Orange SMD LED RF-OUB190TS-CF Datasheet - Size 1.6x0.8x0.7mm - Voltage 1.8-2.4V - Power 72mW - Technical Documentation

1. Product Overview

Wannan takarda tana ba da cikakken ƙayyadaddun fasaha na LED mai launin lemu mai hawa a saman. Na'urar an tsara ta musamman don aikace-aikacen nuna alama na gabaɗaya, tana da fa'idar kallon faɗi, kuma tana dacewa da daidaitaccen tsarin haɗa SMT. Kayan aiki ne mai ƙarami, mai bin ka'idodin RoHS, wanda ya dace da ƙirar lantarki na zamani.

1.1 Product Description

Wannan LED diode ce mai haskaka haske wacce aka kera ta da ƙwayar semiconductor mai launin lemu. An haɗa ta a cikin ƙaramin akwati mai hawa a saman, girmanta shine milimita 1.6 (tsayi) x 0.8 mm (faɗi) x 0.7 mm (tsayi). Wannan ƙaramin siffar ya sa ta dace sosai don aikace-aikacen da ke da ƙarancin sarari, kamar na'urorin hannu, bangarorin sarrafawa, da hasken bayanan alama.

1.2 Core Features and Advantages

• Ultra-Wide Viewing Angle:The typical viewing angle (2θ1/2) of this device is 140 degrees, ensuring high visibility from various positions.
• SMT Compatibility:Fully compatible with all standard surface-mount technology assembly and reflow soldering processes.
• Moisture Sensitivity:Moisture Sensitivity Level (MSL) is Level 3, which defines specific handling and baking requirements prior to soldering.
• Environmental Compliance:This product complies with the RoHS (Restriction of Hazardous Substances) Directive.

1.3 Target Applications

This LED is versatile and can be used in numerous applications, including but not limited to:

• Status and power indicators in consumer electronics and industrial equipment.
• Backlighting for switches, buttons, and symbol displays on control panels.
• General illumination requiring a compact orange light source.

2. In-depth Analysis of Technical Parameters

The following section provides a detailed analysis of the LED's performance characteristics under the specified test conditions (Ts=25°C).

2.1 Electrical and Optical Characteristics

Key performance indicators are defined in the table below. Unless otherwise specified, all measurements are taken at a forward current (IF) of 20mA.

• Forward Voltage (V_F):The voltage drop across the LED during operation. It is categorized into three grades: B0 (1.8-2.0V), C0 (2.0-2.2V), and D0 (2.2-2.4V). This allows designers to select LEDs with consistent voltage characteristics for their circuits.
• Dominant Wavelength (λ_D):Defines the perceived color of the light. It is categorized into E00 (620-625nm) and F00 (625-630nm), corresponding to specific orange hues.
• Luminous Intensity (I_V):The amount of visible light emitted, measured in millicandelas (mcd). It offers multiple grades: G20 (120-150 mcd), 1AW (150-200 mcd), 1AT (200-260 mcd), and 1AU (260-330 mcd). This grading system allows for selection based on brightness requirements.
• Spectral Half Bandwidth (Δλ):The typical value is 15nm, indicating the spectral purity of the orange light.
• Viewing Angle (2θ_1/2):140 degrees, confirming the wide-angle emission characteristics.
• Reverse Current (I_R):At a Reverse Voltage (V_R) of 5V, the maximum leakage current is 10 μA.
• Thermal Resistance (R_THJ-S):The thermal resistance from junction to solder point is 450 °C/W, which is crucial for thermal management calculations.

2.2 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage may occur. Operation at or beyond these limits is not guaranteed.

• Power Dissipation (P_d):72 mW
• Continuous Forward Current (I_F):30 mA
• Peak Forward Current (I_FP):60 mA (under pulse conditions: 0.1ms pulse width, 1/10 duty cycle)
• Electrostatic Discharge (ESD) immunity:2000V (Human Body Model)
• Operating temperature (T_opr):-40°C to +85°C
• Storage temperature (T_stg):-40°C to +85°C
• Maximum Junction Temperature (T_j):95°C

Key Design Notes:The maximum allowable continuous current must be determined based on the actual thermal conditions of the application (PCB layout, ambient temperature) to ensure the junction temperature does not exceed 95°C.

3. Performance Curve Analysis

The provided charts offer valuable insights into understanding the behavior of LEDs under different conditions.

3.1 IV Curve and Relative Intensity

The forward voltage versus forward current curve exhibits a typical exponential relationship. The relative intensity versus forward current curve illustrates how light output increases with current, typically showing near-linear growth within the recommended operating range, with potential saturation or efficiency roll-off at extremely high currents.

3.2 Temperature Dependence

The charts of lead temperature versus relative intensity and lead temperature versus forward current are crucial for thermal design. They demonstrate how light output decreases as the LED lead (representing the junction) temperature increases. Similarly, forward voltage has a negative temperature coefficient, meaning it decreases slightly with rising temperature.

3.3 Spectral Characteristics

The dominant wavelength versus forward current curve shows minimal variation with current, indicating good color stability. The relative intensity versus wavelength plot depicts the spectral power distribution, centered at the dominant wavelength (e.g., 625nm), with a specified 15nm half-bandwidth.

3.4 Radiation Pattern

Radiation pattern diagram (Figure 1-12) visually confirms a broad, Lambertian-like emission pattern with a 140-degree viewing angle, showing relative intensity as a function of the angle from the central axis.

4. Mechanical and Packaging Information

4.1 Package Dimensions and Tolerances

The LED has a rectangular footprint of 1.6mm x 0.8mm. The total height is 0.7mm. Unless otherwise specified on the drawing, all dimensional tolerances are ±0.2mm. Detailed top, bottom, and side views define the precise geometry.

4.2 Polarity Identification and Pad Design

The cathode (negative) terminal is identified by a marked corner or a green indicator on the package bottom view. A recommended pad layout is provided to ensure reliable soldering and proper alignment during pick-and-place assembly. The pad design considers solder fillet formation and thermal relief.

5. Soldering and Assembly Guidelines

5.1 SMT Reflow Soldering Instructions

An ƙera wannan LED don daidaitaccen tsarin walda na infrared ko na iska. Saboda matakin MSL 3 na sa, a ƙarƙashin yanayin ɗakin masana'anta (≤30°C/60%RH), dole ne a yi amfani da kayan aikin nan da sa'o'i 168 (kwanaki 7) bayan buɗe jakar kariya daga ɗanɗano. Idan ya wuce wannan lokacin, dole ne a gasa su bisa ma'aunin IPC/JEDEC kafin walda (misali a 125°C na awowi 8) don cire ɗanɗano da suka ɗauka, don hana lalacewar "guguru". Ya kamata madaidaicin tsarin walda (dumi-dumi, riƙon zafi, kololuwar zafin walda, ƙimar sanyaya) ya bi shawarwarin ƙananan kayan SMD irinsu, yawanci babban zafin jikin ɗaukar ba ya wuce 260°C.

5.2 Operation and Storage Precautions

• Koyaushe ɗauki matakan kariya daga ESD (zubar da wutar lantarki) lokacin sarrafa LED.
• Guji sanya matsin lamba na injina akan ruwan tabarau ko ƙusoshin ƙafa.
• Store the LED in its original moisture-proof packaging within the specified storage temperature range (-40°C to +85°C), in a cool and dry environment.
• Do not expose the LED to solvents or chemicals that may damage the epoxy resin lens.
• During soldering, ensure the soldering iron tip temperature is controlled and contact time is minimized to prevent thermal damage.

6. Packaging and Ordering Information

6.1 Standard Packaging Specifications

The LED is supplied in industry-standard embossed carrier tape for automated handling. The carrier tape dimensions are clearly specified to ensure compatibility with standard pick-and-place equipment feeders. Components are wound on reels, with 4000 pieces per reel. Reel dimensions (diameter, width, hub size) are provided for machine setup and inventory planning.

6.2 Moisture Barrier Packaging and Labeling

Reels are packaged in sealed moisture barrier bags with desiccant and humidity indicator cards to maintain the MSL level during transportation and storage. The bag and reel labels contain key information such as part number, quantity, lot number, and date code.

7. Application Suggestions and Design Considerations

7.1 Typical Application Circuit

In most applications, the LED is driven by a constant current source or in series with a power supply via a current-limiting resistor. The resistor value (R) can be calculated using Ohm's Law: R = (V_{Power Supply}- V_F) / I_F. Misal, amfani da wutar lantarki na 5V, LED na matakin C0 (V_Fkusan 2.1V) da kuma burin I_Fna 20mA, ƙimar resistor kusan (5 - 2.1) / 0.02 = 145 ohms. Madaidaicin resistor na 150 ohms zai dace.

7.2 PCB Layout and Thermal Management

• Tanti mai sanyaya:Yi amfani da tsarin tanti da aka ba da shawarar. Haɗa tanti mai sanyaya (idan ya dace) ko tanti na cathode/anode zuwa yanki mafi girma na tagulla akan PCB yana taimakawa wajen sanyaya, rage zafin jiki, haɓaka rayuwa da kwanciyar hankali na fitar da haske.
• Tuƙin ƙarfin lantarki:为了获得最大的可靠性和稳定的光输出，应使用恒流而非恒压驱动LED。如果使用PWM（脉宽调制）进行调光，请确保频率足够高（通常>100Hz）以避免可见闪烁。
• ESD Protection:In environments prone to electrostatic discharge, even if the LED itself is rated for 2kV HBM, consider adding transient voltage suppression devices or series resistors to the LED circuit to provide additional protection.

8. Reliability and Quality Assurance

This product undergoes a series of reliability tests to ensure performance under various environmental stresses. Standard test items may include (as described in the documentation):

• High-Temperature Storage Life Test.
• Low-Temperature Storage Test.
• Temperature Cycling Test.
• Humidity resistance test.
• Resistance to soldering heat test.
• Lead integrity test.

Defines specific test conditions and pass/fail criteria (e.g., allowable variation in forward voltage or luminous intensity) to ensure product robustness. Failure criteria typically specify the maximum allowable parameter shift after testing (e.g., ΔV_F <±0.2V，ΔI_V <±30%）。

9. Technical Comparison and Differentiation

Compared to general-purpose LEDs, this device offers distinct advantages through its comprehensive binning system for forward voltage, dominant wavelength, and luminous intensity. This enables tighter color and brightness matching in applications requiring multiple LEDs, such as status bars or backlight arrays. Its wide 140-degree viewing angle surpasses many standard LEDs, which typically have narrower beams, making it perform better in applications where off-axis visibility is important. The specified MSL rating and detailed handling instructions provide clear guidance for high-yield manufacturing.

10. Frequently Asked Questions (FAQ)

Q1: What is the difference between the B0, C0, and D0 voltage bins?
A1: These bins classify LEDs based on their forward voltage drop at 20mA. B0 LEDs have the lowest voltage (1.8-2.0V), while D0 has the highest (2.2-2.4V). Selecting LEDs from the same bin for use in the same circuit or array powered by the same voltage ensures consistency in brightness and current consumption.

Q2: Can I drive this LED at its maximum continuous current of 30mA?
A2: Yes, but it is not recommended for optimal lifespan and stability unless the brightness is required. Driving at the typical 20mA provides a better balance between light output, efficiency, and thermal load. If using 30mA, it is essential to ensure excellent PCB thermal design to keep the junction temperature below 95°C.

Q3: My LED appears dimmer than expected. What could be the reason?
A3: Da farko, tabbatar da daidaitaccen kwararar turawa ta hanyar duba ƙimar resistor na jeri ko saitunan tushen kwarara mai dorewa. Na biyu, tabbatar da daidaitaccen polarity. Na uku, duba ko yana da zafi sosai; babban zafin haɗin gwiwa zai rage fitar da haske sosai. A ƙarshe, tabbatar da kun zaɓi matakin ƙarfin haske da ya dace (misali, 1AU shine mafi haske).

Q4: Menene ma'anar matakin damuwa na danshi 3 ga samarwa na?
A4: MSL 3 yana nufin cewa kayan aikin na iya zama a cikin yanayin masana'anta (≤30°C/60% RH) har zuwa sa'o'i 168 (kwanaki 7) bayan buɗe jakar kariya daga danshi. Idan ba a yi garkuwa a cikin wannan lokacin ba, dole ne a gasa su a cikin tanda bushewa bisa ga hanyar da aka kayyade (misali, 125°C na awanni 8) don cire danshin da aka sha, kafin a iya yin garkuwa mai aminci.

11. Practical Application Examples

Yanayi: Ƙirƙirar panel nuna alamar yanayi na LED da yawa don na'urar hanyar sadarwa ta yanar gizo.
Panel ɗin yana buƙatar LED 10 masu launin ruwan lemu don nuna ayyukan hanyar haɗi daga tashoshi daban-daban. Launi iri ɗaya da haske suna da mahimmanci ga kamanni na ƙwararru.

• Zaɓin sassa:Ƙayyade LED daga matakin babban tsayin raƙuman ruwa iri ɗaya (misali F00: 625-630nm) da matakin ƙarfin haske iri ɗaya (misali 1AT: 200-260 mcd) don tabbatar da daidaiton gani.
• Circuit Design:Use the 5V power rail on the PCB. Calculate the series resistor for a drive current of 20mA. Assuming an average V_Fof 2.1V (C0 grade), R = (5V - 2.1V) / 0.02A = 145Ω. Use a 150Ω, 1% tolerance resistor for each LED to minimize current variation.
• PCB Layout:Align the LEDs in a row. Connect the cathode pad of each LED to a dedicated ground pour area on the top layer to aid heat dissipation. Route the 5V power and individual control signals from the microcontroller.
• Manufacturing:Plan SMT assembly so that the LED reels are loaded onto the pick-and-place machine and used within the 168-hour MSL3 window after opening the moisture barrier bag.

12. Working Principle

This is a semiconductor light-emitting diode. When a forward voltage exceeding its characteristic forward voltage (V_F) is applied, electrons and holes recombine in the active region of the orange light-emitting chip (typically based on materials like AlGaInP). This recombination process releases energy in the form of photons (light) with a wavelength corresponding to the orange part of the visible spectrum (approximately 620-630nm). The chip is encapsulated in an epoxy resin lens, providing mechanical protection and shaping the light output beam to achieve a wide viewing angle of 140 degrees.

13. Technology Trends

The overall trend for SMD indicator LEDs like this is towards higher efficiency (more light output per mA of current), improved color consistency through tighter binning, and further miniaturization while maintaining or improving reliability. For automotive and industrial applications, a wider operating temperature range is also increasingly valued. Packaging technology continues to evolve to provide better thermal management from the chip junction to the PCB, thereby allowing higher drive currents or improved lifetime at standard currents.