5484BN Elliptical Blue LED Technical Specification Sheet - Package Dimensions - Voltage 2.8-3.6V - Luminous Intensity 720-1450mcd - Chinese Technical Document

1. Product Overview

This document details the specifications of an elliptical LED with precision optical performance. The device is specifically designed for passenger information signs and similar display system applications. Its core design philosophy focuses on providing a well-defined spatial radiation pattern, which is crucial for achieving uniform illumination and color mixing in graphic displays.

This LED features high luminous intensity output, making it suitable for outdoor and high ambient light environments. Its elliptical lens is a key differentiating feature, creating an asymmetric viewing angle optimized for horizontal signage. This characteristic, combined with a wide viewing angle of 110 degrees (one axis) and 40 degrees (vertical axis), ensures good visibility from various angles. The encapsulation material uses UV-resistant epoxy resin, enhancing long-term reliability and color stability under sunlight exposure, which is critical for outdoor advertising and variable message signs.

2. Detailed Technical Parameters

2.1 Absolute Maximum Ratings

The device is designed to operate within strict electrical and thermal limits to ensure reliability. Absolute maximum ratings define thresholds beyond which permanent damage may occur.

• Forward current (I_F):30 mA (DC). This is the maximum continuous current that can be applied.
• Pulse Forward Current (I_FP):100 mA, allowed under pulse conditions with a duty cycle of 1/10 and a frequency of 1kHz. This allows for short-duration high-brightness operation.
• Reverse Voltage (V_R):5 V. Exceeding this voltage under reverse bias may damage the LED junction.
• Power Dissipation (P_d):100 mW. This parameter limits the total electrical power that can be converted into heat.
• Operating and Storage Temperature:The device can operate at -40°C to +85°C and can be stored at -40°C to +100°C.
• Soldering temperature:Can withstand 260°C for up to 5 seconds, compatible with standard lead-free soldering processes.
• Electrostatic Discharge (ESD):Can withstand 1000V (Human Body Model), indicating a medium level of ESD protection. It is still recommended to follow proper ESD handling procedures.

2.2 Optoelectronic Characteristics

These parameters are measured under standard test conditions (T_a=25°C, I_F=20mA), defines the core performance of the LED.

• Luminous Intensity (I_V):ranges from a minimum of 720 mcd to a maximum of 1450 mcd. Typical values fall within this range, providing high brightness.
• Viewing Angle (2θ_1/2):Asymmetric, 110° x 40°. The larger 110° angle is typically used for a wide horizontal field of view, while the 40° angle provides a more focused vertical beam.
• Peak Wavelength (λ_p):Typical value 468 nm, indicating the point of maximum spectral power emission.
• Dominant Wavelength (λ_d):Ranges from 465 nm to 475 nm. This defines the color of light perceived by the human eye (blue).
• Spectral Half Width (Δλ):Typical value 26 nm. This measures spectral purity; a narrower width indicates a more saturated blue.
• Forward Voltage (V_F):At 20mA, the range is from 2.8V to 3.6V. This is crucial for driving circuit design to ensure proper current regulation.
• Reverse Current (I_R):At V_R=5V, the maximum is 50 μA, indicating good junction quality.

3. Grading System Description

To ensure color and brightness consistency in production, LEDs are sorted into different bins based on key parameters.

3.1 Luminous Intensity Binning

Based on the luminous intensity measured at 20mA, LEDs are classified into four grades (G2, H1, H2, J1).

• G2:720 ~ 860 mcd
• H1:860 ~ 1030 mcd
• H2:1030 ~ 1210 mcd
• J1:1210 ~ 1450 mcd

Measurement uncertainty is ±10%. Designers can select specific bins to achieve particular brightness levels or uniformity of the display.

3.2 Dominant Wavelength Binning

Color consistency is managed through four wavelength grades (1a, 1b, 2a, 2b).

• 1a:465.0 ~ 467.5 nm
• 1b:467.5 ~ 470.0 nm
• 2a:470.0 ~ 472.5 nm
• 2b:472.5 ~ 475.0 nm

The measurement uncertainty is ±1.0 nm. This binning is crucial for applications requiring precise color matching, such as when blue is mixed with other colors in full-color signage.

3.3 Forward Voltage Binning

The forward voltage is divided into four grades (0, 1, 2, 3) to assist drive design and power management.

• 0:2.8 ~ 3.0 V
• 1:3.0 ~ 3.2 V
• 2:3.2 ~ 3.4 V
• 3:3.4 ~ 3.6 V

The measurement uncertainty is ±0.1V. Using LEDs from the same voltage bin can simplify the calculation of current-limiting resistors in series or parallel arrays.

4. Performance Curve Analysis

The datasheet references typical photoelectric characteristic curves. While specific graphs are not provided in the text, standard curves for such LEDs typically include:

• Relative Luminous Intensity vs. Forward Current (I-V Curve):It shows how light output increases with current, typically in an approximately linear relationship before reaching the maximum rated current. It highlights the importance of constant current drive for stable brightness.
• Relative Luminous Intensity vs. Ambient Temperature:It demonstrates the thermal derating of light output. Luminous intensity typically decreases as junction temperature increases, which is a key consideration for thermal management in enclosed signage.
• Forward Voltage vs. Junction Temperature:V_FThe negative temperature coefficient of V is shown. The forward voltage decreases with increasing temperature, which may affect the performance of drive circuits based on simple resistors.
• Spectral distribution:A plot of relative intensity versus wavelength shows a peak at approximately 468 nm and a full width at half maximum of 26 nm, confirming blue light emission.
• Perspective Mode:Polar plot illustrating the asymmetric radiation pattern (110° x 40°), crucial for the optical design that directs light to the desired location in the identifier.

5. Mechanical and Packaging Information

5.1 Package Dimensions

This LED employs a specific elliptical lens package. The key dimensional specifications in the datasheet include:

• All dimensions are in millimeters (mm).
• Standard tolerance is ±0.25 mm unless otherwise specified.
• Maximum resin protrusion under the flange is 1.5 mm.
• After the connecting rib is cut, this part will expose bare copper alloy. If not properly protected during assembly or coating of the protective layer, this area may be susceptible to oxidation.

Precise dimensional drawings are referenced but not detailed in the text. This package is designed for through-hole mounting (DIP).

6. Soldering and Assembly Guide

6.1 Pin Forming

• Bending must occur at least 3 mm from the bottom of the epoxy lamp bead to prevent stress on the internal chip and bonding wires.
• Pin forming must be completedSoldering processbefore.
• Avoid applying stress to the LED package during the bending process.
• Cut the lead frame at room temperature. High-temperature cutting may cause thermal shock.
• PCB holes must be precisely aligned with LED pins. Misalignment causing pin stress will degrade the performance of the epoxy and the LED.

6.2 Storage Conditions

• Yanar da Ajiya da ake ba da shawara: ≤30°C kuma ≤70% zafi na dangi (RH).
• Mafi dadewar rayuwar ajiya a cikin wannan yanayin: watanni 3 daga lokacin jigilar kaya.
• For longer storage (up to 1 year), place the LED in a sealed container filled with nitrogen gas and containing a desiccant.
• Avoid rapid temperature changes under high humidity to prevent condensation, which can lead to moisture ingress and cause failures during soldering ("popcorn" effect).

6.3 Welding Process

Provides detailed recommendations for manual soldering and wave soldering.

• General Rules:Maintain a minimum distance of 3 mm from the solder joint to the epoxy resin LED.
• Manual soldering:Soldering iron tip temperature ≤300°C (suitable for a maximum 30W iron). Soldering time per pin ≤3 seconds.
• Wave/DIP soldering:
  • Preheating temperature: ≤100°C (Duration ≤60 seconds).
  • Solder pot temperature: ≤260°C.
  • Soldering time in pot: ≤5 seconds.
• Avoid applying stress to the leads when the LED is at high temperature.
• Do not solder the same LED more than once (wave soldering or hand soldering).
• After soldering, protect the epoxy lamp bead from mechanical shock/vibration until the LED cools to room temperature.
• Avoid rapid cooling from the peak soldering temperature.

The recommended soldering temperature profile is referenced, typically showing ramp-up, preheat, peak temperature (260°C), and controlled cooling process.

7. Packaging and Ordering Information

7.1 Packaging Specifications

LEDs are packaged in anti-static materials with clear labels.

• Primary Packaging:500 pieces per anti-static bag.
• Secondary Packaging:5 bags packed into one inner box (total 2,500 pieces).
• Tertiary Packaging:10 inner boxes are packed into one master carton (25,000 pieces in total).

7.2 Label Information

Labels on bags and cartons contain key information for traceability and correct application:

• CPN (Customer Part Number):Customer's internal reference number.
• P/N (Production Part Number):Manufacturer Part Number (e.g., 5484BN/BADC-AGJA/P/MS).
• QTY (Quantity):Number of pieces inside the package.
• CAT (Category):Combination grade code for luminous intensity and forward voltage (e.g., H1-2).
• HUE:The grade code for dominant wavelength binning (e.g., 1b).
• REF (Reference):Additional reference information.
• LOT No:Production batch number traceable.
• Production Place:Indicate country of production.

8. Application Recommendations

8.1 Typical Application Scenarios

As specified, this LED is designed for the following applications:

• Color graphic signs and information boards:Its high intensity and oval beam pattern make it ideal for sign backlighting or direct illumination, ensuring readability.
• Variable Message Signs (VMS):Used on highways, airports, and public transport systems. The grading system ensures color and brightness consistency on large multi-LED displays.
• Commercial Outdoor Advertising:UV-resistant epoxy resin and robust design ensure long-term reliability in harsh outdoor environments exposed to sunlight and weather.
• Passenger Information Signage:A specific spatial radiation pattern is designed to mix with red and green LEDs, creating various colors in full-color displays.

8.2 Design Considerations

• Drive Circuit:Use a constant current driver set to 20mA (or lower to reduce brightness/power consumption) to ensure stable operation and long life. When designing the series string, consider V_FBinning.
• Thermal Management:Ko kowane LED yana amfani da wutar lantarki kawai 100mW, tsararrun LED masu yawa a cikin alamun da aka rufe suna haifar da zafi mai yawa. Tabbatar da isasshiyar iska ko hanyoyin sanyaya, don kiyaye zafin jiki a cikin iyakokin aminci, don kiyaye fitowar haske da tsawon rayuwa.
• Optical Design:Use a viewing angle of 110° x 40°. Orient the LED so that the 110° axis covers the required horizontal viewing area. If necessary, use secondary optics (diffusers, lenses) to further shape the beam.
• ESD Protection:Although the ESD rating is 1kV, standard ESD prevention measures must still be implemented during handling and assembly.

9. Technical Comparison and Differentiation

Although the datasheet does not directly compare it with other models, the key differentiating features of this LED can be inferred:

• Elliptical lens vs. Standard circular lens:Main differentiation point. The elliptical lens produces a rectangular radiation pattern, which is more efficient for illuminating rectangular sign areas compared to the circular spot from a round lens, reducing light waste.
• Matched radiation pattern for color mixing:The datasheet clearly states the radiation pattern is suitable for red/green/blue mixing applications. This indicates careful optical design to ensure uniform color mixing across different viewing angles within an RGB pixel cluster.
• High intensity binning:Provides a grade of up to 1450mcd, offering a high-brightness option for sunlight-readable applications.
• UV-Resistant Epoxy:Crucial for outdoor longevity, it prevents the encapsulation material from yellowing and the light transmittance from decreasing over time.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak Wavelength (λ_p~468 nm)It is the wavelength at which the LED emits its maximum optical power.Dominant Wavelength (λ_d465-475 nm)It is the wavelength of monochromatic light perceived by the human eye as having the same color as the LED. Dominant wavelength is more relevant for color specifications in displays.

10.2 Can I continuously drive this LED at 30mA to achieve maximum brightness?

Yes, 30mA is the absolute maximum continuous forward current. However, operating at the maximum rating generates more heat and may accelerate luminous flux degradation over time. For optimal lifetime and reliability, it is recommended to drive at or below the test current of 20mA, unless high brightness is critical and thermal management is excellent.

10.3 Yaya yin oda yadda ake fassara lambobin rarrabuwa (misali H1-2, 1b)?

The "CAT" code (e.g., H1-2) combines the luminous intensity bin (H1 = 860-1030 mcd) and the forward voltage bin (2 = 3.2-3.4V). The "HUE" code (e.g., 1b = 467.5-470.0 nm) specifies the dominant wavelength bin. Specifying these bins ensures you receive LEDs with tightly grouped performance characteristics, enabling consistent display results.

10.4 Me ya sa iyakar rayuwar ajiya ta kasance watanni 3? Menene zai faru idan an wuce wannan lokacin?

The 3-month limit under standard factory conditions (≤30°C/70%RH) is to prevent moisture absorption through the plastic package. After 3 months, the moisture level may exceed the safe limit for soldering, posing a risk of internal delamination or cracking during high-temperature reflow ("popcorn" effect). For longer-term storage, a dry nitrogen-filled environment prevents moisture ingress, extending the safe storage period to one year.

11. Nazarin Shari'ar Zane

Scenario: Design a High-Brightness Outdoor Variable Message Sign (VMS)

1. Demand Analysis:The label must be readable in sunlight, operate at temperatures from -20°C to +60°C, and have a uniform color appearance.
2. LED Selection:This oval blue LED was chosen for its high intensity (select J1 bin for maximum brightness), UV-resistant epoxy suitable for outdoor use, and radiation pattern matching its red and green partner LEDs for color mixing.
3. Electrical Design:The LEDs are arranged in series strings. The driver is a constant-current type, set to 18mA (slightly below 20mA for margin). The worst-case V_F(3.6V from bin 3) is used to calculate the minimum driver voltage required per series string.
4. Thermal Design:PCB uses Metal Core PCB (MCPCB) to effectively conduct heat away from the LED array. Thermal simulation is performed to ensure the LED junction temperature remains below 85°C at the maximum ambient temperature.
5. Optical and Mechanical Design:LED yinang, 110° axis horizontal align to marker. Secondary diffuser plate placed above array, merging individual LED spots into smooth, uniform light panel.
6. Procurement and Assembly:Specify binning code (e.g., intensity J1 bin, wavelength 2a bin) when ordering LEDs to ensure consistency across all production batches. Strictly adhere to soldering temperature profile and storage guidelines during assembly.

12. Ayyukan Aiki

This LED is based on an InGaN (Indium Gallium Nitride) semiconductor chip. When a forward voltage exceeding the diode's threshold (approximately 2.8-3.6V) is applied, electrons and holes are injected into the active region of the semiconductor. They recombine, releasing energy in the form of photons. The specific composition of the InGaN alloy determines the bandgap energy, which in turn defines the wavelength of the emitted light—in this case, within the blue spectrum (approximately 468 nm). The elliptical epoxy resin lens surrounding the chip acts as the primary optical element, refracting and shaping the emitted light into the desired 110° x 40° radiation pattern.

13. Technology Trends

LEDs for signage continue to evolve. While this datasheet represents a mature through-hole (DIP) product, the overall industry trends include:

• Efficiency improvement (lm/W):Updated chip technology and phosphors allow for higher light output at the same or lower drive currents, reducing power consumption and thermal load.
• Adoption of Surface Mount Devices (SMD):Compared to traditional DIP packaging, SMD packaging allows for higher density, automated assembly, and typically offers better thermal paths, although DIP remains relevant in some high-power or legacy designs.
• Color Rendering and Gamut Improvement:Ukuvuselelwa kwezinto zokwakha i-semiconductor kanye nezinhlelo ze-phosphor kwenze i-LED ibe ne-spectrum peak encane futhi inombala ogcwele ngokwanele, okwandise i-gamut yombala yezibonisi ezinombala wonke.
• Ukuhlanganiswa kwezici ezihlakaniphile:Amanye ama-LED esimanje wamakhefu ane-driver afakiwe ngaphakathi (IC-driven LED) noma okungafinyeleleka, okwenza ukuklanywa kohlelo kube lula.
• Ukuthembeka okuthuthukisiwe kanye nempilo yokusebenza:Continuous improvements in packaging materials, such as the use of more robust silicone instead of epoxy in some high-power applications, lead to longer operational life and better tolerance to harsh environments.

The product described in this specification is, in this context, a specialized component optically optimized for specific application areas where its elliptical beam pattern and high-intensity output provide distinct advantages.