Table of Contents
- 1. Product Overview
- 1.1 Core Advantages and Target Market
- 2. In-depth Technical Parameter Analysis
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical and Optical Characteristics (Ta=25°C)
- 3. The binning system description in the datasheet explicitly states that luminous intensity is "graded". This refers to the common industry practice of "binning". During manufacturing, there is natural variation in the performance of semiconductor devices. To ensure consistency for end users, LEDs are tested after production and sorted into different groups or "bins" based on key parameters. For the LTL-6201KY, the primary binning parameter is luminous intensity. The datasheet provides a range (43-109 mcd at 10mA), but in production, devices are sorted into narrower sub-ranges (e.g., 43-55 mcd, 56-70 mcd, etc.). This allows designers to select devices with known, consistent brightness levels for their application, which is crucial for products requiring uniform appearance across multiple indicator lights. Although this brief datasheet does not detail it explicitly, for colored LEDs, other common binning parameters may include forward voltage and dominant wavelength to ensure color consistency. 4. Performance Curve Analysis
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions and Drawings
- 5.2 Pin Connections and Polarity Identification
- 6. Soldering and Assembly Guide
- 7. Application Suggestions and Design Considerations
- 7.1 Typical Application Scenarios
- 7.2 Key Design Considerations
- 8. Technical Comparison and Differentiation
- 9. Frequently Asked Questions (Based on Technical Parameters)
- 10. Practical Design and Usage Cases
- 11. Introduction to Technical Principles
- 12. Trends in Technological Development
1. Product Overview
LTL-6201KY is a solid-state light source designed for rectangular bar-shaped displays. Its primary function is to provide a large-area, bright, and uniform luminous region for applications requiring clear visual indication. The device is manufactured using advanced AlInGaP (aluminum indium gallium phosphide) semiconductor technology, specifically configured to produce an amber-yellow light output. This technology is grown on a transparent GaAs (gallium arsenide) substrate, which helps enhance its efficiency and color purity. The product employs a standard dual in-line package, making it compatible with various mounting techniques, including panel and character mounting, thereby broadening its applicability in different electronic components and user interfaces.
1.1 Core Advantages and Target Market
Wannan na'urar tana ba da fa'idodi masu mahimmanci da yawa, wanda ya sa ta dace da aikace-aikacen masana'antu, kasuwanci da na mabukaci. Babban yanki mai haske da haske yana tabbatar da babban bayyani, wanda ke da mahimmanci ga alamun yanayi, haruffa da hasken bango, da kuma hasken gabaɗaya a cikin ƙananan wurare. Ƙarancin amfani da wutar lantarki ya dace da ƙa'idodin ƙirar kiyaye makamashi na zamani, yayin da kyakkyawan bambanci na kunna/kashewa ke tabbatar da cewa alamun suna bayyana a sarari tsakanin yanayin kunna da mara aiki. Faɗin kallon yana da fa'ida musamman ga aikace-aikacen da alamun za a iya kallon su daga wurare daban-daban, ba kawai daga gaba ba. Ingantaccen ingancin ƙwaƙƙwaran LED yana nufin cewa na'urar tana da dogon rayuwar aiki, juriya ga girgiza da rawar jiki, da kwanciyar hankali a cikin aiki tsawon lokaci. Manyan kasuwonin da aka yi niyya sun haɗa da kwamfutocin sarrafa masana'antu, kayan aikin ma'auni, na'urorin lantarki na mabukaci, hasken cikin mota, da duk wani aikace-aikacen da ke buƙatar ƙaƙƙarfan, amintacce, kuma mai haske mai haske.
2. In-depth Technical Parameter Analysis
Fahimtar cikakken ƙayyadaddun na'urar yana da mahimmanci don haɗa ta daidai cikin ƙirar da'ira. Waɗannan sigogi suna ayyana iyakokin aiki da aikin da ake tsammani a ƙarƙashin yanayi na musamman.
2.1 Absolute Maximum Ratings
These ratings define the stress limits that may cause permanent damage to the device. They are not intended for normal operation.
- Power consumption per chip:75 mW. This is the maximum power that each independent LED chip within the package can dissipate in the form of heat without causing performance degradation.
- Peak forward current per chip:100 mA. This is the maximum allowable instantaneous forward current, but only applicable under pulse conditions with a duty cycle of 1/10 and a pulse width of 0.1 ms. Exceeding this value, even briefly, may lead to catastrophic failure.
- Continuous forward current per chip:25 mA at 25°C. This is the recommended maximum current for continuous DC operation. For ambient temperatures above 25°C, a derating factor of 0.33 mA/°C must be applied. For example, at 50°C, the maximum continuous current is approximately 25 mA - (0.33 mA/°C * 25°C) = 16.75 mA.
- Reverse voltage per chip:5 V. Applying a reverse bias voltage exceeding this value may break down the LED's PN junction.
- Operating and storage temperature range:-35°C to +85°C. The device can operate and be stored within this ambient temperature range.
- Welding Temperature:Maximum 260°C, up to 3 seconds, measured 1.6mm (1/16 inch) below the mounting plane. This is critical for wave soldering or reflow processes to prevent package damage.
2.2 Electrical and Optical Characteristics (Ta=25°C)
These are typical performance parameters measured under specified test conditions, providing expected behavior during normal operation.
- Average luminous intensity:At a forward current of 10 mA, minimum 43 mcd, typical 109 mcd. This parameter is binned, meaning devices are graded or categorized based on their measured light output. Measurement uses a sensor and filter that simulate the photopic response of the human eye (CIE curve).
- Peak Emission Wavelength:595 nm (nanometers) at IF=20 mA. This is the wavelength at which the optical power output reaches its maximum value.
- Spectral Line Half-Width:15 nm at IF=20 mA. This indicates the spectral purity or the distribution range of the emitted light wavelength. A smaller value means the light is closer to monochromatic (purer in color).
- Dominant Wavelength:592 nm at IF=20 mA. This is the single wavelength that best represents the color of light perceived by the human eye, and for this device, it is located in the amber-yellow region.
- Forward Voltage:At IF=20 mA, minimum 2.05 V, typical 2.6 V. This is the voltage drop across the LED when it conducts the specified current. It is crucial for designing current-limiting circuits.
- Reverse Current:At a reverse voltage of 5 V, maximum 100 µA. This is the small leakage current that flows when the device is reverse-biased up to its maximum rating.
3. Explanation of the Binning System
The datasheet clearly states that luminous intensity is "graded." This refers to the industry common practice of "binning." During manufacturing, there is natural variation in the performance of semiconductor devices. To ensure consistency for end users, LEDs are tested after production and sorted into different groups or "bins" based on key parameters. For the LTL-6201KY, the primary binning parameter isLuminous Intensity. The datasheet provides a range (43-109 mcd at 10mA), but in production, devices are sorted into narrower sub-ranges (e.g., 43-55 mcd, 56-70 mcd, etc.). This allows designers to select devices with known, consistent brightness levels for their application, which is crucial for products requiring uniform appearance across multiple indicator lights. While this brief datasheet does not detail it explicitly, for colored LEDs, other common binning parameters may include forward voltage and dominant wavelength to ensure color consistency.
4. Performance Curve Analysis
Although the provided datasheet excerpt mentions "Typical Electrical/Optical Characteristic Curves," the specific charts are not included in the text. Typically, such curves for an LED like the LTL-6201KY include:
- Forward Current vs. Forward Voltage:This nonlinear curve shows the relationship between the current flowing through an LED and the voltage across its terminals. It is crucial for designing drive circuits because a small change in voltage can lead to a large change in current.
- Luminous Intensity vs. Forward Current:This graph shows how the light output increases with the drive current. It is typically linear within a certain range but saturates at higher currents. Excessive current can lead to a decrease in efficiency and accelerated aging.
- Luminous Intensity vs. Ambient Temperature:This curve shows the derating of light output as the LED junction temperature increases. Higher temperatures typically reduce light output and may slightly alter the wavelength.
- Spectral Distribution:A graph showing the relative intensity of emitted light across the wavelength spectrum, centered at a peak wavelength of 595nm and with a defined half-width.
Designers must consult the complete specification containing these charts to understand the device's behavior under non-standard conditions (different currents, temperatures) and to optimize performance and reliability.
5. Mechanical and Packaging Information
5.1 Package Dimensions and Drawings
The device employs a rectangular dual in-line package. The dimensional drawing provides key dimensions for PCB layout, including the package's overall length, width, height, pin pitch, pin diameter, and the position of the light-emitting window. Notes indicate all dimensions are in millimeters unless otherwise specified, with a standard tolerance of ±0.25 mm (0.01 inch). Accurately adhering to these dimensions is necessary for proper installation in panel cutouts and on the PCB.
5.2 Pin Connections and Polarity Identification
The LTL-6201KY has 8 pins. The pin arrangement is as follows: 1-Cathode A, 2-Anode A, 3-Anode B, 4-Cathode B, 5-Cathode D, 6-Anode D, 7-Anode C, 8-Cathode C. This configuration indicates the rectangular light bar contains multiple LED chips (likely four, labeled A, B, C, D) arranged in a specific circuit. The internal schematic (not detailed here) would show how these anodes and cathodes are internally connected. Correct polarity is crucial; connecting an LED in reverse bias will prevent it from lighting and may damage the device if the reverse voltage rating is exceeded. The package likely has a physical marker (notch, dot, or bevel) to identify pin 1.
6. Soldering and Assembly Guide
Sashen Matsakaicin Matsakaici yana ba da mahimman ma'auni don walda: zafin jiki bai kamata ya wuce 260°C fiye da dakika 3 ba. Wannan daidaitaccen ƙimar ne na yawancin abubuwan da ke cikin ramuka. Don walda ta igiyar ruwa, dole ne a sarrafa saurin watsawa da zafin preheating don biyan wannan iyaka. Don walda ta hannu, ya kamata a yi amfani da ƙarfe mai sarrafa zafin jiki, kuma a rage lokacin tuntuɓar fil. Ana ba da shawarar cewa madaidaicin walda ya zama aƙalla 1.6mm daga jikin filastik, don hana lalacewar zafi. Bayan walda, ya kamata a bar na'urar ta sanyaya ta halitta. Ya kamata a bi daidaitattun hanyoyin sarrafa ESD (zubar da wutar lantarki) a duk matakan haɗawa, don hana lalata madaidaicin haɗin semiconductor.
7. Application Suggestions and Design Considerations
7.1 Typical Application Scenarios
- Industrial Control Panel:Machine status indication, power on/off, fault alarm, and mode selection.
- Instrumentation:Backlighting of switches, dials, and gauges on test equipment.
- Consumer Electronics:Power indicator lights and functional status lights (such as recording, playback, mute) on audio-visual equipment.
- Automotive interior:Illumination for dashboard switches, gear shift indicators, or general cabin lighting (where color and brightness are applicable).
- Characters and panels:Backlighting of engraved or printed labels on the front panel provides a professional, uniformly illuminated appearance.
7.2 Key Design Considerations
- Current Limiting:LEDs are current-driven devices. When driven from a voltage source, a current-limiting resistor must be connected in series to set the operating point (e.g., 10mA or 20mA per the datasheet) and prevent thermal runaway. The resistor value is calculated using Ohm's Law: R = (Supply Voltage - LED Forward Voltage) / Desired Current.
- Thermal Management:Despite low power dissipation, the continuous current derating curve must be observed. In high ambient temperature environments or confined spaces, the effective current must be reduced to prevent exceeding the junction temperature limit, which affects light output and lifetime.
- Perspective:A wide viewing angle is beneficial but must be considered in mechanical design. Light may spill into adjacent areas, which may be desired or may require light guides/light shields for control.
- Binning to ensure consistency:For applications with multiple indicator lights, it is recommended to specify strict luminous intensity grades to the supplier to ensure uniform brightness across the entire product.
8. Technical Comparison and Differentiation
The primary differentiation of the LTL-6201KY lies in its use ofAlInGaPTechnology to produce amber yellow light. Compared to older technologies (such as standard GaAsP LED), AlInGaP offers significantly higher luminous efficiency, meaning more light output for the same electrical input power. It also provides better temperature stability and lifetime stability, and due to its narrower spectral half-width, the color is more saturated and pure. The rectangular bar shape, large emitting area, and DIP package distinguish it from smaller point-source LEDs (like 3mm or 5mm round LEDs) and surface-mount device alternatives, offering easier handling for through-hole assembly and potentially better heat dissipation through its longer leads.
9. Frequently Asked Questions (Based on Technical Parameters)
Q: Can I drive this LED with 30mA to get brighter light?
A: The maximum continuous current rating is 25mA at 25°C. Operating at 30mA exceeds this rating, which will increase the junction temperature, reduce efficiency, and significantly shorten the device's lifespan. This is not recommended.
Q: The forward voltage is listed as "Min 2.05V, Typ 2.6V". Which value should I use for circuit calculations?
A: For robust design, use the maximum typical value to ensure sufficient voltage margin. If you use the minimum value and receive a device with a higher forward voltage, your circuit may not be able to provide sufficient current to achieve the desired brightness.
Q: What does "Light Output Binning" mean for my order?
A: This means you can request devices within a specific brightness range. If your application requires consistent brightness across multiple units, you should consult the supplier's detailed binning documentation and specify the desired luminous intensity bin code when ordering.
Q: Can I connect the four internal LED chips in series?
A: An internal circuit diagram is required for confirmation. The given pinout indicates that chips A, B, C, and D have independent anodes and cathodes. This typically allows for individual control or wiring in various series/parallel combinations, but the configuration must be verified against the circuit diagram to avoid short circuits.
10. Practical Design and Usage Cases
Scenario: Design a status panel for a network router with four indicator lights.
The LTL-6201KY was selected for its bright, uniform amber light and wide viewing angle. A 5V power rail is available on the PCB. Targeting a forward current of 15mA and using a typical forward voltage of 2.4V, the current-limiting resistor value is calculated: R = (5V - 2.4V) / 0.015A = 173.3 ohms. A standard 180-ohm resistor is chosen. Four identical circuits are built, one for each LED. The LEDs are mounted behind the front panel with laser-etched legends. As the LEDs are binned for luminous intensity to ensure consistency, all four indicators appear equally bright to the user. The wide viewing angle ensures status is clearly visible even when the router is placed on a low shelf.
11. Introduction to Technical Principles
A light-emitting diode is a semiconductor device that emits light through a process called electroluminescence. When a forward voltage is applied across the PN junction of the semiconductor material, electrons from the N-type region recombine with holes from the P-type region in the depletion zone. This recombination releases energy in the form of photons (light particles). The specific wavelength of the emitted light is determined by the energy bandgap of the semiconductor material. The bandgap of AlInGaP corresponds to the red, orange, amber, and yellow portions of the visible spectrum. Using a transparent GaAs substrate allows more of the generated light to escape from the chip, improving overall light extraction efficiency compared to an absorptive substrate.
12. Trends in Technological Development
Trends in indicator LED technology continue to move towards higher efficiency, higher reliability, and more compact packaging. While through-hole DIP packages like the LTL-6201KY remain suitable for some applications requiring high power handling or ease of manual assembly, the industry has largely shifted to surface-mount device packaging for automated PCB assembly, space savings, and cost. For color LEDs, AlInGaP technology for red-amber-yellow and InGaN technology for blue-green-white have become mainstream due to their superior performance. Future developments may focus on even higher efficiencies, improved color rendering for white LEDs, and integrating control electronics inside the LED package. However, the fundamentals of reliability, clear datasheet parameters, and proper thermal and electrical design remain key to successful implementation.
Detailed Explanation of LED Specification Terminology
Complete Interpretation of LED Technical Terminology
I. Core Indicators of Photoelectric Performance
| Terminology | Unit/Representation | Popular Explanation | Why it is important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | The luminous flux emitted per watt of electrical power; higher values indicate greater energy efficiency. | It directly determines the energy efficiency rating of the luminaire and the electricity cost. |
| Luminous Flux | lm (lumen) | The total amount of light emitted by a light source, commonly known as "brightness". | Determines whether the luminaire is bright enough. |
| Viewing Angle | ° (degree), e.g., 120° | The angle at which luminous intensity drops to half, determining the beam width. | Affects the range and uniformity of illumination. |
| Color Temperature (CCT) | K (Kelvin), such as 2700K/6500K | Haske launin dumi da sanyi, ƙananan ƙima sun karkata zuwa rawaya/dumi, manyan ƙima sun karkata zuwa fari/sanyi. | Yana ƙayyade yanayin hasken wuta da kuma yanayin da ya dace. |
| Color Rendering Index (CRI / Ra) | Unitless, 0–100 | The ability of a light source to reproduce the true colors of objects, with Ra≥80 being preferable. | Affects color fidelity, used in high-demand places such as shopping malls and art galleries. |
| Color tolerance (SDCM) | MacAdam ellipse step, such as "5-step" | A quantitative metric for color consistency; a smaller step number indicates better color consistency. | Ensure no color variation among luminaires from the same batch. |
| Dominant Wavelength | nm (nanometer), e.g., 620nm (red) | Wavelength values corresponding to the colors of colored LEDs. | Determines the hue of monochromatic LEDs such as red, yellow, and green. |
| Spectral Distribution | Wavelength vs. Intensity Curve | Shows the intensity distribution of light emitted by an LED at each wavelength. | Affects color rendering and color quality. |
II. Electrical Parameters
| Terminology | Symbol | Popular Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage (Forward Voltage) | Vf | The minimum voltage required to light up an LED, similar to a "starting threshold". | The driving power supply voltage must be ≥ Vf, and the voltages add up when multiple LEDs are connected in series. |
| Forward Current | If | The current value that makes the LED emit light normally. | Constant current drive is often used, as current determines brightness and lifespan. |
| Maximum Pulse Current | Ifp | The peak current that can be withstood for a short period of time, used for dimming or flashing. | Pulse width and duty cycle must be strictly controlled to prevent overheating and damage. |
| Reverse Voltage | Vr | Maximum reverse voltage that an LED can withstand; exceeding this may cause breakdown. | Reverse connection or voltage surges must be prevented in the circuit. |
| Thermal Resistance (Thermal Resistance) | Rth (°C/W) | The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. | High thermal resistance requires stronger cooling design, otherwise junction temperature rises. |
| Electrostatic Discharge Immunity (ESD Immunity) | V (HBM), such as 1000V | Electrostatic discharge immunity; a higher value indicates greater resistance to electrostatic damage. | Anti-static measures must be implemented during production, especially for high-sensitivity LEDs. |
III. Thermal Management and Reliability
| Terminology | Key Indicators | Popular Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures lead to lumen depreciation and color shift. |
| Lumen Depreciation | L70 / L80 (hours) | The time required for the brightness to drop to 70% or 80% of its initial value. | Directly define the "useful life" of an LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | The degree of color change during use. | Affects the color consistency of the lighting scene. |
| Thermal Aging | Material performance degradation | Degradation of packaging materials due to long-term high temperature. | It may lead to a decrease in brightness, color shift, or open-circuit failure. |
IV. Packaging and Materials
| Terminology | Common Types | Popular Explanation | Characteristics and Applications |
|---|---|---|---|
| Package Types | EMC, PPA, Ceramic | The housing material that protects the chip and provides optical and thermal interfaces. | EMC offers good heat resistance and low cost; ceramic provides superior heat dissipation and long lifespan. |
| Chip Structure | Front-side, Flip Chip | Chip electrode arrangement method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating. | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Different phosphors affect luminous efficacy, color temperature, and color rendering. |
| Lens/Optical Design | Flat, microlens, total internal reflection | Optical structure on the packaging surface, controlling light distribution. | Determines the emission angle and light distribution curve. |
V. Quality Control and Grading
| Terminology | Grading Content | Popular Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Binning | Codes such as 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products in the same batch. |
| Voltage binning | Code such as 6W, 6X | Grouped by forward voltage range. | Ease of matching the driving power supply, improving system efficiency. |
| Color binning | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within a minimal range. | Ensure color consistency to avoid uneven colors within the same luminaire. |
| Color temperature grading | 2700K, 3000K, etc. | Group by color temperature, each group has a corresponding coordinate range. | Meet the color temperature requirements of different scenarios. |
VI. Testing and Certification
| Terminology | Standard/Test | Popular Explanation | Meaning |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Long-term operation under constant temperature conditions, recording brightness attenuation data. | For estimating LED lifetime (in conjunction with TM-21). |
| TM-21 | Lifetime projection standard | Estimating lifespan under actual usage conditions based on LM-80 data. | Providing scientific life prediction. |
| IESNA Standard | Illuminating Engineering Society Standard | Covers optical, electrical, and thermal test methods. | Industry-recognized testing basis. |
| RoHS / REACH | Environmental Certification | Ensure the product does not contain harmful substances (e.g., lead, mercury). | Entry requirements for the international market. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting products. | Commonly used in government procurement and subsidy programs to enhance market competitiveness. |