PLCC-2 LED 67-11-IB0100L-AM Datasheet - Ice Blue - 120° Viewing Angle - 3.1V - 10mA - Simplified Chinese Technical Documentation

1. Product Overview

Bu belge, PLCC-2 (Plastik Leaded Chip Carrier) yüzey montaj paketi kullanan, yüksek parlaklıklı buz mavisi bir LED'in özelliklerini ayrıntılı olarak açıklamaktadır. Bu cihaz, zorlu ortamlarda güvenilirlik ve yüksek performans için tasarlanmış olup, 120 derece geniş görüş açısına sahiptir ve otomotiv bileşenleri için katı AEC-Q101 standardına uygundur. Temel tasarım amacı, otomotiv iç mekan uygulamaları için kararlı, canlı bir aydınlatma sağlamak ve aynı zamanda farklı elektriksel ve termal koşullar altında uzun kullanım ömrü ve kararlılık sağlamaktır.

1.1 Core Advantages

• High Luminous Efficiency:Under a standard forward current of 10mA, the typical luminous intensity can reach 300 millicandelas (mcd), ensuring bright and visible light output.
• Wide-Angle Illumination:The 120° viewing angle provides a broad, uniform light distribution, making it ideal for backlight panels and indicator lights.
• Automotive-Grade Reliability:AEC-Q101 certification confirms its suitability for the harsh environmental conditions in automotive electronics, including wide temperature fluctuations and vibration.
• Robust ESD Protection:Capable of withstanding electrostatic discharge up to 8kV (Human Body Model), enhancing robustness during handling and assembly.
• Environmental Compliance:The product complies with RoHS (Restriction of Hazardous Substances) and REACH regulations, supporting global environmental standards.

1.2 Target Market and Applications

This LED is specifically designed for the automotive electronics market. Its main application areas include:

• Automotive interior lighting:For footwells, door handles, cup holders, and general cabin ambient lighting.
• Switch backlighting:Provides clear visibility for buttons and controls on the dashboard, center console, and steering wheel.
• Instrument cluster indicator lights:Used for warning lights, status indicator lights, and instrument backlighting within the driver's instrument cluster.

2. In-depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

Operating parameters define the performance of the LED under standard test conditions (Ts=25°C).

• Forward current (I_F):The recommended operating current is 10mA, with an absolute maximum rating of 20mA. Operation requires a minimum current of at least 2mA.
• Luminous intensity (I_V):At 10mA, the intensity typically reaches 355 mcd, with a standard bin guaranteed minimum of 140 mcd and a maximum of 560 mcd. The measurement tolerance is ±8%.
• Forward Voltage (V_F):Typically 3.1V at 10mA, ranging from a minimum of 2.75V to a maximum of 3.75V. The forward voltage has a negative temperature coefficient, decreasing as the junction temperature increases.
• Viewing Angle (φ):Defined as the full angle at which the intensity drops to half of its peak value. This LED offers a wide viewing angle of 120° ± 5°.
• Chromaticity coordinates (CIE x, y):The typical chromaticity point is (0.18, 0.23), defining its ice-blue hue. The tolerance for these coordinates is ±0.005.

2.2 Thermal Characteristics

Thermal management is crucial for the lifespan and performance stability of LEDs.

• Thermal Resistance (R_{th JS}):The thermal resistance from junction to solder point is specified with two values: 130 K/W (actual measured value) and 100 K/W (electrical calculation value). This parameter indicates the efficiency of heat transfer from the LED chip to the PCB.
• Junction temperature (T_J):The maximum allowable junction temperature is 125°C. Exceeding this limit may lead to permanent performance degradation.
• Operating and storage temperature:The device's rated operating temperature range is -40°C to +110°C, suitable for global automotive applications.

2.3 Absolute Maximum Ratings

These are stress limits that must not be exceeded under any conditions to prevent permanent damage.

• Power consumption (P_d):Maximum 75 mW.
• Inrush current (I_FM):300mA pulse with tolerable duration ≤10μs and low duty cycle (D=0.005).
• Reverse voltage (V_R):This LED is not designed for reverse bias operation. Applying a reverse voltage may cause immediate failure.
• Soldering temperature:Capable of withstanding peak temperatures of 260°C for up to 30 seconds during reflow soldering, compatible with standard lead-free soldering processes.

3. Performance Curve Analysis

3.1 Forward Current vs. Forward Voltage Relationship (I-V Curve)

The graph shows a nonlinear relationship. The forward voltage increases with current but exhibits a negative temperature coefficient. This must be considered when designing current-limiting circuits, as V_Fwill decrease as the LED heats up during operation.

3.2 Relationship between Relative Luminous Intensity and Forward Current

A cikin ƙananan kewayon na'urar, fitowar haske tana da alaƙa da kusan layi tare da na'urar, amma a lokacin da na'urar ta kusanci matsakaicin ƙimar (20mA), yana iya nuna alamun raguwar aiki (raguwar aiki). Ana ba da shawarar aiki a cikin 10mA na yau da kullun ko ƙasa da haka, don samun mafi kyawun aiki da tsawon rayuwa.

3.3 Relationship Between Relative Luminous Intensity and Junction Temperature

Ƙarfin haske yana raguwa yayin da zafin jiki ya tashi. Wannan hoton yana nuna cewa lokacin da T_JWhen approaching 140°C, the output may drop to approximately 40% of its room temperature value. This highlights the importance of effective PCB thermal design (using thermal vias, sufficient copper area) for maintaining brightness.

3.4 Chromaticity Shift

Both forward current and junction temperature affect the chromaticity coordinates of the LED. The ΔCIE-x and ΔCIE-y charts show minor shifts. Although the shift range is small, it should be considered for applications requiring strict color consistency under different operating conditions or in arrays using multiple LEDs.

3.5 Forward Current Derating Curve

This key chart defines the maximum allowable continuous forward current based on the pad temperature (T_S). As T_Sincreases, the maximum allowable I_FIt must be reduced to keep the junction temperature below 125°C. For example, at T_Sof 110°C, the maximum I_Fis 20mA. This curve is crucial for determining safe operating conditions in the final application.

3.6 Allowable Pulse Handling Capability

The diagram shows the relationship between pulse width (t_p), duty cycle (D), and the allowable peak pulse current (I_FA). For extremely short pulses (e.g., 10μs) at low duty cycles (0.005), the LED can handle currents up to 300mA. This is useful for designing strobe or pulse signal functions.

3.7 Spectral Distribution

The relative spectral distribution graph shows the characteristic peak wavelength of the ice blue LED. The narrow main peak ensures color purity. There are no significant secondary peaks in the red or green regions, confirming the expected color output.

4. Explanation of the Grading System

To ensure consistency in mass production, LEDs are sorted into different bins based on key parameters.

4.1 Luminous Intensity Grading

Based on the luminous intensity measured at 10mA, LEDs are sorted into multiple bins (L1 through GA). Each bin covers a specific range on a logarithmic scale (e.g., T1: 280-355 mcd, T2: 355-450 mcd). The datasheet highlights the "possible output bins" for this specific product model. Designers must specify the required bin when ordering to ensure brightness uniformity in assemblies using multiple LEDs.

4.2 Color Binning

The standard ice blue binning structure is defined within the CIE 1931 chromaticity diagram. The provided table lists specific bin codes (e.g., CM0, CL3) and their corresponding CIE x and y coordinate boundaries. This allows for the selection of LEDs with nearly identical chromaticity points, which is critical for applications like backlighting where color mismatch between adjacent LEDs is visually unacceptable.

5. Mechanical and Packaging Information

5.1 Mechanical Dimensions

PLCC-2 package is a standard surface-mount design. The dimension drawing (referenced in the PDF) provides key dimensions, including body length, width, height, lead pitch, and pad location. Adherence to these dimensions is critical for PCB pad design and automated assembly.

5.2 Recommended Solder Pad Layout

The recommended PCB pad design is provided. This layout is optimized for forming reliable solder joints during reflow soldering, ensuring proper mechanical connection and thermal conduction to the PCB. Following this recommendation helps prevent tombstoning or poor soldering.

5.3 Polarity Identification

The PLCC-2 package typically has a molded notch or a marked cathode at one corner of the device body. During PCB assembly, correct polarity orientation is crucial to ensure proper LED operation. Applying reverse voltage is prohibited.

6. Welding and Assembly Guide

6.1 Reflow Soldering Temperature Profile

This component is compatible with standard lead-free (SnAgCu) reflow soldering processes. The temperature profile includes preheating, thermal soak, reflow, and cooling stages, with a peak temperature not exceeding 260°C for a maximum of 30 seconds. The time above 217°C (liquidus temperature) should be controlled to ensure proper solder joint formation without damaging the LED package.

6.2 Usage Precautions

• ESD Precautions:Although rated for 8kV HBM, standard ESD handling procedures (using grounded wrist straps, workstations, and conductive containers) should still be followed during assembly.
• Current Limitation:Always drive the LED using a constant current source or a current limiting resistor in series with a voltage source. Direct connection to a voltage source exceeding V_Fwill cause excessive current and failure.
• Thermal Management:Implement appropriate PCB thermal design. Use derating curves to determine safe operating current based on expected maximum ambient temperature and PCB thermal performance.
• Cleaning:If cleaning is required after soldering, use a compatible solvent that will not damage the plastic lens or epoxy.
• Storage Conditions:Store in a dry, anti-static environment within the specified temperature range of -40°C to +110°C.

7. Packaging and Ordering Information

7.1 Packaging Information

LEDs are supplied in tape and reel form, which is the standard packaging for automatic surface mount assembly equipment. Reel specifications (tape width, pocket pitch, reel diameter) are provided to ensure compatibility with assembly line feeders.

7.2 Part Number and Ordering Information

The base part number is67-11-IB0100L-AM. This number encodes key attributes:

• 67-11:Possibly indicates package type (PLCC-2) and/or series.
• IB:Yana nuna ice blue.
• 0100L:Yana iya zama da alaƙa da matakan haske ko lambar samfur.
• AM:Possibly indicates automotive grade or a specific revision.

8. Application Design Considerations

8.1 Drive Circuit Design

For stable operation, a constant current driver is preferred over a simple resistor-limited voltage source, especially in automotive environments where the supply voltage (e.g., a 12V battery) can fluctuate significantly. The driver should be designed to provide the required current (e.g., 10mA) over the expected input voltage range and temperature.

8.2 PCB Thermal Design

To maintain performance and lifespan:

• Use a PCB with sufficient copper thickness.
• Use a thermal pad connected to a larger copper plane or internal ground layer, and connect it through multiple thermal vias.
• Follow the derating curve. If the PCB temperature at the solder joint is expected to reach 80°C, the maximum continuous current must be reduced accordingly from the absolute maximum of 20mA.

8.3 Optical Integration

A 120° viewing angle is suitable for wide-area illumination. For applications requiring more focused light, secondary optical elements (lenses, light guides) may be necessary. When designing light guides or diffusers, the chromaticity coordinates of ice blue should be considered to achieve the desired final color effect.

9. Technical Comparison and Differentiation

Compared to general-purpose PLCC-2 LEDs, this device offers significant advantages for automotive applications:

• Reliability:AEC-Q101 certification involves rigorous stress testing (high-temperature storage, temperature cycling, humidity, etc.), which is not required for commercial-grade components.
• Extended temperature range:Operating ambient temperature up to +110°C, exceeding the typical +85°C limit of commercial LEDs, which is necessary for locations near heat sources in vehicles.
• Controlled Binning:Detailed intensity and color binning ensures consistency, which is less stringent or absent in low-cost alternatives.
• ESD Robustness:The 8kV HBM ESD rating provides a higher safety margin against electrostatic damage during manufacturing and handling.

10. Frequently Asked Questions (FAQ)

10.1 What is the recommended operating current?

The typical operating current is 10mA. It can operate between a minimum of 2mA and an absolute maximum of 20mA, but operating at 10mA provides the best balance between brightness, efficiency, and long-term reliability.

10.2 Yaya za a zaɓi madaidaicin resistor na iyakancewar kwarara?

Yin amfani da dokar Ohm: R = (V_{Wutar lantarki}- V_F) / I_F. Use the maximum V from the datasheet_F(3.75V) for worst-case design to ensure the current never exceeds the desired value. For a 12V supply and 10mA target: R = (12V - 3.75V) / 0.01A = 825Ω. Use the next higher standard value (e.g., 820Ω or 1kΩ), and calculate the power dissipation in the resistor (P = I²R).

10.3 Me ya sa sarrafa zafi yake da muhimmanci sosai?

High junction temperature directly leads to three problems: 1)Light output decline:Light output reduction. 2)Color Drift:The emitted color may change. 3)Accelerated Aging:The lifespan of an LED decreases exponentially. Proper heat dissipation through the PCB is essential to maintain specified performance.

10.4 Can multiple LEDs be connected in series or in parallel?

Series connectionIt is usually the preferred choice because all LEDs carry the same current, ensuring uniform brightness. The power supply voltage must be higher than all V_F values. Parallel connectionIt is not recommended to proceed without equipping each LED with an independent current-limiting resistor, because V_FSlight variations can lead to significant current imbalances, resulting in uneven brightness and potential overload of individual LEDs.

11. Practical design case study

11.1 Automotive Dashboard Switch Backlight

Scene:Design backlighting for a row of 5 identical push-button switches on the dashboard.

• Design Objectives:Uniform, cool blue illumination on all buttons.
• Implementation Plan:
  1. LED Selection:Specify part number 67-11-IB0100L-AM, and select strict color binning (e.g., CM2) and specific luminous intensity binning (e.g., T1: 280-355 mcd) to ensure consistency.
  2. Circuit:Connect all 5 LEDs in series to a single constant current driver set to 10mA. Assuming a typical V_F为3.1V，驱动器需要输出顺从电压 > 15.5V（5 * 3.1V）。12V汽车电源不足，因此需要升压转换器或从稳压更高电压（例如18V）工作的驱动器。
  3. PCB Layout:Place each LED directly behind its corresponding switch diffuser. Design the PCB pads strictly according to the recommended pad layout. Connect the thermal pad of each LED to a dedicated copper pour area on the board and use multiple thermal vias to connect to the internal ground plane for heat dissipation.
  4. Verification:After assembly, measure the pad temperature near an LED while operating in a high ambient temperature chamber (e.g., +85°C). Use the derating curve to verify if a 10mA current is still safe at the measured T_S.

12. How It Works

This is a semiconductor light-emitting diode (LED). When a forward voltage exceeding its bandgap energy is applied between the anode and cathode, electrons and holes recombine in the active region of the semiconductor chip (typically based on InGaN material for blue/white/ice blue). This recombination process releases energy in the form of photons (light). The specific composition of the semiconductor layers determines the wavelength (color) of the emitted light. The plastic PLCC package protects the chip, provides mechanical protection, and incorporates a molded lens that shapes the light output to achieve a 120° viewing angle.

13. Technology Trends

The development of such LEDs is driven by several key trends in the automotive and general lighting industries:

• Efficiency Improvement (lm/W):Continuous advancements in materials science aim to produce more light output (lumens) per unit of electrical input power (watts), thereby reducing energy consumption and thermal load.
• Higher Reliability and Lifespan:Progress in packaging materials, die-attach techniques, and phosphor technology (for white LEDs) continues to drive higher Mean Time Between Failure (MTBF) figures, exceeding 50,000 hours.
• Miniaturization:The demand for smaller, denser electronic components has driven the development of LEDs in smaller package forms (e.g., chip-scale packages) while maintaining or increasing light output.
• Smart and Adaptive Lighting:Integration with control systems to achieve dynamic lighting effects, dimming, and color temperature adjustment is becoming increasingly common, although this typically involves more complex LED driver ICs rather than the LED components themselves.
• Strict quality standards:The adoption of standards such as AEC-Q102 (a more specific standard for discrete optoelectronic semiconductors in automotive applications) represents a trend toward more specialized and rigorous testing for automotive components.