T20 Series Monochrome LED Datasheet - 2016 Package - 2.0x1.6x0.75mm - 40mA - Technical Documentation

1. Product Overview

T20 serisi, genel aydınlatma uygulamaları için tasarlanmış, yüksek performanslı, üstten görünümlü tek renkli ışık yayan diyotlardan (LED) oluşan bir seridir. Bu belgede ayrıntıları verilen spesifik model, kompakt bir 2016 yüzey montaj cihazı (SMD) paketi kullanır. Bu seri, otomatik montaj süreçlerine uygun, geliştirilmiş ısı dağıtımına sahip bir paketleme ile güvenilir ve verimli bir ışık çıktısı sağlamayı amaçlamaktadır.

Its core design philosophy focuses on balancing high luminous flux output with robust thermal management to ensure stable operation even under demanding conditions. The package is optimized for lead-free reflow soldering, aligning with modern environmental and manufacturing standards, and is designed for ongoing compliance with the RoHS directive.

2. Key Features and Applications

2.1 Product Features

• Top-view White LED:Light is emitted perpendicular to the mounting surface, making it ideal for direct illumination.
• Enhanced Heat Dissipation Package Design:Improved the thermal path from the LED chip to the PCB, helping to manage junction temperature and maintain performance and lifespan.
• High Luminous Flux Output:It provides bright light output with its compact size, typical values vary by color (e.g., 10 lumens for green at 40mA, 5.5 lumens for red).
• High current capability:Rated forward current (IF) is 50 mA (continuous), with a pulse rating (IFP) of 75 mA under specific conditions.
• Compact package size:The 2016 package size is approximately 2.0mm x 1.6mm, enabling high-density PCB layout.
• Wide Viewing Angle:The typical viewing angle (2θ1/2) is 120 degrees, providing broad and uniform illumination.
• Lead-free reflow soldering application:Compatible with standard SMT reflow processes using lead-free solder.
• Compliant with RoHS standards:Product design and manufacturing comply with the Restriction of Hazardous Substances Directive.

2.2 Target Applications

This LED series is versatile and suitable for various lighting scenarios, including:

• Indoor Lighting:Integrated into luminaires for residential, commercial, or industrial indoor spaces.
• Retrofit (Replacement):As a direct replacement for old or inefficient light sources in existing luminaires.
• General lighting:Provides primary or secondary lighting for a wide range of products.
• Architectural/decorative lighting:For accent lighting, signage, and aesthetic lighting designs that require specific monochromatic light.

3. Detailed Technical Specifications

3.1 Photometric and Electrical Characteristics

Unless otherwise specified, all measurements are specified under the conditions of a junction temperature (Tj) of 25°C and a forward current (IF) of 40mA. Design margin must account for tolerances.

3.1.1 Photometric Characteristics

Luminous flux output depends on color. Provide typical and minimum values:

• Red (RED):Typical value 5.5 lumens, minimum value 2.0 lumens.
• YELLOW:Typical value 5.0 lumens, minimum value 2.0 lumens.
• BLUE:Typical value 2.3 lumens, minimum value 1.0 lumens.
• GREEN:Typical value 10.0 lumens, minimum value 8.0 lumens.

Luminous flux measurement tolerance is ±7%.

3.1.2 Electrical Characteristics

• Forward Voltage (VF):It varies depending on the semiconductor material. Typical values range from 2.1V for red to 3.0V for green, with a maximum limit as high as 3.4V.Tolerance is ±0.1V.
• Reverse Current (IR):For all colors, the maximum value is 10 μA at a reverse voltage (VR) of 5V.
• Viewing Angle (2θ1/2):The typical value for all colors is 120 degrees, defined as the off-axis angle when the luminous intensity is half of the peak value.
• Electrostatic Discharge (ESD) Sensitivity:All colors have a minimum rating of 1000V (Human Body Model, HBM), indicating a moderate level of ESD robustness, suitable for standard handling precautions.

3.2 Absolute Maximum Ratings

Stresses beyond these limits may cause permanent damage. To ensure reliability, operating conditions should be designed well below these ratings.

• Forward Current (IF):50 mA (continuous DC).
• Pulse Forward Current (IFP):75 mA (pulse width ≤100μs, duty cycle ≤1/10).
• Reverse Voltage (VR):5 V.
• Power Dissipation (PD):Red/Yellow: 130 mW; Blue/Green: 170 mW.
• Operating Temperature (Topr):-40°C to +105°C.
• Storage Temperature (Tstg):-40°C to +85°C.
• Junction Temperature (Tj):110°C (Absolute Maximum).
• Soldering Temperature (Tsld):Reflow soldering temperature profile, peak temperature is 230°C or 260°C, maximum 10 seconds.

Note: Exceeding these parameters may cause LED characteristics to deviate from specified values.

4. Grading System Description

Don tabbatar da daidaiton launi da haske a cikin samarwa, ana rarraba LED zuwa bincike daban-daban bisa ga mahimman ma'auni.

4.1 Flux Binning

Under the conditions of IF=40mA and Tj=25°C, the luminous flux is classified into codes from AA to AG, with minimum and maximum lumen ranges defined. For example, code AF covers 10 to 14 lumens. This allows designers to select LEDs that meet their brightness requirements.

4.2 Wavelength Binning

The dominant wavelength is binned to control color purity. A range is specified for each color:

• Red:620-625 nm, 625-630 nm, 630-635 nm.
• Yellow:585-590 nm, 590-595 nm, 595-600 nm.
• Blue:455-460 nm, 460-465 nm, 465-470 nm.
• Green:520-525 nm, 525-530 nm, 530-535 nm.

The wavelength measurement tolerance is ±1nm.

4.3 Forward Voltage Binning

Forward voltage is also binned to aid in circuit design for current regulation. Different code ranges are provided for lower voltage colors (Red/Yellow: 1.8-2.6V, stepwise) and higher voltage colors (Blue/Green: 2.6-3.4V, stepwise).Tolerance is ±0.1V.

4.4 Part Number Coding System

The part number structure (e.g., T20**011F-*****) encodes specific attributes, enabling precise identification and ordering. Key elements include the type code (20 representing the 2016 package), color temperature/color code, color rendering index (for white light), number of series/parallel chips, and a color code defining performance standards (e.g., F for ERP standard, M for ANSI standard).

5. Performance Curve Analysis

The datasheet references two key graphical representations of performance.

5.1 Spectrogram

Figure 1. Spectral Diagram:This diagram typically shows the relationship between the relative radiant power and wavelength for each LED color (red, yellow, blue, green) at Tj=25°C. It visually defines the spectral purity and peak wavelength, which are directly related to the perceived color. A narrow spectrum indicates high color saturation, which is typical for monochromatic LEDs.

5.2 Viewing Angle Distribution Diagram

Figure 2. Viewing Angle Distribution Diagram:This polar plot illustrates the spatial radiation pattern of an LED. For a top-view LED with a 120-degree wide viewing angle, the curve will show a broad, Lambertian-like distribution, where the intensity is highest at 0 degrees (perpendicular to the LED surface) and smoothly decreases towards the edges. This pattern is crucial for designing optical components and understanding illumination uniformity.

6. Mechanical and Packaging Information

6.1 Package Dimensions

The nominal dimensions for the 2016 SMD package are 2.0mm in length, 1.6mm in width, and 0.75mm in height. The bottom view shows the pad layout and polarity marking. The anode and cathode pads are clearly identified, with the cathode typically indicated by a marking or a chamfer on the package. Unless otherwise specified, dimensional tolerances are ±0.1mm.

6.2 Polarity Marking

Correct polarity is crucial. The package includes a visual marker (e.g., a dot, a line, or a chamfer) to identify the cathode terminal. The pad pattern is asymmetric to prevent incorrect placement during assembly.

7. Welding and Assembly Guide

7.1 Reflow Soldering Temperature Profile

Provides a detailed reflow soldering temperature profile suitable for lead-free soldering processes. Key parameters include:

• Preheating:Heat from 150°C to 200°C within 60-120 seconds.
• Heating rate:The maximum rate to reach the peak temperature is 3°C/sec.
• Time above liquidus (T_L=217°C):60-150 seconds.
• Package peak temperature (T_P):Maximum 260°C.
• In T_P:±5°C time:
• Maximum 30 seconds.Cooling rate:
• Maximum 6°C/sec.Total cycle time:

Maximum 8 minutes from 25°C to peak temperature.

1. 7.2 Important NotesReflow Soldering Restrictions:
2. It is recommended that LEDs not be subjected to more than two reflow soldering cycles. If a second reflow is performed more than 24 hours after the first soldering, the LED may be damaged.Post-soldering rework:
3. After reflow soldering, rework (e.g., using a soldering iron) should not be performed on the LED, as localized heat may cause damage.Power dissipation:

Care must be taken in the thermal design of the application to ensure that the power dissipation does not exceed the absolute maximum ratings, as this directly affects the junction temperature and lifetime.

8. Packaging and Ordering Information

8.1 Tape and Reel Packaging

• For automated SMT assembly, LEDs are supplied in embossed carrier tape and reel format.Carrier tape dimensions:
• Are clearly specified to ensure compatibility with feeder equipment.Reel Capacity:
• Maximum 5000 pieces per reel.Cumulative Tolerance:

The cumulative tolerance for 10 pitches is ±0.2mm.

8.2 Outer Packaging

• Reels are further packaged in cartons for transportation and storage.Box Capacity:
• Standard configuration is 10 rolls per box, with options for 30 or 60 rolls per box also available.Label:

The box and inner bag are affixed with labels containing key information, including part number, date code, lot number, quantity, and product parameters. A desiccant is included inside the moisture barrier bag to protect the components.

9. Application Design Considerations

9.1 LED Driver

LED is a current-driven device. It is strongly recommended to use a constant current source rather than a constant voltage source to ensure stable light output and prevent thermal runaway. The driver should be designed to provide the required operating current (e.g., rated at 40mA) while staying within the absolute maximum ratings. Forward voltage binning information is useful for calculating the voltage headroom required for the driver.

9.2 Thermal Management

Despite the enhanced thermal performance package, effective heat dissipation remains crucial for performance and longevity. The PCB layout should use sufficient copper area (thermal pads) connected to the LED pads to conduct heat away from the junction. Operating at or near the maximum rated current generates more heat, requiring more aggressive thermal design to keep the junction temperature (Tj) well below its 110°C maximum limit.

9.3 Optical Integration

120-degree wide viewing angle makes these LEDs suitable for applications requiring broad, diffuse illumination without secondary optics. For focused beams, primary optics (lenses) or reflectors are necessary. The small light source size of the 2016 package is advantageous for optical control.

10. Technical Comparison and Differentiation

• In the field of monochrome SMD LEDs, the T20/2016 series positions itself with the following specific advantages:Comparison with smaller packages (e.g., 0603, 0402):
• Due to its larger size, it provides significantly higher light output and better thermal performance, making it suitable for higher-power general lighting tasks, not just indicator functions.Comparison with larger packages (e.g., 5050, 7070):
• Offers a more compact footprint for space-constrained designs while still providing considerable luminous flux, achieving a balance between size and performance.Thermal Management Enhancement:
• Explicitly mentions that enhanced thermal management packaging design is a key differentiator from many standard LED packages, implying better reliability under continuous operation.Comprehensive Binning:

Detailed binning for luminous flux, wavelength, and voltage provides designers with the tools needed for high-consistency applications, a level of strict definition not found in all LED series.

11. Frequently Asked Questions (FAQ)

11.1 What is the difference between "Typical" and "Minimum" luminous flux?

"Typical" yana wakiltar matsakaicin ko mafi yawan fitarwa a cikin samarwa a ƙarƙashin yanayin gwaji. "Minimum" shine ƙaƙƙarfan iyaka da aka garanti; kowane LED mai dacewa da ƙayyadaddun zai yi aiki a wannan matakin ko sama. Mai zane ya kamata ya yi amfani da "Minimum" a cikin lissafin mafi munin yanayi, don tabbatar da aikace-aikacen ya cika mafi ƙarancin buƙatun haske.

11.2 Can I continuously drive this LED at its maximum current of 50mA?

Ko da yake cikakkiyar mafi girman ƙididdiga shine 50mA, ci gaba da aiki a wannan matakin zai haifar da matsakaicin zafi, kuma yana iya tura zafin jiki zuwa iyakarsa, sai dai idan an yi amfani da musamman sarrafa zafi. Don samun mafi kyawun rayuwa da ingantaccen aiki, ana ba da shawarar a yi aiki a ƙarƙashin gwajin naɗin 40mA ko ƙasa, ko kuma a yi kwaikwayon yadda ake sarrafa zafi a 50mA a hankali.

11.3 How to interpret the part number to order the correct LED?

You must refer to the part number coding system table. You need to define each placeholder (X1 to X10) according to your requirements: package type (20 represents 2016), desired color/wavelength, desired luminous flux bin, voltage bin, and specific color code (e.g., F represents ERP standard). Please provide the fully constructed part number to your supplier for precise ordering.

11.4 Me yasa ba a ba da shawarar yin reflow na biyu bayan fiye da awa 24 ba?

This may be related to moisture sensitivity. SMD packages absorb moisture from the atmosphere. During rapid reflow soldering, this trapped moisture can vaporize and cause internal delamination or cracking (the "popcorn" effect). If a device is not soldered within a specific time window after removal from its moisture barrier bag, or if it is exposed for too long, it may need to be baked to remove moisture before a second reflow. This precaution simplifies the process by recommending complete avoidance of this practice unless specific handling procedures are followed.

12. Misali na aikace-aikace na zahiri

1. Scenario: Designing a Decorative RGB Wall Washer Light.Component Selection:
2. Engineers select red, green, and blue LEDs from the T20 series. They choose specific wavelength bins (e.g., 625-630nm red, 525-530nm green, 465-470nm blue) to achieve the desired color gamut. They also select mid-range luminous flux bins (e.g., code AC or AD) for balanced brightness.Circuit Design:
3. Three independent constant current drivers are designed, one for each color channel, set to 40mA. The driver output voltage headroom is determined based on the maximum VF from the datasheet (e.g., 3.4V for green/blue) plus some margin.PCB Layout:
4. The LED is placed on the PCB with sufficient copper pour area connected to its thermal pad. The layout follows the recommended pad pattern from the dimension drawing to ensure proper soldering and alignment.Thermal Analysis:
5. Considering a sealed luminaire, the engineers calculated the expected thermal resistance from junction to ambient. They ensured the estimated junction temperature remained below 85°C even with multiple LEDs powered simultaneously for long life.Assembly:

PCB assembly was strictly performed according to the specified reflow soldering temperature profile. LEDs were used within the recommended time window after opening the bag to avoid moisture issues.

13. Introduction to Working Principles

The Light Emitting Diode (LED) is a semiconductor device that emits light when an electric current passes through it. This phenomenon is called electroluminescence. In monochromatic LEDs like the T20 series, a semiconductor chip (typically made from materials such as AlInGaP (for red/yellow) or InGaN (for blue/green)) is encapsulated inside. When a forward voltage exceeding the chip's bandgap voltage is applied, electrons and holes recombine in the semiconductor's active region, releasing energy in the form of photons (light). The specific material composition and structure of the semiconductor determine the wavelength (color) of the emitted light. The package serves to protect the chip, provide electrical connections, and may contain phosphors (for white LEDs) or a transparent dome/lens to shape the light output. The design of the 2016 package focuses on efficiently extracting this light and managing the heat generated by non-radiative recombination and electrical resistance.

14. Technology Development Trends

• The development of SMD LEDs like the T20 series follows several key industry trends:Efficiency Improvement (Lumens/Watt):
• Ongoing advancements in material science and chip design continuously drive higher luminous efficacy, meaning more light output per unit of electrical power consumed.Miniaturization and High Power:
• The trend is to package higher light output into smaller packages, as seen in successors to 2016 (such as 1010 or even smaller chips). This enables more streamlined product designs.Enhanced Reliability and Thermal Management:
• With increasing power density, advanced packaging materials (e.g., ceramic substrates, high thermal conductivity molding compounds) are being adopted to better manage junction temperature, a primary factor affecting LED lifespan.Standardization and Binning:
• The industry is trending towards more precise and standardized binning systems, providing designers with predictable performance, which is crucial for applications requiring color and brightness consistency across thousands of units.Smart and Integrated LEDs: