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LTPL-C035RH660 LED Datasheet - 660nm Red Light - 2.1W Power - 350mA Current - Simplified Chinese Technical Document

A technical datasheet for a high-power 660nm red surface-mount LED, detailing its photoelectric characteristics, absolute maximum ratings, binning codes, thermal performance, and assembly guidelines.
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PDF Document Cover - LTPL-C035RH660 LED Datasheet - 660nm Red Light - 2.1W Power - 350mA Current - Simplified Chinese Technical Document

1. Product Overview

This document details the specifications of a high-power surface-mount red LED with a peak wavelength of 660nm. Designed for solid-state lighting applications, this device combines high radiant flux output and high energy efficiency within an ultra-compact package. It aims to provide design flexibility and reliable performance as an alternative to traditional lighting technologies in various application scenarios.

1.1 Main Features and Advantages

This LED possesses several key characteristics that help enhance its performance and simplify the integration process:

2. Absolute Maximum Ratings

Yin aiki fiye da waɗannan iyakoki na iya haifar da lalacewar na'urar na dindindin. Duk ƙididdiga an ƙayyade su a yanayin zafin yanayi (Ta) na 25°C.

Important Note:Prolonged operation under reverse bias conditions may cause component damage or failure. Proper circuit design must ensure that the LED does not experience reverse voltage.

3. Electro-Optical Characteristics

The following parameters define the core performance of the LED under standard test conditions of Ta=25°C and a forward current (If) of 350mA. This is the recommended operating point.

3.1 Main Characteristics Table

4. Tsarin Lambobi da Rarrabuwa

To ensure consistency in production and application, LEDs are sorted into different performance bins based on key parameters. The binning code is marked on the product packaging.

4.1 Rarrabuwar Ƙarfin Lantarki Mai Gaba (Vf)

Under the condition of If=350mA, LEDs are divided into voltage bins with a tolerance of ±0.1V.

4.2 Rarrabuwar Ƙarfin Haske (Φe)

LEDs are sorted by optical output power, with a tolerance of ±10%.

4.3 Rarrabuwar Tsawon Zango (λp)

LEDs are classified according to their dominant emission wavelength, with a tolerance of ±3nm.

Tips for designers:For applications requiring specific performance consistency (e.g., color matching in arrays, precise voltage drop), it is recommended to specify or request limited binning codes, which should be discussed during the procurement process.

5. Performance Curves and Detailed Analysis

The following curves help provide a deeper understanding of LED behavior under various operating conditions. Unless otherwise specified, all data are typical values measured at 25°C.

5.1 Relative Radiant Flux vs. Forward Current

This curve shows the relationship between drive current and light output. Radiant flux increases with current, but not linearly. Operating above the recommended 350mA yields higher output but also increases junction temperature and accelerates lumen depreciation. This curve is crucial for determining the optimal drive current that balances brightness and lifetime.

5.2 Relative Spectral Distribution

Wannan hoton yana kwatanta rarraba ƙarfin haske na LED a cikin dukan kewayon bakan zango. Ya tabbatar da halin kwanciyar hankali na LED, tare da tsayayyen kololuwa a kusa da 660nm (ja mai zurfi), kuma bakan bakan yana da kunkuntar. Wannan sifa tana da mahimmanci ga aikace-aikacen da ke buƙatar takamaiman tsaftar bakan, kamar hasken shuka ko na'urar auna haske.

5.3 Radiation Pattern (Viewing Angle)

Taswirar Polar tana nuna rarraba sararin samaniya na haske. Matsakaicin kusurwar dubawa na 130° yana nuna yanayin fitarwa mai faɗi mai kama da Lambertian. Wannan yana ba da haske mai faɗi da daidaito wanda ya dace da aikace-aikacen haske na gabaɗaya da alamomi, sabanin kusurwar haske mai ƙunci da ake amfani da ita don fitilun haske.

5.4 Forward Current vs. Forward Voltage (I-V Curve)

Wannan madaidaicin lankwili yana nuna alaƙar ma'auni tsakanin ƙarfin lantarki da ƙarfin lantarki a cikin diode. Ƙarfin lantarki na juyawa yana kusa da ƙimar Vf ta yau da kullun na 2.1V. Fahimtar wannan lankwili tana da mahimmanci don ƙirar da'irar iyakance ƙarfin lantarki. Idan aka yi amfani da tushen ƙarfin lantarki, ƙananan canje-canje a cikin zaɓaɓɓen ƙarfin lantarki zai haifar da babban canji a cikin ƙarfin lantarki, saboda haka dole ne a yi amfani da mai tuƙi na yau da kullun ko resistor a jere.

5.5 Relative Radiant Flux vs. Junction Temperature

Wannan shi ne daya daga cikin mahimman layukan zane na sarrafa zafi. Yana nuna yadda fitowar haske ke raguwa yayin da zafin jiki (Tj) ke tashi. Manyan fitilun LED suna da hankali ga zafi; Tj mai girma yana rage inganci (haske) da rage tsawon rayuwa. Ana buƙatar ingantattun matakan sanyaya zafi, don kiyaye Tj a ƙasa kamar yadda zai yiwu, a mafi kyau ya zama nesa da ƙimar madaidaicin 110°C, don tabbatar da kwanciyar hankali da dogon aminci.

6. Mechanical Dimensions and Package Information

Wannan LED yana amfani da kunshewar na'urar haɗawa ta saman (SMD). Mahimman bayanan girma sun haɗa da:

The outline drawing provides precise dimensions for the PCB pad design, including pad size, spacing, and component placement location.

7. Assembly and Soldering Guide

Proper handling and soldering are critical for reliability.

7.1 Shawarar Tsarin Zazzabi na Walda

A detailed temperature-time profile is provided. Key parameters typically include:

Important Note:The temperature profile may need to be adjusted according to the solder paste specification. Reflow soldering can be performed up to three times. If hand soldering is necessary, the temperature per pad must not exceed 300°C, and the time must not exceed 2 seconds. The reliability of dip soldering is not recommended or guaranteed.

7.2 Shawarar Tsarin PCB Pad

The land pattern for PCB design is provided. This pattern ensures good solder joint formation, electrical connection, and most importantly, optimal heat transfer from the LED thermal pad to the PCB copper plane. The size and shape of the thermal pad on the PCB are critical for effective heat dissipation.

7.3 Tsaftacewa da Aiki

8. Ƙayyadaddun Marufi

LEDs are supplied in tape-and-reel packaging, compatible with automatic placement equipment.

9. Bayanin Aikace-aikace da La'akari da Ƙira

9.1 Ƙirar Da'irar Turawa

LEDs are current-driven devices. To ensure reliable operation:

9.2 Gudanar da Zafi

This is crucial for high-power LEDs. The design steps include:

  1. PCB Design:Use a PCB with a dedicated thermal pad, which should be connected to an internal ground plane or a large area of copper foil.
  2. Vias:Arrange an array of thermal vias under the LED thermal pad to conduct heat to the inner layers or the bottom of the board.
  3. External Heat Sink:For applications involving high current operation or high ambient temperatures, it may be necessary to add an external heat sink to the PCB.
  4. Monitoring:In critical applications, consider monitoring the board temperature near the LED to ensure it does not exceed the operating limits.

9.3 Dangantakar Muhalli da Kayan

Na'urar tana da lallausan zinare, amma a lura:

10. Typical Application Scenarios

Wannan 660nm jan haske LED saboda takamaiman tsawon raƙuman ruwa da ƙarfi, ya dace da aikace-aikace da yawa:

11. Frequently Asked Questions (FAQ)

Q1: Menene bambanci tsakanin Radiation Flux (mW) da Luminous Flux (lm)?
A1: Radiation Flux yana auna jimlar ƙarfin haske a cikin Watts, ba tare da la'akari da tsawon zango ba. Luminous Flux yana auna hasken da idon mutum yake gani, kuma an yi masa nauyin lanƙwasa na gani na photopic (kololuwa a hasken kore na 555nm). Ga LED mai haske ja mai zurfi na 660nm, ingancin haske (lm/W) ya fi ƙasa da na LED farin haske ko kore, saboda haka Radiation Flux shine mafi dacewar ma'auni don auna ƙarfin haskensa.

Q2: Zan iya amfani da cikakken igiyar ruwa na 700mA don kunna wannan LED?
A2: Ko da yake yana yiwuwa, ba a ba da shawarar don aiki na ci gaba ba. Yin haka zai haifar da ƙarin zafi, yana rage inganci da sauri (duba lanƙwasa na Dangantaccen Flux vs. Zazzabi), kuma yana rage tsawon rayuwar LED. Matsakaicin aiki na 350mA da aka ba da shawarar yana ba da mafi kyawun daidaito tsakanin fitarwa, inganci, da tsawon rai.

Q3: Me yasa filin haɗa zafi ya kasance mai tsaka-tsaki a lantarki?
A3: This design simplifies PCB layout and improves thermal performance. It allows the thermal pad to be directly connected to a large area copper ground plane or heat sink on the PCB without causing an electrical short. This maximizes the heat conducted away from the LED junction.

Q4: How to interpret the bin code when ordering?
A4: The bin code (e.g., V2R4P6L) specifies the performance ranges for voltage, radiant flux, and peak wavelength. To achieve consistent performance within an array, you should specify a narrow range or a single bin for each parameter. A standard order may receive a mix of bins within the product's overall specification range.

Detailed Explanation of LED Specification Terminology

Complete Explanation of LED Technical Terminology

I. Core Photoelectric Performance Indicators

Terminology Unit/Pernyataan Penjelasan Populer Mengapa Penting
Efisiensi Cahaya (Luminous Efficacy) lm/W (lumen per watt) Fluks cahaya yang dihasilkan per watt daya listrik, semakin tinggi semakin hemat energi. Directly determines the energy efficiency rating and electricity cost of the lighting fixture.
Luminous Flux lm (lumen) The total amount of light emitted by a light source, commonly referred to as "brightness". Determines whether the lighting fixture is bright enough.
Viewing Angle ° (degree), e.g., 120° The angle at which light intensity drops to half, determining the beam width. Affects the lighting range and uniformity.
Correlated Color Temperature (CCT) K (Kelvin), e.g., 2700K/6500K The warmth or coolness of light color; lower values are yellowish/warm, higher values are whitish/cool. Determines the lighting atmosphere and suitable application scenarios.
Color Rendering Index (CRI / Ra) Unitless, 0–100 The ability of a light source to reproduce an object's true colors, Ra≥80 is recommended. Affects color authenticity, used in high-demand places like shopping malls and art galleries.
Standard Deviation of Color Matching (SDCM) MacAdam ellipse steps, e.g., "5-step" A quantitative metric for color consistency; a smaller step number indicates better color consistency. Ensures no color variation among luminaires from the same batch.
Dominant Wavelength nm (nanometer), e.g., 620nm (red) The wavelength value corresponding to the color of a colored LED. Determines the hue of monochromatic LEDs such as red, yellow, and green.
Spectral Distribution Wavelength vs. Intensity curve Shows the intensity distribution of light emitted by an LED across various wavelengths. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbol Penjelasan Populer Design Considerations
Forward Voltage Vf The minimum voltage required to turn on an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf; voltages add up when multiple LEDs are connected in series.
Forward Current If The current value that makes the LED emit light normally. Constant current drive is commonly used, as the current determines brightness and lifespan.
Maximum Pulse Current Ifp Peak current that can be tolerated in a short time, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled, otherwise overheating damage may occur.
Reverse Voltage Vr The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. The circuit must be protected against reverse connection or voltage surges.
Thermal Resistance Rth (°C/W) The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. A high thermal resistance requires a more robust heat dissipation design; otherwise, the junction temperature will rise.
ESD Immunity V (HBM), e.g., 1000V Anti-static strike capability, the higher the value, the less susceptible to damage from static electricity. Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Key Indicators Penjelasan Populer Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, lifespan may double; excessively high temperature leads to lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) The time required for brightness to drop to 70% or 80% of its initial value. Ayyana kai tsaye "rayuwar aiki" na LED.
Lumen Maintenance % (misali 70%) Kashi na hasken da ya rage bayan amfani na wani lokaci. Yana nuna ikon riƙe haske bayan amfani na dogon lokaci.
Color Shift Δu′v′ or MacAdam Ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Degradation of material performance. Deterioration of packaging materials due to prolonged high temperatures. May lead to decreased brightness, color shift, or open-circuit failure.

IV. Packaging and Materials

Terminology Common Types Penjelasan Populer Characteristics and Applications
Package Types EMC, PPA, Ceramic The housing material that protects the chip and provides optical and thermal interfaces. EMC offers good heat resistance and low cost; ceramics provide superior heat dissipation and long lifespan.
Chip Structure Front-side, Flip Chip The arrangement method of chip electrodes. Flip Chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating YAG, silicate, nitride Coated on the blue LED chip, partially converts to yellow/red light, mixing to form white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/optical design Flat, microlens, total internal reflection Optical structure on the packaging surface, controlling light distribution. Determines the emission angle and light distribution curve.

V. Quality Control and Binning

Terminology Binning Content Penjelasan Populer Purpose
Luminous Flux Binning Codes such as 2G, 2H Grouped by brightness level, each group has a minimum/maximum lumen value. Ensure consistent brightness for products in the same batch.
Voltage binning Codes such as 6W, 6X Grouped by forward voltage range. Facilitates driver matching and improves system efficiency.
Color binning 5-step MacAdam ellipse Group by color coordinates to ensure colors fall within a minimal range. Ensures color consistency and avoids color variation within the same luminaire.
Color temperature binning 2700K, 3000K, etc. Grouped by color temperature, each group has a corresponding coordinate range. To meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standard/Test Penjelasan Populer Significance
LM-80 Lumen Maintenance Test Long-term operation under constant temperature conditions, recording data on luminous flux depreciation. Used to estimate LED lifetime (in conjunction with TM-21).
TM-21 Lifetime Projection Standard Projecting lifespan under actual use conditions based on LM-80 data. Providing scientific life prediction.
IESNA Standard Illuminating Engineering Society Standard Covers optical, electrical, and thermal testing methods. Industry-recognized testing basis.
RoHS / REACH Environmental certification Ensure products do not contain harmful substances (e.g., lead, mercury). Entry requirements for the international market.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting products. Commonly used in government procurement and subsidy programs to enhance market competitiveness.