Bayanin Fasaha na LTST-C21KGKT - LED SMD Mai Haɗawa ta Baya - Kori AlInGaP - 20mA - 2.4V - Takardun Fasaha na Hausa

1. Bayyani Game da Samfur Wannan takarda tana ba da cikakkun bayanai na fasaha na LED mai ƙarfi, mai haɗawa ta baya a saman allon (SMD). Na'urar tana amfani da guntun semiconductor na Aluminum Indium Gallium Phosphide (AlInGaP) don samar da haske kore. An ƙera ta don hanyoyin haɗawa ta atomatik kuma tana bin ƙa'idodin RoHS (Ƙuntata Abubuwa Masu Haɗari), wanda ya sa ta zama kayan aiki mai dorewa wanda ya dace da masana'antar kera na'urorin lantarki na zamani.

Babban aikace-aikacen wannan LED shine a cikin hasken baya (backlighting), alamomin matsayi, da hasken panel inda sarari ya yi ƙanƙanta a saman allon da'ira (PCB). Ƙirarta ta haɗawa ta baya tana ba ta damar a haɗa ta a gefen allon da'ira daban da inda haske ke fitowa, wanda ke ba da damar ƙirar samfura masu ƙirar ƙira da tanadin sarari.

2. Zurfin Binciken Ma'auni na Fasaha

2.1 Matsakaicin Matsayin Iyaka Ba za a iya aiki da na'urar fiye da waɗannan iyakokin ba don hana lalacewa na dindindin. Matsakaicin iyakoki sun haɗa da matsakaicin halin yanzu na gaba (I_F) na 30 mA a yanayin zafin muhalli (T_amb) na 25°C. Ƙarfin watsawa (power dissipation) shine 75 mW. Don aiki mai bugun jini (pulsed operation), matsakaicin halin yanzu na gaba na 80 mA yana yiwuwa a ƙarƙashin zagayowar aiki (duty cycle) na 1/10 tare da faɗin bugun jini (pulse width) na 0.1 ms. Matsakaicin ƙarfin lantarki na baya (V_R) shine 5 V. Yankin zafin aiki da ajiya an ƙayyade daga -55°C zuwa +85°C.

Yanayin haɗa solder yana da mahimmanci: haɗa solder ta hanyar igiyar ruwa (wave) ko infrared reflow bai kamata ya wuce 260°C fiye da dakika 5 ba, yayin da haɗa solder ta hanyar tururi (vapor phase) bai kamata ya wuce 215°C fiye da mintuna 3 ba. Ana amfani da ma'aunin rage ƙarfi (derating factor) na 0.4 mA/°C ga halin yanzu na gaba don yanayin zafin muhalli sama da 50°C.

2.2 Halayen Lantarki da Na Gani An auna a T_amb=25°C da halin yanzu na gaba (I_F) na 20 mA, an ƙayyade ma'auni masu mahimmanci na aiki._FƘarfin Hasken (I_V): Ya kewayo daga mafi ƙanƙanta na 28.0 mcd zuwa mafi girma na 180.0 mcd. Ba a ƙayyade ƙimar al'ada a cikin teburin taƙaitaccen bayani, wanda ke nuna ya dogara da takamaiman lambar rarrabuwa (bin code) (duba Sashe na 3). Aunin yana bin lanƙwan amsa ido na CIE photopic._aKusurwar Dubawa (2θ_1/2): An ƙayyade shi azaman digiri 70. Wannan shine cikakken kusurwar da ƙarfin haske ya ragu zuwa rabin ƙimar da aka auna akan tsakiyar axis._RTsawon Zangon Kololuwa (λ_P): Kusan 574 nm. Wannan shine tsawon zango inda rarraba ƙarfin haske (spectral power distribution) ya kasance a matsakaicinsa.

Tsawon Zangon da Ya Fi Rinjaye (λ_D): Ya kewayo daga 567.5 nm zuwa 576.5 nm a I_F=20mA. Wannan shine tsawon zango guda ɗaya da idon ɗan adam ke gani wanda ke ayyana launin hasken, wanda aka samo daga zanen launi na CIE (CIE chromaticity diagram).

Rabin Faɗin Zangon Haske (Δλ): Kusan 15 nm. Wannan yana nuna tsaftar hasken kore.

Ƙarfin Lantarki na Gaba (V_F): Ya kewayo daga 1.80 V zuwa 2.40 V a I_F=20mA._aHalin Yanzu na Baya (I_R): Matsakaicin 10 μA a V_R=5V._FƘarfin Ƙwaƙwalwa (C): Yawanci 40 pF da aka auna a 0 V bias da mitar 1 MHz.

• 3. Bayanin Tsarin Rarrabe (Binning) Don tabbatar da daidaiton launi da haske a cikin samarwa, ana rarraba LED zuwa rukunoni (bins). Wannan samfurin yana amfani da ma'auni biyu masu zaman kansu na rarrabuwa._V3.1 Rarrabe Ƙarfin Hasken (Luminous Intensity Binning) Raka'a suna cikin millicandelas (mcd) a I_F=20mA. Rukunoni (bins) sune:Lambar N: 28.0 mcd (Mafi ƙanƙanta) zuwa 45.0 mcd (Mafi girma)
• Lambar P: 45.0 mcd zuwa 71.0 mcd_{Lambar Q: 71.0 mcd zuwa 112.0 mcd}Lambar R: 112.0 mcd zuwa 180.0 mcdAna amfani da rangwame (tolerance) na ±15% a cikin kowane rukunin ƙarfin haske.
• 3.2 Rarrabe Tsawon Zangon Haske (Dominant Wavelength Binning) Raka'a suna cikin nanometers (nm) a I_F=20mA. Rukunoni (bins) sune:_PLambar C: 567.5 nm (Mafi ƙanƙanta) zuwa 570.5 nm (Mafi girma)Lambar D: 570.5 nm zuwa 573.5 nm
• Lambar E: 573.5 nm zuwa 576.5 nm_dAna amfani da rangwame mai tsauri na ±1 nm a cikin kowane rukunin tsawon zango. Cikakken lambar sashi ya haɗa da waɗannan lambobin rarrabuwa don ƙayyade takamaiman aiki.4. Binciken Lanƙwan Ayyuka (Performance Curves) Duk da yake an ambaci takamaiman zane-zane amma ba a cikakken bayani a cikin rubutun da aka bayar ba, lanƙwan al'ada don irin waɗannan na'urori za su haɗa da:_FLanƙwan I-V (Halin Yanzu-Ƙarfin Lantarki): Yana nuna alaƙar ƙima (exponential relationship) tsakanin ƙarfin lantarki na gaba da halin yanzu. Lanƙwan zai sami takamaiman ƙarfin lantarki na gwiwa (knee voltage) kusan 1.8-2.4V.
• Ƙarfin Hasken vs. Halin Yanzu na Gaba: Yana nuna cewa fitar da haske yana ƙaruwa tare da halin yanzu, amma ba lallai ba ne a layi daya, musamman a halin yanzu mafi girma saboda tasirin dumama.Ƙarfin Hasken vs. Yanayin Zafin Muhalli: Yana nuna raguwar fitar da haske yayin da zafin haɗuwa (junction temperature) ya ƙaru. LED na AlInGaP yawanci suna da ma'auni mara kyau na zafin jiki (negative temperature coefficient) don fitar da haske.
• Rarraba Zangon Haske (Spectral Distribution): Zanen da ke nuna ƙarfin da aka fitar a faɗin tsawon zango, yana kololuwa kusan 574 nm tare da faɗin kusan 15 nm a rabin matsakaici._FTsarin Kusurwar Dubawa (Viewing Angle Pattern): Zanen polar da ke kwatanta rarraba ƙarfin haske ta kusurwoyi, wanda yawanci yana da siffar Lambertian ko mai fitar da gefe (side-emitter) don wannan salon kunshin.Waɗannan lanƙwan suna da mahimmanci ga masu ƙira don hasashen aiki a ƙarƙashin yanayin aiki mara daidaituwa._F5. Bayanin Ƙirar Jiki da Kunshin
• 5.1 Girman Kunshin LED yana bin ƙirar kunshin SMD na ma'auni na EIA. An ba da duk mahimman girma (tsawon jiki, faɗi, tsayi, tazarar jagora, da sauransu) a cikin zane-zane masu tushen milimita tare da rangwamen daidaitaccen na ±0.10 mm sai dai idan an lura daban. An ƙayyade ruwan tabarau (lens) a matsayin "Ruwa Bayyananne (Water Clear)."_R5.2 Gano Ƙarshen Lantarki (Polarity) da Tsarin Ƙafar Haɗawa (Pad Layout) Bangaren yana da tashoshi na anode da cathode. Bayanin fasaha ya haɗa da zanen ƙafar haɗa solder da aka ba da shawarar don tsarin PCB. Yin bin waɗannan girma yana da mahimmanci don cimma haɗin solder mai dogaro, daidaitawar da ta dace, da kuma watsa zafi mai inganci yayin aikin reflow. Ƙirar ƙafar haɗawa kuma tana taimakawa wajen hana tsayawar bangare (tombstoning) yayin haɗa solder.6. Jagororin Haɗawa da Haɗawa (Soldering da Assembly)_R6.1 Bayanan Yanayin Haɗa Solder ta Reflow An ba da shawarar bayanan reflow na infrared (IR) guda biyu: ɗaya don tsarin haɗa solder na tagulla-da gubar (SnPb) na daidaitaccen, da ɗaya don tsarin haɗa solder mara gubar (Pb-free), yawanci ta amfani da gami na SAC (Sn-Ag-Cu). Bayanin mara gubar yana buƙatar mafi girman zafin jiki (har zuwa 260°C) amma dole ne a sarrafa lokacin da ya wuce ruwa mai ruwa (liquidus) a hankali don hana lalata kunshin LED na epoxy. Matakan dumama kafin haɗawa suna da mahimmanci don rage girgizar zafi (thermal shock).
• 6.2 Ajiya da Sarrafawa LEDs na'urori ne masu hankali ga danshi. Don ajiya mai tsawo a waje da jakar shinge na asali na danshi, ya kamata a ajiye su a cikin yanayi wanda bai wuce 30°C da 70% danshi ba. Idan an ajiye su ba tare da kunshin ba fiye da mako guda, ana ba da shawarar gasa a kusan 60°C na aƙalla sa'o'i 24 kafin haɗa solder don cire danshin da aka sha da kuma hana "fasar wake (popcorning)" yayin reflow.6.3 Tsaftacewa Idan tsaftacewa bayan haɗa solder ya zama dole, kawai ya kamata a yi amfani da takamaiman kaushi. Tsoma LED a cikin barasa na ethyl ko isopropyl a zafin daki na ƙasa da minti ɗaya yana yarda. Sinadarai da ba a ƙayyade ba ko masu tsauri na iya lalata ruwan tabarau na filastik da kayan kunshin.

6.4 Kariya daga Zubar da Lantarki (ESD) LED yana da saukin lalacewa daga zubar da lantarki (ESD). Dole ne a sami ingantattun sarrafawa na ESD a lokacin sarrafawa da haɗawa:

Yi amfani da igiyoyin wuyan da aka kafa da katifu masu hana tashin hankali (anti-static).

Tabbatar cewa duk kayan aiki da wuraren aiki suna da tushe daidai.

Yi la'akari da amfani da mai ionizer don kawar da cajin tsaye wanda zai iya taruwa akan ruwan tabarau na filastik._F7. Bayanin Kunshin da Odar Sayayya Ana ba da LEDs a cikin kunshin masana'antu na daidaitaccen don sauƙaƙe haɗawa ta atomatik.

• Tepe da Reel: Ana sanya abubuwan a cikin tepe mai ɗaukar kaya mai faɗin 8mm.Girman Reel: An ɗora akan reels masu diamita 7-inch (178 mm).
• Adadi: Daidaitaccen reel ya ƙunshi guda 3000. Ana samun mafi ƙarancin adadin oda na guda 500 don sauran kaya.Ma'auni na Kunshin: Yana bin ƙa'idodin ANSI/EIA-481-1-A. Tepe yana da hatimin murfi, kuma ana ba da izinin fanko biyu a jere a jere.
• Cikakken lambar sashi (misali, LTST-C21KGKT) yana ɓoye takamaiman halaye, gami da lambobin rarrabuwa don ƙarfin haske da tsawon zango da ya fi rinjaye.8. Bayanan Aikace-aikace da Abubuwan Ƙira
• 8.1 Ƙirar Da'irar Gudanarwa (Drive Circuit) LEDs na'urori ne masu gudanar da halin yanzu. Don aiki mai tsayayye da daidaito, musamman lokacin gudanar da LED da yawa a layi daya, resistor mai iyakance halin yanzu a jere (series current-limiting resistor) ga kowane LEDana ba da shawarar sosai

(Tsarin Da'ira A). Gudanar da LEDs kai tsaye a layi daya ba tare da resistors ɗaya ɗaya ba (Tsarin Da'ira B) ba a ba da shawarar ba saboda bambance-bambance a cikin ƙarfin lantarki na gaba (V_F) daga na'ura zuwa na'ura. Waɗannan bambance-bambancen na iya haifar da bambance-bambance masu yawa a cikin raba halin yanzu, wanda ke haifar da haske mara daidaituwa da yuwuwar matsin lamba na LED tare da mafi ƙarancin V_F.

Ƙimar resistor na jere (R_S) za a iya ƙididdige ta ta amfani da Dokar Ohm: R_S = (V_supply - V_F) / I_F, inda I_F shine halin yanzu na aiki da ake so (misali, 20 mA) kuma V_F shine ƙarfin lantarki na gaba na al'ada ko matsakaici daga bayanin fasaha.

8.2 Sarrafa Zafi (Thermal Management) Ko da yake watsawar ƙarfi (power dissipation) yana da ƙanƙanta (75 mW matsakaici), ingantaccen sarrafa zafi har yanzu yana da mahimmanci don kiyaye dogon lokaci na dogaro da daidaitaccen fitar da haske. Fitar da hasken LED yana raguwa tare da ƙaruwar zafin haɗuwa (junction temperature). Tabbatar da ingantacciyar hanyar zafi daga ƙafafun haɗa solder na LED zuwa farantin tagulla na PCB yana taimakawa wajen watsa zafi. Guji aiki a matsakaicin iyaka na halin yanzu da iyakokin zafin jiki na tsawon lokaci._F8.3 Iyakokin da Yankin Aikace-aikace An ƙera wannan bangaren don kayan aikin lantarki na gaba ɗaya kamar na'urorin lantarki na masu amfani, na'urori na sarrafa ofis, da kayan aikin sadarwa. Ba a ƙera shi musamman ko cancanta don aikace-aikacen da gazawar zai iya haifar da haɗari kai tsaye (misali, sarrafa jiragen sama, tallafin rayuwa na likita, tsarin amincin sufuri). Don irin waɗannan aikace-aikace masu dogaro, tuntuɓar masana'anta don samfuran musamman ya zama dole.

• 9. Kwatancen Fasaha da Bambance-bambance Babban abubuwan banbance na wannan LED suneikonta na haɗawa ta baya
• da amfani daguntun AlInGaP
• don fitar da kore.Haɗawa ta Baya vs. SMD na Daidaitaccen Duba Sama: Wannan yana ba da damar haɗa LED a gefen ƙasa na PCB yayin haskakawa ta rami ko jagorar haske, yana 'yantar da ƙasar saman da ta dace don wasu abubuwa. Yana ba da damar ƙirar samfura masu siriri.

AlInGaP vs. GaP na Al'ada ko InGaN: Fasahar AlInGaP tana ba da inganci mafi girma da ingantaccen kwanciyar hankali na zafin jiki don tsawon zango na ja, orange, amber, da kore idan aka kwatanta da tsofaffin fasahohi. Yawanci tana ba da haske mafi girma da mafi yawan wuraren launi masu jikewa.

Ruwan Tabarau Bayyananne (Water Clear Lens): Yana ba da ainihin launin guntun ba tare da watsewa ba, yana haifar da tsarin haske mai mai da hankali da ƙarfi idan aka kwatanta da ruwan tabarau masu watsewa.

10. Tambayoyin da Ake Yawan Yi (FAQ)

• Q1: Menene bambanci tsakanin tsawon zango kololuwa da tsawon zango da ya fi rinjaye?A1: Tsawon zango kololuwa (λ_P) shine tsawon zango na zahiri inda LED ke fitar da mafi yawan ƙarfin haske. Tsawon zango da ya fi rinjaye (λ_D) ƙima ce da aka ƙididdige bisa fahimtar launin ɗan adam (gidan CIE) wanda ya fi wakiltar launin da ake gani. Don LED kore mai launi guda, sau da yawa suna kusa, amma λ_D shine ma'auni mafi dacewa don daidaita launi.
• Q2: Zan iya gudanar da wannan LED a 30 mA a ci gaba?A2: Duk da yake matsakaicin iyaka shine 30 mA DC, mafi kyawun aiki don tsawon rai da daidaitaccen fitar da haske yawanci ana samun shi a ko ƙasa da gwajin halin yanzu na 20 mA. Aiki a 30 mA zai haifar da ƙarin zafi, rage inganci, kuma yana iya rage tsawon rai. Koyaushe ka tuntubi jagororin rage ƙarfi (derating) don yanayin zafi mai girma.
• Q3: Ta yaya zan fassara lambobin rarrabuwa a cikin lambar sashi?A3: Ƙarshen lambar sashi yana ƙunshe da lambobin da ke ƙayyade rukunin ƙarfin haske (misali, R don mafi girman fitarwa) da rukunin tsawon zango da ya fi rinjaye (misali, D don tsakiyar kore). Zaɓin lambobin rarrabuwa da suka dace yana da mahimmanci don aikace-aikacen da ke buƙatar daidaiton haske da launi a cikin LED da yawa.
• Q4: Shin wannan LED ya dace da haɗa solder ta igiyar ruwa (wave soldering)?A4: Ee, bayanin fasaha ya ƙayyade yanayin haɗa solder ta igiyar ruwa na 260°C na dakika 5 matsakaici. Duk da haka, haɗa solder ta reflow shine hanyar da aka fi so kuma ta fi yawa don abubuwan SMD kamar wannan.
• 11. Nazarin Misalin Ƙira da Amfani Labari: Ƙirar alamar matsayi don na'urar likita mai ɗaukuwa. Na'urar tana buƙatar haske mai haske, kore mara shakka "wuta a kunne/ shirye" alama. Sarari a saman allon sarrafawa yana da iyaka sosai. An zaɓi LED mai haɗawa ta baya. An sanya shi a gefen ƙasa na babban PCB. Ƙaramin rami da aka haƙa daidai a cikin saman panel yana ba da damar hasken ya haskaka. Ana iya amfani da bututun haske ko ƙirar rami mai sauƙi. Da'irar gudanarwa tana amfani da wadata 3.3V. Ƙididdigar resistor na jere: R_S = (3.3V - 2.2V_typ) / 0.020A = 55 Ohms. An zaɓi resistor na daidaitaccen ƙimar 56 Ohm. Don tabbatar da daidaiton launi a duk raka'o'i, an ƙayyade LED daga rukunin tsawon zango iri ɗaya (misali, Lambar D) a cikin lissafin kayan aiki.12. Gabatarwa da Ka'idar Fasaha Wannan LED yana dogara ne akan kayan semiconductor na Aluminum Indium Gallium Phosphide (Al_x In_y Ga_1-x-y P) da aka girma akan substrate. Lokacin da aka yi amfani da ƙarfin lantarki na gaba, electrons da ramuka suna sake haɗuwa a cikin yanki mai aiki na guntun, suna sakin makamashi a cikin nau'in photons (haske). Takamaiman rabo na aluminum, indium, da gallium a cikin lattice crystal yana ƙayyade ƙarfin bandgap, wanda kai tsaye yana ayyana tsawon zango (launi) na hasken da aka fitar. Don fitar da kore, ana amfani da takamaiman abun da ke ciki don cimma bandgap daidai da haske kusan 570-580 nm. Tsarin kayan AlInGaP an san shi da babban ingancin quantum na ciki a cikin kewayon zango na ja-zuwa-kore.

13. Trends da Ci gaba a Masana'antu Trend a cikin SMD LEDs don aikace-aikacen nuni da hasken baya yana ci gaba zuwa mafi inganci, ƙananan fakitoci, da mafi girman dogaro. Akwai ƙwaƙƙwaran ƙoƙari don ingantaccen aiki a cikin hanyoyin haɗa solder mara gubar da babban zafin jiki. Bukatar sarrafa launi daidai da ƙarin matse rarrabuwa yana ƙaruwa, musamman a aikace-aikacen inda daidaita launi ke da mahimmanci a cikin nuni ko panel. Bugu da ƙari, haɗa LED tare da ƙa'idodin halin yanzu ko da'irar sarrafawa (kamar LED masu gudanar da IC) wani trend ne mai girma don sauƙaƙe ƙira da inganta daidaiton aiki, ko da yake wannan bangaren na musamman LED ne na daidaitaccen, mai hankali.

. Mechanical and Package Information

.1 Package Dimensions

The LED conforms to an EIA standard SMD package outline. All critical dimensions (body length, width, height, lead spacing, etc.) are provided in millimeter-based drawings with a standard tolerance of ±0.10 mm unless otherwise noted. The lens is specified as "Water Clear."

.2 Polarity Identification and Pad Layout

The component has anode and cathode terminals. The datasheet includes a recommended solder pad footprint diagram for PCB layout. Adhering to these dimensions is crucial for achieving a reliable solder joint, proper alignment, and effective heat dissipation during the reflow process. The pad design also helps prevent tombstoning (component standing up on one end) during soldering.

. Soldering and Assembly Guidelines

.1 Reflow Soldering Profiles

Two suggested infrared (IR) reflow profiles are provided: one for standard tin-lead (SnPb) solder process and one for lead-free (Pb-free) solder process, typically using SAC (Sn-Ag-Cu) alloys. The lead-free profile requires a higher peak temperature (up to 260°C) but must carefully control the time above liquidus to prevent damage to the LED's epoxy package. Pre-heating stages are critical to minimize thermal shock.

.2 Storage and Handling

LEDs are moisture-sensitive devices. For extended storage outside the original moisture-barrier bag, they should be kept in an environment not exceeding 30°C and 70% relative humidity. If stored unpackaged for more than one week, a bake-out at approximately 60°C for at least 24 hours is recommended before soldering to remove absorbed moisture and prevent "popcorning" during reflow.

.3 Cleaning

If cleaning after soldering is necessary, only specified solvents should be used. Immersing the LED in ethyl alcohol or isopropyl alcohol at room temperature for less than one minute is acceptable. Unspecified or aggressive chemicals can damage the plastic lens and package material.

.4 Electrostatic Discharge (ESD) Protection

The LED is susceptible to damage from electrostatic discharge. Proper ESD controls must be in place during handling and assembly:

• Use grounded wrist straps and anti-static mats.
• Ensure all equipment and workstations are properly grounded.
• Consider using an ionizer to neutralize static charges that may accumulate on the plastic lens.

. Packaging and Ordering Information

The LEDs are supplied in industry-standard packaging to facilitate automated assembly.

• Tape and Reel:Components are placed in 8mm wide embossed carrier tape.
• Reel Size:Mounted on 7-inch (178 mm) diameter reels.
• Quantity:Standard reel contains 3000 pieces. A minimum order quantity of 500 pieces is available for remainder stock.
• Packaging Standards:Complies with ANSI/EIA-481-1-A specifications. The tape has a cover seal, and a maximum of two consecutive empty pockets is allowed.

The full part number (e.g., LTST-C21KGKT) encodes the specific characteristics, including the bin codes for luminous intensity and dominant wavelength.

. Application Notes and Design Considerations

.1 Drive Circuit Design

LEDs are current-driven devices. For stable and uniform operation, especially when driving multiple LEDs in parallel, a series current-limiting resistor for each LED isstrongly recommended(Circuit Model A). Driving LEDs directly in parallel without individual resistors (Circuit Model B) is not recommended due to variations in the forward voltage (V_F) from device to device. These variations can cause significant differences in current sharing, leading to uneven brightness and potential overstress of the LED with the lowest V_F.

The value of the series resistor (R_s) can be calculated using Ohm's Law: R_s= (V_supply- V_F) / I_F, where I_Fis the desired operating current (e.g., 20 mA) and V_Fis the typical or maximum forward voltage from the datasheet.

.2 Thermal Management

Although power dissipation is relatively low (75 mW max), effective thermal management is still important for maintaining long-term reliability and consistent light output. The LED's light output decreases with increasing junction temperature. Ensuring a good thermal path from the LED's solder pads to the PCB copper planes helps dissipate heat. Avoid operating at the absolute maximum current and temperature limits for extended periods.

.3 Application Scope and Limitations

This component is designed for general-purpose electronic equipment such as consumer electronics, office automation devices, and communication equipment. It is not specifically designed or qualified for applications where failure could lead to direct safety hazards (e.g., aviation control, medical life-support, transportation safety systems). For such high-reliability applications, consultation with the manufacturer for specialized products is necessary.

. Technical Comparison and Differentiation

The key differentiating features of this LED are itsreverse mountcapability and its use of anAlInGaPchip for green emission.

• Reverse Mount vs. Standard Top-View SMD:This allows the LED to be mounted on the bottom side of a PCB while shining light through a hole or a light guide, freeing up valuable top-side real estate for other components. It enables slimmer product designs.
• AlInGaP vs. Traditional GaP or InGaN:AlInGaP technology offers higher efficiency and better temperature stability for red, orange, amber, and green wavelengths compared to older technologies. It typically provides higher brightness and more saturated color points.
• Water Clear Lens:Provides the true color of the chip without diffusion, resulting in a more focused and intense beam pattern compared to diffused lenses.

. Frequently Asked Questions (FAQ)

Q1: What is the difference between peak wavelength and dominant wavelength?

A1: Peak wavelength (λ_P) is the physical wavelength where the LED emits the most optical power. Dominant wavelength (λ_d) is a calculated value based on human color perception (CIE chart) that best represents the perceived color. For a monochromatic green LED, they are often close, but λ_dis the more relevant parameter for color matching.

Q2: Can I drive this LED at 30 mA continuously?

A2: While the absolute maximum rating is 30 mA DC, optimal performance for longevity and stable light output is typically achieved at or below the test current of 20 mA. Operating at 30 mA will generate more heat, reduce efficiency, and may shorten lifespan. Always consult derating guidelines for elevated temperatures.

Q3: How do I interpret the bin codes in the part number?

A3: The part number suffix contains codes that specify the luminous intensity bin (e.g., R for highest output) and the dominant wavelength bin (e.g., D for mid-green). Selecting the appropriate bin codes is crucial for applications requiring consistent brightness and color across multiple LEDs.

Q4: Is this LED suitable for wave soldering?

A4: Yes, the datasheet specifies a wave soldering condition of 260°C for 5 seconds maximum. However, reflow soldering is the preferred and most common method for SMD components like this one.

. Design and Usage Case Study

Scenario: Designing a status indicator for a portable medical device.

The device requires a bright, unambiguous green "power on/ready" indicator. Space on the top control panel is extremely limited. A reverse mount LED is chosen. It is placed on the bottom side of the main PCB. A small, precisely drilled aperture in the top panel allows the light to shine through. A light pipe or simple hole design can be used. The drive circuit uses a 3.3V supply. Calculating the series resistor: R_s= (3.3V - 2.2V_typ) / 0.020A = 55 Ohms. A 56 Ohm standard value resistor is selected. To ensure color consistency across all units, LEDs from the same wavelength bin (e.g., Code D) are specified in the bill of materials.

. Technology Principle Introduction

This LED is based on Aluminum Indium Gallium Phosphide (Al_xIn_yGa_-x-yP) semiconductor material grown on a substrate. When a forward voltage is applied, electrons and holes recombine in the active region of the chip, releasing energy in the form of photons (light). The specific ratio of aluminum, indium, and gallium in the crystal lattice determines the bandgap energy, which directly defines the wavelength (color) of the emitted light. For green emission, a specific composition is used to achieve a bandgap corresponding to light around 570-580 nm. The AlInGaP material system is known for its high internal quantum efficiency in the red-to-green spectral range.

. Industry Trends and Developments

The trend in SMD LEDs for indicator and backlighting applications continues toward higher efficiency, smaller packages, and greater reliability. There is a strong drive for improved performance in lead-free and high-temperature reflow soldering processes. The demand for precise color control and tighter binning is increasing, especially in applications where color matching is critical across displays or panels. Furthermore, the integration of LEDs with built-in current regulation or control circuitry (like IC-driven LEDs) is a growing trend to simplify design and improve performance consistency, though this particular component is a standard, discrete LED.