Mechanical and Packaging Information

4.1 Package Outline Dimensions

The device features a compact SMT footprint. Critical dimensions include the body size, lead spacing, and overall height. All unspecified tolerances are ±0.1 mm. The polarity is indicated by a specific marking or pin configuration on the package, which must be observed during PCB layout and assembly.

4.2 Tape and Reel Packaging

The LEDs are supplied on carrier tape and reel for automated pick-and-place assembly. The reel dimensions and tape pocket design are specified to ensure compatibility with standard SMT equipment. The standard loaded quantity is 2000 pieces per reel.

4.3 Moisture Sensitivity and Storage

The components are packaged in a moisture-resistant aluminum bag with a desiccant. Precautions are critical: the bag must not be opened until the components are ready for use. Before opening, storage should be at ≤30°C and ≤90% RH. After opening, the components have a recommended floor life of one year under conditions of ≤30°C and ≤60% RH to prevent moisture-induced damage during reflow soldering.

5. Soldering and Assembly Guidelines

The primary recommended soldering method is Infrared (IR) reflow soldering. The maximum allowable profile peak temperature is 260°C for a duration not exceeding 10 seconds. Hand soldering is permissible but must be limited to 350°C for a maximum of 3 seconds per lead to prevent thermal damage to the plastic package and the semiconductor die.

6. Application Suggestions

6.1 Typical Application Scenarios

• Optical Indicators: Status lights on consumer electronics, industrial controls, and automotive dashboards.
• Light Guide/Pipe Coupling: The top-view, wide-angle emission is ideal for edge-lighting or injecting light into acrylic or polycarbonate light guides, commonly used in button backlighting, panel indicators, and decorative lighting.
• Backlighting: Suitable for small LCD displays, keypads, switch illumination, and general decorative or accent lighting.
• Interior Automotive Lighting: Applications such as dashboard switch backlighting, where reliability and consistent color are paramount.

6.2 Design Considerations

• Current Limiting: An external current-limiting resistor is absolutely mandatory. The LED's forward voltage has a negative temperature coefficient, meaning a small increase in voltage can cause a large, potentially destructive increase in current. The resistor value should be calculated based on the supply voltage and the desired forward current (typically 20 mA or less).
• Thermal Management: While power dissipation is low, ensuring the PCB provides adequate heat sinking, especially in high ambient temperature environments or when driven at the maximum continuous current, will enhance long-term reliability.
• ESD Precautions: Although the device has built-in ESD protection, standard ESD handling procedures should still be followed during assembly and installation.

7. Reliability Testing

The product undergoes a comprehensive suite of reliability tests conducted with a 90% confidence level and a Lot Tolerance Percent Defective (LTPD) of 10%. Key tests include:

• Reflow Soldering Resistance
• Temperature Cycling (-40°C to +100°C)
• Thermal Shock
• High & Low Temperature Storage
• DC Operating Life (1000 hours at 20mA)
• High Temperature/High Humidity (85°C/85% RH for 1000 hours)

These tests validate the device's robustness under typical environmental and operational stresses encountered in electronic products.

8. Frequently Asked Questions (Based on Technical Data)

Q: What is the primary advantage of the "TOP View" design?
A: It emits light perpendicular to the PCB plane, through the board itself. This is optimal for applications using a light pipe positioned directly over the LED, as it maximizes coupling efficiency and provides uniform illumination with a wide viewing angle.

Q: Can I drive this LED directly from a 5V supply without a resistor?
A: No. This will almost certainly destroy the LED. The forward voltage is approximately 3.2V. Connecting 5V directly would force a current far exceeding the maximum rating, causing immediate failure. A series resistor is essential.

Q: How do I interpret the luminous intensity value?
A: Luminous intensity (measured in millicandela, mcd) indicates brightness as perceived by the human eye from a specific direction. The wide 120° viewing angle means this brightness is maintained over a very broad area, but the peak intensity value is measured along the central axis (0°).

Q: What does the binning information on the label mean?
A: The label includes codes for Luminous Intensity Rank (CAT), Chromaticity Coordinates (HUE), and Forward Voltage Rank (REF). This allows traceability and ensures you receive components with the specific optical and electrical characteristics you specified in your order, which is crucial for color-matching in multi-LED applications.

9. Operational Principle

The device is a semiconductor light source. It is based on an Indium Gallium Nitride (InGaN) chip, which is a direct bandgap semiconductor material. When a forward voltage exceeding the device's threshold is applied, electrons and holes recombine within the active region of the chip. In this specific material system (InGaN), this recombination process releases energy primarily in the form of photons in the blue wavelength spectrum (around 468 nm). The water-clear lens material encapsulates the chip and helps shape the emitted light into the desired wide-angle pattern.

10. Design and Usage Case Study

Scenario: Backlighting for Membrane Switch Panel
A designer is creating a user interface panel with several membrane switches that need to be backlit in blue for visibility in low-light conditions. The panel uses individual light pipes for each switch icon, routed from a central PCB.

Component Selection: The 65-11 series blue LED is chosen because its top-view emission efficiently couples into the base of the light pipes. The wide 120° viewing angle ensures even illumination across the icon area even if alignment is not perfect.

Circuit Design: The system power supply is 5V. For each LED, a current-limiting resistor is calculated. Using a typical V_F of 3.2V and a target I_F of 20mA, the resistor value is R = (5V - 3.2V) / 0.02A = 90 Ω. A standard 91 Ω resistor is selected. The power dissipation in the resistor is (1.8V)^2 / 91Ω ≈ 36 mW, well within a standard 1/8W resistor's rating.

PCB Layout: The LED footprints are placed precisely under the mounting holes for the light pipes. Polarity markings on the PCB silkscreen match the LED's anode/cathode indicator. Small thermal relief connections are used on the pad connected to the LED's cathode (thermal pad, if present) to aid soldering while providing some heat dissipation.

Result: The final product achieves uniform, bright blue backlighting for all switches with minimal power consumption and high reliability, validated by the component's specified reliability tests.