Select language

EL101XH-G Phototransistor Optocoupler Datasheet - 4-Pin SOP Package - 8mm Creepage Distance - 5000Vrms Isolation Voltage - Halogen-Free - Simplified Chinese Technical Documentation

Detailed technical specifications for the EL101XH-G series 4-pin SOP phototransistor optocoupler. Features include 5000Vrms isolation voltage, 8mm long creepage distance, compliance with halogen-free standards, and a wide operating temperature range from -55°C to 125°C.
smdled.org | PDF Size: 0.7 MB
Ukadiriaji: 4.5/5
Your Rating
You have already rated this document
PDF Document Cover - EL101XH-G Phototransistor Optocoupler Datasheet - 4-Pin SOP Package - 8mm Creepage Distance - 5000Vrms Isolation Voltage - Halogen-Free - Simplified Chinese Technical Documentation

1. Product Overview

The EL101XH-G series is a family of high-performance phototransistor optocouplers designed for reliable signal isolation in demanding electronic applications. These devices are intended to provide a robust electrical isolation barrier between input and output circuits, preventing ground loops, voltage spikes, and noise from propagating between different parts of a system. Their core functionality is achieved through optical coupling of an infrared light-emitting diode with a silicon phototransistor detector, all housed within a compact 4-pin small outline package (SOP).

A key distinguishing feature of this series is8mm long creepage distance, which significantly enhances the safety and reliability for applications requiring high isolation voltage. This design combines5000 VRMSIsolation voltageRated value, making this series suitable for industrial control systems, power supplies, and appliances, where user safety and equipment protection are critical. The device also adoptsHalogen-freeProcess manufacturing, by limiting bromine (Br) and chlorine (Cl) content to comply with environmental regulations.

The target market for the EL101XH-G series is broad, covering industrial automation, telecommunications, measurement instruments, and consumer appliances. Typical applications include isolation in Programmable Logic Controller (PLC) I/O modules, signal transmission in telecommunications equipment, interface isolation in measurement instruments, and safety isolation in household appliances such as fan heaters.

2. Detailed Technical Parameters

2.1 Absolute Maximum Ratings

These ratings define the stress limits that may cause permanent damage to the device. Operation at or beyond these limits is not guaranteed.

2.2 Electro-Optical Characteristics

These parameters define the performance of the device under normal operating conditions (unless noted, Ta= 25°C).

2.2.1 Input Characteristics (LED Side)

2.2.2 Output Characteristics (Phototransistor Side)

2.2.3 Transfer Characteristics

These parameters define the coupling efficiency and speed between input and output.

3. Grading System Description

EL101XH-G series employsCTR-based grading system, this is the main difference between different models. Model EL101XThe "X" in H-G indicates the CTR grade (0, 1, 7, 8, 9). Each grade corresponds to specific minimum and typical CTR ranges, as detailed in Section 2.2.3. This allows designers to select a device with the precise gain required for their application. Choosing a higher CTR grade (e.g., EL1019H) can reduce the drive current required for the input LED, thereby lowering power consumption and heat generation. Conversely, for applications with ample drive current, a lower CTR grade may be sufficient.

4. Performance Curve Analysis

Although the PDF indicates the presence of "Typical Optoelectronic Characteristic Curves," no specific charts are provided in the textual content. Typically, such data sheets include curves showing the following relationships:

Designers should consult the official datasheet with graphical charts to accurately simulate device behavior under non-standard conditions.

5. Mechanical and Packaging Information

5.1 Pin Configuration

The 4-pin SOP package has the following pin arrangement:

  1. Input infrared LEDAnode
  2. Input infrared LED
  3. Cathode
  4. Output phototransistorEmitter

Output phototransistor

Collector

This is the standard configuration for a phototransistor optocoupler.5.2 Package Dimensions and Pad LayoutThe device is described as a "compact 4-pin SOP with a 2.2 mm height". The PDF includes a "Package Dimensions" drawing and a "Recommended Land Pattern for Surface Mount". The land pattern recommendation is for reference only, and the datasheet explicitly advises designers to modify the pad dimensions based on their specific PCB fabrication process and thermal requirements. Proper pad design is crucial for reliable soldering and mechanical strength.

6. Soldering and Assembly Guide

The key parameters provided are

Welding temperature260°C, for 10 seconds. This aligns with the typical lead-free reflow soldering profile (IPC/JEDEC J-STD-020). Designers and manufacturers must ensure their reflow oven profile does not exceed this temperature duration to prevent damage to the internal epoxy molding compound and wire bonds. Standard handling procedures for moisture-sensitive devices (MSL rating, not specified in the provided text but should be checked in the full datasheet) should be followed, including baking if the package is exposed to ambient humidity exceeding its rated level.

(Y)

: Tape and reel packaging option. Can be TA, TB, or none (indicating tube packaging).

: Optional suffix, indicating VDE safety certification.

Tube

: 100 pieces per tube. Options include standard version or version with VDE certification.Tape and reel packaging

High temperature operation marking.

1-digit year code.

2-digit week code.

  1. Optional marking for VDE certified version.8. Application RecommendationsCC8.1 Typical Application Circuit
  2. Photocouplers can be used in two main modes:Digital switching/isolation

: The input LED is driven by a digital signal (e.g., from a microcontroller GPIO). The phototransistor output acts as a switch, pulling the line to ground or V through a pull-up resistor.

provides faster switching speed but higher current consumption. R

= 100Ω test condition is used for characterization; actual values typically range between 1kΩ and 10kΩ.

Wide operating temperature range (-55°C to +125°C).

Exceeds the typical commercial range (0°C to 70°C), making it suitable for industrial, automotive, and military-grade applications.
Pending safety certifications

The datasheet lists certifications from UL, cUL, VDE, SEMKO, NEMKO, DEMKO, FIMKO, and CQC as "pending." This indicates the device is designed to meet these stringent international safety standards.
10. Frequently Asked Questions (Based on Technical Parameters)

Q1: What is the purpose of the long creepage distance?
A1: Creepage distance is the shortest path along the surface of the insulating package between two conductive parts (input and output pins). The 8mm distance increases protection against high-voltage arcing or tracking along the package surface, especially in humid or contaminated environments, thereby enhancing long-term reliability and safety.

Q2: Yaya za a zaɓi CTR darajar da ta dace?
A2: Zaɓi bisa ga ƙarfin kwararar da kuke da ita da kuma ƙarfin fitarwa da kuke buƙata. Idan microcontroller ɗinku zai iya ba da 5mA kawai, zaɓi babban matakin CTR (misali EL1019H) don samun isasshen ƙarfin fitarwa. Idan kuna da isasshen ƙarfin kwarara, ƙananan matakan na iya zama mafi arha. Koyaushe ƙirƙira bisa ga yanayin mafi munin (CTR mafi ƙanƙanta a zafin jiki mafi girma).Q3: Shin ana iya amfani da wannan don keɓe siginar AC?Q4: What is the difference between isolation voltage and collector-emitter voltage rating?A4: Isolation voltage (5000VRMS) is the packageBetween the input and output sides.

The dielectric withstand voltage. Collector-emitter voltage (80V) is during normal operation.

Can be applied across the output transistor itself.The maximum voltage. They are completely different parameters.

11. Practical Design Case Studies

  1. Scenario:In an industrial PLC module, isolate a 3.3V microcontroller GPIO signal to control a 24V relay coil on an independent power domain.FDesign Steps:FInput Side:MCU GPIO is 3.3V. Assuming the desired Iis 5mA, the typical V
  2. is 1.2V, calculate RlimitF= (3.3V - 1.2V) / 0.005A = 420Ω. Use a standard 430Ω resistor.
  3. CTR Selection:The base of the transistor driving the relay coil requires approximately 5mA. At IL=5mA, the required minimum CTR = (5mA / 5mA)*100% = 100%. To ensure operation at 125°C (where CTR is lower), select a grade with sufficient margin. EL1018H (minimum CTR 130%) is a good choice.
  4. Output Side:Connect the phototransistor collector to the 24V power supply via a pull-up resistor (R
). The emitter is connected to the base of the relay driver transistor (an NPN BJT or N-channel MOSFET gate). When the MCU output is high, the LED turns on, the phototransistor saturates, pulling the base close to ground potential, thereby turning off the driver. When the MCU output is low, the LED turns off, the phototransistor turns off, and a separate bias resistor pulls the driver base high to activate the relay. A flyback diode is required across the relay coil.

Layout:

Keep input and output traces physically separated on the PCB. Place bypass capacitors close to the device pins. Follow the recommended pad layout for reliable soldering.

  1. This design provides robust isolation, protecting the sensitive microcontroller from transients generated by inductive relay coils.12. Working PrincipleAn optocoupler (or opto-isolator) is a device that uses light to transmit electrical signals between two isolated circuits. In the EL101XH-G series:Applied toInput pins (anode and cathode)
  2. The current causes the integrated
  3. Infrared light-emitting diode (LED)Emit photons.These photons propagate through the transparent insulating material within the package, typically molded epoxy.Photons strike.
  4. Output side pins.
  5. Silicon phototransistorCbase region.FLight energy generates electron-hole pairs in the base region, effectively acting as base current, causing the transistor to operate in its
Collector and emitter

Conducts between.

Output collector current (I

Regulations in industrial, automotive (ISO 26262), and medical equipment fields continue to tighten, requiring components to have higher certified isolation ratings, longer creepage/clearance distances, and proven reliability data.

Detailed Explanation of LED Specification Terminology

Complete Interpretation of LED Technical Terminology

I. Core Indicators of Photoelectric Performance

Terminology Unit/Representation Popular Explanation Why It Matters
Luminous Efficacy lm/W (lumens per watt) The luminous flux emitted per watt of electrical power; higher values indicate greater energy efficiency. It directly determines the energy efficiency rating of the luminaire and the electricity cost.
Luminous Flux lm (lumen) The total amount of light emitted by a light source, commonly known as "brightness". Determines whether the luminaire is bright enough.
Viewing Angle ° (degree), e.g., 120° The angle at which luminous intensity drops to half, determining the beam width. Affects the range and uniformity of illumination.
Correlated Color Temperature (CCT) K (Kelvin), such as 2700K/6500K Launin haske mai dumi ko sanyi, ƙananan ƙima sun fi rawaya/dumi, manyan ƙima sun fi fari/sanyi. Yana ƙayyade yanayin hasken wuta da yanayin da ya dace.
Color Rendering Index (CRI / Ra) Unitless, 0–100 The ability of a light source to reproduce the true colors of objects, with Ra≥80 being preferable. Affects color fidelity, used in high-demand places such as shopping malls and art galleries.
Color tolerance (SDCM) MacAdam ellipse step, such as "5-step" A quantitative metric for color consistency; a smaller step number indicates better color consistency. Ensure no color variation among luminaires from the same batch.
Dominant Wavelength nm (nanometer), e.g., 620nm (red) Wavelength values corresponding to the colors of colored LEDs. Determines the hue of monochromatic LEDs such as red, yellow, and green.
Spectral Distribution Wavelength vs. Intensity Curve Shows the intensity distribution of light emitted by an LED at each wavelength. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbols Popular Explanation Design Considerations
Forward Voltage (Forward Voltage) Vf The minimum voltage required to light up an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf; the voltages add up when multiple LEDs are connected in series.
Forward Current If The current value that makes the LED emit light normally. Constant current drive is often used, as the current determines brightness and lifespan.
Maximum Pulse Current Ifp The peak current that can be withstood for a short period of time, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled to prevent overheating damage.
Reverse Voltage Vr Maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. Reverse connection or voltage surges must be prevented in the circuit.
Thermal Resistance (Thermal Resistance) Rth (°C/W) The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. High thermal resistance requires stronger heat dissipation design, otherwise junction temperature rises.
Electrostatic Discharge Immunity (ESD Immunity) V (HBM), e.g., 1000V Electrostatic discharge immunity; a higher value indicates greater resistance to electrostatic damage. Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Key Indicators Popular Explanation Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) The time required for the brightness to drop to 70% or 80% of its initial value. Directly defining the "useful life" of an LED.
Lumen Maintenance % (e.g., 70%) The percentage of remaining brightness after a period of use. Characterizes the ability to maintain brightness after long-term use.
Color Shift Δu′v′ or MacAdam ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Material performance degradation Degradation of packaging materials due to long-term high temperature. Zai iya haifar da raguwar haske, canjin launi ko gazawar bude hanya.

IV. Kullewa da Kayan aiki

Terminology Nau'o'in gama gari Popular Explanation Characteristics and Applications
Package Types EMC, PPA, Ceramic The housing material that protects the chip and provides optical and thermal interfaces. EMC offers good heat resistance and low cost; ceramic provides superior heat dissipation and long lifespan.
Chip Structure Front-side, Flip Chip Chip electrode arrangement method. Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating. YAG, silicate, nitride Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical Design Flat, microlens, total internal reflection The optical structure on the encapsulation surface controls the light distribution. Determines the emission angle and the light distribution curve.

V. Quality Control and Grading

Terminology Grading Content Popular Explanation Purpose
Luminous Flux Binning Codes such as 2G, 2H Group by brightness level, each group has a minimum/maximum lumen value. Ensure consistent brightness for products in the same batch.
Voltage binning Codes such as 6W, 6X Grouped by forward voltage range. Ease of matching drive power supply, improving system efficiency.
Color binning 5-step MacAdam ellipse Group by color coordinates to ensure colors fall within an extremely small range. Ensure color consistency to avoid color unevenness within the same luminaire.
Color temperature grading 2700K, 3000K, etc. Group by color temperature, each group has a corresponding coordinate range. Meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standard/Test Popular Explanation Meaning
LM-80 Lumen Maintenance Test Long-term operation under constant temperature conditions, recording luminance attenuation data. For estimating LED lifetime (in conjunction with TM-21).
TM-21 Lifetime projection standard Estimating lifespan under actual usage conditions based on LM-80 data. Providing scientific life prediction.
IESNA Standard Illuminating Engineering Society Standard Covers optical, electrical, and thermal testing methods. Industry-recognized testing basis.
RoHS / REACH Environmental Certification Ensure the product does not contain harmful substances (such as lead, mercury). Entry requirements for the international market.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting products. Commonly used in government procurement and subsidy programs to enhance market competitiveness.