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PD438B 4.8mm Semi-Lens Silicon PIN Photodiode Datasheet - 4.8mm Diameter - Black Lens - Simplified Chinese Technical Documentation

PD438B Datasheet. This is a 4.8mm diameter, high-speed, high-sensitivity silicon PIN photodiode, featuring a cylindrical side-view package with a black infrared-filtering epoxy lens.
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PDF Document Cover - PD438B 4.8mm Semi-Lens Silicon PIN Photodiode Datasheet - 4.8mm Diameter - Black Lens - Simplified Chinese Technical Documentation

1. Product Overview

PD438B is a high-performance silicon PIN photodiode designed for applications requiring fast response and high infrared light sensitivity. It features a compact cylindrical side-view plastic package with a diameter of 4.8 mm. A key characteristic of this device is its epoxy encapsulation, formulated to act as an integrated infrared (IR) filter. This built-in filter is spectrally matched to common IR emitters, enhancing the signal-to-noise ratio by selectively transmitting the target infrared wavelengths while attenuating unwanted visible light.

The core advantages of PD438B include its fast response time, high photosensitivity, and low junction capacitance, making it suitable for high-speed detection circuits. The device is manufactured using lead-free materials and complies with relevant environmental regulations such as RoHS and EU REACH, ensuring its suitability for modern electronic manufacturing.

The primary target markets and application areas for this photodiode are consumer electronics and industrial sensing. It is highly suitable for use as a high-speed photodetector in systems such as cameras, video recorders, and camcorders. Its characteristics also make it a reliable component in various photoelectric switches and sensing modules, where precise detection of infrared signals is crucial.

2. In-depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

This device is designed to operate reliably within the specified environmental and electrical limits. Exceeding these absolute maximum ratings may cause permanent damage.

2.2 Electro-Optical Characteristics

These parameters, measured at the standard temperature of 25°C, define the core photodetection performance of the PD438B.

Tolerances for key parameters have been specified: luminous intensity (±10%), dominant wavelength (±1nm), and forward voltage (±0.1V) to ensure consistency across production batches.

3. Performance Curve Analysis

The datasheet provides several characteristic curves illustrating how key parameters vary with operating conditions. These are crucial for circuit designers.

3.1 Spectral Sensitivity

The spectral response curve shows the relative sensitivity of the photodiode at different wavelengths. Due to the integrated infrared-filtering epoxy, its peak will appear sharply around 940 nm, while sensitivity in the visible spectrum (400-700 nm) is significantly reduced. This curve is essential for ensuring wavelength matching between the detector and emitter.

3.2 Relationship Between Dark Current and Ambient Temperature

This curve typically shows that the dark current (Id) increases exponentially with rising ambient temperature. Designers must account for this increased noise floor in high-temperature applications or when detecting extremely weak optical signals.

3.3 Relationship Between Reverse Photocurrent and Irradiance (Ee)

This graph illustrates the linear relationship between incident optical power (irradiance) and the generated photocurrent (IL) when the diode is reverse-biased. Linearity is a key characteristic of PIN photodiodes, making them suitable for optical measurement applications.

3.4 Relationship Between Terminal Capacitance and Reverse Voltage

Junction capacitance (Ct) decreases as reverse bias voltage (VR) increases. This curve allows designers to select the operating bias voltage to optimize the trade-off between speed (lower capacitance at higher voltage) and power consumption/heat.

3.5 Relationship Between Response Time and Load Resistance

Rise/fall time (tr/tf) is influenced by the RC time constant formed by the photodiode junction capacitance and the external load resistance (RL). This curve shows how response time increases with larger load resistance, guiding the selection of RL in transimpedance amplifier circuits to achieve the desired speed.

3.6 Relationship Between Power Consumption and Ambient Temperature

This derating curve indicates the maximum allowable power dissipation as a function of ambient temperature. As temperature increases, the maximum power the device can safely handle decreases linearly, which is crucial for thermal management in system design.

4. Mechanical and Packaging Information

4.1 Package Dimensions

The PD438B employs a cylindrical side-view package with a nominal diameter of 4.8 mm. The detailed mechanical drawing in the datasheet provides all critical dimensions, including body diameter, length, lead pitch, and lead diameter. Unless otherwise specified, the standard tolerance for all package dimensions is ±0.25 mm. The side-view configuration is specifically designed for applications where the optical path is parallel to the PCB surface.

4.2 Polarity Identification

Photodiode abu ne mai polariti. Ana gane cathode yawanci ta hanyar mafi tsayin ƙafa, fili akan kunshe, ko alama ta musamman. Zanen kunshe a cikin takardar ƙayyadaddun bayanai yana nuna haɗin anode da cathode a sarari, waɗannan alamomin dole ne a bi su yayin haɗawa, don tabbatar da daidaitaccen bias (bisa kishiyawa yana buƙata don aiki daidai).

5. Welding and Assembly Guide

To maintain reliability and prevent damage during assembly, specific welding conditions must be followed.

6. Packaging and Ordering Information

6.1 Packaging Specifications

The standard packaging process for PD438B is as follows: 500 pieces are packed in one anti-static bag. Six such bags are placed into an inner box. Finally, ten inner boxes are loaded into a master shipping (outer) carton, totaling 30,000 pieces per master carton.

6.2 Label Specifications

The label on the packaging contains several key identifiers:

Wannan alamar tana tabbatar da iyawar gano asalin kayan cikin sarkar kayan gaba ɗaya da kuma sarrafa kayan daidai.

7. Application Notes and Design Considerations

7.1 Typical Application Circuit

PD438B is most commonly used in one of the following two circuit configurations:

  1. Photovoltaic Mode (Zero Bias):Photodiode is directly connected to a high-impedance load (such as an op-amp input). This mode provides minimal dark current and noise but has slower response and lower linearity. Suitable for low-speed, precise optical measurements.
  2. Photoconductive mode (reverse bias):The photodiode is connected with the cathode to a positive voltage and the anode to a virtual ground (e.g., the inverting input of a transimpedance amplifier). This is the recommended mode for PD438B to leverage its high-speed capability. Reverse bias reduces junction capacitance (increasing speed) and improves linearity. The feedback resistor value in the transimpedance amplifier sets the gain (Vout = Iphoto * Rfeedback).

7.2 Design Considerations

8. Technical Comparison and Differentiation

PD438B distinguishes itself in the market through the following key features:

Compared to larger photodiodes, it occupies less space. Compared to photodiodes without filters, it better suppresses ambient visible light noise.

9. Frequently Asked Questions (FAQ)

Q1: What is the purpose of the black epoxy lens?
A1: The black epoxy is not just for appearance; its formulation makes it an effective infrared filter. It transmits the target infrared wavelength (peak at 940 nm) while absorbing most visible light, significantly reducing interference from ambient light sources such as indoor lighting.

Q2: Should I operate the PD438B with or without a reverse bias voltage?
A2: Don aiki mai sauri (kamar yadda aka nuna lokacin tashi na 50 ns), ana ba da shawarar sosai yin amfani da aikin karkata baya a yanayin photoconductive don sarrafa PD438B, yawanci ƙarfin lantarki mai karkata tsakanin 5V zuwa 10V. Wannan yana rage ƙarfin capacitor na haɗin gwiwa, kuma yana inganta daidaito da sauri.

Q3: Ta yaya za a canza ƙarfin lantarki na haske zuwa siginar ƙarfin lantarki mai amfani?
A3: Hanya mafi yawanci kuma mai inganci ita ce amfani da da'irar amplifier mai jujjuyawa (TIA). Ana haɗa photodiode tsakanin shigarwar juzu'i da fitarwar amplifier na aiki, resistor na amsawa yana ƙayyade riba (Vout = -Iphoto * Rf). Yawanci, ana haɗa ƙaramin capacitor na amsawa a kan resistor don daidaita da'ira da iyakance bandwidth.

Q4: What is the significance of the "dark current" parameter?
A4: Dark current is the small current that flows through a photodiode when it is in complete darkness and under reverse bias. It acts as a noise source. A lower dark current (5 nA typical for PD438B) means the device can detect weaker optical signals without the signal being obscured by its own noise.

Q5: Can this photodiode be used for visible light detection?
A5: Although its spectral range starts from 400 nm (violet), its sensitivity in the visible spectrum is greatly attenuated by the infrared filter epoxy lens. Its peak sensitivity is clearly located in the infrared region at 940 nm. For primary visible light detection, using a photodiode without infrared filter packaging would be more appropriate.

10. How It Works

A PIN photodiode is a semiconductor device with a wide, lightly doped intrinsic (I) region sandwiched between P-type and N-type regions. When photons with energy greater than the semiconductor bandgap strike the device, they generate electron-hole pairs in the intrinsic region. Under the influence of an applied reverse bias electric field, these charge carriers are separated, producing a photocurrent proportional to the intensity of the incident light. The wide intrinsic region offers several advantages: it creates a larger depletion region for photon absorption (increasing sensitivity), reduces junction capacitance (increasing speed), and allows operation at higher reverse voltages. The PD438B uses silicon material, whose bandgap is suitable for detecting light from the visible to near-infrared spectrum.

11. Disclaimer and Usage Instructions

Information in this technical document is subject to change without notice. The provided charts and typical values are for design reference only and do not represent guaranteed specifications. When implementing this component, designers must strictly adhere to absolute maximum ratings to prevent device failure. The manufacturer assumes no responsibility for any damage resulting from the use of this product outside its specified operating conditions. Without prior consultation and specific certification, this product is not intended for safety-critical, life-support, military, automotive, or aerospace applications.

Detailed Explanation of LED Specification Terminology

Complete Interpretation of LED Technical Terminology

I. Core Indicators of Photoelectric Performance

Terminology Unit/Representation Popular Explanation Why It Matters
Luminous Efficacy lm/W (lumens per watt) The luminous flux emitted per watt of electrical power; higher values indicate greater energy efficiency. It directly determines the energy efficiency rating of the luminaire and the electricity cost.
Luminous Flux lm (lumen) The total amount of light emitted by a light source, commonly known as "brightness". Determines whether the luminaire is bright enough.
Viewing Angle ° (degree), e.g., 120° The angle at which luminous intensity drops to half, determining the beam width. Affects the range and uniformity of illumination.
Correlated Color Temperature (CCT) K (Kelvin), such as 2700K/6500K Haske launin dumi da sanyi, ƙananan ƙima sun karkata zuwa rawaya/dumi, manyan ƙima sun karkata zuwa fari/sanyi. Yana ƙayyade yanayin hasken wuta da kuma yanayin da ya dace.
Color Rendering Index (CRI / Ra) Unitless, 0–100 The ability of a light source to reproduce the true colors of objects, with Ra≥80 being preferable. Affects color fidelity, used in high-demand places such as shopping malls and art galleries.
Color tolerance (SDCM) MacAdam ellipse step, such as "5-step" A quantitative metric for color consistency; a smaller step number indicates better color consistency. Ensure no color variation among luminaires from the same batch.
Dominant Wavelength nm (nanometer), e.g., 620nm (red) Wavelength values corresponding to the colors of colored LEDs. Determines the hue of monochromatic LEDs such as red, yellow, and green.
Spectral Distribution Wavelength vs. Intensity Curve Shows the intensity distribution of light emitted by an LED at each wavelength. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbol Popular Explanation Design Considerations
Forward Voltage (Forward Voltage) Vf The minimum voltage required to light up an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf; voltages add up when multiple LEDs are connected in series.
Forward Current If The current value that makes the LED emit light normally. Constant current drive is often used, as the current determines brightness and lifespan.
Maximum Pulse Current Ifp The peak current that can be withstood for a short period of time, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur.
Reverse Voltage Vr Maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. Reverse connection or voltage surges must be prevented in the circuit.
Thermal Resistance (Thermal Resistance) Rth (°C/W) The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. High thermal resistance requires stronger heat dissipation design, otherwise junction temperature rises.
Electrostatic Discharge Immunity (ESD Immunity) V (HBM), e.g., 1000V Electrostatic discharge immunity; a higher value indicates greater resistance to electrostatic damage. Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Key Indicators Popular Explanation Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) The time required for the brightness to drop to 70% or 80% of its initial value. Directly define the "useful life" of an LED.
Lumen Maintenance % (e.g., 70%) The percentage of remaining brightness after a period of use. Characterizes the ability to maintain brightness after long-term use.
Color Shift Δu′v′ or MacAdam ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Material performance degradation Degradation of packaging materials due to long-term high temperature. Zai iya haifar da raguwar haske, canjin launi ko gazawar bude hanya.

IV. Kullewa da Kayan aiki

Terminology Nau'o'in da aka saba gani Popular Explanation Characteristics and Applications
Package Types EMC, PPA, Ceramic The housing material that protects the chip and provides optical and thermal interfaces. EMC offers good heat resistance and low cost; ceramic provides superior heat dissipation and long lifespan.
Chip Structure Front-side, Flip Chip Chip electrode arrangement method. Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating. YAG, silicate, nitride Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical Design Flat, microlens, total internal reflection Optical structure on the packaging surface, controlling light distribution. Determines the emission angle and light distribution curve.

V. Quality Control and Grading

Terminology Grading Content Popular Explanation Purpose
Luminous Flux Binning Codes such as 2G, 2H Group by brightness level, each group has a minimum/maximum lumen value. Ensure consistent brightness for products in the same batch.
Voltage binning Codes such as 6W, 6X Grouped by forward voltage range. Facilitates driver power matching and improves system efficiency.
Color binning 5-step MacAdam ellipse Group by color coordinates to ensure colors fall within an extremely small range. Ensure color consistency to avoid color unevenness within the same luminaire.
Color temperature grading 2700K, 3000K, etc. Group by color temperature, each group has a corresponding coordinate range. Meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standard/Test Popular Explanation Meaning
LM-80 Lumen Maintenance Test Long-term operation under constant temperature conditions, recording luminance attenuation data. For estimating LED lifetime (in conjunction with TM-21).
TM-21 Lifetime projection standard Projecting lifespan under actual use conditions based on LM-80 data. Providing scientific life prediction.
IESNA Standard Illuminating Engineering Society Standard Covers optical, electrical, and thermal test methods. Industry-recognized testing basis.
RoHS / REACH Environmental Certification Ensure the product does not contain harmful substances (e.g., lead, mercury). Entry requirements for the international market.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting products. Commonly used in government procurement and subsidy programs to enhance market competitiveness.