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LTR-5888DHP1 Phototransistor Datasheet - Dark Green Package - Vce 30V - Pc 100mW - English Technical Documentation

Complete technical datasheet for the LTR-5888DHP1 phototransistor, featuring high sensitivity, fast switching, and a dark green package for infrared applications. Includes electrical characteristics, binning system, and performance curves.
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PDF Document Cover - LTR-5888DHP1 Phototransistor Datasheet - Dark Green Package - Vce 30V - Pc 100mW - English Technical Documentation

1. Product Overview

LTR-5888DHP1 wani babban hankali phototransistor ne wanda aka tsara don aikace-aikacen gano infrared (IR). Babban aikinsa shine canza hasken infrared mai faruwa zuwa wutar lantarki. Wani muhimmin fasali shine takamaiman fakitin filastik mai duhu kore, wanda aka ƙera don rage ko yanke tsayin hasken da ake iya gani. Wannan ƙirar tana rage tsangwama daga tushen hasken da ake iya gani na kewaye, yana mai da na'urar ta dace musamman don aikace-aikacen da siginar da ake sha'awar ke cikin bakan infrared kawai, kamar ji na kusanci, gano abu, da masu karɓar sarrafa nesa na IR.

Na'urar tana ba da faɗin kewayon aiki don igiyar taro kuma tana da halayen saurin sauye-sauye, yana ba ta damar amsa da sauri ga canje-canjen hasken IR. Wannan haɗin tacewa na gani, hankali, da sauri ya sa ya zama abu mai fa'ida don tsarin lantarki daban-daban da ke buƙatar ingantaccen ganowa na IR.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

2.2 Electrical & Optical Characteristics

These parameters are specified at TA=25°C and define the typical performance of the device.

3. Binning System Explanation

The LTR-5888DHP1 employs a comprehensive binning system based on its On-State Collector Current (IC(ON)). Binning is a quality control process that groups components with similar performance characteristics. Two binning tables are provided: one for the production setting range and one for the final guaranteed range.

The parameter IC(ON) is defined as the average collector current under standardized conditions (VCE = 5V, Ee = 1 mW/cm²). Devices are sorted into bins labeled A through H, each with a specific IC(ON) range (e.g., Bin A: 0.20mA to 0.26mA for production setting). Each bin is associated with a distinct color marking (Red, Black, Green, Blue, White, Purple, Yellow, Orange). This allows designers to select devices with tightly controlled sensitivity for their specific circuit requirements, ensuring consistent system performance. For example, an application requiring a precise trigger threshold would benefit from using devices from a single, narrow bin.

4. Performance Curve Analysis

The datasheet includes several typical characteristic curves, which provide visual insight into device behavior under varying conditions.

5. Mechanical & Packaging Information

The device uses a special dark green plastic package. The package dimensions are provided in the datasheet with all measurements in millimeters. Key dimensional notes include: a tolerance of ±0.25mm unless specified otherwise, a maximum resin protrusion under the flange of 1.5mm, and lead spacing measured at the point where leads exit the package. The dark green material is crucial for its optical filtering properties, blocking visible light to enhance IR-specific performance.

6. Soldering & Assembly Guidelines

Jagorar farko da aka bayar yana da alaƙa da danniya na zafi na solder. Za a iya sanya igiyoyin zuwa zafin jiki na 260°C na tsawon lokaci na 5 seconds, wanda aka auna a wuri mai nisan 1.6mm (0.063 inches) daga jikin fakitin. Wannan ƙayyadaddun yana da mahimmanci don ayyana ingantaccen bayanin martabar solder na sake kwarara. Wuce wannan iyakar lokaci-zafin jiki na iya haifar da lalacewa a ciki na die semiconductor, haɗin waya, ko kuma fakitin filastik kanta, wanda zai haifar da gazawa nan take ko rage dogon lokaci na dogaro. Ya kamata kuma a bi daidaitattun ayyukan masana'antu don sarrafa na'urori masu kula da danshi (MSL) sai dai idan an faɗi in ba haka ba.

7. Application Recommendations

7.1 Typical Application Scenarios

7.2 Design Considerations

8. Technical Comparison & Differentiation

The LTR-5888DHP1's primary differentiator is its dedicated dark green package for visible light suppression. Compared to clear or non-filtered phototransistors, it offers superior performance in environments with high ambient visible light, as it is less likely to be triggered falsely. Its combination of a relatively high VCEO (30V), fast switching speed (µs range), and a detailed binning system for sensitivity makes it a robust and design-friendly choice for a wide array of IR sensing tasks. The comprehensive binning allows for precision matching in applications requiring multiple sensors or very consistent trigger points.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the purpose of the dark green package?
A: It acts as a visible light filter. It attenuates light in the visible spectrum (approx. 400-700nm) while allowing infrared wavelengths (typically >700nm) to pass through to the semiconductor chip. This improves the signal-to-noise ratio in IR-only applications.

Q: Ta yaya zan fassara teburori daban-daban na binning guda biyu?
A: Teburin "Production Setting" yana nuna ƙaƙƙarfan kewayon ciki da ake amfani da su yayin masana'anta don rarraba na'urori. Teburin "On State Range" yana nuna mafi faɗi, kewayon ƙayyadaddun garanti wanda abokin ciniki zai iya dogaro da shi. Na'urori daga rukunin samarwa guda ɗaya za su kasance da madaidaicin aiki fiye da waɗanda kawai suka cika mafi faɗin kewayon garanti.

Q: Ina iya amfani da wannan na'urar a cikin hasken rana kai tsaye?
A: Duk da cewa kunshin yana tace hasken da ake iya gani, hasken rana yana ɗauke da adadi mai yawa na radiyon infrared. Wannan na iya cika ma'aunin. Don amfani a waje ko a cikin ƙarfi na IR na muhalli, garkuwar gani, tacewa na lantarki, ko amfani da tsarin tushen IR da aka daidaita ana ba da shawarar sosai.

Q: Me zai faru idan na wuce yanayin zafin gudanar da gubar/lokaci?
A: It can cause irreversible damage: melting of the package, breaking of internal wire bonds, or degradation of the semiconductor properties. Always adhere to the 260°C for 5 seconds guideline at 1.6mm from the body.

10. Practical Design Case Study

Scenario: Designing a Proximity Sensor for an Automatic Soap Dispenser.
The goal is to detect a hand placed ~5-10cm below a nozzle. An IR LED emitter is placed opposite the LTR-5888DHP1 detector, both facing the detection zone.

Design Steps:
1. Circuit Configuration: Use the phototransistor in common-emitter switch mode. Connect the emitter to ground, the collector to a pull-up resistor (RL) connected to a supply voltage (e.g., 5V). The output signal is taken from the collector node.
2. Component Selection: Choose an IR LED with a wavelength matched to the peak sensitivity of the phototransistor. Select an RL value (e.g., 10kΩ) that provides a good voltage swing. Based on the expected reflected IR intensity, select a phototransistor from Bin D or E for medium sensitivity.
3. Modulation (Optional but Recommended): To reject ambient light, drive the IR LED with a pulsed current (e.g., 38kHz). Follow the phototransistor output with a bandpass filter or a dedicated IR receiver IC tuned to the same frequency. This makes the system immune to constant ambient IR.
4. Threshold Detection: The output voltage at the collector will drop when a hand reflects the IR light onto the detector. A comparator or microcontroller's ADC can be used to detect this voltage change and trigger the soap pump.
5. Considerations: Account for the dark current increase with temperature (Fig. 1) when setting the detection threshold. Ensure the device's power dissipation is within limits per Fig. 2.

11. Operating Principle

A phototransistor is fundamentally a bipolar junction transistor (BJT) where the base region is exposed to light and is not connected to an electrical terminal. Incident photons with energy greater than the semiconductor's bandgap are absorbed in the base-collector junction region. This absorption creates electron-hole pairs. The electric field in the reverse-biased base-collector junction sweeps these charge carriers, generating a photocurrent. This photocurrent acts as the base current for the transistor. Due to the transistor's current gain (β or hFE), the resulting collector current is the photocurrent multiplied by the gain (IC ≈ β * Iphoto). This internal amplification is what gives a phototransistor much higher sensitivity than a simple photodiode. The dark green package material absorbs most visible light photons, while infrared photons can pass through and be absorbed by the silicon to generate the signal current.

12. Technology Trends

The field of optoelectronics for sensing continues to evolve. Trends relevant to devices like the LTR-5888DHP1 include:
Integration: Moving towards integrated solutions that combine the photodetector, amplifier, and digital logic (like a Schmitt trigger or modulator/demodulator) into a single package (e.g., IR receiver modules).
Miniaturization: Development of phototransistors in smaller surface-mount packages to meet the demands of compact consumer electronics.
Enhanced Filtering: Use of more sophisticated interference filters deposited directly on the chip or package to provide sharper wavelength selectivity, improving rejection of unwanted ambient light sources.
Application-Specific Optimization: Devices are increasingly being characterized and binned for very specific applications (e.g., specific pulse detection for data communication, very low dark current for precision measurement), rather than as general-purpose components.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), misal, 2700K/6500K Gumi na haske ko sanyi, ƙananan ƙimomi suna da rawaya/dumi, mafi girma fari/sanyi. Yana ƙayyade yanayin haske da yanayin da ya dace.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Halin yanayin aiki na ainihi a cikin guntu LED. Kowane raguwa na 10°C na iya ninka tsawon rayuwa; yana da yawa yana haifar da lalacewar haske, canjin launi.
Kupungua kwa Lumen L70 / L80 (masaa) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: yana da kyau mai jure zafi, farashi mai rahusa; Ceramic: mafi kyau zubar da zafi, tsawon rai.
Tsarin Chip Gaba, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X An rarrabe ta hanyar kewayon ƙarfin lantarki na gaba. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse An rarraba ta hanyar daidaitawar launi, tabbatar da kewayon matsi. Yana ba da tabbacin daidaiton launi, yana guje wa rashin daidaiton launi a cikin kayan haske.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Standard ya kukadiria maisha Inakadiria maisha chini ya hali halisi kulingana na data ya LM-80. Inatoa utabiri wa kisayansi wa maisha.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Takardun muhalli Yana tabbatar da babu abubuwa masu cutarwa (gubar, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.