Oval LED Lamp Bead 3474BKBR/MS Specification Sheet - Blue - 20mA Forward Current - 110mW Power Consumption - Technical Documentation

1. Product Overview

This document details the technical specifications of the high-precision optical performance oval LED lamp bead, model 3474BKBR/MS. This device is specifically designed for applications in information display systems that require high visibility and reliable performance.

1.1 Core Advantages and Product Positioning

The primary design objective of this elliptical LED is to serve passenger information signs and similar display applications. Its core advantage stems from its unique optical design:

• High Luminous Intensity Output:Provides bright, clear illumination, which is key to achieving daylight-readable signs.
• Elliptical and Well-Defined Radiation Pattern:The elliptical lens structure creates a well-defined spatial radiation pattern, optimizing light distribution for the rectangular or elliptical display apertures commonly found in signage.
• Wide and Asymmetric Viewing Angle:Viewing angle (2θ1/2) is 110° on one axis and 60° on the perpendicular axis. This asymmetric pattern is ideal for efficiently directing light toward the viewer in typical signage mounting configurations.
• Robust Material Construction:UV-resistant epoxy is used, enhancing long-term reliability and preventing lens yellowing or degradation when used outdoors or in high-UV environments.
• Environmental Compliance:本产品设计符合RoHS（有害物质限制）、欧盟REACH法规，并且不含卤素（溴<900 ppm，氯<900 ppm，溴+氯<1500 ppm）。

1.2 Target Market and Applications

This LED primarily targets the commercial and traffic signage markets. Its matched radiation pattern makes it suitable for mixing with yellow, red, or green filters or secondary optics in color applications. Typical use cases include:

• Color graphic signs
• Allon bayanai
• Alamar bayanai mai canzawa
• Allon tallan kasuwanci na waje

2. In-depth Analysis of Technical Parameters

Wannan sashe yana ba da cikakken bayani, haƙiƙa game da mahimman sigogi na lantarki, na gani, da na zafi waɗanda aka ayyana a cikin takardar ƙayyadaddun bayanai.

2.1 Device Selection and Absolute Maximum Ratings

Wannan LED tana amfani da kayan guntu na InGaN (Indium Gallium Nitride) don samar da haske mai shuɗi, sannan ta yada ta hanyar ruwan tabarau mai shuɗi. Fahimtar Cikakken Ƙimar Ƙimar yana da mahimmanci don tabbatar da tsawon rayuwar kayan aiki da hana lalacewa nan take.

• Ƙarfin lantarki na baya (V_R): 5V- Yin amfani da ƙarfin lantarki na baya fiye da wannan ƙimar na iya haifar da lalacewar maras dawowa a haɗin LED.
• Ƙarfin lantarki na gaba (I_F): 30mA- Matsakaicin ci gaba da ci gaba da ƙarfin lantarki na DC da za a iya amfani da shi. Yin aiki a wannan iyaka ko kusa da shi yana haifar da ƙarin zafi kuma yana iya rage tsawon rayuwa.
• Matsakaicin ƙarfin lantarki na gaba (I_FP): 100mA- Wannan ƙimar bugun jini ce (duty cycle 1/10 @ 1kHz). Ba za a yi amfani da ita don aikin DC ba. Yana nuna cewa LED na iya jure ƙarfin gajeren lokaci, wanda zai iya kasancewa da alaƙa a wasu tsare-tsaren tuƙi masu yawa.
• Yin amfani da wutar lantarki (P_d): 110mW- A Ta=25°C, iyakar mafi girman wutar lantarki da fakit ɗin zai iya watsawa a matsayin zafi. Wucewa wannan iyaka yana da haɗarin zafi mai yawa. Haƙiƙanin ƙididdigar wutar lantarki shine ƙarfin lantarki na gaba (V_F) × ƙarfin lantarki na gaba (I_F).
• Aiki da yanayin ajiya:Kewayon daga -40°C zuwa +85°C (aiki) da -40°C zuwa +100°C (ajiye). Waɗannan faɗin kewayon sun tabbatar da dacewarsa ga yanayi mara kyau na waje.
• Yanayin goge-goge (T_sol): 260°C, for 5 seconds- This defines the tolerance of the reflow soldering profile, which is crucial for PCB assembly without damaging the epoxy package or internal bonds.

2.2 Binciken Halayen Haske da Lantarki

All parameters are specified under standard test conditions of Ta=25°C and I_F=20mA, which is the recommended operating point.

• Luminous Intensity (I_v):Ranges from 550 mcd (min) to 1130 mcd (max), with a typical value of 800 mcd. This high intensity is a key characteristic for signage applications.
• Viewing Angle (2θ_1/2):An tabbatar da 110° (X-axis) / 60° (Y-axis). Wannan rashin daidaituwa an tsara shi musamman don tambari.
• Tsawon zango mafi girma (λ_p):Matsakaicin ƙima 468 nm. Wannan shine tsawon zango da ke da mafi girman ƙarfin fitar da haske.
• Babban tsawon zango (λ_d):Kewayon daga 460 nm zuwa 475 nm. Wannan shine tsawon zango guda ɗaya da ido ke fahimta, wanda ke ayyana "launi" na shuɗi.
• Ƙarfin lantarki na gaba (V_F):A 20mA, kewayon daga 2.4V zuwa 3.4V. Dole ne masu zane su tabbatar da cewa da'irar tuƙi za ta iya dacewa da wannan bambanci, musamman lokacin amfani da wutar lantarki mai tsayayyen ƙarfi.
• Kwararar lantarki ta baya (I_R):A V_R=5V, matsakaicin 50 µA. Ƙananan ƙima yana nuna ingantacciyar haɗin mahaɗa.

3. Bayanin Tsarin Rarraba

Don sarrafa bambance-bambancen kera, ana rarraba LED zuwa matakan aiki daban-daban. Wannan yana bawa masu zane damar zaɓar sassa waɗanda suka cika takamaiman buƙatun ƙarfi da daidaiton launi don aikace-aikacensu.

3.1 Rarraba Ƙarfin Haskakawa

An ayyana matakan ta lambobi BA zuwa BD, waɗanda ke haɗa da mafi ƙarancin da mafi girman ƙimar ƙarfin haskakawa da aka auna a I_F= 20mA. Matsakaicin juzu'i shine ±10%.

• BA:550 mcd zuwa 660 mcd
• BB:660 mcd to 790 mcd
• BC:790 mcd to 945 mcd
• BD:945 mcd to 1130 mcd

Selecting a higher bin (e.g., BD) ensures maximum brightness but may incur additional cost. For a uniform appearance in multi-LED signs, specifying a narrow or single bin is crucial.

3.2 Rarraba Babban Tsawon Zango

Wavelength bins are defined by codes B1 through B5, each covering a 3 nm range from 460 nm to 475 nm. The tolerance is ±1 nm.

• B1:460 nm to 463 nm (bluer, leaning towards cyan-blue)
• B2:463 nm to 466 nm
• B3:466 nm to 469 nm
• B4:469 nm zuwa 472 nm
• B5:472 nm zuwa 475 nm (mai zurfi, shuɗin gemu)

Daidaiton launi na gaba ɗaya na nuni yana da mahimmanci. Ƙayyadaddun matakin tsawon raƙuman ruwa guda ɗaya (misali B3) yana tabbatar da cewa duk LED ɗin suna da kusan inuwa iri ɗaya.

4. Performance Curve Analysis

Lanƙwan da aka bayar na yau da kullun yana ba da haske mai mahimmanci don fahimtar halayen LED a cikin yanayin da ba daidai ba.

4.1 Spectral Distribution and Directivity

Relative Intensity vs. WavelengthThe curve shows the typical blue LED spectrum centered at 468 nm with a full width at half maximum of approximately 20 nm.DirectivityThe curve visually confirms the 110°/60° viewing angle, showing the decrease in relative intensity as the angle from the central axis increases.

4.2 Electrical and Thermal Characteristics

• Forward Current vs. Forward Voltage (I-V Curve):This curve is nonlinear, typical of a diode. It shows the relationship between voltage and current, which is crucial for designing current-limiting circuits. The knee voltage is approximately 2.8V to 3.0V.
• Relative Intensity vs. Forward Current:Light output increases with current, but not linearly. Driving current beyond 20mA leads to diminishing efficiency returns and increased heat.
• Relative Intensity vs. Ambient Temperature:LED light output decreases as ambient temperature (T_a) increases. This derating must be considered in thermal design, especially in enclosed signs or hot climates.
• Forward Current vs. Ambient Temperature:This curve likely illustrates the recommended maximum operating current derating as temperature increases to stay within the 110mW power dissipation limit.

5. Mechanical and Packaging Information

5.1 Girman Kunnawa da Tolerances

The datasheet includes detailed dimensional drawings of the oval LED package. Key features include:

• Overall package shape and lead pitch.
• Location and dimensions of the cathode identifier (typically the flat side or green dot on the package).
• A critical note specifies that all dimensions are in millimeters, with a standard tolerance of ±0.25mm, unless otherwise stated.
• The maximum resin protrusion below the flange is specified as 1.5mm, which is important for clearance during PCB mounting.

5.2 Gane Polarity

Correct polarity is crucial. The package includes a visual indicator (e.g., flat side, notch, or colored dot) to identify the cathode (-) lead. The anode (+) is typically the longer lead in through-hole versions, but for this SMD component, refer to the outline drawing to identify the marking on the package.

6. Jagororin Walda da Haɗawa

Proper handling is critical to maintaining reliability.

6.1 Siffata Ƙafar (Idan Ya Dace)

If leads require forming for through-hole mounting:

• Bend at a distance ≥ 3mm from the epoxy lamp base.
• 在Before soldering soldering.
• Perform molding. Avoid applying stress to the package; stress may damage internal connections or cause the epoxy resin to crack.
• Cut the leads at room temperature.
• Ensure the PCB holes are perfectly aligned with the LED leads to avoid mounting stress.

6.2 Storage Conditions

LED is a moisture-sensitive device.

• After receipt, store at ≤ 30°C and ≤ 70% relative humidity.
• The recommended storage life under this condition is 3 months.
• For storage exceeding 3 months up to 1 year, use a sealed container with a nitrogen atmosphere and desiccant.
• Avoid sudden temperature changes in humid environments to prevent condensation.

6.3 Soldering Process

• 保持焊点到环氧树脂灯珠的距离 > 3mm。
• Do not solder on the base of the LED itself.
• Follow the reflow soldering profile with a peak temperature of 260°C for a maximum of 5 seconds.

7. Packaging and Ordering Information

7.1 Moisture Barrier Bag Packaging

LEDs are provided in moisture barrier packaging, typically including:

• Carrier Tape:LEDs are placed in embossed carrier tapes for automatic SMT assembly.
• Reel:The carrier tape is wound onto the reel.
• Desiccant and Humidity Indicator Card:Included in the sealed bag for moisture protection.
• Inner Box and Master Carton:Used for bulk transportation and storage.

7.2 Label Description and Carrier Tape Specification

The packaging label contains the following codes:

• CPN (Customer Part Number)
• P/N (Product Number: 3474BKBR/MS)
• QTY (Quantity)
• CAT (Luminous Intensity Bin, e.g., BC)
• HUE (Dominant Wavelength Grade, e.g., B3)
• REF (Forward Voltage Grade)
• LOT No.

Detailed carrier tape dimensions (D, F, P, W1, W3, etc.) are provided to ensure compatibility with standard SMD assembly equipment.

7.3 Package Quantity and Model Number

• Standard Packing: 2500 pieces per inner box.
• Kowane babban akwati yana dauke da akwatuna 10 a ciki (gabaɗaya 25,000 guda).
• Nau'in3474BKBR/MSYana bin tsarin suna, mai yiwuwa yana nuna salon kunshewa (3474), launi (BKBR yana wakiltar shuɗi?) da shigarwa/salo (MS yana nufin mai hankali ga danshi ko makamantansu). Takardar ƙayyadaddun bayanai ta nuna wurin da aka keɓe don ƙara lambar ƙari (3474BKBR-□□□□) don ƙayyadaddun mataki ko bambance-bambancen.

8. Application Suggestions and Design Considerations

8.1 Typical Application Circuit

Don tabbatar da aiki mai dogaro:

• Constant Current Drive:It is highly recommended to use constant current drive instead of constant voltage drive. For low-current applications, a simple series resistor may be sufficient, but a dedicated constant current LED driver IC provides better stability, efficiency, and protection against voltage spikes.
• Current Setting:Operate at or below the typical test condition of 20mA for optimal efficiency and lifespan. Use the I-V curve to calculate the appropriate series resistor or driver setting based on your power supply voltage.
• Reverse Voltage Protection:If the LED may be exposed to reverse voltage transients, consider connecting a protection diode in parallel (cathode to anode, anode to cathode).

8.2 Thermal Management

Although the power is low (maximum 110mW), heat can still affect performance and lifespan:

• Yi amfani da PCB mai isasshen yanki na tagulla, kuma haɗa shi da kwanon LED don zama mai sanyaya.
• A cikin tsararrun da suka yi yawa, tabbatar da isasshen tazara, idan an rufe sai a yi la'akari da sanyaya mai ƙarfi.
• ReferenceRelative intensity vs. ambient temperatureCurve, don rage tsinkayar fitar da haske a yanayin zafi mai girma.

8.3 Optical Integration

• Tsarin hasken elliptical an tsara shi don dacewa da ramukan alama na yau da kullun. Daidaita babban axis na LED (110°) da axis na biyu (60°) tare da shimfidar alama, don samun mafi kyawun daidaito da inganci.
• When using color filters, ensure compatibility with the LED's blue spectrum and UV-resistant epoxy to prevent accelerated aging.

9. Technical Comparison and Differentiation

Although the datasheet does not provide a direct competitor comparison, the key differentiating factors of this product can be inferred:

• Compared to standard circular LEDs:The elliptical beam provides better coverage for rectangular pixels in signs, reducing the required number of LEDs or improving uniformity compared to circular LEDs with a circular beam.
• Compared to non-UV-resistant LEDs:UV-resistant epoxy resin is a critical advantage for any outdoor or long-life application, preventing the common failure mode of lens browning and output attenuation.
• Compared to low-intensity LEDs:High luminous intensity (up to 1130 mcd) makes it suitable for sunlight-readable applications in strong ambient light.
• Comprehensive binning:Detailed intensity and wavelength binning structure allows for achieving high color consistency in displays, a key requirement for professional signage.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED continuously at 30mA?
A: The absolute maximum rating is 30mA, but typical operating conditions and all photometric specifications are given at 20mA. Operating at 30mA generates more heat, reduces efficiency (lumens per watt), and may shorten lifespan. For optimal reliability, it is recommended to design for 20mA or lower.

Q: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (λp) is the physical peak of the emission spectrum. Dominant wavelength (λd) is the single wavelength perceived as the color by the human eye, calculated from the full spectrum. λd is more relevant for color matching in displays.

Q: How to interpret the binning code when ordering?
A: To ensure sign uniformity, specify both the luminous intensity bin (e.g., BC) and the dominant wavelength bin (e.g., B3) in your order. This guarantees all LEDs have very similar brightness and color.

Q: Is a heatsink required?
A: For a single LED at 20mA (~2.8V * 0.02A = 56mW), a heatsink is typically not required if there is some copper on the PCB. For LED arrays or operation in high-temperature environments, thermal design becomes important.

11. Ayyukan Ƙira da Amfani na Ainihi

Scenario: Designing a single-line variable message sign character.
A character consists of a 5x7 pixel matrix. Each "pixel" is a rectangular aperture. Use this elliptical LED:

1. Placement:Mount the LED behind each aperture, aligning its 110° wide axis with the rectangle's long side and its 60° narrow axis with the short side. This effectively fills the aperture.
2. Circuit:Use a constant-current driver IC capable of driving a 35-LED (5x7) multiplexed matrix to reduce wiring. When active, set the current for each LED to 18-20mA.
3. Binning:Order all LEDs for the entire sign from the same CAT (e.g., BC) and HUE (e.g., B3) bins to ensure uniform brightness and color across the display.
4. Thermal Management:Design a PCB with thermal vias connected to the backplane ground layer under the LED pads to dissipate heat from the 35-LED array.
5. Software:Implement PWM (Pulse Width Modulation) via the driver IC to achieve dimming control for different ambient lighting conditions.

12. Gabatarwar Aikin Tsari

This LED operates based on the principle of electroluminescence in a semiconductor diode. The core is a chip made of InGaN (Indium Gallium Nitride) semiconductor material. When a forward voltage exceeding the diode's knee voltage (approximately 2.8-3.0V) is applied, electrons are injected from the n-type region and holes from the p-type region into the active region. When these carriers recombine, they release energy in the form of photons (light). The specific composition of the InGaN alloy determines the bandgap energy, which in turn defines the wavelength of the emitted light—in this case, blue (approximately 468 nm). The elliptical epoxy resin lens surrounding the chip is designed to refract and shape the raw light into the desired 110°/60° radiation pattern.

13. Trends da Bayanan Fasaha

This component represents a specialized application of mainstream LED technology. The overarching trends in the LED industry providing context include:

• Efficiency Improvement:Continuous R&D steadily increases lumens per watt (luminous efficacy), enabling brighter displays or lower power consumption.
• Miniaturization:While this is a large package for high output, the trend in general lighting is toward smaller, more densely packed chips (e.g., chip-scale packaging).
• Smart & Connected Lighting:For signage, this means LEDs are integrated with smart drivers capable of networked control, dynamic content, and adaptive brightness.
• Color Quality & Consistency:As detailed in the grading sections of this specification, stricter grading and improved manufacturing processes are driven by the demand for excellent and consistent visual performance in professional displays.
• Sustainability:Compliance with halogen-free, RoHS, and REACH standards has now become a basic expectation, reflecting the industry's focus on environmental responsibility.

Elliptical LED packages remain a specialized solution where optical control for specific aperture shapes, reliability, and high-intensity output are prioritized over the smallest possible form factor.